CN102950657A - Brittle material substrate fracture device - Google Patents
Brittle material substrate fracture device Download PDFInfo
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- CN102950657A CN102950657A CN2012101684076A CN201210168407A CN102950657A CN 102950657 A CN102950657 A CN 102950657A CN 2012101684076 A CN2012101684076 A CN 2012101684076A CN 201210168407 A CN201210168407 A CN 201210168407A CN 102950657 A CN102950657 A CN 102950657A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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Abstract
The present invention provides a brittle material substrate fracture device which can be used for enabling a substrate to break vertically from a line. Bottom knives are rotatingly and freely fixed above a pair of supporting members. The bottom knives are closed to enable the position aligning with the line, thus a substrate is arranged, and the substrate is pressed from the upper part of a blade. Thus, the bottom knives can rotate toward reverse direction, and the substrate can break in the direction vertical with the line.
Description
Technical field
The present invention relates to a kind of brittle substrate breaking device that makes the fracture of the brittle substrate such as semiconductor substrate.
Background technology
Semiconductor chip is to cut off to make along this regional boundary position by the element area that will be formed on the semiconductor wafer.As the shearing device of the substrate of semiconductor wafer etc., cutter sweep is more common, and is still different according to purpose, also uses chalker, breaking device.Utilize line and when having applied the substrate fracture of semiconductor wafer etc. of slight crack, use the substrate breaking device making in advance.In addition, so-called fracture is the concept that comprises following situation, namely, in the substrate of crystalline material in the situation of riving of the particular orientation cutting substrate that holds scissile crystallization, with the situation of the orientation-independent of crystallization ground cutting substrate, and cutting polycrystalline or non-crystalline material etc. does not have towards the situation of the crystalline substrate of particular orientation.
In the past, with semiconductor substrate for example silicon wafer cut in the situation of chip, utilize cutter sweep to make cutting wheel rotation, and cut semiconductor substrate less by cutting.But; the discharge chip that needs water to discharge cutting and produce; in order not make this water or to discharge chip the performance of semiconductor chip is produced harmful effect, and need to carry out semiconductor chip is implemented protection and is used for rinse water or discharge the front and back step of chip.So, the shortcoming that has the step complicated and can't realize cost reduction or shorten process time.And, in the semiconductor substrate that the mechanical fragile layer film forming such as low dielectric substance layer form, can occur film is peeled off or producing the problem such as fragment because of the cutting of having used cutting wheel, and at (the microelectromechanical system of the MEMS with small frame for movement, MEMS) in the substrate, the surface tension that is caused by water can cause structural damage, thereby can produce the problem that originally just can't make water and can't use cutting step.
And, following substrate breaking device has been proposed in the patent documentation 1,2, that is, by to forming the semiconductor substrate of line, begin vertically to push so that its fracture with face along line from the back side that is forming the face of ruling.Figure 1A is the figure of the major part of the aforesaid substrate breaking device of expression.Among this figure, bed plate 101A, 101B are a pair of substrate maintaining parts that separates configuration with slight distance.On bed plate 101A, 101B, across the thin slice 102 of protecting usefulness for example semiconductor substrate 103 is installed with tackness thin slice 104 gluings.On semiconductor substrate 103, forming line 105a～105c with specific interval in advance.When rupturing, in line that the configuration of the middle of bed plate 101A, 101B should be ruptured, this situation, be line 105b, blade 106 is harmonized from the top of this line 105b descended in line 105b, thereby push semiconductor substrate 103.So utilize the fracture of the three-point bending of a pair of bed plate 101A, 101B and blade 106.
[background technology document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2004-39931 communique
[patent documentation 2] Japanese Patent Laid-Open 2010-149495 communique
Summary of the invention
[problem that invention will solve]
In having the substrate breaking device of aforesaid formation, when rupturing directly over the line 105b of the lower surface that is formed on semiconductor substrate 103, force down as shown in Figure 1B in the situation that blade 106 pushes, because semiconductor substrate 103 slight curvatures, so stress concentrates on the part that semiconductor substrate 103 contacts with the leading edge of bed plate 101A, 101B.This bending causes that at the slight crack leading section of line 105b stress is concentrated, and slight crack is towards the contact site progress of blade 106 with the semiconductor substrate 103 of the contact via tackness thin slice 104, and final semiconductor substrate 103 is cut into shaped like chips.At this moment, in the unsuitable situation of the conditions such as speed or the amount of being pressed into of forcing down of blade 106, can produce following problem: the trend of semiconductor substrate 103 when it is ruptured is separated with blade 106, can't fully keep semiconductor substrate 103 with bed plate 101A, 101B and blade 106 3, thereby the plane of disruption with respect to the surperficial out of plumb of substrate and brokenly at a slant.Like this, in the situation of fracture plane inclination, the aspects such as quality of semiconductor chip are impacted.
Especially in the fracture that utilizes three-point bending, as monocrystalline silicon substrate, have in the situation of wafer of crystalline material of riving property in certain particular orientation, and in the situation about rupturing in the orientation except the crystal orientation with the strongest riving property, how wafer can rupture in the modes that pulled by the direction towards stronger the riving property of performance.And, owing to following impact is difficult to vertically and with smooth cross section rupture in the scribing position of expection, that is, and by the leading edge of bed plate 101A, 101B and the inclination of the caused plane of disruption of position error of the each several part of line 105b, blade 106; Semiconductor substrate 103 is out of shape because being subject to pushing with tackness thin slice 104, thereby causes semiconductor substrate 103 to move with fine pitch along the y direction on bed plate; Temporarily change etc. in pushing force under the situation of blade as mentioned above 106 with semiconductor substrate 103 separates.
The present invention finishes in order to solve described problem, its purpose is to provide a kind of substrate breaking device, no matter this substrate breaking device is to having the crystalline substrate of splitting surface in specific single or a plurality of orientation or to the polycrystalline that does not have riving property, amorphous substrate, can both vertically rupturing along line.
[technological means of dealing with problems]
In order to address this problem, brittle substrate breaking device of the present invention is by applying power to the substrate that is forming the fragile material of ruling, and rupture along described line, and comprise: a pair of bed plate, itself so that the crestal line separately that is made of separately upper surface and subtend face is parallel and relatively to mode dispose, and load described substrate at upper surface; Pair of supporting members, it supports described a pair of bed plate from the face with the opposition side of the bearing surface of described substrate respectively; Switching mechanism, its by can described a pair of bed plate relative to leading edge unanimously form centered by line the approximated position, and away from described approximated position away from the position between the mode that moves, make mutually parallel in the opposite direction of described pair of supporting members; Blade, its along the back side of described line and wire be connected to the rule back side of side of forming of described substrate; And the blade driving mechanism, it makes described blade relatively move in the mode that approaches with respect to described a pair of bed plate, and the face of substrate is vertically applied power; And described pair of supporting members flexibly keeps described bed plate by upper surface respectively, so that this bed plate can move with slight distance along the direction vertical with the face of substrate.
Herein, in order to make described substrate fracture, also can be when blade be relatively moved in the mode that approaches with respect to a pair of bed plate, with described a pair of bed plate relatively to leading edge contact or the mode of roughly contact and under the close state, carry out the face of substrate is vertically applied the action of power.
Herein, described a pair of bed plate and pair of supporting members also can have following structure,, have the respectively toroidal of butt that is, and by this toroidal is slided over each other, and make described bed plate with can be flexibly fixing along the mode that the direction vertical with the face of substrate rotated.
Herein, also can described a pair of bed plate and pair of supporting members separately between, has following structure, namely, this structure is to include the elastomeric material that shrinks because of the load in when fracture or the formation of spring material, and makes described bed plate with can be flexibly fixing along the direction vertical with the face of the substrate mobile mode of sinking.
Herein, described brittle substrate also can be the substrate of crystalline texture with riving property.
[effect of invention]
As above at length illustrated as, according to the present invention, because when fracture make a pair of bed plate relatively to leading edge with contact or roughly the mode of contact is close, if and apply pushing force, bed plate is moved with slight distance along the direction vertical with the face of substrate, so, can make the heterogeneity of the fracture mechanism of substrate, irregular movement or change are disappeared, its result, during before cutting off substrate fully, can be continuously applied pushing force to the position of institute's purpose, so, can make substrate along vertically fracture of line.Even if especially will realize the substrate that ruptures is the substrate that has crystalline texture and have splitting surface in specific single or a plurality of orientation, no matter the orientation of splitting surface how, can vertically rupture in desired position and orientation.
Description of drawings
Figure 1A is the figure of an example that represents the major part of substrate breaking device in the past.
Figure 1B is the figure of action that represents major part when fracture of substrate breaking device in the past.
Fig. 2 is the perspective view of frontal of the substrate breaking device of first embodiment of the invention.
Fig. 3 is the perspective view of frontal of the substrate breaking device of first embodiment of the invention.
Fig. 4 is the top view that expression is installed in substrate the brittle substrate in the described substrate breaking device.
Fig. 5 is the figure of bed plate, supporting member and blade before the substrate breaking device of expression present embodiment ruptures.
Fig. 6 is the figure of bed plate, supporting member and the blade of substrate breaking device when rupturing of expression present embodiment.
Fig. 7 is the figure that the substrate breaking device of expression present embodiment carries out post-rift bed plate, supporting member and blade.
Fig. 8 is the figure of bed plate, supporting member and blade before the substrate breaking device of expression second embodiment of the invention ruptures.
Fig. 9 is the figure of bed plate, supporting member and blade before the substrate breaking device of expression third embodiment of the invention ruptures.
Figure 10 is the figure of bed plate, supporting member and blade before the substrate breaking device of expression four embodiment of the invention ruptures.
Figure 11 is the figure of bed plate, supporting member and blade before the substrate breaking device of expression fifth embodiment of the invention ruptures.
Figure 12 is the figure of bed plate, supporting member and blade before the substrate breaking device of expression sixth embodiment of the invention ruptures.
[explanation of symbol]
10 breaking devices
11 brace tables
12 pillars
13 platforms
14 Y platforms
15 turntables
17 lifting guiding elements
18 mountings
19 lifting platforms
20,24,53A, 53B supporting member
21,25,32 stepper motors
22,26,33 ball screws
23,106 blades
27 motors
28 rotating mechanisms
30 supporting mechanisms
31 cameras
34 guide rails
35 camera support portions
40,103 semiconductor substrates
41 ring elements
42 tackness films
43,105a, 105b, 105c line
44,102 thin slices
53A, 53B supporting member
54A, 54B, 101A, 101B bed plate
54Aa, 54Ba crestal line
56A, 56B rotating shaft
62 Compress Springs
64 adjustment of load springs
71A, 71B bed plate platform
72A, 72B supporting member
73A, 73B, 81A, 81B bed plate
74A, 74B rotating shaft
75A, 75B, 80A, 80B extension spring
76A, 76B stepwise bolt
77A, 77B Compress Spring
78A, 78B rubber slab
79A, 79B bed plate platform
104 tackness thin slices
X, y, z axle
The specific embodiment
Fig. 2 and Fig. 3 be from from the perspective view of the positive different direction observation of the breaking device of the brittle substrate of expression first embodiment of the invention.Among these figure, breaking device 10 is by 4 pillars 12 brace table 11 to be remained on the platform 13.Brace table 11 supports Y platform 14, and at Y platform 14 turntable 15 is being set.Y platform 14 is platforms that turntable 15 is moved along Y-direction, and turntable 15 is the platforms that make following substrate rotation.At the upper surface of brace table 11, also vertically except turntable 15 establishing 4 columned lifting guiding elements 17, and in the mode of the upper end that is erected at lifting guiding element 17 mounting 18 is being set.Between brace table 11 and mounting 18, arranging with only along z direction of principal axis freely mobile mode and the lifting platform 19 that carried out the lifting guiding by lifting guiding element 17.
Stepper motor 25 is being set and is utilizing the driving of this stepper motor 25 and the ball screw 26 that rotates at brace table 11, be subject to the driving of ball screw 26, Y platform 14 is moved along the y direction of principal axis.Motor 27, rotating mechanism 28 make turntable 15 rotations.
At brace table 11 supporting mechanism 30 as characteristic of the present invention is being set.Supporting mechanism 30 keeps (being designated hereinafter simply as substrate) such as semiconductor substrates, thereby and when rupturing, to be subject to from the pushing force of blade 23 substrate being kept in the mode of specific cross section fracture via substrate.Details about supporting mechanism 30 will be narrated hereinafter.
Camera 31 is being set below brace table 11.Camera 31 for example is CCD (charge-coupled device, charge coupled device) camera, and is used for observing exterior region and the blade 23 of bed plate via being formed on the peristome on the brace table 11 and being arranged on slotted hole section on the supporting mechanism 30.And, be formed on line on the substrate 40 or the position of chip by substrate 40 being made a video recording, detecting, thus, can carry out inching to the position of substrate 40.
And, below brace table 11, arranging and make camera 31 along travel mechanism that the x direction of principal axis moves.As shown in Figure 3, this travel mechanism comprises stepper motor 32 and the ball screw 33 that links with the axle of stepper motor 32, and by making camera support portion 35 mobile in the x-direction along guide rail 34, and the camera 31 on 35 tops, camera support portion is moved along the x direction of principal axis.
Fig. 4 represents to remain on the substrate 40 on the supporting mechanism 30.Among Fig. 4, cross over putting up on the ring element 41 of ring-type and stick together film 42, attaching circular substrate 40 at this core that sticks together film 42.On substrate 40, forming to clathrate a plurality of chips, forming to clathrate in advance at its lower surface and ruling, can separating between each chip.
Moreover, as the substrate of fracture by this substrate breaking device, comprise such as infrabasal plate: have the substrate of the crystalline texture of silicon single crystal substrate etc., the high rigidity substrate that sapphire substrate or Diamonal substrate are such, carborundum (SiC) substrate, aluminium nitride (AlN) substrate etc.In addition, also can be the various brittle substrates such as glass substrate.
Herein, lifting guiding element 17, mounting 18, lifting platform 19, supporting member 24, stepper motor 25 and ball screw 26 have consisted of the blade driving mechanism that blade 23 is moved up and down along the z direction of principal axis.And Y platform 14, turntable 15 and driving mechanism thereof have consisted of the substrate 40 that makes on the supporting mechanism 30 along travel mechanism that its face moves.And stepper motor 32, ball screw 33 and guide rail 34 have consisted of the camera movement mechanism that camera 31 is moved along the x direction of principal axis.
Fig. 5 is the amplification sectional view of bed plate and supporting member periphery.Pair of supporting members 53A, 53B and rotating shaft 56A, 56B utilize the screw philosophy fixing rigidly, and bed plate 54A, 54B are supported with the form from up and down clamping.Between bed plate 54A, 54B and supporting member 53A, 53B, insert respectively 2 Compress Springs 62, and towards making the mutual close pressuring direction of rotating shaft 56A, 56B and bed plate 54A, 54B.And bed plate 54A, 54B make the mutually switching mechanism of parallel and can open and close towards the y direction mobile in the opposite direction of supporting member 53A, 53B.And, the adjustment of load spring 64 when rotating is being set between bed plate 54A, 54B and supporting member 53A, 53B.
The action of Fig. 5～Fig. 7 that the below utilizes expression bed plate and supporting member when utilizing described substrate breaking device fracture describes.When making substrate 40 fracture, initial, no matter crestal line 54Aa, the 54Ba of bed plate are parallel in axial which position of x with the front end of blade 23, blade 23 is adjusted into the central authorities that are positioned at this crestal line 54Aa and 54Ba.Thus, can be with the leading edge location of a pair of bed plate 54A, 54B.
Then, as shown in Figure 4, utilize tackness film 42 that substrate 40 and ring element 41 are fitted.And, make forming of substrate 40 the facing down of 43 sides of ruling, via the thin slice 44 of protection usefulness this ring element 41 is installed on the turntable shown in Figure 1 11.Then, adjust the rotary angle position of turntable 11, harmonize in the mode of the front end of substrate breaking device 23 with the scribing position of substrate 40, carry out the angle orientation of substrate 40.In the situation of having carried out in this way the location, the crestal line of the front end of the center line between bed plate 54A, the 54B and blade 23 and the line of substrate 40 are in the configuration of z direction of principal axis point-blank.
Then, towards making the direction of the interval closure of a pair of bed plate 54A, 54B that this bed plate 54A, 54B are moved.And, as shown in Figure 6, under the state that crestal line 54Aa, the 54Ba of bed plate contact fully or roughly contact, finish the location.Also have, the position of the crestal line under this state becomes center line.
Then, carry out fracture.Fracture is to utilize stepper motor 21 that lifting platform 19 is descended, and blade 23 is moved along the z direction, thereby as shown in Figure 7, utilize blade 23 to push the substrate 40 that is supported by a pair of bed plate 54A, 54B directly over line.
If blade 23 pushing substrates 40, the line of substrate 40 is disposed in the mode consistent with blade 23 so, so blade 23 is from the back side of the upper surface pushing line 43 of substrate 40.Substrate 40 pushing a pair of bed plate 54A, the 54B that are urged.
A pair of bed plate 54A, 54B all process comparatively smoothly with each face both sides substrate 40 butts, and be positioned at plane with the z perpendicular direction with height identical on the z direction.So with respect to substrate 40, bed plate 54A, 54B block pushing force from substrate 40 with the zone that has expansion planarly.In addition, if blade 23 pushing substrates 40, bed plate 54A is because of as adjustment of load spring 64 shrinks as shown in Figure 7 so, centered by the central shaft of rotating shaft 56A towards counterclockwise slightly rotating.Similarly, bed plate 54B rotates centered by the central shaft of rotating shaft 56B toward the clockwise direction slightly because of as adjustment of load spring 64 shrinks as shown in Figure 7.The angle of these rotations for example is below 1 °, to be generally about 0.1 °.Like this, when the pushing force towards substrate 40 of blade 23 becomes state above the spring constant of adjustment of load spring 64, although substrate 40 becomes the state that is subject to bending stress but still is supported with face at bed plate 54A, 54B upper surface separately.So, can apply bending stress to substrate 40, and partly apply pushing force unlike like that crestal line 54Aa, the 54Ba to bed plate 54A, 54B that utilize that in the past three-point bending fracture method observes.And, can cut off with the vertical cross section along line, and blade 23 and substrate 40 can be because of fracture the time yet trend and separate.
After the fracture of substrate 40 has been carried out in action more than utilizing, blade 23 is risen, and after making Y platform 14 distance that only width mobile and semiconductor chip is suitable under the effect of stepper motor 25, proceed identical cutting operation.
Among the present invention because bootom couch cutter shaft rotates slightly, so even if apply and in substrate, produce after the pushing force crookedly, substrate is kept as face at the bed plate upper surface, and can before cutting off substrate fully, positively keep.Even if having the semiconductor chips such as silicon substrate of crystalline splitting surface, also can harmonize and cut off in line and perpendicular to the face ground of substrate.So, can be applied in the shearing device of the various substrates with crystalline splitting surface.
Also have, adopted in the described embodiment by making blade 23 liftings come to give the formation that pushing force makes substrate 40 fractures to substrate 40, but, also can replace making blade 23 liftings, and adopt the formation make a pair of bed plate 54A, 54B lifting and to make substrate 40 fractures.
The below describes other embodiments of the present invention.Only major part is described in the following embodiments, because whole formation and Fig. 5～Fig. 7 are roughly the same, so omit detailed explanation.
Fig. 8 represents the second embodiment of the present invention.Among Fig. 8, bed plate platform 71A, 71B with can about the mode that opens and closes consist of, supporting member 72A, 72B are being set respectively at an upper portion thereof, and, bed plate 73A, 73B are being set respectively at an upper portion thereof.Bed plate 73A, 73B rotate freely by pair of rotary shafts 74A, 74B to keep.And, between bed plate 73A, 73B and supporting member 72A, 72B, in the outside of rotating shaft extension spring 75A, 75B are being set respectively, and along rotating shaft 74A, 74B rotation freely.In addition, have the through hole that stepwise bolt 76A, 76B are run through in the inboard of the rotating shaft of bed plate 73A, 73B, the screw division of the front end of stepwise bolt 76A, 76B is screwed on supporting member 72A, the 72B.So bed plate 73A, 73B are subject to the tension force of extension spring 75A, 75B, still, stipulate its upper limit position by the head of stepwise bolt 76A, 76B.Between the through hole of stepwise bolt 76A, 76B and bed plate 73A, 73B, minim gap is being set herein.And, set in the mode that the head upper surface of stepwise bolt 76A, 76B is more lower slightly than the upper surface of bed plate 73A, 73B.
In this state, at the top of bed plate 73A, 73B placement substrate 40, line is harmonized in the tangent tangent position of bed plate 73A, 73B, and utilize blade 23 to push from top.Thus, the tangent leading edge portion of bed plate 73A, 73B is rotated centered by rotating shaft 74A, 74B slightly in the mode that slightly reduces.At this moment, even if be applied in pushing force on the substrate 40, can be not do not cut off with the vertical cross section along line discretely from the upper surface of bed plate 73A, 73B yet.
The below utilizes Fig. 9 that the 3rd embodiment of the present invention is described.In the present embodiment, bed plate 73A, the 73B in the outer peripheral portion of stepwise bolt 76A, 76B and the boundary member of supporting member 72A, 72B, the resistance value when sinking in order to adjust and be provided with respectively Compress Spring 77A, 77B.Thus, by making the Strength Changes of Compress Spring 77A, 77B, can when rupturing, suitably adjust the resistance value that sinks to of the boundary member of bed plate 73A, 73B.
The below utilizes Figure 10 that the 4th embodiment of the present invention is described.In the present embodiment, bed plate 73A, the 73B in the outer peripheral portion of stepwise bolt 76A, 76B and the boundary member of supporting member 72A, 72B are disposing respectively columnar rubber slab 78A, 78B.In this case, by using the different rubber slab of coefficient of elasticity, also can when rupturing, select the resistance value that sinks to of the boundary member of bed plate 73A, 73B.
Figure 11 represents the 5th embodiment, has to make bed plate platform 71A and supporting member 72A and bed plate platform 71B and supporting member 72B integrated and become the formation of bed plate platform 79A, 79B.In this case, extension spring 80A, 80B are arranged between the below of bed plate 73A, 73B and bed plate platform 79A, 79B.In this case, by substrate 40 being configured in the upper surface of this bed plate platform 79A, 79B, and utilize blade 23 to push, also can make substrate 40 with vertical cross section fracture.
Figure 12 is the sectional view of details of the bed plate section of expression the 6th embodiment.In the present embodiment, have the integrated formation of the bed plate of making and rotating shaft, and be made as the lower surface of bed plate 81A, 81B cylindric.In addition, form the formation that the upper surface of supporting member 72A, 72B is made as circular-arc groove.Like this, make the structure in the large footpath of rotating shaft by employing, it is consistent or than the top section of upper surface the roughly semicircular rotary middle spindle of the lower surface of bed plate can be set for upper level with bed plate 81A, 81B.Especially be in the situation of thicker or more crisp material at substrate 40, sometimes because substrate is applied excessive pushing force, and cause unexpected destruction at the substrate surface that blade 23 contacts with substrate 40, but by making rotary middle spindle consistent with bed plate upper level (comparatively it is desirable to the contact-making surface height of substrate and blade), pushing force from blade can be converted to efficiently the bending stress of the direction of splitting towards the slight crack front end that makes the line of substrate, and can avoid the destruction of substrate surface.Certainly, also can as the first embodiment, bed plate, supporting member and rotating shaft be made as respectively the structure that is not integrated.
[industrial utilizability]
The present invention can be suitable as the brittle substrate breaking device, even if be the substrate that has splitting surface in specific single or a plurality of orientation or noncrystalline, polycrystalline substrate, also can vertically rupture along line, thereby make the various semiconductor substrates fractures such as silicon semiconductor substrate.
Claims (5)
1. brittle substrate breaking device, it applies power by the substrate to the fragile material that forming line, and ruptures along described line, and comprises:
A pair of bed plate, itself so that the crestal line separately that is made of separately upper surface and subtend face is parallel and relatively to mode dispose, and loading described substrate at upper surface;
Pair of supporting members, it supports described a pair of bed plate from the face with the opposition side of the bearing surface of described substrate respectively;
Switching mechanism, its by can described a pair of bed plate relative to leading edge unanimously form centered by line the approximated position, and away from described approximated position away from the position between the mode that moves, make mutually parallel in the opposite direction of described pair of supporting members;
Blade, its along the back side of described line and wire be connected to the rule back side of side of forming of described substrate; And
The blade driving mechanism, it makes described blade relatively move in the mode that approaches with respect to described a pair of bed plate, and the face of substrate is vertically applied power; And
Described pair of supporting members flexibly keeps described bed plate by upper surface respectively, so that this bed plate can move with slight distance along the direction vertical with the face of substrate.
2. brittle substrate breaking device according to claim 1, wherein
In order to make described substrate fracture, when blade is relatively moved in the mode that approaches with respect to a pair of bed plate, with described a pair of bed plate relatively to leading edge contact or the mode of roughly contact and under the close state, carry out the face of substrate is vertically applied the action of power.
3. brittle substrate breaking device according to claim 1 and 2, wherein
Described a pair of bed plate and pair of supporting members have following structure,, have the respectively toroidal of butt that is, and by this toroidal is slided over each other, and make described bed plate with can be flexibly fixing along the mode that the direction vertical with the face of substrate rotated.
4. brittle substrate breaking device according to claim 1, wherein
Described a pair of bed plate and pair of supporting members separately between, has following structure, namely, this structure is to include the elastomeric material that shrinks because of the load in when fracture or the formation of spring material, and makes described bed plate with can be flexibly fixing along the direction vertical with the face of the substrate mobile mode of sinking.
5. brittle substrate breaking device according to claim 1, wherein
Described brittle substrate is the substrate with crystalline texture of riving property.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-184297 | 2011-08-26 | ||
| JP2011184297A JP5548172B2 (en) | 2011-08-26 | 2011-08-26 | Brittle material substrate breaker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102950657A true CN102950657A (en) | 2013-03-06 |
| CN102950657B CN102950657B (en) | 2016-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210168407.6A Expired - Fee Related CN102950657B (en) | 2011-08-26 | 2012-05-28 | Brittle material substrate fracture device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5548172B2 (en) |
| KR (1) | KR101449106B1 (en) |
| CN (1) | CN102950657B (en) |
| TW (1) | TWI488230B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104339461A (en) * | 2013-08-09 | 2015-02-11 | 三星钻石工业股份有限公司 | Method for cutting off laminated ceramic substrate |
| CN104942858A (en) * | 2014-03-28 | 2015-09-30 | 三星钻石工业股份有限公司 | Method and device for breaking resin sheet |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6243699B2 (en) * | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | Fragment material substrate cutting device |
| JP6268917B2 (en) * | 2013-10-25 | 2018-01-31 | 三星ダイヤモンド工業株式会社 | Break device |
| JP2016040079A (en) * | 2014-08-12 | 2016-03-24 | 三星ダイヤモンド工業株式会社 | Segmentation method and segmentation apparatus for brittle material substrate |
| JP6481465B2 (en) * | 2014-08-21 | 2019-03-13 | 三星ダイヤモンド工業株式会社 | Breaking method of composite substrate |
| KR101669503B1 (en) * | 2016-09-19 | 2016-10-26 | 김성규 | Method For Manufacturing Focus Ring |
| JP6460267B2 (en) * | 2018-01-29 | 2019-01-30 | 三星ダイヤモンド工業株式会社 | Break device |
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| JPS61215008A (en) * | 1985-03-20 | 1986-09-24 | 株式会社日立製作所 | Method of dividing ceramic substrate |
| JPH08268728A (en) * | 1995-01-30 | 1996-10-15 | Futaba Corp | Substrate cutter |
| JP2010149495A (en) * | 2008-11-26 | 2010-07-08 | Laser Solutions Co Ltd | Substrate cutter |
| CN101792254A (en) * | 2009-01-30 | 2010-08-04 | 三星钻石工业股份有限公司 | Apparatus for breaking substrate of brittle material |
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| JP4287090B2 (en) | 2002-01-15 | 2009-07-01 | Ｔｏｗａ株式会社 | Jig for cutting resin-sealed substrates |
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- 2011-08-26 JP JP2011184297A patent/JP5548172B2/en not_active Expired - Fee Related
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- 2012-04-17 TW TW101113647A patent/TWI488230B/en not_active IP Right Cessation
- 2012-05-28 CN CN201210168407.6A patent/CN102950657B/en not_active Expired - Fee Related
- 2012-07-25 KR KR1020120081206A patent/KR101449106B1/en active IP Right Grant
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| JPS61215008A (en) * | 1985-03-20 | 1986-09-24 | 株式会社日立製作所 | Method of dividing ceramic substrate |
| JPH08268728A (en) * | 1995-01-30 | 1996-10-15 | Futaba Corp | Substrate cutter |
| JP2010149495A (en) * | 2008-11-26 | 2010-07-08 | Laser Solutions Co Ltd | Substrate cutter |
| CN101792254A (en) * | 2009-01-30 | 2010-08-04 | 三星钻石工业股份有限公司 | Apparatus for breaking substrate of brittle material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104339461A (en) * | 2013-08-09 | 2015-02-11 | 三星钻石工业股份有限公司 | Method for cutting off laminated ceramic substrate |
| CN104339461B (en) * | 2013-08-09 | 2017-09-29 | 三星钻石工业股份有限公司 | The cutting-off method of laminated ceramic substrate |
| CN104942858A (en) * | 2014-03-28 | 2015-09-30 | 三星钻石工业股份有限公司 | Method and device for breaking resin sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI488230B (en) | 2015-06-11 |
| JP2013043414A (en) | 2013-03-04 |
| JP5548172B2 (en) | 2014-07-16 |
| KR101449106B1 (en) | 2014-10-08 |
| KR20130023067A (en) | 2013-03-07 |
| CN102950657B (en) | 2016-03-09 |
| TW201310515A (en) | 2013-03-01 |
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