CN102911479B - High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method - Google Patents
High heat conduction epoxy resin composition applicable to fully wrapped devices and preparation method Download PDFInfo
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Abstract
An epoxy resin composition applicable to fully wrapped devices is composed of an epoxy resin, a phenolic resin, an inorganic filling agent, a heat conduction filler and an additive. The epoxy resin is represented as a formula (1) and/or a formula (2), and the mass content of the epoxy resin is 2-7% of the total mass of the composition; the phenolic resin is represented as a formula (3) and/or a formula (4), and the mass content of the phenolic resin is 2-7% of the total mass of the composition; and the heat conduction filler is a crystallized silicon dioxide powder, an aluminum oxide powder or a silicon nitride powder. The invention further discloses a preparation method of the epoxy resin composition. The epoxy resin composition has the advantages of being wide in applicability, high in filling, few in pores and high in reliability. According to the preparation method, open mixing rollers are added between an extruder and a fluted roller in traditional epoxy resin composition production processes for open milling and mixing, and a thread groove is added onto a grooved roller with low temperatures, so that the preparation method has the advantages of being high in conveying capacity and large in shear cutting force.
Description
Technical field
The present invention relates to a kind of composition epoxy resin, particularly a kind of high-thermal-conductivity epoxy resin composition being applicable to total incapsulation device; The invention still further relates to the preparation method of this composition epoxy resin.
Background technology
Total incapsulation device is mainly used for the electronic product requiring that electric current is large, power is high, and its back side thickness is generally 0.9-1.0mm, and such thickness have impact on the thermal diffusivity of total incapsulation device greatly.When dispelling the heat bad, the temperature of electronic product operationally can reach more than 70 DEG C, and temperature high like this will produce impact greatly to the job stability of triode, thus produces great effect to the performance of whole electronic product.Therefore, in order to improve thermal diffusivity, ensure the working reliability of electronic product, the back side thickness of current total incapsulation device is to slim development, and its back side thickness, from 0.9-1.0mm, is reduced to 0.7mm, 0.5mm gradually, and back side thickness the thinnest is in the market 0.43mm.Back side thickness reduces to original over half.After back side thickness reduces, narrow and small due to backside space, this device is when encapsulating, during the flowing of plastic cement in its front and the back side, resistance difference increases, thus cause flow velocity difference also to become large, easily cause and form pore overleaf, or cause and fill the plastic package process defects such as discontented.
Mill mainly relies on two relatively pivotal rollers to produce extruding, shearing action to material in mixing process, through repeatedly kneading, and adjoint chemical action in kneading process, the macromolecular chain of internal batch is interrupted, make the various composition blendings of internal batch evenly, and finally reach mixing object.And this traditional mode is often many along with insolubles, the features such as melting effect difference.
Summary of the invention
Technical problem to be solved by this invention is for the deficiencies in the prior art, provide a kind of formulation ratio rationally, the high-thermal-conductivity epoxy resin composition being applicable to total incapsulation device that the back side is less than the total incapsulation device needs of 0.9mm can be met simultaneously.
Another technical problem to be solved by this invention there is provided a kind of preparation method of composition epoxy resin as above.The method can reduce the bubble of composition epoxy resin effectively, improves the encapsulating performance of product.
Technical problem to be solved by this invention is realized by following technical scheme.The present invention is a kind of composition epoxy resin being suitable for total incapsulation device, is characterized in: said composition is made up of epoxy resin, resol, inorganic filler, heat-conducting filler and additive;
Described epoxy resin is the epoxy resin shown in general formula [1] and/or general formula [2]; What the content of epoxy resin accounted for composition total mass is 2 ~ 7%;
【1】
【2】
Described resol is the resol shown in general formula [3] and/or general formula [4], and the content of resol accounts for 2 ~ 7% of composition total mass;
【3】
【4】
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or alpha-silicon nitride powders; The content of described heat-conducting filler is 5 ~ 20% of composition total mass;
The content of described mineral filler is 65 ~ 80% of total composition quality; And the summation of the content of mineral filler and heat-conducting filler is always organize quality 70 ~ 90%;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of often kind of additive is 0.1 ~ 1% of composition total content.
In composition technical scheme of the present invention: described heat-conducting filler is preferably type ground silica end, obtuse angle or spherical alumina aluminium powder form.
Technical problem to be solved by this invention can also be realized further by following technical scheme.The invention also discloses a kind of preparation method of the composition as described in above technical scheme, be characterized in, its step is as follows:
Resol in composition epoxy resin is joined in ball mill with the additive except liquid type and carries out ball milling 1 ~ 2 hour, after stirring in agitator with other materials in composition in proportion again, extrude through forcing machine, after extruding through open refining mixing roller carry out out refining mixing, again through stack calendering in flakes, pulverize after cooling zone cooling, obtain resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller be set up in parallel, and one of them is ganoid smooth roll, and another is the grooved roller that surface is provided with thread groove; Open smooth roll and grooved roller when refining mixing to rotate in opposite directions, and the rotating ratio of the two is 1 ~ 1.5:1; The temperature opening smooth roll when refining mixing is 50 ~ 150 DEG C, and the temperature of grooved roller is 0-50 DEG C.
In preparation method's technical scheme of the present invention, preferred technical scheme is further:
1. the preferred rotating ratio of smooth roll and grooved roller is 1.1 ~ 1.2:1; The temperature opening smooth roll when refining mixing is preferably 70 ~ 100 DEG C, and the temperature of grooved roller is preferably 0-25 DEG C.
2. the grooved roller described in and the diameter of smooth roll are preferably 150 ~ 800mm, and length is preferably 300 ~ 2500mm.
3. described in, the thread groove width of grooved roller is preferably 2 ~ 20mm, and groove depth is preferably 1 ~ 10mm.
4. the thread groove of grooved roller described in and grooved roller axis acutangulate and are preferably 30 ~ 65 °, more preferably 35 ~ 55 °.
In the present composition: epoxy resin shown in general formula [1] and [2], can be used alone, also can two kinds used in combination, be preferably two kinds used in combination.Time used in combination, general formula [1] preferably accounts for 10 ~ 60% of epoxy resin quality, and further preferred formula [2] is than the content height about 10 ~ 20% of general formula [1].General formula [3], the resol shown in [4] can be used alone, also can be used in combination.Be preferably two kinds used in combination.Time used in combination, general formula [3] accounts for 10 ~ 40% of resol quality.The equivalence ratio of epoxy resin and resol, the ratio of the hydroxyl value in the epoxy radix/resol namely in epoxy resin, is preferably 0.5 ~ 1.2, more preferably 0.9 ~ 1.0.Described inorganic filler is fused silica powder, can be spherical, also can be dihedral.Described heat-conducting filler is ground silica end, also can be alumina powder.Ground silica end can be medium-sized, also can be obtuse angle.Alumina powder can be spherical, also can be dihedral.Be preferably type ground silica end, obtuse angle or spherical alumina aluminium powder form.Curing catalyst in the present invention has no particular limits, and that can enumerate has triphenylphosphine, DBU, imidazoles and azoles azole derivative and its esters and other curing catalysts.Consider from speed of response and shelf lives angle, preferably triphenylphosphine, DBU and imidazole derivative.The various additives needed for other various epoxy plastic cements that the present invention also uses, include but not limited to that releasing agent, coupling agent, tinting material, stress relief agent and ion catch short agent etc.Releasing agent comprises lipid acid, montanic acid, palmitinic acid, oxidized form or Non-oxidized polyethylene wax etc., and these releasing agents can ensure that the resin after solidifying can take out from the mould of metastasis model device.Coupling agent comprises the conventional siloxanes such as epoxy silane, aminosilane, hydrosulphonyl silane.Tinting material is carbon black mainly.Stress relief agent can coordinate with silicone oil or polysiloxane rubber powder etc.Ion capturing agent has no particular limits, and can use known anion ion exchange body, as hydrotalcite or the hydrous oxide etc. containing the element selected from magnesium, aluminium, titanium, zirconium, bismuth.They may be used singly or in combination of two or more.
The present composition in the preparation, have employed new opening and refines mixing roller, changes mill tradition scraper knife type stirring pattern.Opening the grooved roller refining mixing roller adopts thread forms to carry out mixing, the material in roller gap is realized to carry out spiral-push conveying, due to two roller surface speed and temperature difference and be coated on a roller, return between two rollers, so repeatedly reciprocal, complete continuous kneading effect, it can reduce the wearing and tearing of mixing roller, effectively avoids the generation of material insolubles.
Total incapsulation high-thermal-conductivity epoxy resin composition of the present invention, by content and the kind adjustment of the various component of this resin combination, coordinates with suitable mineral filler and heat-conducting filler.Further cooperation in the process of the present invention, can solve back side pore common when the slim total incapsulation device in the back side is encapsulated and fill the defects such as discontented, and having very high reliability.Packaging process requirement and reliability requirement that the encapsulation back side is less than the total incapsulation device of 0.9mm can be reached.
Add out between the forcing machine of preparation method of the present invention in traditional composition epoxy resin production technique and stack and refine mixing roller and carry out out refining mixing.And on the grooved roller that temperature is lower, with the addition of thread groove, have the grooved roller of thread groove compared with the smooth roll not having thread groove, there is carrying capacity strong, the feature that front shear force is strong.
It is extensive that composition epoxy resin of the present invention has suitability, and high filling, the feature that pore is few, reliability is high, be specially adapted to be suitable for total incapsulation device.
Accompanying drawing explanation
Fig. 1 is out a kind of schematic diagram refining mixing roller;
Fig. 2 is a kind of structural representation of grooved roller.
Embodiment
Referring to accompanying drawing, further describe concrete technology implementation scheme of the present invention, to make those skilled in the art understand the present invention further, but scope of the present invention is not limited to these examples.
Embodiment 1, a kind of composition epoxy resin being suitable for total incapsulation device, said composition is made up of epoxy resin, resol, inorganic filler, heat-conducting filler and additive;
Described epoxy resin is the epoxy resin shown in general formula [1] Yu general formula [2]; The ratio of the two is respectively not less than 30% of amount of epoxy, and what the content of epoxy resin accounted for composition total mass is 4%;
Described resol is the resol shown in general formula [3] Yu general formula [4], and the ratio of the two is respectively not less than 10% of resol amount, and the content of resol accounts for 4% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or alpha-silicon nitride powders; The content of described heat-conducting filler is 5% of composition total mass;
The content of described mineral filler is 80% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of often kind of additive is 1% of composition total content.
Embodiment 2, a kind of composition epoxy resin being suitable for total incapsulation device, said composition is made up of epoxy resin, resol, inorganic filler, heat-conducting filler and additive;
Described epoxy resin is the epoxy resin shown in general formula [1] or general formula [2]; What the content of epoxy resin accounted for composition total mass is 3%;
Described resol is the resol shown in general formula [3] or general formula [4], and the content of resol accounts for 2% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or alpha-silicon nitride powders; The content of described heat-conducting filler is 20% of composition total mass;
The content of described mineral filler is 70% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of often kind of additive is 0.1 ~ 1% of composition total content, and the total amount of additive is 5% of composition total content.
Embodiment 3, a kind of composition epoxy resin being suitable for total incapsulation device, said composition is made up of epoxy resin, resol, inorganic filler, heat-conducting filler and additive;
Described epoxy resin is the epoxy resin shown in general formula [1] Yu general formula [2]; The ratio of the two is respectively not less than 10% of amount of epoxy, and what the content of epoxy resin accounted for composition total mass is 7%;
Described resol is the resol shown in general formula [3] Yu general formula [4], and the ratio of the two is respectively not less than 30% of resol amount, and the content of resol accounts for 6% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or alpha-silicon nitride powders; The content of described heat-conducting filler is 15% of composition total mass;
The content of described mineral filler is 65% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of often kind of additive is 1% of composition total content.
Embodiment 4, a kind of composition epoxy resin being suitable for total incapsulation device, said composition is made up of epoxy resin, resol, inorganic filler, heat-conducting filler and additive;
Described epoxy resin is the epoxy resin shown in general formula [1] Yu general formula [2]; The ratio of the two is respectively not less than 40% of amount of epoxy, and what the content of epoxy resin accounted for composition total mass is 2%;
Described resol is the resol shown in general formula [3] Yu general formula [4], and the ratio of the two is respectively not less than 40% of resol amount, and the content of resol accounts for 3% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or alpha-silicon nitride powders; The content of described heat-conducting filler is 12% of composition total mass;
The content of described mineral filler is 78% of total composition quality; Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of often kind of additive is 0.1 ~ 1% of composition total content, and the total amount of additive is 6% of composition total content.
Embodiment 5, a kind of composition epoxy resin being suitable for total incapsulation device, said composition is made up of epoxy resin, resol, inorganic filler, heat-conducting filler and additive;
Described epoxy resin is the epoxy resin shown in general formula [1] Yu general formula [2]; The ratio of the two is respectively not less than 40% of amount of epoxy, and what the content of epoxy resin accounted for composition total mass is 6%;
Described resol is the resol shown in general formula [3] Yu general formula [4], and the ratio of the two is respectively not less than 20% of resol amount, and the content of resol accounts for 7% of composition total mass;
In various: n=0-5; M=1-5;
Described heat-conducting filler is one or several in ground silica end, alumina powder or alpha-silicon nitride powders; The content of described heat-conducting filler is 8% of composition total mass;
The content of described mineral filler is 74% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of often kind of additive is 0.1 ~ 1% of composition total content, and the total amount of additive is 5% of composition total content.
Embodiment 6, in the composition of embodiment 1-5 described in any one: described heat-conducting filler is type ground silica end, obtuse angle or spherical alumina aluminium powder form.
Embodiment 7, a kind of preparation method as the composition in embodiment 1-6 as described in any one, its step is as follows:
Resol in composition epoxy resin is joined in ball mill with the additive except liquid type and carries out ball milling 1 ~ 2 hour, after stirring in agitator with other materials in composition in proportion again, extrude through forcing machine, after extruding through open refining mixing roller carry out out refining mixing, again through stack calendering in flakes, pulverize after cooling zone cooling, obtain resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller be set up in parallel, and one of them is ganoid smooth roll, and another is the grooved roller that surface is provided with thread groove; Open smooth roll and grooved roller when refining mixing to rotate in opposite directions, and the rotating ratio of the two is 1.2:1; The temperature opening smooth roll when refining mixing is 100 DEG C, and the temperature of grooved roller is 25 DEG C.
Embodiment 8, a kind of preparation method as the composition in embodiment 1-6 as described in any one, its step is as follows:
Resol in composition epoxy resin is joined in ball mill with the additive except liquid type and carries out ball milling 1 ~ 2 hour, after stirring in agitator with other materials in composition in proportion again, extrude through forcing machine, after extruding through open refining mixing roller carry out out refining mixing, again through stack calendering in flakes, pulverize after cooling zone cooling, obtain resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller be set up in parallel, and one of them is ganoid smooth roll, and another is the grooved roller that surface is provided with thread groove; Open smooth roll and grooved roller when refining mixing to rotate in opposite directions, and the rotating ratio of the two is 1.1:1; The temperature opening smooth roll when refining mixing is 80 DEG C, and the temperature of grooved roller is 25 DEG C.
Embodiment 9, a kind of preparation method as the composition in embodiment 1-6 as described in any one, its step is as follows:
Resol in composition epoxy resin is joined in ball mill with the additive except liquid type and carries out ball milling 1 ~ 2 hour, after stirring in agitator with other materials in composition in proportion again, extrude through forcing machine, after extruding through open refining mixing roller carry out out refining mixing, again through stack calendering in flakes, pulverize after cooling zone cooling, obtain resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller be set up in parallel, and one of them is ganoid smooth roll, and another is the grooved roller that surface is provided with thread groove; Open smooth roll and grooved roller when refining mixing to rotate in opposite directions, and the rotating ratio of the two is 1:1; The temperature opening smooth roll when refining mixing is 50 DEG C, and the temperature of grooved roller is 0 DEG C.
Embodiment 10, a kind of preparation method as the composition in embodiment 1-6 as described in any one, its step is as follows:
Resol in composition epoxy resin is joined in ball mill with the additive except liquid type and carries out ball milling 1 ~ 2 hour, after stirring in agitator with other materials in composition in proportion again, extrude through forcing machine, after extruding through open refining mixing roller carry out out refining mixing, again through stack calendering in flakes, pulverize after cooling zone cooling, obtain resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller be set up in parallel, and one of them is ganoid smooth roll, and another is the grooved roller that surface is provided with thread groove; Open smooth roll and grooved roller when refining mixing to rotate in opposite directions, and the rotating ratio of the two is 1.4:1; The temperature opening smooth roll when refining mixing is 70 DEG C, and the temperature of grooved roller is 10 DEG C.
Embodiment 11, in the preparation method in embodiment 7-10 described in any one: described grooved roller and the diameter of smooth roll are 150 ~ 800mm, length is 300 ~ 2500mm.
Embodiment 12, in the preparation method in embodiment 7-11 described in any one: the thread groove width of described grooved roller is 2 ~ 20mm, and groove depth is 1 ~ 10mm.
Embodiment 13, in the preparation method in embodiment 7-12 described in any one: it is 30 ~ 65 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
Embodiment 14, in the preparation method in embodiment 7-10 described in any one: it is 35 ~ 55 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
Embodiment 15, a kind of composition epoxy resin being suitable for total incapsulation device, said composition is made up of epoxy resin, resol, inorganic filler, heat-conducting filler and additive;
Described epoxy resin is the epoxy resin shown in general formula [1] Yu general formula [2]; What the content of epoxy resin accounted for composition total mass is 4%; Its formula of [1] and general formula [2] respectively account for 40% and 60% of epoxy resin;
Described resol is the resol shown in general formula [3] Yu general formula [4], and the content of resol accounts for 4% of composition total mass; General formula [3] and general formula [4] respectively account for 50% of resol;
In various: n=0-5; M=1-5;
Described heat-conducting filler is type ground silica end, obtuse angle; The content of described heat-conducting filler is 11.5% of composition total mass; The content of described mineral filler is 77% of total composition quality;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of often kind of additive is 0.5% of composition total content.
Preparation method's step is as follows:
Resol in composition epoxy resin is joined in ball mill with the additive except liquid type and carries out ball milling 1 ~ 2 hour, after stirring in agitator with other materials in composition in proportion again, extrude through forcing machine, after extruding through open refining mixing roller carry out out refining mixing, again through stack calendering in flakes, pulverize after cooling zone cooling, obtain resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller be set up in parallel, and one of them is ganoid smooth roll, and another is the grooved roller that surface is provided with thread groove; Open smooth roll and grooved roller when refining mixing to rotate in opposite directions, and the rotating ratio of the two is 1.2:1; The temperature opening smooth roll when refining mixing is 75 DEG C, and the temperature of grooved roller is 15 DEG C.
Described grooved roller and the diameter of smooth roll are 500mm, and length is 1500mm.The thread groove width of described grooved roller is 10mm, and groove depth is 5mm.It is 45 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
Get the present embodiment to obtain composition epoxy resin and carry out Experiment of correlation detection.
Test condition: utilize transfer moIding machine, die temperature 175 DEG C, forming pressure 5MPa, set time 120s condition under carry out.In addition, post cure condition is 175 DEG C, 6 hours.
(1) gel time: carry out mensuration gelation time (s) by the 5.3rd article of gelation time of SJ/T 11197-1999 epoxy molding plastic.
(2) length of flow: carry out mensuration flow distance (cm) by the 5.2nd article of Spiral flow length of SJ/T 11197-1999 epoxy molding plastic.
(3) flame retardant resistance: the flame retardant resistance measuring material by the 5.12nd article of flame retardant resistance of SJ/T 11197-1999 epoxy molding plastic.
(4) CTE and Tg: measure CTE and Tg by the 5.6th article of linear expansivity of SJ/T 11197-1999 epoxy molding plastic and second-order transition temperature.
(5) water-intake rate: the water-intake rate measuring embodiment by the 5.11st article of water-intake rate of SJ/T 11197-1999 epoxy molding plastic.
Experimental result sees table.
Claims (7)
1. be suitable for a composition epoxy resin for total incapsulation device, it is characterized in that: said composition is made up of epoxy resin, resol, inorganic filler, heat-conducting filler and additive;
Described epoxy resin is the epoxy resin shown in general formula [1] and/or general formula [2]; What the content of epoxy resin accounted for composition total mass is 2 ~ 7%;
Described resol is the resol shown in general formula [3] and/or general formula [4], and the content of resol accounts for 2 ~ 7% of composition total mass;
In various: n=0-5; M=1-5; And n is not 0 in formula [1];
Described heat-conducting filler is one or several in ground silica end, alumina powder or alpha-silicon nitride powders; The content of described heat-conducting filler is 5 ~ 20% of composition total mass;
The content of described mineral filler is 65 ~ 80% of total composition quality; And the summation of the content of mineral filler and heat-conducting filler is 70 ~ 90% of total mass;
Described additive is curing catalyst, releasing agent, coupling agent, tinting material, fire retardant, stress relief agent and ion capturing agent, and the content of often kind of additive is 0.1 ~ 1% of composition total content;
The summation of all material contents of said composition is 100%;
Its preparation methods steps is as follows:
Resol in composition epoxy resin is joined in ball mill with the additive except liquid and carries out ball milling 1 ~ 2 hour, after stirring in agitator with other materials in composition in proportion again, extrude through forcing machine, after extruding through open refining mixing roller carry out out refining mixing, again through stack calendering in flakes, pulverize after cooling zone cooling, obtain resin combination;
The described mixing roller of refining of opening comprises two cylindrical roller be set up in parallel, and one of them is ganoid smooth roll, and another is the grooved roller that surface is provided with thread groove; Open smooth roll and grooved roller when refining mixing to rotate in opposite directions, and the rotating ratio of the two is 1 ~ 1.5:1; The temperature opening smooth roll when refining mixing is 50 ~ 150 DEG C, and the temperature of grooved roller is 0-50 DEG C.
2. composition according to claim 1, is characterized in that: described heat-conducting filler is type ground silica end, obtuse angle or spherical alumina aluminium powder form.
3. composition according to claim 1, is characterized in that: the rotating ratio of smooth roll and grooved roller is 1.1 ~ 1.2:1; The temperature opening smooth roll when refining mixing is 70 ~ 100 DEG C, and the temperature of grooved roller is 0-25 DEG C.
4. composition according to claim 1 and 2, is characterized in that: described grooved roller and the diameter of smooth roll are 150 ~ 800mm, and length is 300 ~ 2500mm.
5. composition according to claim 1 and 2, is characterized in that: the thread groove width of described grooved roller is 2 ~ 20mm, and groove depth is 1 ~ 10mm.
6. composition according to claim 1 and 2, is characterized in that: it is 30 ~ 65 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
7. composition according to claim 6, is characterized in that: it is 35 ~ 55 ° that the thread groove of described grooved roller and grooved roller axis acutangulate.
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| CN103602038A (en) * | 2013-11-07 | 2014-02-26 | 林云波 | Preparation method of high-heat-conductivity phenol aldehyde resin-base high polymer material |
| CN104497490B (en) * | 2014-12-22 | 2017-08-25 | 科化新材料泰州有限公司 | High-thermal-conductivity epoxy resin composition for total incapsulation device and preparation method thereof |
| CN104804378A (en) * | 2015-04-29 | 2015-07-29 | 海太半导体（无锡）有限公司 | Semiconductor plastic package material |
| CN105199318B (en) * | 2015-09-24 | 2017-12-26 | 苏州宽温电子科技有限公司 | A kind of preparation method of resin base heat-conductive copper-clad plate |
| CN107141721B (en) * | 2017-06-02 | 2019-11-22 | 江苏华海诚科新材料股份有限公司 | A kind of high dielectric constant composition epoxy resin and preparation method thereof |
| CN110128782A (en) * | 2018-02-09 | 2019-08-16 | 衡所华威电子有限公司 | Compatible anticorrosive composition epoxy resin of a kind of copper wire and preparation method thereof |
| CN111073217B (en) * | 2019-12-23 | 2022-10-14 | 江苏科化新材料科技有限公司 | High-thermal-conductivity low-stress epoxy plastic packaging material for semiconductor packaging |
| CN111153631A (en) * | 2020-02-25 | 2020-05-15 | 长兴电子材料（昆山）有限公司 | High-thermal-conductivity and high-reliability epoxy resin composition and application thereof |
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| CN102504493A (en) * | 2011-11-18 | 2012-06-20 | 江苏华海诚科新材料有限公司 | Epoxy resin composition applicable to pre-encapsulation of inner interconnection framework system |
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| WO2010078689A1 (en) * | 2009-01-06 | 2010-07-15 | Dow Global Technologies Inc. | Metallic compounds in non-brominated flame retardant epoxy resins |
| CN102408545A (en) * | 2011-10-19 | 2012-04-11 | 江苏华海诚科新材料有限公司 | Resin compound used for sealing rare earth permanent magnet coreless energy-saving motor |
| CN102432980A (en) * | 2011-10-19 | 2012-05-02 | 江苏华海诚科新材料有限公司 | Epoxy resin composition for semiconductor packaging and preparation method thereof |
| CN102504493A (en) * | 2011-11-18 | 2012-06-20 | 江苏华海诚科新材料有限公司 | Epoxy resin composition applicable to pre-encapsulation of inner interconnection framework system |
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