CN102933024A - Printed wiring board and method of manufacturing same - Google Patents

Printed wiring board and method of manufacturing same Download PDF

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Publication number
CN102933024A
CN102933024A CN2012102442765A CN201210244276A CN102933024A CN 102933024 A CN102933024 A CN 102933024A CN 2012102442765 A CN2012102442765 A CN 2012102442765A CN 201210244276 A CN201210244276 A CN 201210244276A CN 102933024 A CN102933024 A CN 102933024A
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Prior art keywords
strengthening part
nickel
addition
pcb
circuit board
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CN2012102442765A
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CN102933024B (en
Inventor
田岛宏
渡边正博
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Tatsuta Electric Wire and Cable Co Ltd
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Tatsuta Electric Wire and Cable Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention provides a printed wiring board with shielding performance and durability, and the printed board can work under relatively large temperature scope and moisture scope environment of high temperature and high moisture lifted from normal temperature and normal moisture. The printed wiring board (1) comprises: an enforced member (135), a surface of base material (135a) formed by stainless steel is formed with a nickel layer (135b); and a conductive bonding agent layer (130) coated on the surface of the enforced member (135). And on the surface of the enforced member (135), surface area ratio between Ni(OH)2 and Ni is 1.8 to 3.0.

Description

The manufacture method of printed circuit board (PCB) and printed circuit board (PCB)
Technical field
The application relates to for the printed circuit board (PCB) of portable phone, computer etc. and the manufacture method of printed circuit board (PCB).
Background technology
In the past, in order to shield noise to the impact of the electronic units such as portable phone, computer, electronic unit was installed on the printed circuit board (PCB) with film.The bending that printed circuit board (PCB) occurs in use etc. can cause the installed position that is used for mounting electronic parts on this printed circuit board (PCB) to produce distortion, thereby may cause described electronic unit impaired.Therefore, because the external force such as the distortion of installation site and impaired, the stiffener with conductivity (patent documentation 1 and 2) of being made by stainless steel etc. is set in the position relative with the installation site of mounting electronic parts usually in order to prevent electronic unit.
The prior art document
Patent documentation
Patent documentation 1: Japan's Patent Application Publication communique " JP 2007-189091 number "
Patent documentation 2: Japan's Patent Application Publication communique " JP 2009-218443 number "
Summary of the invention
Technical problem
Yet, found that strengthening part can reduction with respect to the peel strength (peeling off required power) of conductive adhesive under hot and humid environment.Thus, in aforesaid environment, strengthening part may come off from conductive adhesive, and perhaps, the bonding strength between conductive adhesive and the strengthening part reduces, and resistance value increases, thereby may cause shielding properties to reduce.
The application proposes in view of the above-mentioned problems, and its purpose is to provide a kind of ambient temperature and moisture that can improve to the hot and humid printed circuit board (PCB) than the required shielding properties that possesses of printed circuit board (PCB) and durability in large-temperature range and the humidity range environment.
Technological means
For solving the problems of the technologies described above, the applicant has carried out wholwe-hearted research, found that: on the surface of strengthening part, and nickel hydroxide (Ni(OH) 2) containing ratio higher, strengthening part is larger with respect to the peel strength of conductive adhesive.The invention of the printed circuit board (PCB) below thereby the applicant has finished.
The application's printed circuit board (PCB) comprises: strengthening part is formed with nickel dam on the surface of the base material of being made by stainless steel; And the conductive adhesive layer, be bonded on the surface of described strengthening part.Wherein, in the surface of described strengthening part, the surface area ratio of nickel hydroxide and nickel is 1.8-3.0.
According to above-mentioned formation, in the adhesive surface between strengthening part and conductive adhesive layer, can increase hydroxy by the containing ratio that improves nickel hydroxide, and the hydrogen bond of the OH base by described hydroxy and conductive adhesive layer surface improves bonding strength.As a result, can under from ambient temperature and moisture to hot and humid larger temperature range and humidity range environment, keep higher stripping performance, thereby can improve the required shielding properties that possesses of printed circuit board (PCB) and durability.
In addition, the application's printed circuit board (PCB) comprises: strengthening part is formed with nickel dam on the surface of the base material of being made by stainless steel; And the conductive adhesive layer, be bonded on the surface of described strengthening part.Wherein, the surface gloss of described strengthening part is less than or equal to 500; In the surface of described strengthening part, the surface area ratio of nickel hydroxide and nickel is 1.8-3.0.
According to above-mentioned formation, be made as by the surface gloss with strengthening part and be less than or equal to 500, can enlarge the bonding surface area of strengthening part and conductive adhesive layer.Thus, can increase bonding strength between strengthening part and the conductive adhesive layer.As a result, can the environment from ambient temperature and moisture to hot and humid larger temperature range and humidity range, keep less resistance value and can keep higher stripping performance, thereby can improve the required shielding properties that possesses of printed circuit board (PCB) and durability.
In addition, the applicant finds: for the ratio of nickel hydroxide and nickel in the surface that makes strengthening part is 1.8-3.0, it is suitable that the surface that is plated in strengthening part by the electrolysis of adopting nickel sulfamic acid to bathe forms nickel dam.
That is, in the described strengthening part of the application's printed circuit board (PCB), described nickel dam can plate to form by the electrolysis of bathing with nickel sulfamic acid.
According to above-mentioned formation, can form suitable nickel dam at strengthening part.In addition, can think: generally, when external environment condition (environment for use) is hot environment, in strengthening part, be out of shape owing to different coefficient of thermal expansions causes the generation of interfaces between nickel dam and stainless steel substrate.In addition, can predict: when having internal stress in the nickel dam, because and the relation between the described distortion, can produce in a large number the caused larger crackle of stress in the nickel dam, described crackle will cause conductivity to reduce, and resistance value is increased.By the electrolysis plating of using nickel sulfamic acid to bathe, thus the situation that the conductivity that the internal stress that can reduce nickel dam can prevent from causing because of crackle reduces.
The invention effect
Can improve the required shielding properties that possesses of printed circuit board (PCB) and durability.
Description of drawings
Fig. 1 is the partial sectional view of the printed circuit board (PCB) of present embodiment.
Fig. 2 is the partial sectional view of the printed circuit board (PCB) of present embodiment.
Description of reference numerals
1: printed circuit board (PCB); 90a: electromagnetic wave;
110: printed circuit board (PCB); 111: dielectric film;
112: substrate parts; 113: adhesive phase;
115: earthy circuit pattern; 120: screened film;
121: insulating barrier; 122: conductive layer;
123: electric conducting material; 130: the conductive adhesive layer;
135: strengthening part; 135a: base material;
135b: nickel dam; 150: electronic unit;
160: hole section
Embodiment
Below, with reference to the accompanying drawings, the application's preferred implementation is described.
(integral body of printed circuit board (PCB) 1 consists of)
At first, use Fig. 1, the printed circuit board (PCB) 1 of present embodiment is described.As shown in Figure 1, printed circuit board (PCB) 1 comprises: strengthening part 135 is formed with nickel dam on the surface of the base material of being made by stainless steel; And conductive adhesive layer 130, with the surface engagement of strengthening part 135.In addition, the glossiness on strengthening part 135 surfaces is less than or equal to 500.In addition, the surface area ratio of the nickel hydroxide on strengthening part 135 surfaces and nickel is at 1.8-3.0.
At this, " the surface area ratio of nickel hydroxide and nickel ", that is, " Ni(OH) 2/ Ni surface area ratio " be by ESCA(Electron Spectroscopy for Chemical Analysis: the Ni(OH that the chemical analysis electronic spectrograph) surface of strengthening part is analyzed and calculated main detection) 2, NiO, Ni ratio after Ni(OH) 2Ratio divided by the resulting numerical value of the ratio of Ni.
Particularly, printed circuit board (PCB) 1 comprises: printed circuit board (PCB) 110, film 120, conductive adhesive layer 130, strengthening part 135.In addition, the installation site that arranges below printed circuit board (PCB) 110 is connected with electronic unit 150.Strengthening part 135 is configured in the position relative with the installation site of connecting electronic parts 150.Thus, strengthening part 135 is strengthened the installation site of electronic unit 150.Strengthening part 135 with conductivity is electrically connected with the earthy circuit pattern 115 of printed circuit board (PCB) 110 by conductive adhesive layer 130.Thus, strengthening part 135 keeps equipotentials with earthy circuit pattern 115, therefore, can shield from the impact on the installation site of electronic unit 150 of the noise of the electromagnetic wave 90a of outside etc.
The below specifies each formation.
(printed circuit board (PCB) 110)
Printed circuit board (PCB) 110 comprises: substrate parts 112 is formed with a plurality of circuit patterns such as not shown signal circuit pattern, earthy circuit pattern 115; Adhesive phase 113 is arranged on the substrate parts 112; And dielectric film 111, be bonded on the adhesive phase 113.
Not shown signal with circuit pattern and earthy circuit pattern 115 be formed on substrate parts 112 above.Above-mentioned circuit pattern forms by conductive material is implemented etch processes.In addition, wherein, earthy circuit pattern 115 refers to keep the pattern of earthing potential.
Adhesive phase 113 is arranged on signal with the adhesive between circuit pattern and earthy circuit pattern 115 and the dielectric film 111, plays insulating properties and the effect that dielectric film 111 and substrate parts 112 is bonding of keeping.In addition, the thickness of adhesive phase 113 is 10 μ m-40 μ m, but does not need to be limited especially, can suitably set.
Substrate parts 112 and dielectric film 111 form by engineering plastics.For example, the resins such as polyethylene terephthalate, polypropylene, crosslinked polyethylene, polyester, polybenzimidazoles, polyimides, polyimide amide, Polyetherimide, polyphenylene sulfide are arranged.If less demanding to thermal endurance, the preferred polyester film that uses cheapness.If require flame resistance, preferably use polyphenylene sulfide film, if also require thermal endurance, preferably use polyimide film, polyamide membrane, glass-epoxy film.In addition, the thickness of substrate parts 112 is 10 μ m-40 μ m, and the thickness of dielectric film 111 is 10 μ m-30 μ m, but does not need to be limited especially, can suitably set.
In addition, by laser processing etc., form porose 160 at above-mentioned dielectric film 111 and adhesive phase 113.Hole section 160 is used for making and is selected from a plurality of signals and exposes with a part of zone of the circuit pattern of circuit pattern, earthy circuit pattern.In the present embodiment, hole section 160 is formed on the stacked direction of dielectric film 111 and adhesive phase 113, so that expose to the outside in the part zone of earthy circuit pattern 115.In addition, suitably set the aperture of hole section 160, so that other adjacent circuit patterns can not expose.
(strengthening part 135)
In strengthening part 135, be formed with nickel dam 135b on the whole surface of the base material 135a of the stainless steel material with conductivity.Preferably, nickel dam 135b forms by electrolytic ni plating.Further preferably, nickel dam 135b plates to form by nickel sulfamic acid.
In addition, can regulate by comprising brightener the glossiness of nickel dam.For thereby the surface area that enlarges the adhesive surface between strengthening part 135 and the conductive adhesive layer 130 improves bonding strength, the glossiness of nickel dam is preferably and is less than or equal to 500, more preferably is less than or equal to 460.In addition, thus further preferably not comprising brightener forms lacklustre nickel dam with nickel dam.
Wherein, " brightener " has half brightener (elementary brightener) and brightener (second-class brightener).As half brightener (elementary brightener), can use saccharin sodium, 1,5 naphthalene disulfonate, 1,3,6 sodium trisulfonates, p-toluene sulphur vinegar amine etc.As brightener (second-class brightener), then usually use with half brightener, as using counmalin, propargyl alcohol, butynediols, formaldehyde, thiocarbamide, quinoline, pyridine etc.NIMAC33(half brightener that Japanese MacDermid Co., Ltd. system particularly, is arranged), NIMAC8162(brightener).
In addition, on the surface of nickel dam 135b, the lower limit of the surface area ratio of nickel hydroxide and nickel is preferably 1.8, and more preferably 2.0, be preferably again 2.1.In addition, on the surface of nickel dam 135b, the upper limit of the surface area ratio of nickel hydroxide and nickel is preferably 3.0, and more preferably 2.8, be preferably again 2.4.In addition, the thickness of nickel dam 135b is 1 μ m-3 μ m, can suitably set according to formation.
As mentioned above, in the adhesive surface between strengthening part 135 and conductive adhesive layer 130, can increase hydroxy by the containing ratio that improves nickel hydroxide, and can utilize the hydrogen bond between the OH base on described hydroxy and conductive adhesive layer surface to improve bonding strength.In addition, be made as by the surface gloss with strengthening part 135 and be less than or equal to 500, can enlarge the bonding surface area of strengthening part 135 and conductive adhesive layer 130.Thus, can improve the bonding strength of strengthening part 135 and conductive adhesive layer 130.As a result, can under from ambient temperature and moisture to hot and humid larger temperature range and humidity range environment, keep higher stripping performance, thereby can improve the printed circuit board (PCB) 1 required shielding properties that possesses and durability.
In addition, the electrolysis that the method that forms nickel dam 135b is not limited to adopt nickel sulfamic acid to bathe is plated, for example, and can also be by adopting watt electrolysis of hereby bathing plating or adopting the electroless plating without the electrolytic nickel bath to form nickel dam 135b.Adopting when watt hereby bathing, thereby may cause that peel strength reduces under the hot and humid environment owing to forming larger internal stress, therefore need to come relieve stresses by comprising brightener.Yet owing to comprising brightener, the surface area of the adhesive surface between strengthening part 135 and the conductive adhesive layer 130 reduces, and the possibility of result can reduce peel strength.So, bathe formation nickel dam 135b by nickel sulfamic acid and can more effectively improve peel strength.
As mentioned above, can form suitable nickel dam at strengthening part by the nickel sulfamic acid bath.In addition, generally, when the temperature of external environment condition (environment for use) reaches a high temperature, because coefficient of thermal expansion is different, thereby be out of shape at the nickel dam 135b of strengthening part 135 and the generation of interfaces of base material 135a.And, when having internal stress among the nickel dam 135b, because and the relation between the described distortion, may in nickel dam 135b, produce the larger crackle that is caused by stress in a large number, described crackle causes conductivity to reduce, thereby causes resistance value to increase.By the electrolysis plating of adopting nickel sulfamic acid to bathe, the internal stress of formed nickel dam 135b is less, the phenomenon that the conductivity that therefore can prevent from being caused by crackle reduces.
Aforesaid strengthening part 135 is configured in the position relative with the installation site of electronic unit 150, by strengthening the installation site of electronic unit 150, prevents from producing distortion etc. in the installation site by what bending etc. caused.In addition, base material 135a is not limited to stainless steel material, so long as the material that can strengthen the installation site and have conductivity then can use any materials.But, because stainless steel material has the hardness that is suitable for strengthening and better corrosion resistance, therefore, use stainless steel material can more effectively strengthen the installation site of electronic unit 150, and can bring shield effectiveness to the installation site.In addition, the thickness of strengthening part 135 is 0.05mm-1mm, can suitably determine this thickness according to consisting of.
(conductive adhesive layer 130)
Conductive adhesive layer 130 is formed by any adhesive in isotropic conductivity adhesive and the anisotropic conductive adhesive.The isotropic conductivity adhesive has the electrical property identical with existing scolder.Thus, when forming conductive adhesive layer 130 with the isotropic conductivity adhesive, all can guarantee electric conducting state at the three-dimensional that is consisted of by thickness direction, Width and length direction.On the other hand, when forming conductive adhesive layer 130 with the anisotropic conductive adhesive, can only guarantee electric conducting state at the two-dimensional directional that is consisted of by thickness direction.In addition, conductive adhesive layer 130 can be by forming by resulting conductive adhesive after mixing electroconductive particle take soft magnetic material as principal component and adhesive.
The adhesive that conductive adhesive layer 130 comprises such as have acrylic resin, epoxylite, siloxane resin, thermoplastic elastomer (TPE) resinoid, rubber resin, polyester resin, carbamate resinoid etc.In addition, adhesive can be the monomer of above-mentioned resin, can also be above-mentioned resin blend body.In addition, adhesive can also comprise tackifier.Tackifier are such as the tackifier such as aliphatic acid hydrocarbon resins, C5/C9 hybrid resin, rosin, rosin derivative, terpene resin, aromatic hydrocarbon resinoid, heat reactivity resin are arranged.
(film 120)
Film 120 comprises: with contact condition be bonded in electric conducting material 123 conductive layer 122, be arranged on the insulating barrier 121 on the conductive layer 122.Film 120 is by having conductive layer 122, thereby has the shield effectiveness of the noise such as shielding electromagnetic wave.
Electric conducting material 123 is formed by any adhesive in isotropic conductivity adhesive and the anisotropic conductive adhesive.The isotropic conductivity adhesive has the electrical property identical with existing scolder.Thus, when forming electric conducting material 123 with the isotropic conductivity adhesive, on the three-dimensional that is consisted of by thickness direction, Width and length direction, all can guarantee electric conducting state.On the other hand, when forming electric conducting material 123 with the anisotropic conductive adhesive, can only guarantee electric conducting state at the two-dimensional directional that is consisted of by thickness direction.In addition, when electric conducting material 123 was formed by the isotropic conductivity adhesive, electric conducting material 123 can have the function of conductive layer 122, therefore, sometimes can also omit conductive layer 122 is set.
In addition, electric conducting material 123 is made of insulating properties adhesive and the electroconductive particle that is dispersed in the insulating properties adhesive.Particularly, the insulating properties adhesive is as resin of binding property, is made of thermosetting resins such as the thermoplastic resins such as polystyrene type, vinyl acetate class, polyesters, polyethylene kind, polypropylene type, polyamide-based, rubber-like, acrylic compounds or phenol, epoxies, carbamates, melamine class, alcohol acids.In addition, the electroconductive particles such as hybrid metal, carbon in above-mentioned resin of binding property, the conductive adhesive that has conductivity with preparation.When thermal endurance is not had special requirement, preferably be not subjected to the polyesters thermoplastic resin of the restriction such as maintaining requirement, there is thermal endurance to require or the epoxies thermosetting resin of preferred high reliability when requiring better pliability.In addition, all preferably when implementing hot pressing, oozing out (Resin Flow) few resin in above-mentioned any situation.In addition, the thickness of electric conducting material 123 is 3 μ m-30 μ m, but does not need to be limited especially, can suitably set.
Conductive layer 122 has the shield effectiveness to coming the unwanted radiation in the signal of telecommunication that main substrate sends or shielding from the noise of the electromagnetic wave of outside etc.Conductive layer 122 is by nickel, copper, silver, tin, gold, palladium, aluminium, chromium, titanium, zinc and contains the metal level that the alloy of one or more materials in the above-mentioned material forms.In addition, can suitably select metal material according to desired shield effectiveness.Easily oxidized when copper contacts with atmosphere, gold then price is too high, therefore, and preferred cheap aluminium or the high silver of reliability.In addition, film thickness can according to desired shield effectiveness and property be moved in anti-alternating bending/wiping and suitable the selection gets final product, but preferred thickness is 0.01 μ m-10 μ m.When thickness can not obtain sufficient shield effectiveness during less than 0.01 μ m, bendability existing problems when surpassing 10 μ m.In addition, the formation method of conductive layer 122 has vacuum moulding machine, sputter, CVD method, the organic method of MO(metal), gold-plated, slice method etc., but with regard to the batch production aspect, preferred vacuum deposition method, thus can access cheap and stable conductive layer 122.In addition, as mentioned above, when electric conducting material 123 is formed by the isotropic conductivity adhesive, sometimes can also omit conductive layer 122 is set.
Insulating barrier 121 is formed by the resin such as epoxies, polyesters, acrylic compounds, phenol and carbamates or above-mentioned resin blend thing, plays to keep insulating properties and cover conductive layer 122 can directly not expose it to the outside effect.In addition, the thickness of insulating barrier 121 is 1 μ m-10 μ m, but does not need to be limited especially, can suitably set.
In the above description, describe centered by characteristic, so that can be more readily understood the application, yet the application is not limited to the execution mode put down in writing in above-mentioned detailed description, but can also be applicable to other execution mode, should enlarge as far as possible and explain its scope of application.For example, in the present embodiment, printed circuit board (PCB) 1 comprises film 120, but is not limited to this, as shown in Figure 2, can also omit film 120 is set.
In addition, the term that uses in this manual and grammer only are used for explaining in precise term the application, and the explanation that is not used in the application is limited.In addition, the concept of the invention that can put down in writing from this specification of person of ordinary skill in the field other the formation, system, method etc. of expecting easily that the application's concept comprises.Thus, the claimed scope of claims should comprise the equivalent structure of the scope that does not break away from present techniques thought.In addition, for the purpose that fully understands the application and the application's effect, expectation is fully with reference to disclosed document etc.
[embodiment 1]
Be determined in embodiment 1,2 that the surface area ratio of nickel hydroxide and nickel is the peel strength of the strengthening part (nickel dam) of 1.8-3.0 in the surface.In addition, in comparative example 1,2, measure above-mentioned ratio less than the peel strength of 1.8 strengthening part.
In addition, employed strengthening part is of a size of 10mm * 180mm * 0.2mm.The conductive adhesive layer of bonding strengthening part has used the CBF-300(thickness 40 μ m of Japanese Tatsuta Densen K. K. system).In addition, the surface area ratio of the nickel plating process of strengthening part, nickel plating thickness, nickel hydroxide and nickel all is documented in the table 1.
In addition, based on JIS C6471(1995) the peeling off of mechanical test/peel strength of copper foil, method A(90 ° direction) standard carried out the mensuration of peel strength.
(embodiment 1,2 and comparative example 1,2 measurement result)
Measure by above-mentioned peel strength to strengthening part, and measurement result is shown in Table 1.In addition, " zero " on " peel strength value evaluation " hurdle expression has obtained as the required suitable peel strength that possesses of strengthening part, that is, peel strength value is more than or equal to 10N/cm.In addition, " * " on same hurdle represents that then peel strength value is less than 10N/cm.
[table 1]
Figure BDA00001885091800091
According to above-mentioned measurement result, as can be known: the surface area ratio less than 1.8 comparative example 1 and 2 in, can not obtain as the suitable peel strength of strengthening part.In addition, as can be known: be among the embodiment 1 and 2 of 1.8-3.0 at the surface area ratio, obtained as the suitable peel strength of strengthening part.That is from the above: for obtaining suitable peel strength, the surface area ratio on strengthening part (nickel dam) surface is preferably 1.8-3.0.
In addition, all plate to form nickel dam by the electrolysis of bathing with nickel sulfamic acid in embodiment 1 and 2, therefore, as can be known: as the nickel plating process that forms nickel dam, nickel sulfamic acid is bathed comparatively suitable.
[embodiment 2]
The surface gloss of having measured the nickel dam that bathe to form by nickel sulfamic acid in embodiment 1-5 is less than or equal to the resistance value of 500 strengthening part.In addition, in comparative example 1-7 respectively to the strengthening part of not implementing nickel plating, by watt hereby bathing the strengthening part that forms nickel dam and having carried out resistance value mensuration by the strengthening part that forms nickel dam without the electrolytic nickel plating.
In addition, the strengthening part of use is of a size of 10mm * 180mm * 0.2mm.In addition, when measuring resistance value, use " the load type variable contact resistance analyzer " of Yamazaki Co. Ltd.'s essence machine institute system, load has been fixed as 0.5N, measured the sheet resistance value on the two sides (A face and B face) of strengthening part.In addition, be that strengthening part after 85 ℃, humidity are to place 96 hours under the environment of 85%RH carries out resistance value and measures to the strengthening part of initial condition with in temperature respectively, and the mean value on the two sides (A face and B face) of strengthening part is made as resistance value.In addition, the nickel plating process of employed strengthening part, nickel plating thickness are shown in the table 2.
In addition, use the portable gloss degree meter PG-1 of Japanese electric look Co., Ltd. system to measure under the following conditions glossiness, that is: to measure angle and be 60 °, optics be JIS Z8741, follow ISO 2813, ATSM D 523, DIN 67530, light source are that tungsten lamp, detector are photodiode.Respectively any three positions of the leading section of sample, pars intermedia, rearward end are measured 9 positions totally, their mean value is made as glossiness.
(measurement result of embodiment 3-7 and comparative example 3-7)
As mentioned above the resistance value of strengthening part has been carried out measuring and measurement result being shown in Table 2.In addition, " zero " expression on " resistance value evaluation " hurdle: (A) initial resistivity value is less than 1 Ω, and, (B) temperature be the resistance value of strengthening part after 85 ℃ and humidity are to place 96 hours under the environment of 85%RH divided by the value of (A) initial resistivity value gained less than 12.In addition, " * " on same hurdle expression: (A) initial resistivity value is more than or equal to 1 Ω; Perhaps, (B) temperature be the resistance value of strengthening part after 85 ℃ and humidity are to place 96 hours under the environment of 85%RH divided by the value of (A) initial resistivity value gained more than or equal to 12.
[table 2]
According to above-mentioned measurement result, as can be known: the comparative example 3 of not implementing nickel plating all can not obtain suitable resistance value in initial condition with in temperature is state after 85 ℃ and humidity are to place 96 hours under the environment of 85%RH.In addition, as can be known: glossiness greater than 500 comparative example 4 and 5 in, be that strengthening part failed to obtain suitable resistance value after 85 ℃ and humidity were to place 96 hours under the environment of 85%RH in temperature.In addition, as can be known: by watt hereby bathing or form among the comparative example 4-7 of nickel dam without the electrolytic nickel plating, be that strengthening part failed to obtain suitable resistance value after 85 ℃ and humidity were to place 96 hours under the environment of 85%RH in temperature.
In addition, as can be known: glossiness is less than or equal to 500, and no matter form among the embodiment 3-7 of nickel dam by the electrolysis plating of using nickel sulfamic acid to bathe, be to be that strengthening part all can obtain suitable resistance value under the state after 85 ℃ and humidity are to place 96 hours in the environment of 85%RH in initial condition or in temperature.That is, from the above: obtain suitable resistance value, the glossiness on strengthening part (nickel dam) surface is preferably and is less than or equal to 500, preferably forms nickel dam by the electrolysis plating of using nickel sulfamic acid to bathe.

Claims (3)

1. a printed circuit board (PCB) is characterized in that, comprising:
Strengthening part is formed with nickel dam on the surface of the base material of being made by stainless steel; And
The conductive adhesive layer is bonded on the surface of described strengthening part,
In the surface of described strengthening part, the surface area ratio of nickel hydroxide and nickel is 1.8-3.0.
2. a printed circuit board (PCB) is characterized in that, comprising:
Strengthening part is formed with nickel dam on the surface of the base material of being made by stainless steel; And
The conductive adhesive layer is bonded on the surface of described strengthening part,
The surface gloss of described strengthening part is less than or equal to 500,
In the surface of described strengthening part, the surface area ratio of nickel hydroxide and nickel is 1.8-3.0.
3. printed circuit board (PCB) according to claim 1 and 2 is characterized in that,
In described strengthening part, described nickel dam forms by the electrolysis plating of using the nickel sulfamic acid bath.
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