CN102909954B - Thin film pattern forming apparatus, thin film pattern forming method and adjustment method for thin film pattern forming apparatus - Google Patents

Thin film pattern forming apparatus, thin film pattern forming method and adjustment method for thin film pattern forming apparatus Download PDF

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Publication number
CN102909954B
CN102909954B CN201210275135.XA CN201210275135A CN102909954B CN 102909954 B CN102909954 B CN 102909954B CN 201210275135 A CN201210275135 A CN 201210275135A CN 102909954 B CN102909954 B CN 102909954B
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China
Prior art keywords
nozzle
substrate
nozzle unit
pattern
thin
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CN201210275135.XA
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Chinese (zh)
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CN102909954A (en
Inventor
冈本裕司
矶圭二
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Priority claimed from JP2011172026A external-priority patent/JP2013038177A/en
Priority claimed from JP2011253517A external-priority patent/JP2013110236A/en
Priority claimed from JP2012111095A external-priority patent/JP2013237004A/en
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Publication of CN102909954A publication Critical patent/CN102909954A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials

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  • Coating Apparatus (AREA)

Abstract

The present invention provides a film pattern forming apparatus, a film pattern forming method and an adjustment method for the thin film pattern forming apparatus. When unfavorable conditions such as the nozzle hole blockage are occurs, the apparatus in operation has to be stopped to replace the nozzle. So a technology which can reduce stop time in the operation of the apparatus is expected. The film pattern forming apparatus of the present invention, is provided with a nozzle unit with a plurality of nozzle holes which discharge droplets of the film materials, and the nozzle unit is arranged opposite to the substrate held in a loading station. The substrate is moved towards the direction of the surface of the substrate by a moving mechanism relative to the nozzle unit. A first image-capturing device detects a film pattern formed by coating the film materials on the substrate. A control device enables the droplets of the film materials to be discharged toward the substrate from the nozzle unit, and an inspection pattern is formed by the film material adhered to the substrate. Further, whether the nozzle holes of the nozzle unit are in good condition is determined by the acquisition and analysis of image data of the inspection pattern captured by using the first image-capturing device captured image data.

Description

Thinfilm pattern forms the method for adjustment of device, thin-film pattern forming method and device
Technical field
The present invention relates to a kind of by forming the device of Thinfilm pattern, the formation method of Thinfilm pattern and the method for adjustment of device from nozzle towards the spue drop of thin-film material of substrate.
Background technology
The method in the past that forms welding resistance resist pattern at printing distributing board is described.First, be formed with whole coating photonasty welding resistance resist of the printing distributing board of circuit design on surface.Utilize predetermined mask pattern, after welding resistance resist film is exposed, develop, form thus welding resistance resist pattern.
By welding resistance resist droplet treatment, make drop only be attached to the desired region of printing distributing board and it is solidified, the technology that is formed with thus welding resistance resist pattern gets most of the attention.The drop of welding resistance resist spues towards printing distributing board from multiple nozzles.Can be by make drop solidify to the surperficial drop irradiation ultraviolet radiation that is attached to printing distributing board.
Patent documentation 1: TOHKEMY 2004-104104 communique
Sometimes because the liquid materials such as welding resistance resist produce the unfavorable conditions such as obstruction at nozzle bore.If produce the unfavorable condition such as spray nozzle clogging, the device in having to shut down is also changed shower nozzle.Expect the technology of the running dwell time of reduction device.And the technology of the bad Recovery processing (correction process) of nozzle bore is promptly carried out in expectation.
Summary of the invention
Based on a viewpoint of the present invention, provide a kind of Thinfilm pattern to form device, it has:
Objective table, keeps substrate;
Nozzle unit, opposed and be provided with to spue multiple nozzle bores of drop of thin-film material of described substrate with described substrate;
Travel mechanism, with respect to described nozzle unit, moves described substrate to direction in the face of this substrate;
The 1st filming apparatus, detects the Thinfilm pattern being formed by the thin-film material of coating described substrate; And
Control device,
Described control device makes the drop of thin-film material spue to described substrate from described nozzle unit, forms check pattern by the thin-film material that is attached to described substrate,
Obtain the view data of the described check pattern of taking with described the 1st filming apparatus,
Judge that by analyzing the view data of obtaining whether the nozzle bore of described nozzle unit is good.
Based on other viewpoints of the present invention, a kind of thin-film pattern forming method is provided, described thin-film pattern forming method has:
Form the operation of the check pattern being formed by thin-film material at substrate from thering is the spue drop of thin-film material of the nozzle unit of multiple nozzle bores;
The operation of judging that by observing described check pattern whether described nozzle bore is good; And
Spue the state of thin-film material from being judged to be bad described nozzle bore stopping, from the normal described nozzle bore thin-film material that spues, on substrate, form thus the operation as the Thinfilm pattern of target.
Based on another other viewpoints of the present invention, a kind of method of adjustment of film forming device is provided, described film forming device has:
Objective table, it keeps substrate at maintenance face;
Multiple shower nozzles, it is with to remain on the substrate of described objective table opposed and be formed with towards spue multiple nozzle bores of drop of thin-film material of described substrate;
Travel mechanism, makes described objective table move towards the direction parallel with described maintenance face with respect to the opposing party with the side in described shower nozzle; And
Filming apparatus, can move with respect to described shower nozzle, and is configured to and can moves to the position that can take described nozzle bore,
Described method of adjustment has:
Described filming apparatus is moved to the position that can take described shower nozzle, and take the operation of at least 2 described shower nozzles; And
According to the image of the described shower nozzle photographing, adjust the operation of the relative position of multiple described shower nozzles.
Invention effect:
Can prevent to result from that the Thinfilm pattern of bad nozzle bore is bad by making to be judged to be the do not spue control of thin-film material of bad nozzle bore.And, even also can carry out the formation of Thinfilm pattern under the state that produces bad nozzle bore, carry out thus the decline of restraining device running rate.
Can adjust like a cork by taking at least 2 described shower nozzles the relative position of shower nozzle.
Brief description of the drawings
Fig. 1 is the synoptic diagram of the drawing apparatus of embodiment 1.
Fig. 2 A is the stereogram of nozzle unit, and Fig. 2 B is the upward view of nozzle unit.
Fig. 3 is the figure that represents the position relationship of nozzle and nozzle image.
Fig. 4 is the top view that forms the substrate of Thinfilm pattern.
Fig. 5 A is the upward view of nozzle unit and nozzle unit supporting device, and Fig. 5 B is the figure that represents the scanning sequency of substrate surface.
Fig. 6 A is the nozzle unit of state and the upward view of nozzle unit supporting device of a nozzle unit of dismounting, and Fig. 6 B is the figure that represents to dismantle the scanning sequency of the substrate surface under the state of a nozzle unit.
Fig. 7 A is the flow chart of the thin-film pattern forming method of embodiment 1.
Fig. 7 B is the detail flowchart of the step S4 of Fig. 7 A.
Fig. 7 C is the detail flowchart of the step S8 of Fig. 7 A.
Fig. 8 A is the figure that represents the check pattern in design, and Fig. 8 B is the figure that represents an example of the check pattern in fact forming.
Fig. 9 A is the top view of a part for normal thin film figure, and Fig. 9 B is the top view that produces a part for bad Thinfilm pattern.
Figure 10 is the synoptic diagram of the film forming device of embodiment 2.
Figure 11 is the stereogram of objective table, filming apparatus, apparatus for correcting and the ejection head unit of the film forming device of embodiment 2.
Figure 12 A is the top view that is formed at the Thinfilm pattern on substrate, and Figure 12 B is the top view that is formed at the Thinfilm pattern that comprises bad position on substrate.
Figure 13 is the flow chart of the repair method of the film forming device of embodiment 2.
Figure 14 is the sectional view of ejection head unit and filming apparatus.
Figure 15 is the figure that represents the position relationship of the coverage of ejection head unit and filming apparatus.
Figure 16 is figure method of adjustment, that represent the position relationship of the coverage of nozzle unit and filming apparatus of the film forming device for other embodiment are described.
Figure 17 is figure method of adjustment, that represent the position relationship of the coverage of nozzle unit and filming apparatus of the film forming device of the variation for other embodiment are described.
Figure 18 is the synoptic diagram of the film forming device that comprises liquid drop jetting apparatus of embodiment 3.
Figure 19 A is the synoptic diagram of aiming at the alignment device comprising in station, and Figure 19 B and Figure 19 C are the top views of aiming at the substrate in station.
Figure 20 A and Figure 20 B are the synoptic diagrams that checks a part for the liquid drop jetting apparatus comprising in film forming station.
Figure 21 A is the synoptic diagram that represents nozzle unit, and Figure 21 B is the spue top view of face of the drop that represents nozzle unit, and Figure 21 C is the summary top view that represents the configuration of nozzle unit.
Figure 22 A～Figure 22 D is the substrate inversion set that comprises in substrate reversion station and the synoptic diagram of ultraviolet lamp.
Figure 23 A, Figure 23 C and Figure 23 E are the summary top views of substrate holder, and Figure 23 B, Figure 23 D and Figure 23 F are the summary side views of substrate holder.
Figure 24 A is the figure that the audit function of the liquid drop jetting apparatus to embodiment 3 describes, and Figure 24 B and Figure 24 C are the figure that the audit function of the liquid drop jetting apparatus to embodiment 4 describes.
Figure 24 D～Figure 24 F is the figure that the audit function of the liquid drop jetting apparatus to embodiment 4 describes, and Figure 24 G is the figure that the audit function of the liquid drop jetting apparatus to embodiment 5 describes.
Figure 25 A, Figure 25 B are the figure that represents the example of the coating result of the thin-film material of embodiment 6, and Figure 25 C is the figure that represents the example of the coating result of the thin-film material of embodiment 7.
Figure 26 is the synoptic diagram of the film forming device of embodiment 8.
Figure 27 is the synoptic diagram of the film forming device of embodiment 9.
Figure 28 A and Figure 28 B are the figure that an example of plaid matching uncle Data correction describes.
In figure: 20-base plate, 21-travel mechanism, 22-X travel mechanism, 23-Y travel mechanism, 24-θ rotating mechanism, 25-objective table, 30-pillar, 31-crossbeam, 32-filming apparatus, 33-control device, 34-storage device, 35-input unit, 36-output device, 37-apparatus for correcting, 38-bad position, 40-nozzle unit, 41-nozzle fixture (support unit), 42, 42A～42D-shower nozzle, 43-light source, 45-nozzle bore, 45r-becomes the nozzle bore of benchmark, 46, 46a, 46b-nozzle rows, 47-angular instrument, 48-elevating mechanism, 50-substrate, 51-target pattern region, 52-does not use region, 53-Thinfilm pattern, the image of 55A～55D-nozzle bore, the imaginary plane that 56-is vertical with X-axis, check pattern in 60-design, the check pattern that 61-forms, 65-nozzle unit supporting device, 66-sensor, 67-driver, 70-elemental scanning area, 71-Pass region, 75-is coated with the region of liquid material, 76-opening, the auxiliary body of 77-(satellite), 80-filming apparatus, 81-lighting device, 82-coverage, 101-substrate is moved into mouth, 102-aims at station, 103-checks film forming station, 104-substrate reversion station, 105-aims at station, 106-checks film forming station, 107-substrate is taken out of mouth, 111～114-lifter, 115, 116-conveyer, 118-basket, 120-control device, 120a-storage device, 121～127-substrate, 122a～122d-alignment mark, 128-inspection plate, 129-substrate, 129a-Thinfilm pattern forms region, 129b-inspection area, 131-base (base station), 132-X objective table, 133-θ objective table, 134-chuck plate, 135～138-CCD camera, 141-base, 142-framework, 142a, 142b-pillar, 142c-crossbeam, 143-Y objective table, 144-X objective table, 145-chuck plate, 146-connecting member, 147a～147f-nozzle unit, 147a 1～147a 4-shower nozzle, 147a 5～147a 9-ultraviolet source, the interim mounting table of 148-, 149-θ objective table, 150-substrate inversion set, 151-substrate holder, 152-support unit, 153-vacuum suction pad, 154-compression roller, 155-clamp mechanism, 160-ultraviolet lamp, 161-support unit, 162-ultraviolet source, 163～166-CCD camera, 167-linear transducer, 170-liquid drop jetting apparatus, 171,172,173-film forming device, the 180-portion that spues, 181-inspection portion, 182-framework.
Detailed description of the invention
[embodiment 1]
The synoptic diagram of the film forming device of embodiment 1 shown in Fig. 1.On base plate 20, maintain objective table 25 by travel mechanism 21.Travel mechanism 21 comprises X travel mechanism 22, Y travel mechanism 23 and θ rotating mechanism 24.The XYZ orthogonal coordinate system that horizontal plane is made as to XY face, vertical is made as to Z axis is defined.X travel mechanism 22 moves Y travel mechanism 23 to X-direction.Y travel mechanism 23 moves θ rotating mechanism 24 to Y-direction.θ rotating mechanism 24, using the axle parallel with Z axis as pivot, changes the posture of the direction of rotation of objective table 25.Objective table 25 keeps becoming as film-shaped the substrate (for example printing distributing board) 50 of object.On objective table 25, for example use vacuum chuck.
Crossbeam 31 is supported to have by pillar 30 in base plate 20 tops.Nozzle unit supporting device 65 and filming apparatus 32 are installed on crossbeam 31.Nozzle unit supporting device 65 upper supports have multiple nozzle units 40.For the structure of nozzle unit 40 and the detailed content of configuration, will be described hereinafter.Filming apparatus 32 and nozzle unit 40 are opposed with the substrate 50 that remains on objective table 25.Filming apparatus 32 take be formed at substrate 50 surperficial Wiring pattern, alignment mark, be formed at the Thinfilm pattern etc. of substrate 50.The view data of taking and obtain inputs to control device 33.Each nozzle unit 40 from multiple nozzle bores towards substrate 50 such as, with the drop mode thin-film material such as ultraviolet curing resin, welding resistance resist that spues.The thin-film material spuing is attached to the surface of substrate 50.
Apparatus for correcting 37 moves to the below of nozzle unit 40, and repairs the temporary fault of nozzle unit 40, such as nozzle bore obstruction etc.The repair method stopping up as nozzle bore, for example, can enumerate purification, attraction, wiping etc.Purification refers to the processing of the additional malleation in space in the nozzle to holding thin-film material.Attraction refers to the processing of the additional negative pressure in space to nozzle outside.Wiping refers to the surperficial processing of wiping the nozzle bore opening of nozzle unit 40 with brush.When form film on substrate 50 time, apparatus for correcting 37 is kept out of the way from the space between nozzle unit 40 and substrate 50.
Control device 33 is controlled X travel mechanism 22, Y travel mechanism 23, θ rotating mechanism 24, objective table 25, nozzle unit 40 and apparatus for correcting 37.Control device 33 comprises storage device 34.In storage device 34, store the view data of the Thinfilm pattern that should describe etc.
Operating personnel are inputted various instructions (command) or control required numeric data to control device 33 by input unit 35.Input unit 35 for example uses keyboard, contact panel etc.Control device 33 is exported the various information such as alarm from output device 36 to operating personnel.Output device 36 uses liquid crystal display, pronunciation device etc.
In Fig. 1, with respect to base plate 20 fixed nozzle unit 40, and the mode moving with objective table 25 configures objective table 25, but also can with its on the contrary, at the fixing objective table 25 of base plate 20, and nozzle unit 40 is moved with respect to objective table 25.Or, also can be configured to directions X moving nozzle unit 40, to Y-direction moving stage 25.Under any circumstance, as long as make a side of nozzle unit 40 and objective table 25 relatively mobile with respect to the opposing party.
The stereogram of each nozzle unit 40 shown in Fig. 2 A.The bottom surface of nozzle fixture (support unit) 41 is provided with 4 shower nozzle 42A～42D.Shower nozzle 42A～42D arranges with this order towards the negative direction of X-axis.Each shower nozzle 42A～42D is formed with multiple nozzle bores 45.Dispose respectively more in the outer part light source 43 more in the outer part and than shower nozzle 42D than shower nozzle 42A.Light source 43 is to substrate 50 (Fig. 1) irradiation ultraviolet radiation.Ultraviolet ray is solidified the ultraviolet hardening thin-film material that is attached to substrate 50.In addition, in the time that thin-film material uses the material of photocuring by the wavelength domain beyond ultraviolet ray, use the light source of light of the wavelength domain that radiation can cured film material as light source 43.
The upward view of shower nozzle 42A～42D shown in Fig. 2 B and light source 43.The bottom surface (with the opposed surface of substrate 50) of shower nozzle 42A is formed with 2 row nozzle rows 46a, 46b.Multiple nozzle bores 45 that nozzle rows 46a and the each freedom of nozzle rows 46b are arranged with spacing (cycle) 8P along Y direction form.Nozzle rows 46b departs to the negative direction of X-axis with respect to nozzle rows 46a, in addition, only departs from spacing 4P to the negative direction of Y-axis., in the Y direction, with spacing, 4P's nozzle bore 45 of shower nozzle 42A is spacedly distributed.Spacing 4P is for example equivalent to the resolution ratio of 300dpi.
The structure of shower nozzle 42B～42D is identical with the structure of shower nozzle 42A.Shower nozzle 42B, shower nozzle 42C, shower nozzle 42D are mechanically positioned to only depart from 2P, P, 3P with respect to shower nozzle 42A to the negative direction of Y-axis respectively, and are installed on spray nozzle fixture 41 (Fig. 2 A).Dispose respectively more in the outer part light source 43 more in the outer part and than shower nozzle 42D than shower nozzle 42A.
As shown in Figure 3, uniformly-spaced arrange along Y-direction with the spacing P of the resolution ratio that is equivalent to 1200dpi at the image 55A～55D of the nozzle bore 45 of the imaginary plane vertical with X-axis 56 upright projection shower nozzle 42A～42D.Therefore, can form Thinfilm pattern by the liquid material resolution ratio with 1200dpi on Y direction that spues from 4 shower nozzle 42A～42D.
Shown in Fig. 4, should be formed at an example of the surperficial Thinfilm pattern (welding resistance resist) of substrate 50.On 1 plate base 50, compound (multiaspect) installs multiple printing distributing boards.Multiple Thinfilm patterns 53 of the same shape corresponding with printing distributing board configure with ranks shape along directions X and Y-direction.Each Thinfilm pattern 53 has the opening for soldering electronic building brick.The conducting film of copper or copper alloy etc. exposes in opening.
Near the edge of substrate 50, delimitation does not configure the not use region 52 of the ring-type of Thinfilm pattern 53.At the interior formation Thinfilm pattern 53 in the target pattern region 51 that is not used region 52 to surround.
The upward view of nozzle unit 40 shown in Fig. 5 A and nozzle unit supporting device 65.4 nozzle units 40 are removably installed on nozzle unit supporting device 65.Each nozzle unit 40 comprises shower nozzle 42A～42D and nozzle fixture 41.Regulate the relative position of nozzle unit 40 in the mode of uniformly-spaced arranging along Y direction with the image of the nozzle bore of 4 nozzle units of imaginary plane upright projection vertical with X-axis.
Control device 33 is sent the instruction that spues of aqueous thin-film material to driver 67.Driver 67 sends to the nozzle bore 45 (Fig. 2 A, Fig. 2 B) of regulation the signal that spues in the suitable moment according to the instruction that spues receiving.According to the view data that is stored in storage device 34 (Fig. 1), to directions X moving substrate 50 time, the nozzle bore liquid material that spues in the suitable moment from regulation, can form Thinfilm pattern 53 (Fig. 4) on the surface of substrate 50 thus.
If to the positive direction moving substrate 50 of X-axis, nozzle unit 40 moves to the negative direction of X-axis with respect to substrate 50.To X-direction moving substrate 50 be of equal value with respect to substrate 50 to the opposite direction moving nozzle unit 40 of X-axis.In this description, be called by nozzle unit 40 scanning substrates 50 to the action of directions X moving substrate 50.
On nozzle unit supporting device 65, with nozzle unit 40, sensor 66 is installed accordingly.Sensor 66 detects the handling state of nozzle unit 40.The testing result of sensor 66 is input to control device 33.Sensor 66 can use mechanically to survey and have or not the sensor of nozzle unit, surveys the sensor that has or not nozzle unit optically.Replaced from the disassembly status of input unit 35 (Fig. 1) input nozzle unit 40 by operating personnel that to detect the handling state of nozzle unit 40 with sensor 66 also passable.
One example of the scanning sequency (scanning sequency) on substrate 50 surfaces based on nozzle unit 40 shown in Fig. 5 B.1 nozzle unit 40 can be called to elemental scanning area 70 by the region of 1 scanning attachment film material.By 1 scanning, form Thinfilm pattern with the resolution ratio of 1200dpi in the Y direction.In addition, if move half spacing of nozzle bore and carry out shuttle-scanning to Y-direction, can form Thinfilm pattern with the resolution ratio of 2400dpi.Now, 1 shuttle-scanning is called " 1 scanning ".
By 4 nozzle units 40, can in the 1st scanning, make thin-film material be attached to 4 elemental scanning area 70a that arrange along Y-direction.To Y-direction offset nozzle unit 40 and carry out the 2nd scanning, can make thus thin-film material be attached to and be coated with 4 elemental scanning area 70b of 4 elemental scanning area 70a adjacency of liquid material in the 1st scanning.Be called " Pass region 71 " with the region that can be delimited by multiple elemental scanning areas of 1 scanning attachment film material.In the time carrying out simple scanning, as in Fig. 5 B by as shown in arrow, the scanning direction of nozzle unit 40 when Pass region 71 that scanning adjoins each other becomes mutual opposite direction.
When can be by the target pattern region 51 (Fig. 4) of 8 elemental scanning areas, 70 covered substrates 50, can form Thinfilm pattern in the whole region in target pattern region 51 by 2 scanning.
Shown in Fig. 6 A, dismantle the nozzle unit supporting device 65 of state and the upward view of nozzle unit 40 of 1 nozzle unit in 4 nozzle units 40.Be illustrated by the broken lines the nozzle unit 40 of dismounting.Dismounting shown in Fig. 6 A is positioned at the state of the nozzle unit 40 of end in the Y direction.Be " disassembly status " from the sensor 66 corresponding with the nozzle unit 40 of dismounting to control device 33 notices.
One example of the scanning sequency while dismantling 1 nozzle unit 40 shown in Fig. 6 B.If control device 33 (Fig. 6 A) is surveyed and dismantled at least 1 nozzle unit 40 according to the notice from sensor 66 (Fig. 6 A), do not use the nozzle unit 40 of dismounting and calculate the scanning sequency that forms Thinfilm pattern.Owing to only can use 3 nozzle units 40 under the state shown in Fig. 6 A, so 1 Pass region 71 is made up of 3 elemental scanning areas 70.In example shown in Fig. 5 B, can be scanned the whole region in target pattern region 51 by 2 scanning, but in the example shown in Fig. 6 B, have to carry out 3 scanning for scanning whole region.
The whole region of 3 elemental scanning area 70a adhering to of thin-film material, thin-film material adheres in the 2nd scanning 3 elemental scanning area 70b and 2 elemental scanning area 70c coverage goal area of the pattern 51 (Fig. 4) that thin-film material adheres in the 3rd scanning in the 1st scanning.
The flow chart of the control sequence based on control device 33 (Fig. 1) shown in Fig. 7 A.
In step S1, form check pattern.One example of check pattern 60 shown in Fig. 8 A.Check pattern 60 is set the liquid material spuing from each nozzle bore 45 (Fig. 2 A, Fig. 2 B) for can be mutually not continuous on the surface of substrate 50.As an example, the pattern of the liquid material based on spuing respectively from multiple nozzle rows 46a, nozzle rows 46b (Fig. 2 B) is formed at the diverse location on directions X substrate 50.And the pattern of the thin-film material forming by each nozzle bore 45 is the straight-line pattern that directions X is grown.Check pattern 60 is formed at the not use region 52 (Fig. 4) of substrate 50.
In the step S2 of Fig. 7 A, take the check pattern forming with filming apparatus 32 (Fig. 1).The view data obtaining inputs to control device 33 (Fig. 1).One example of the check pattern 61 forming shown in Fig. 8 B.The position 61a that should form straight-line pattern is not formed with straight-line pattern.And straight-line pattern 61b becomes and is shorter than original length.Straight-line pattern is corresponding one by one with nozzle bore, so can survey bad nozzle bore by the graphical analysis of the check pattern 61 that forms.If control device 33 (Fig. 1) detects bad nozzle bore, the nozzle identification serial number for identifying bad nozzle bore is stored in to storage device 34 (Fig. 1).
Then,, in the step S3 shown in Fig. 7 A, be determined with the nozzle unit using without being not suitable for.Add up to the number of bad nozzle bore by each nozzle unit 40, if the number of bad nozzle bore exceedes permissible value, this nozzle unit 40 is judged to be to be not suitable for the nozzle unit (defective nozzle unit) of use.This permissible value is stored in storage device 34 (Fig. 1).Operating personnel utilize input unit 35 (Fig. 1) input permissible value.If input permissible value, control device 33 rewrites the permissible value that is stored in storage device 34.
In the time dismantling a part of nozzle unit, can not form the check pattern corresponding with this nozzle unit.Therefore,, about the nozzle unit of dismounting, do not carry out whether fit for service is judged.
When not inspection to be not suitable for use nozzle unit 40 time, in step S4, form Thinfilm pattern.
The detail flowchart of step S4 shown in Fig. 7 B.In step SA1, the judgement of whether having dismantled at least one nozzle unit.In the time that all nozzle units 40 are all mounted, the scanning sequency (Fig. 5 B) in step SA2 when common forms Thinfilm pattern.Wherein, " conventionally time scanning sequency " refers to the scanning sequency when being judged to be bad nozzle.
Before forming Thinfilm pattern, control device 33 is read the nozzle identification serial number of bad nozzle bore from storage device 34.Control device 33 sends instruction to driver 67, to do not send the signal that spues of liquid material to bad nozzle bore, only sends to normal nozzle bore the signal that spues.Thus, while forming Thinfilm pattern, thin-film material can not spue from bad nozzle bore.Thin-film material can land on the position corresponding with bad nozzle bore, but land in its thin-film material around to face in Directional Extension, can avoid thus coating to leak.
For example,, while comprising the pattern of the thin linearity forming by 1 nozzle bore as the Thinfilm pattern of target, because 1 bad nozzle bore produces fatefulue defect to Thinfilm pattern.In this case, in step S3 (Fig. 7 A), set the permissible value of the number of bad nozzle bore for O.
Form the step S5 that Thinfilm pattern turns back to Fig. 7 A afterwards.
In step SA1, inspection when dismantling at least 1 nozzle unit, makes the scanning sequency (for example Fig. 6 B) being only used to form using the nozzle unit 40 of installation as the Thinfilm pattern of target in step SA3.In addition, for all combinations of the nozzle unit 40 that can use, can make in advance scanning sequency and be stored in storage device 34 (Fig. 1).
In step SA4, with in step SA3, obtain fault time scanning sequency form Thinfilm pattern.Form the step S5 that Thinfilm pattern turns back to Fig. 7 A afterwards.
In the step S5 of Fig. 7 A, be determined with without temporarily stopping requirement.Operating personnel will temporarily stop requirement by input unit 35 (Fig. 1) and input to control device 33.In storage device 34, have and temporarily stop requirement mark, when input temporarily stops requirement, this mark becomes " having requirement " state.For example, while wanting, at the position of dismantling nozzle unit 40, new nozzle unit 40 is installed, operating personnel input and temporarily stop requirement.
While temporarily not stopping requirement, in step S6, determine whether and finish operation.In the time that another substrate 50 forms Thinfilm pattern, turn back to step S1, form check pattern in the not use region 52 (Fig. 4) of the substrate 50 that should again form Thinfilm pattern.After completing the processing of all substrates 50, finish operation.
In step S3, in the time being judged to be to have the nozzle unit that is not suitable for use, in step S7, judge that the nozzle unit that is not suitable for using is temporary fault or constant fault.For example, for example, even if carry out stipulated number, 5 correction process, when fault is not recovered yet, be judged to be constant fault.The number of times of correction process is for 4 times when following, is judged to be temporary fault.
While being judged to be temporary fault, in step S9, carry out correction process.This correction process utilizes apparatus for correcting 37 (Fig. 1) to carry out.Apparatus for correcting 37 for example whisks off nozzle face with rubber brush processed, or attracts the resin stopping up in nozzle bore.If correction process finishes, turn back to step S1.
In the time being judged to be constant fault in step S7, in step S10, send fault warning from output device 36.After sending fault warning, in step S11, become and restart wait state.And, while being judged to be in step S5 temporarily to stop requirement, in step S11, also becoming and restart wait state.Restart wait if become, the requirement mark that temporarily stops of storage device 34 is made as to " no requirement (NR) " state.
The flow chart of the order of step S11 shown in Fig. 7 C.In addition, this order is not to carry out with control device 33 (Fig. 1), but gets involved execution by operating personnel.In step SB1, dismounting is judged to be the nozzle unit 40 of constant fault or at the position of dismantling nozzle unit 40, new nozzle unit 40 is installed.New nozzle unit 40 can, for having carried out to being judged to be for the time being the nozzle unit 40 of constant fault the nozzle unit of repairing, also can be untapped nozzle unit 40.
Be judged to be the dismounting of nozzle unit 40 or the installation of new nozzle unit 40 of constant fault if complete,, in step SB2, operating personnel utilize input unit 35 (Fig. 1) instruction control device 33 to restart.In addition, can be judged to be the dismounting of nozzle unit 40 and the installation both sides of new nozzle unit 40 of constant fault.
If instruction restarts, turn back to the step S1 shown in Fig. 7 A, start to form check pattern.In addition, in the time that a part of region that does not use region 52 of substrate 50 has been formed with check pattern, again form check pattern in the region that does not also form check pattern.
Then, the variation of embodiment 1 is described.In above-described embodiment 1, in step S10 (Fig. 7 A), send after fault warning and become and restart wait.Restart wait if become, need operating personnel's intervention.In variation, send and the nozzle unit 40 that is judged to be constant fault be made as after fault warning not to serviceable condition and turn back to step S1.In the time that the check pattern of step S1 forms and when the film of step S4 forms, do not send to being made as the not nozzle unit 40 of serviceable condition the signal that spues., operating personnel stay out of the formation processing that also can proceed film.In the time that dismounting is judged to be the nozzle unit 40 of persistent fault, operating personnel input and temporarily stop requirement from input unit 35.
Then, the effect of above-described embodiment 1 is described.
A part for the Thinfilm pattern that should form shown in Fig. 9 A.In the region 75 that thin-film material adheres to, dispose opening 76.The conducting film of copper etc. is in the interior exposure of opening 76.On this conducting film, weld electronic building brick.
Shown in Fig. 9 B, under the state that has bad nozzle bore, also bad nozzle bore is sent an example of the Thinfilm pattern that the signal that spues forms.In opening 76, be attached with the dielectric film that is called auxiliary body 77.Auxiliary body 77 is adhered to and is formed by the thin-film material spuing in the abnormal moment from bad nozzle bore or the thin-film material spuing towards the direction different from normal direction.Easily to produce soldering bad because being difficult to merge scolding tin for the opening 76 that is formed with auxiliary body 77.
In embodiment 1, owing to not sending to bad nozzle bore the signal that spues, so can prevent auxiliary body 77.While there is bad nozzle bore, owing to proceeding spuing of thin-film material, so running rate that also can restraining device declines.
In addition, under the state of not inputting the signal that spues, sometimes also produce the unfavorable condition hanging and so on from nozzle bore as thin-film material.If produce this badly, also can cause forming auxiliary body 77 even if do not send to bad nozzle bore the signal that spues.So, cause the unfavorable condition that thin-film material hangs and so on can be by the shape decision of check pattern.Even when being judged as according to the shape of check pattern when producing the signal that spues as do not sent and also forming the unfavorable condition of auxiliary body and so on, in step S3 (Fig. 7 A), be independently judged to be to be not suitable for the nozzle unit of use with the number of bad nozzle bore, and perform step the processing of S7.
And, in embodiment 1, even also can use remaining nozzle unit 40 to continue the thin-film material that spues under the state of a part of nozzle unit 40 of dismounting.Therefore, can improve the running rate of Thinfilm pattern formation device.
In above-described embodiment 1, form check pattern and check that whether nozzle is good at the substrate 50 that forms Thinfilm pattern by each.Also can check that whether nozzle bore is good in the group formation check pattern by each substrate 50, replace and checking that by each substrate 50 whether nozzle bore is good.
[embodiment 2]
The synoptic diagram of the film forming device based on embodiment 2 shown in Figure 10.Filming apparatus 80 is installed on objective table 25.By moving stage 25 and by filming apparatus 80 be configured in nozzle unit 40 under, can take a part of nozzle bore in multiple nozzle bores of nozzle unit 40 with filming apparatus 80 thus.Other structures are identical with the structure of the film forming device of the embodiment 1 shown in Fig. 1.In addition, in embodiment 1, multiple nozzle units 40 are installed on nozzle unit supporting device 65.In the explanation of embodiment 2, the example that 1 nozzle unit 40 is installed on nozzle unit supporting device 65 is described.In addition, in embodiment 2 also with embodiment 1 in the same manner, multiple nozzle units 40 can be installed on nozzle unit supporting device 65.Below, to the incomplete structure explanation identical with embodiment 1.
The stereogram of the objective table 25 of the film forming device based on embodiment 2 shown in Figure 11, nozzle unit 40, nozzle unit supporting device 65.On the maintenance face of objective table 25, maintain substrate 50.The top of substrate 50 is supported with nozzle unit 40.Nozzle unit 40 comprises nozzle fixture 41 and is fixed on multiple shower nozzles 42 of nozzle fixture 41.Shower nozzle 42 be provided with multiple nozzle bores with the opposed face of substrate 50.
Nozzle unit supporting device 65 comprises angular instrument 47 and elevating mechanism 48.Angular instrument 47 can be using the axle parallel with Z axis as pivot swivel nozzle unit 40 within the scope of certain angle.Elevating mechanism 48 is along Z direction moving nozzle unit 40.
The edge of objective table 25 is provided with filming apparatus 80.Filming apparatus 80 uses such as CCD camera etc.Moving stage 25 and by filming apparatus 80 be configured in nozzle unit 40 under, can take thus a part of nozzle bore.Control filming apparatus 80 by control device 33, and the view data of taking to control device 33 inputs.In addition, can use linear transducer as filming apparatus 80.In the time utilizing linear transducer, when control device 33 moving stage 25, obtain many one dimension images.Can synthesize many one dimension images that obtain and generate two dimensional image.
Nozzle bore within the scope of lighting device 81 lighting shootings.As means of illumination, can adopt and for example coaxially fall to penetrating illumination.Illumination light only comprises the wavelength domain that does not make aqueous thin-film material curing, and does not comprise the wavelength that makes the curing ultraviolet territory of thin-film material.
Apparatus for correcting 37 is further installed on objective table 25.To the mobile apparatus for correcting 37 in below of nozzle unit 40, recover thus the obstruction of nozzle bore etc.Control apparatus for correcting 37 by control device 33.The restoration methods of stopping up as nozzle bore, for example, can enumerate purification, attraction, wiping etc.
If purify, flow out aqueous thin-film material from nozzle bore.On apparatus for correcting 37, dispose the pallet of accepting the thin-film material flowing out from nozzle bore.In apparatus for correcting 37, accommodate to the suction device of the additional negative pressure of nozzle bore.In addition, in apparatus for correcting 37, possesses the brush for whisking off shower nozzle 42.
Shown in Figure 12 A, be formed at the top view of the Thinfilm pattern 53 on substrate 50.For example Thinfilm pattern 53 is made up of the pattern of the multiple congruences with the configuration of ranks shape.The view data of the Thinfilm pattern 53 forming is stored in control device 33 (Figure 10).If produce the unfavorable conditions such as nozzle bore obstruction at a part of nozzle bore 45 (Fig. 2 A, Fig. 2 B), as shown in Figure 12 B, occur the bad position 38 of the linearity parallel with directions X.
The flow chart of the repair method of the film forming device based on embodiment 2 shown in Figure 13.As shown in Figure 12 B, if there is bad position 38 at the Thinfilm pattern 53 forming, in step SC1, think the position of Y-direction of bad nozzle bore 45 (Fig. 2 A, Fig. 2 B) by the location estimating of bad position 38.But, although only can will think that the position limitation of bad nozzle bore, in certain area, is difficult to the bad nozzle bore 45 (bad nozzle bore) of specific generation by the position of bad position 38.Exist the region of bad nozzle bore to be called by being inferred as " suspicious region ".In suspicious region, comprise multiple nozzle bores.And, be also difficult to the affiliated shower nozzle 42 of specific bad nozzle bore 45, so each shower nozzle 42 is defined to suspicious region.
In step SC2, take the suspicious region of each shower nozzle 42 with filming apparatus 80 (Figure 10, Figure 11).Particularly, operating personnel utilize the positional information of the Y-direction of input unit 35 (Figure 10) input suspicious region.This positional information can be the positional information taking the shower nozzle 42 shown in Fig. 2 B as benchmark, can be also taking substrate 50 positional informations as benchmark shown in Figure 12 B.In the time of the positional information of input taking substrate 50 as benchmark, control device 33 (Figure 10) converts the positional information taking shower nozzle 42 as benchmark to from the positional information taking substrate 50 as benchmark.As shown in figure 14, control device 33 moving stages 25, and filming apparatus 80 is moved to each shower nozzle 42 suspicious region under.
In addition, also can adopt the method for the position of automatic detection suspicious region to replace operating personnel to input the positional information of suspicious region.Then, the method for the position to automatic detection suspicious region describes.First, on substrate 50, forming Thinfilm pattern 53 (Figure 12 A) uses filming apparatus 32 (Figure 10) to take Thinfilm pattern 53 afterwards.The image of taking by automatic analysis determines whether and has bad position 38 (Figure 12 B).In the time bad position 38 being detected according to the position of the position calculation suspicious region of bad position 38.
The position relationship of the coverage 82 of nozzle bore 45 shown in Figure 15 and filming apparatus 80 (Figure 14).For example, in coverage 82, hold 3～4 nozzle bores 45 that belong to 1 shower nozzle 42.Can be by make the suspicious region of 4 shower nozzles 42 be contained in successively in coverage 82 and take to directions X moving stage 25 (Figure 14).Control device 33 shows at output device 36 image photographing.
In step SC3, operating personnel are shown in the next specific bad nozzle bore of image of output device 36 by observation and have the shower nozzle 42 of bad nozzle bore.In step S4, operating personnel judge whether bad nozzle bore 45 can recover.For example, when bubble is trapped in, bad nozzle bore 45 when interior, small foreign matter are residual is placed in bad nozzle bore 45 when interior etc., judges that bad nozzle bore 45 can recover.When thin-film material is interior when curing at bad nozzle bore 45, bad nozzle bore 45 is while being out of shape etc., judges that bad nozzle bore can not recover.
In the time judging that bad nozzle bore 45 can recover, in step SC9, the shower nozzle 42 under bad nozzle bore 45 is exchanged into new shower nozzle.When in step SC4, be judged to be to recover bad time, in step SC5, operating personnel input the information of specific bad nozzle bore 45 and carry out the instruction of correction process from input unit 35.The information of specific bad nozzle bore 45 comprises the information of the nozzle bore 45 in information and the specific shower nozzle 42 of specific shower nozzle 42.
In step SC6, control device 33 (Figure 10) carries out correction process to bad nozzle bore 45.Particularly, apparatus for correcting 37 (Figure 11) is moved to bad nozzle bore 45 under.Afterwards, attract, wiping, purification etc.Attract only to bad nozzle bore 45 or near the nozzle bore it is carried out.Wiping and purification are carried out the shower nozzles 42 under bad nozzle bore 45.
If correction process finishes, in step SC7, take the nozzle bore 45 after correction process with filming apparatus 80 (Figure 14).The image obtaining is shown in output device 36 (Figure 10) by control device 33.In step SC8, the image that operating personnel are shown in output device 36 by observation judges whether the bad of nozzle bore 45 recovers.Bad while having recovered when judging, finish correction process.In the time that judgement does not recover bad, in step S9, the shower nozzle 42 that comprises bad nozzle bore 45 is exchanged into new shower nozzle.
In above-described embodiment 2, without just can use filming apparatus 80 (Figure 10, Figure 11) to observe nozzle bore 45 (Figure 15) from nozzle fixture 41 release sprayhead 42.Therefore, when there is bad position 38 (Figure 12 B) at Thinfilm pattern 53, the state of specific bad nozzle bore and position like a cork.Thus, can shorten the time of correction process.
And the wiping of carrying out also makes bad nozzle bore 45 recover sometimes, but on the contrary, also can become the main cause of stopping up normal nozzles hole 45 in step SC6 (Figure 13).In embodiment 2, only the shower nozzle 42 under bad nozzle bore 45 is carried out to wiping, and normal shower nozzle 42 is not carried out to wiping.Therefore, can prevent from resulting from the bad generation of wiping.
In above-described embodiment 2, in step SC3 (Figure 13), operating personnel carry out the bad nozzle bore 45 of specific generation by the image of observing nozzle bore.Also can get involved the bad nozzle bore 45 of specific generation and determine whether and can recover without operating personnel by carrying out automated image analysis by control device 33 (Figure 10).Store the view data of various bad nozzle bores and the information that whether can recover, can carry out thus the automatic analysis of image.
And, in above-described embodiment 2, use filming apparatus 80 (Figure 10, Figure 11) for the bad nozzle bore 45 of specific generation.Can realize the observation on the wider surface of shower nozzle 42 by filming apparatus 80 being made as to more low range.Thus, can observe the pollutional condition on shower nozzle 42 surfaces.
In above-described embodiment 2, as shown in figure 11, filming apparatus 80 and apparatus for correcting 37 are installed on the objective table 25 of substrate 50 use, but except the objective table 25 of substrate 50 use, also configurable filming apparatus 80 and apparatus for correcting 37 use objective tables.Thus, can alleviate the weight of substrate 50 use objective tables 25.And, can be configured to filming apparatus 80 and apparatus for correcting 37 are fixed on to base plate 20 (Fig. 1), and nozzle unit 40 be moved to the top of filming apparatus 80 or apparatus for correcting 37.
Then,, with reference to Figure 16, the method for adjustment of the film forming device to the variation based on embodiment 2 describes.In this method of adjustment, the relative position of adjusting multiple shower nozzles 42 after multiple shower nozzles 42 is installed on the nozzle fixture 41 shown in Figure 11.
As shown in figure 16, be contained in the mode follow shot device 80 in the coverage 82 of filming apparatus 80 and obtain image with the nozzle bore that becomes benchmark (hereinafter referred to as " benchmark the nozzle bore ") 55r of 1 shower nozzle 42.Similarly, take the benchmark nozzle bore 45r of another shower nozzle 42.
The image photographing by analysis is obtained the relative position relation of the benchmark nozzle bore 45r of multiple shower nozzles 42.According to result of calculation, adjust the relative position of shower nozzle 42, so that benchmark nozzle bore 45r is disposed at the position as target.The fine setting of shower nozzle 42 positions can be undertaken by fine setting screw thread etc.
As shown in figure 17, the edge (edge) of 2 shower nozzles 42 that adjoin each other can be disposed at can coverage 52 in, and take the edge of shower nozzle 42.The image that can photograph by analysis detects the edge of shower nozzle 42, and obtains the relative position relation of multiple shower nozzles 42.
[embodiment 3]
Figure 18 illustrates the synoptic diagram of the film forming device that comprises liquid drop jetting apparatus 171 of embodiment 3.Film forming device 171 comprises the aligning station 102, inspection film forming station 103, substrate reversion station 104, aligning station 105, inspection film forming station 106, ultraviolet lamp 108 and the lifter 111～114 that are disposed at basket 118 inside.And, on the basket 118 of film forming device 171, be provided with substrate move into mouthfuls 101 and substrate take out of mouthfuls 107.Film forming device 171 forms the Thinfilm patterns such as welding resistance resist and uses for the surface of the substrate 121～127 of the printing distributing board as such as rectangular-shaped and the back side.Film forming device 171 comprises conveyer 115, conveyer 116 and control device 120.Substrate 121～127 carries out from outside to the inner conveyer 115 that moves through of basket 118.The conveying of substrate 121～127 in the inside of basket 118 utilizes lifter 111～114 to carry out.Conveyer 116 by substrate 121～127 from taking out of to the outside of basket 118 in basket 118.Control the action of the action of various device of the inside of basket 118 and conveyer 115, conveyer 116 by control device 120.Control device 120 comprises storage device 120a.Be delivered to the surface of substrate 121～127 of the inside of basket 118 towards the upper direction (Z axis positive direction) of accompanying drawing.
In this description, divide the orthogonal coordinate system that is made as the right-handed system of Z axis positive direction with vertical top.Below in explanation, configure towards Y-axis positive direction successively to 5 stations that check film forming station 106 from aiming at station 102, move into mouthfuls 101 by substrate and move into substrate 121～127 in basket 118 via each station 102～106, entirety is carried towards Y-axis positive direction, and takes out of mouth 107 by substrate and take out of to the outside of basket 118.
In film forming device 171, processed by each station unification at aligning station 102, inspection film forming station 103, substrate reversion station 104, aligning station 105, inspection film forming station 106.Therefore, can realize the raising of production efficiency.
With reference to figure 19A～Figure 19 C, describe aiming at station 102.Figure 19 A represents to be stored in the synoptic diagram of the alignment device of aiming at station 102.Alignment device comprises from base 131 sides and is disposed at successively X objective table 132, θ objective table 133, the chuck plate 134 base (pedestal) 131.Chuck plate 134 keeps being delivered to by lifter 111 absorption the substrate 122 of aiming at station 102.
X objective table 132 can move maintained substrate 122 along X-direction.θ objective table 133 can with in parallel plane of XY around the maintained substrate 122 of rotation around the rotating shaft parallel with Z axis.X objective table 132, θ objective table 133 and chuck plate 134 form maintenance substrate 122 moving stage in aligning station 102 interior movements.The control device 120 that moves through of the absorption of the substrate 122 based on chuck plate 134, the substrate 122 based on X objective table 132 and θ objective table 133 is controlled.
And alignment device comprises CCD camera 135～138.CCD camera 135～138 is taken the registration mark being formed on the substrate 122 that remains on chuck plate 134.Shooting based on CCD camera 135～138 is controlled by control device 120.And the view data (testing result) obtaining by CCD camera 135～138 is sent to control device 120.
Figure 19 B represents to be delivered to the top view of aiming at station 102 and adsorbing the substrate 122 that is held in chuck plate 134.For example, become registration mark 122a～122d at the surperficial quadrangle of substrate 122.
Loading under substrate 122 in chuck plate 134 is held in chuck plate 134 state in absorption driving by X objective table 132 by lifter 111 moves aiming at the station 102 interior positive directions to X-axis.Mobile substrate 122 is afterwards shown in Figure 19 B bracket.
CCD camera 135～138 is disposed at the top of the chuck plate 134 after X-axis positive direction moves.Each CCD camera 135～138 is configured in respectively the position that can take registration mark 122a～122d.Substrate 122 moves to the below of CCD camera 135～138 by X objective table 132, CCD camera 135～138 is taken the registration mark 122a～122d that is formed at substrate 122.The view data photographing is sent to control device 120.
Control device 120 is processed the view data of obtaining by CCD camera 135～138, the posture (direction) in the position and XY plane of grasp substrate 122 in (in the face of substrate 122) direction.Afterwards, for example proofread and correct (change) substrate 122 posture in direction (θ correction) in XY plane.
Shown in Figure 19 B in the XY of substrate 122 plane to the situation of a position deviation angle [alpha] counterclockwise as an example.Now, for example link the summit that is formed with registration mark 122a and the positive direction of the limit on summit that is formed with registration mark 122d taking the latter's summit as benchmark from Y-axis to a tilt angle alpha counterclockwise.Control device 120 is grasped this position deviation according to the view data of obtaining by CCD camera 135～138.Control device 120 is by revising this position deviation by θ objective table 133 to a clockwise direction anglec of rotation α.Correction result, each limit of rectangular-shaped substrate 122 is parallel with X-axis or Y-axis.
As shown in Figure 19 C, after the θ that carries out substrate 122 proofreaies and correct, control device 120 drives X objective table 132, and to the negative direction moving substrate 122 of X-axis.The displacement of substrate 122 with for example in the operation shown in Figure 19 B the distance to the positive direction moving substrate 122 of X-axis equate.
Substrate 122 after the negative direction of X-axis moves is shown in the bracket of Figure 19 C.The substrate 122 that is implemented θ correction is transported to and is checked film forming station 103 by lifter 111.Lifter 111 by rotation by θ objective table 133 change in real estate in direction towards substrate 122 maintain it towards being delivered on the objective table that checks film forming station 103.
Proofread and correct owing to completing θ at aligning station 102, so just can start to substrate 122 surface formation Thinfilm patterns without the position correction of carrying out substrate 122 in inspection film forming station 103.For example, with compared with forming the situation of Thinfilm pattern after θ correction is carried out at inspection film forming station 103, can shorten the processing time checking in film forming station 103, even can realize and shorten interval time and enhance productivity.
In addition, on substrate 122, conventionally produce extension strain, and different from design load in the size of formation moment substrate 122 of carrying out Thinfilm pattern.Control device 120 is according to the size of the view data mensuration substrate 122 that uses CCD cameras 135～138 to obtain at aligning station 102.Carry out the formation of Thinfilm pattern on substrate 122 in inspection film forming station 103 time, generate the view data of the raster format that is used to form Thinfilm pattern according to the size of measuring.The view data generating is stored in the storage device 120a of control device 120.Be described in detail in the following explanation that checks film forming station 103 about this order.
Figure 20 A and Figure 20 B represent the synoptic diagram of a part that is stored in the liquid drop jetting apparatus 170 that checks film forming station 103.As shown in FIG. 20 A, liquid drop jetting apparatus 170 comprises the base 141 being arranged in the face parallel with XY plane (horizontal plane) and is disposed at successively Y objective table 143, X objective table 144, the chuck plate 145 base 141 from base 141 sides.Chuck plate 145 keeps being delivered to by lifter 111 absorption the substrate 123 that checks film forming station 103.
Y objective table 143 can move maintained substrate 123 to Y direction.X objective table 144 can move maintained substrate 123 to X-direction.Y objective table 143, X objective table 144 and chuck plate 145 form and are disposed on base 141, keep substrate 123 and at the moving stage that checks the interior moving substrate 123 in film forming station 103.The absorption of substrate 123 based on chuck plate 145, the instruction that control device 120 is accepted in the movement of substrate 123 based on Y objective table 143 and X objective table 144 are carried out.
In addition, Y objective table 143, X objective table 144 and chuck plate 145 can be disposed at above-below direction in this order, also can realize moving stage with the high function objective table of the function with Y objective table 143, X objective table 144, chuck plate 145.
Nozzle unit 147a～147f is configurable in the top of chuck plate 145.Nozzle unit 147a～147f is fixed on base 141 by framework 142.Framework 142 comprises pillar 142a, the pillar 142b that is fixed on base 141 and the crossbeam 142c that is supported on pillar 142a, pillar 142b.
Nozzle unit 147a～147f is held on the crossbeam 142c of framework 142 through connecting member 146.Nozzle unit 147a～147f comprises respectively multiple shower nozzles and ultraviolet source.The shower nozzle for example drop of ultraviolet hardening thin-film material that spues towards the surface of substrate 123 that is held in moving stage.Along X-direction moving substrate 123 time, carry out spuing of thin-film material.On the surface of substrate 123, form Thinfilm pattern by the thin-film material being spued, for example the pattern of welding resistance resist.Be formed at the surperficial Thinfilm pattern of substrate 123 by the ultraviolet curing (solidifying) of penetrating from ultraviolet source temporarily.
In the storage device 120a of control device 120, store the data that are formed at the view data (lattice uncle data) of the Thinfilm pattern on substrate 123 or represent the amount of movement of substrate 123 based on moving stage and the relation (timing spues) in the period that spues of the thin-film material from shower nozzle.Data (initial value) when these are design.Control device 120 is generated the view data (control data) of raster format according to the view data of the substrates 123 of taking at aligning station 102 by these data.For example, control device 120 utilizes in the directions X of aiming at the view data calculating substrate 123 of taking at station 102, the extension strain of Y-direction.Proofread and correct in the Y direction the coordinate (corrections of lattice uncle data) of the position of the drop of land thin-film material according to the extension strain of the Y-direction of substrate 123.On directions X according to the extension strain correction substrate 123 of the directions X of substrate 123 relation (timing spues) in the amount of movement based on X objective table 144 and the period that spues from the thin-film material of shower nozzle.So, being pre-stored within by correction the control data that the data of storage device 120a obtain is stored in storage device 120a.In addition, on the directions X of substrate 123, also proofread and correct coordinate instead of the timing that spues (corrections of lattice uncle data) of the position of land thin-film material.
With reference to figure 28A and Figure 28 B, an example of the correction of plaid matching uncle data describes.Figure 28 A and Figure 28 B represent the view data of the raster format being made up of multiple pixels of be arranged in rows direction and column direction.The pixel blacking that should be coated with the region of welding resistance resist in two figure represents.
Figure 28 A represents the design load (initial value) of the position of land thin-film material.The pixel in the outside of the circle of describing with solid line is as answering the area stores of coated thin film material in storage device 20a.
For example, the length of supposing directions X is l x, Y-direction length be l ythe elongation of directions X of rectangular-shaped substrate 123 be that the elongation of Δ X, Y-direction is Δ Y.If produce equably elongation on whole substrate 123, in directions X, Y-direction, the elongation of per unit length becomes Δ X/l x, Δ Y/l y.The circumference of Figure 28 A and inside (region of uncoated thin film material) expand according to dependent variable.,, on substrate 123, owing to answering the change in location of coated thin film material, therefore control device 120 is proofreaied and correct the coordinate (pixel) of the position of answering coated thin film material.
The view data of the raster format after proofreading and correct shown in Figure 28 B.The pixel of the periphery of for example describing with solid line in Figure 28 B becomes the region of answering coated thin film material after correction.The circumference of describing with solid line in Figure 28 A dots as a reference in Figure 28 B.For example, control data when, the view data shown in Figure 28 B forms as Thinfilm pattern are stored in storage device 120a again.
Control device 120, according to the control data that are kept at storage device 120a, is controlled thin-film material and is spued and the movement of substrate 123 based on moving stage from nozzle unit 147a～147f, so that thin-film material is coated the presumptive area on substrate 123.When substrate 123 moves along X-direction below the vertical of nozzle unit 147a～147f (Z axis negative direction) applied thin-film material.
In near of the nozzle unit 147a～147f of liquid drop jetting apparatus 170 shown in Figure 20 B.Nozzle unit 147a～147f is the nozzle unit that for example structure is identical, along Y direction to be uniformly-spaced fixed on connecting member 146.Connecting member 146 can be installed on the crossbeam 142c of framework 142 movably to Z-direction.So, nozzle unit 147a～147f is held on framework 142 can adjust the mode of the distance between substrate 123.By control device 120 Control Nozzle unit 147a～147f movements to Z-direction based on connecting member 146.In addition, nozzle unit 147a～147f can not be directly fixed on the crossbeam 142c of framework 142 by connecting member 146.
At the synoptic diagram of nozzle unit 147a shown in Figure 21 A.Nozzle unit 147a is included in nozzle fixture 47a cupper along the alternatively stacked shower nozzle 147a of X-direction 1～147a 4and ultraviolet source 147a 5～147a 9.Each shower nozzle 147a 1～147a 4possess 2 row nozzle rows of configuration spaced apart in X-direction.Each nozzle rows comprises multiple for example 192 nozzle bores of arranging along Y direction.Each nozzle rows is for example about 30mm along the length of Y direction.From can the spue drop of ultraviolet hardening thin-film material of each nozzle bore.
Ultraviolet source 147a 5～147a 9for example comprise light emitting diode (LED) and form, sending the light of ultraviolet region wavelength.From shower nozzle 147a 1～147a 4each nozzle bore spue to the ultraviolet hardening thin-film material of substrate 123 by from ultraviolet source 147a 5～147a 9the photocuring (temporarily solidifying) sending.Control from ultraviolet source 147a by control device 120 5～147a 9penetrate ultraviolet light.
(the shower nozzle 147a of nozzle unit 147a shown in Figure 21 B 1～147a 4) the spue upward view of face of drop.In Figure 21 B, omit ultraviolet source 147a 5～147a 9record.Arranged opposite shower nozzle 147a on moving stage 1～147a 4.
Shower nozzle 147a 1～147a 4the nozzle bore of 1 nozzle rows configure with 160 μ m cycles along Y direction.At each shower nozzle 147a 1～147a 4in, the mode that the nozzle rows of the positive side of X-axis departs from 80 μ m with the nozzle rows of the minus side of the relative X-axis in position of nozzle bore to Y-axis positive direction forms.Therefore, each shower nozzle 147a 1～147a 4be included in 384 nozzle bores arranging with 80 μ m interleaved in Y direction, there is the resolution ratio of about 300dpi about Y direction.Each nozzle bore comprises piezoelectric element and forms, according to the applied voltage thin-film material that spues.The spuing of thin-film material (voltage additional) carried out in the instruction of receiving control device 120.In addition, in embodiment 3, nozzle is classified 2 row as, but nozzle rows can be made as 1 row, more than also can being made as 3 row.
Shower nozzle 147a 1～147a 4when departing from relative position to the positive direction of Y-axis successively, entirety configures along X-direction.Shower nozzle 147a 2be configured to relative shower nozzle 147a 1only depart from 20 μ m to Y-axis positive direction side.As a same reason, shower nozzle 147a 3, shower nozzle 147a 4be configured to relative shower nozzle 147a respectively 2, shower nozzle 147a 3only depart from 20 μ m to the positive direction side of Y-axis.As a result, nozzle unit 147a possesses the nozzle bore with 20 μ m interval (high-resolution of about 1200dpi) configurations in Y direction.
The summary top view of nozzle unit 147a～147f shown in Figure 21 C.As aforementioned, each nozzle unit 147a～147f can make drop land in the scope of the approximately 30mm along Y direction.And, along Y direction uniformly-spaced to configure.Distance between adjacent nozzle unit 147a～147f is for example about 60mm.
In inspection film forming station 103, after the substrate of being carried by lifter 111 123 is held on moving stage (chuck plate 145), for example, when making its positive direction to X-axis move, the target location that spues (welding resistance resist forms target location) in the odd column pixel along X-direction (pixel of additional circular mark in Figure 21 C) of each nozzle unit 147a～147f below, from nozzle unit 147a～147f thin-film material that spues.If end spues to the target location in odd column pixel, make substrate 123 for example only after mobile 10 μ m to Y-axis positive direction at Y objective table 143, then when making substrate 123 move to the positive direction of X-axis, the target location that spues in the even column pixel along X-direction (pixel of additional fork-shaped mark in Figure 21 C) of each nozzle unit 147a～147f below, from nozzle unit 147a～147f thin-film material that spues.Can be by the drop that spues towards the target location of odd column pixel and even column pixel on the outlet along X-direction and loop, thus realize describing under the high-resolution of about 2400dpi.
Finish to spue after drop to even column pixel, drive Y objective table 143, make substrate 123 move about 30mm to the positive direction of Y-axis.Afterwards, by X objective table 144 make substrate 123 in X-direction come and go, on outlet and loop respectively to odd column pixel and even column pixel land thin-film material.
In addition, again carry out same processing, come and gone Thinfilm pattern for 3 times by the total along X-direction and formed the lip-deep of substrate 123.
The liquid drop jetting apparatus of embodiment 3 shown in Figure 20 A～Figure 21 C possesses 6 nozzle unit 147a～147f.The quantity of nozzle unit is not limited to 6.The number of nozzle unit for example can be 1.
Shown in Figure 22 A～Figure 22 D, be contained in the substrate inversion set 150 at substrate reversion station 104 and the synoptic diagram of ultraviolet lamp (welding resistance resist solidification equipment) 160.As shown in Figure 22 A, substrate inversion set 150 comprises substrate holder 151 and support unit 152.Substrate holder 151 has the shape of removing 3 limits of a minor face along rectangular periphery.The substrate 121～127 that is transported to substrate reversion station 104 by lifter 112 (Figure 18) is held in substrate holder 151.Bar-shaped support unit 152 supporting substrates retainers 151.Support unit 152 is configured in the plane that the plane of dividing with substrate holder 151 is identical, and its bearing of trend is parallel with the bearing of trend that 2 arms of substrate holder 151 divide.Substrate holder 151 can rotate taking support unit 152 as pivot.The rotation of substrate holder 151 based on support unit 152 controlled by control device 120.
Ultraviolet lamp 160 comprises support unit 161 and ultraviolet source 162.Support unit 161 for example extends to the direction parallel with the bearing of trend of the support unit 152 of substrate inversion set 150.Ultraviolet source 162 for example comprises lamp or LED and forms, and sends the light of ultraviolet region wavelength.Ultraviolet source 162 can be with higher than contained ultraviolet source 147a in nozzle unit 147a (Figure 21 A) 5～147a 9ultraviolet light is sent in the output of (Figure 21 A).Ultraviolet light wavelength can be made as and ultraviolet source 147a from nozzle unit 5～147a 9the ultraviolet light wavelength penetrating equates, also can be made as difference.
Ultraviolet source 162 is supported on support unit 161 in the mode that can move at its bearing of trend.Control from ultraviolet source 162 and penetrate the movement along support unit 161 of ultraviolet light and ultraviolet source 162 by control device 120.
As shown in Figure 22 B, checking that the substrate 124 that is formed with from the teeth outwards Thinfilm pattern in film forming station 103 (Figure 18) is transported to substrate reversion station 104 by lifter 112.Substrate 124 directly loads precedent as the surface of substrate 124 (being formed with the face of Thinfilm pattern) (Z axis positive direction) upward on substrate holder 151 by lifter 112.Substrate holder 151 keeps substrate 124 by fixing adsorb, press, clamping etc., substrate 124 is not held in and can relatively moves with respect to substrate holder 151.Fixing maintenance and the releasing thereof of substrate 124 based on substrate holder 151 controlled by control device 120.
As shown in Figure 22 C, in the time that ultraviolet source 162 penetrates ultraviolet light, ultraviolet source 162 is moved along support unit 161.Substrate inversion set 150 and ultraviolet lamp 160 are configured in the time that ultraviolet source 162 is moved along support unit 161, ultraviolet source 162 is by remaining on the top of the substrate 124 on substrate holder 151, the at least illuminated Thinfilm pattern in substrate 124 of the ultraviolet light penetrating from ultraviolet source 162 forms region, the whole surface of for example substrate 124.The ultraviolet light penetrating from ultraviolet source 162 is for example with 1000mJ/cm 2energy density irradiate the whole surface in substrate 124.The formal of surperficial Thinfilm pattern that is formed at substrate 124 by the irradiation of ultraviolet light solidified.The surperficial Thinfilm pattern of substrate 124 is cured to its inside by formal solidifying.In formal solidifying, ultraviolet light irradiates in substrate 124 with stronger energy density in solidifying temporarily.In addition, interim the solidifying carrying out in inspection film forming station 103 solidified the skin section of Thinfilm pattern, but the inside of Thinfilm pattern is still uncured.Can prevent that thin-film material is to Directional Extension in face by cured skin portion.
As shown in Figure 22 D, irradiating ultraviolet light makes substrate holder 151 Rotate 180s ° after the surperficial Thinfilm pattern of substrate 124 is formally solidified taking support unit 152 as pivot.Thus, reversion is held in the table quilt (surface and the back side) of the substrate 124 of substrate holder 151.The state that the substrate 124 that table is inverted is directly inverted with table is carried in aiming at station 105 by lifter 113, then carries in checking film forming station 106.Before the conveying of carrying out based on lifter 113, remove the maintenance of substrate 124 based on substrate holder 151.
With reference to figure 23A～Figure 23 F, the structure of substrate holder 151 is described.Figure 23 A, Figure 23 C and Figure 23 E represent the summary top view of substrate holder 151, and Figure 23 B, Figure 23 D and Figure 23 F represent the summary front view of substrate holder 151.
In structure example shown in Figure 23 A and Figure 23 B, substrate holder 151 possesses vacuum suction pad 153 on the surface of 2 arms.Shown in Figure 23 A and Figure 23 B, be formed with the example of multiple vacuum suction pads 153 on the surface of 2 arms.Lifter 112 (Figure 18) conveying substrate 124 and loading in being formed with on the surface of vacuum suction pad 153.Substrate 124 is by being adsorbed and being held in substrate holder 151 from the attraction of vacuum suction pad 153.
In structure example shown in Figure 23 C and Figure 23 D, substrate holder 151 is to dispose by pressure roller 154 along the mode of 2 arms respectively.Lifter 112 moves towards the edge of substrate 124 by pressure roller 154 after substrate 124 is positioned on substrate holder 151.Press by the edge of substrate 124 roller 154 that is pressed, substrate 124 is held in substrate holder 151.
In structure example shown in Figure 23 E and Figure 23 F, substrate holder 151 possesses clamp mechanism 155.Clamp mechanism 155 shown in Figure 23 E and Figure 23 F has the part of holding up of the long side direction that divides along 2 arms of substrate holder 151.By hold up part a part (clamp head) swing to inner side (for example 90-degree bent) fix the end that loads the substrate on substrate holder 151 124.
Substrate holder 151 shown in Figure 23 A～Figure 23 F fixes and keeps substrate 124 by adsorbing, press, sandwich the part that is not formed with Thinfilm pattern in substrate 124.
In above-mentioned example, after irradiating ultraviolet light the formal surperficial Thinfilm pattern that solidifies substrate 124, the table quilt of rotary plate retainer 151 substrate 124 that reverses.As other orders, can, after the table quilt of reversion substrate 124, from Z axis negative direction side, the surface irradiation ultraviolet light of substrate 124 formally be solidified.And the formal curing of irradiation carrying out based on ultraviolet light that can walk abreast is inverted with the table of the rotation of substrate 124 based on substrate holder 151 simultaneously.Now, for example adopt for the ultraviolet light of the surface irradiation prescribed strength of the substrate 124 in rotation and the structure of rotary synchronous ultraviolet source 162 grades in rotary moving of substrate 124.Can be by formally solidify to shorten the processing time in substrate reversion station 104 during reversion table quilt.
The substrate 124 that carries out the reversion of the formal curing and table quilt of surperficial Thinfilm pattern is transported to and is aimed at station 105 by lifter 113 (Figure 18).
Aim at station 105 and possess the 26S Proteasome Structure and Function identical with aiming at station 102.Detect the registration mark at the back side that is formed at substrate 124 and carry out θ correction by CCD camera.And, measured the size of the substrate 124 that forms Thinfilm pattern on surface by view data, and generate control data used when the back side at substrate 124 forms Thinfilm pattern again.
Lifter 113 by the rotation of the 105 θ objective tables that comprise of standing by aligning change in real estate in direction towards substrate 124 maintain it towards being delivered on the objective table that checks film forming station 106.
Check that film forming station 106 possesses and the structure and the function that check that film forming station 103 is identical.Check that the control data of using according to the back side in film forming station 106 form Thinfilm pattern at the back side of substrate 124.
In addition, the control data that the back side is used can make according to the view data of obtaining in aligning station 102.Now, the view data of obtaining in aligning station 105 is for example only proofreaied and correct for θ.
Because the θ that carry out substrate 124 at aligning station 105 proofread and correct, so without carry out θ correction in inspection film forming station 106.Therefore, just can start to form overleaf Thinfilm pattern without carrying out contraposition with respect to the substrate 124 that is delivered to inspection film forming station 106.Therefore, can shorten the processing time checking in film forming station 106, even can realize and shorten the intermittent time and enhance productivity.
After substrate 121～127 forms Thinfilm pattern overleaf, be delivered to conveyer 116 by lifter 114 (Figure 18).Afterwards, substrate 121～127 is taken out of to the outside of basket 118 from taking out of mouth 107 by conveyer 116.Under the state loading on conveyer 116, the whole back side illuminaton ultraviolet ray by ultraviolet lamp 108 to substrate 121～127, and the formal of Thinfilm pattern that is formed at the back side of substrate 121～127 solidified.Ultraviolet lamp 108 can be in the mode of the top by loading the substrate 121～127 on conveyer 116 in the interior movement of basket 118.When ultraviolet lamp 108 passes through the top of substrate 121～127, to the back side illuminaton ultraviolet ray of substrate 121～127.Or, can at the interior fixed configurations ultraviolet lamp 108 of basket 118, for example, make substrate 121～127 move below ultraviolet lamp 108 by conveyer 116.In the time that substrate 121～127 passes through the below of ultraviolet lamp 108, carry out irradiating to the ultraviolet ray of substrate 121～127.Irradiate and control by control device 120 to the ultraviolet ray of substrate 121～127.
In film forming device 171, finish checking in film forming station 103 after substrate 124 surfaces form Thinfilm patterns till during substrate 124 being loaded on the objective table that checks film forming station 106, stand in 104 and formally solidify to form in substrate 124 surface film patterns in substrate reversion.The lip-deep Thinfilm pattern that is formed at substrate 124 in inspection film forming station 103 does not just contact with any position and formally solidifies at substrate reversion station 104.
Owing to not carrying out the not interior zone of complete cured film pattern of formal curing substrate 124, so produce adherence (sticky feeling).If form the Thinfilm pattern at substrate 124 back sides under the formal curing state of Thinfilm pattern of not implementing substrate 124 surfaces, while for example forming Thinfilm pattern to substrate 124 back sides when based on lifter 113 treatment substrate 124 or in inspection film forming station 106, sometimes on surperficial Thinfilm pattern, leave scar etc.And, also sometimes because adherence produces unfavorable condition in various processing.
Finish after the surface of substrate 124 forms Thinfilm pattern till formally solidify to form the surperficial Thinfilm pattern in substrate 124 during substrate 124 is loaded on the objective table at inspection film forming station 106, can prevent from thus leaving scar on the surperficial Thinfilm pattern of substrate 124.Therefore, can form the Thinfilm pattern of high-quality.
And the formal of Thinfilm pattern that carries out substrate 124 back sides due to the ultraviolet ray by radiating from ultraviolet lamp 108 solidified, draw upper scar so can prevent from taking out of to the Thinfilm pattern at substrate 124 back sides after the outside of basket 118.
With reference to figure 24A～Figure 24 G, check film forming station 103 to being disposed at, check that the audit function of the liquid drop jetting apparatus 170 at film forming station 106 describes.Liquid drop jetting apparatus 170 based on embodiment 3 not only has film-shaped and becomes function, also has inspection and whether suitably carries out the audit function that spue of drop from nozzle bore.
The stereogram of a part for liquid drop jetting apparatus 170 based on embodiment 3 shown in Figure 24 A.Liquid drop jetting apparatus 170 based on embodiment 3 comprise towards substrate 121～127 spue thin-film material drop the portion that spues 180 and be disposed at than the portion of spuing 180 more by the inspection portion 181 of the positive side of X-axis.Inspection portion 181 for example possesses the framework 182 with framework 142 same structures of the portion of spuing 180., framework 182 forms by being fixed on 2 pillars of base 141 to Z-direction and being set up in 2 crossbeams between pillar along Y direction.On the crossbeam of framework 182 for example to be supported with linear transducer 167 with the opposed mode of moving stage.Linear transducer 167 can guide to Y direction by guiding piece, and moves to Y direction by line motor.
Linear transducer 167 comprises 7500 light emitting diodes that are arranged in a direction, for example 35mm scope.The substrate 121～127 remaining in chuck plate 145 is taken (detection) by linear transducer 167.In linear transducer 167, the orientation of light emitting diode is parallel with X-direction.Linear transducer 167 is controlled by control device 120.Therefore the instruction that, control device 120 is accepted in the movement of the shooting based on linear transducer 167 or linear transducer 167 is carried out.
For example, after thin-film material being coated to substrate 121～127 by the portion of spuing 180, substrate 121～127 is held in absorption under the state of chuck plate 145, moves to inspection portion 181 by X objective table 144.The spue position of X-direction of position, for example nozzle unit 147a～147f and linear transducer 167 of portion 180 and inspection portion 181 is stored in storage device 120a, control device 120 according to the position data that is stored in the inspection portion 181 in storage device 120a to inspection portion 181 moving substrates 121～127.Shown in Figure 24 A, move to the substrate 123 of the below of the framework 182 of inspection portion 181 by moving stage.
If substrate 123 moves to inspection portion 181, check the result that spues (land vestige) of thin-film material in the portion 180 that spues.Omit if for example stop up, produce the coating of undesirable level in known nozzle bore by the inspection of the result that spues, need that substrate 123 is carried out to the position that in correction process and substrate 123, generation is omitted and be stored in storage device 120a.And, notify operating personnel's nozzle bore of film forming device blocked by control device 120.Thus, can before the substrate 122 coated thin film materials that should process to the next one, eliminate the maintenance that nozzle bore stops up.
As an example, in linear transducer 167 is mobile above substrate 123 along Y direction, takes and be formed at the Thinfilm pattern (coating result) of substrate 123, and the view data of shooting is sent to control device 120.Control device 120 test example are as the edge of circular pattern or do not carry out the coating of thin-film material and the line omitted, and testing result is stored in storage device 120a.Can obtain the good no judgement (qualified no judgement) that Thinfilm pattern is formed at substrate 123 by the data of storage, also can after utilize this data while carrying out correction process.
[embodiment 4]
Then, embodiment 4 is described.Below to describing with the difference of embodiment 3, to identical incomplete structure explanation.The result that is formed at substrate 121～127 about Thinfilm pattern can detect as above-described embodiment 3, but in addition detects in addition the method that nozzle bore stops up.In embodiment 4, for example, utilize inspection plate whether suitably to carry out the inspection that spue of drop from nozzle bore.
Shown in Figure 24 B, check the top view with plate 128.Inspection comprises for example epoxy resin film and is formed at its surperficial Copper Foil with plate 128, and has flat shape longer in a direction.The length that checks the long side direction of using plate 128 is for example 550mm left and right, and width is for example tens mm.Also can not use epoxy resin film, only form and check with plate 128 by Copper Foil.
Make Copper Foil forming surface (Z axis positive direction) upward, for example, in the long side direction mode parallel with Y direction, inspection is held in to chuck plate 145 with plate 128 absorption.Maintenance inspection on objective table is the below of nozzle unit 147a～147f with the position of plate 128.
Control device 120 drives X objective table 144, make to check when moving to the negative direction of X-direction, for example X-axis with plate 128, send from all nozzle bores of nozzle unit 147a～147f together towards checking with the spue instruction of (inspection use spues) thin-film material of plate 128.Thin-film material is spued continuously with plate 128 for example checking during the negative direction of X-axis moves 1mm.
In Figure 24 B, represent to be attached to short solid line the pattern (land vestige) checking with the thin-film material of plate 128.The land vestige that accompanying drawing left side is the thin-film material that spues from the nozzle bore of nozzle unit 147a, accompanying drawing right side is the land vestige of the thin-film material that spues from the nozzle bore of nozzle unit 147f.Omission is positioned in the middle of it and the record of the land vestige of the thin-film material spuing from the nozzle bore of nozzle unit 147b～147e.
Be formed on the wire land vestige of 1mm length X-direction by the thin-film material for example spuing from normal each nozzle bore stopping up without nozzle bore.The configuration of the nozzle bore shown in land vestige and Figure 21 B distributes accordingly., each nozzle unit 147a～147f is upper forms along Y direction uniformly-spaced to arrange 8 row of land vestige of multiple land vestiges.8 of land vestige are listed in X-direction and arrange.
In Figure 24 C, represent that absorption is held in the top view of plate 128 for the inspection of chuck plate 145.The inspection plate 128 that is formed with land vestige is held in absorption under the state of chuck plate 145, is being checked film forming station 103, is being checked that the interior negative direction to X-axis in film forming station 106 moves to inspection portion 181 by the driving of X objective table 144.Plate 128 for inspection after moving is shown in Figure 24 C bracket.
Check and use plate 128 and linear transducer 167 about X-direction contraposition.Check the below that is disposed at position that can mobile linear transducer 167 by X objective table 144 with plate 128.
As shown in Figure 24 D, linear transducer 167 comprising from checking with a side's of the long side direction of plate 128 end in for example moving with constant speed in the scope of the opposing party's end, is taken the copper foil surface that checks use plate 128 to the negative direction of Y-axis in the example shown in Y direction, this figure.Thus, obtain the view data of the land vestige that comprises thin-film material.
As shown in Figure 24 E, check by the scope of land vestige at least forming, for example check with taking on the whole surface of Copper Foil of plate 128 by linear transducer 167.Institute's vestige that has assured result along Y direction detects by 1 scanning is unified.
In addition, it is parallel with Y direction exactly that inspection needn't be held in its long side direction with plate 128, and the moving direction that also can be held in linear transducer 167 is parallel with Y direction exactly.But preferably each long side direction of wire land vestige and the moving direction of linear transducer 167 are orthogonality relation.So can shorten the width (being 35mm in this example) that can take based on linear transducer 167.And, even for carrying the situation more than the nozzle unit of embodiment 3, also irrelevant with the number of nozzle unit, can be with 1 of 1 linear transducer 167 time scanning shoot land vestige.
In addition, in this example, move linear transducer 167 to the negative direction of Y-axis, but also can move and check with plate 128 to the positive direction of Y-axis by Y objective table 143.Linear transducer 167 relatively moves into plate 128 for inspection (or keeping checking the objective table with plate 128) scope on plate 128 for inspection that can take the wire land vestige that can form 1mm length.
And this example adopts linear transducer 167 is disposed to the structure of more leaning on the positive side of X-axis than framework 142, but linear transducer 167 for example can be held in and can move to Y direction on framework 142.
The view data of being taken by linear transducer 167 is sent to control device 120.
Control device 120 for example, according to the view data (testing result) of obtaining by linear transducer 167, particularly determine whether and suitably carry out spue (detection spue bad) of drop from each nozzle bore of nozzle unit 147a～147f according to checking with the land vestige on plate 128.As an example, detect the situation (inadequate land vestige) of not skimming over to the situation of land vestige (omission of land vestige) or land vestige forming the position probing of land vestige.By detecting, these bad positions are specific thinks bad nozzle bore.Control device 120 notifies user suitably not carry out the nozzle bore spuing of drop.As the bad reason that spues, for example, can think that nozzle bore stops up.
The user who accepts notice can for example improve according to the situation of content of announcement or user's side the measure of nozzle bore obstruction etc.
In this example, not to Y direction moving stage (not changing the relative position of shower nozzle and objective table to Y direction), be only coated with continuously the thin-film material of specific length to X-direction, for example, be only coated with the thin-film material of 1mm length.About Y direction, due to the not overlapped and mutual distance configuration across to a certain degree of the land vestige from multiple nozzle bores, so can pinpoint accuracy ground detect the obstruction of nozzle bore.For example, in the time that nozzle bore stops up, owing to not forming the land vestige of 1mm, so clear and definite which nozzle bore stops up like a cork.
In addition, not with wire coated thin film material, be point-like but can be coated with into land vestige.But, can be by be coated with the thickness of detection line with wire.In the time that land vestige is thinner than normal width, do not stop up completely though can be judged to be nozzle bore, but produce local obstruction, and the discharge-amount of thin-film material tails off.Control device 120 can be for example by the width of land vestige and threshold and be judged to be to spue while being less than threshold value bad.
For example, when the n of adjacency, 2 or 3 nozzle bores are when bad, the measure that does not improve spray nozzle clogging just forms Thinfilm pattern on substrate 121～127, because the pixel of land thin-film material is not connected, so as shown in Figure 24 F, cause forming on Thinfilm pattern groove.This substrate 121～127 can also not meet as the quality of product and is made as outside specification.In addition, in the time that more than 2 nozzle bore of adjacency is bad, can set especially the advice method based on control device 120.
Under the prerequisite of controlling based on control device 120, finish regulation sheet number for example at every turn, implement the inspection of embodiment 4 while 100 plate bases being formed to the processing of Thinfilm patterns as an example.Can be undertaken by batch, or must before starting the processing of 1 plate base formation Thinfilm pattern, carry out.
According to the result of determination of the inspection method based on embodiment 4, can take measures from spuing of each nozzle bore in order suitably to carry out drop.Therefore, if according to the liquid drop jetting apparatus based on embodiment 4, can utilize easy structure to check with high efficiency whether drop spues good, and carry out the Thinfilm pattern formation of high-quality.
[embodiment 5]
Then, embodiment 5 is described.Below, to describing with the difference of embodiment 4, to identical incomplete structure explanation.In embodiment 4, utilize and check to judge with plate 128 whether drop is good from spuing of nozzle bore, but also can utilize the substrate of formation Thinfilm pattern to carry out the inspection of nozzle bore obstruction.
As shown in Figure 24 G, on the substrate 129 of formation Thinfilm pattern, Thinfilm pattern is set and forms region 129a and inspection area 129b.Thinfilm pattern is formed at Thinfilm pattern and forms in the 129a of region.In example shown in Figure 24 G, on substrate 129, divide 20 Thinfilm patterns with 5 row 4 row and form region 129a.It is for example about 30mm that Thinfilm pattern forms the region 129a length along Y direction separately.Inspection area 129b is divided into the end of the X-direction of substrate 129.The flat shape of inspection area 129b is for example rectangle, and the size of Y direction and X-direction is respectively tens mm and about 30mm.
Thinfilm pattern shown in Figure 24 G forms and on the 129a of region, utilizes nozzle unit numerical example to form Thinfilm pattern as the liquid drop jetting apparatus that is not 6 but 1, only possess nozzle unit 147a as an example.When making substrate 129 come and go 1 time along X-direction, towards substrate 129 thin-film material that spues, and form region 129a at 5 Thinfilm patterns of left end row and form Thinfilm patterns.After substrate 129 is moved about 30mm by the positive direction of Y-axis, then when making substrate 129 come and go 1 time to X-direction, towards substrate 129 thin-film material that spues, form Thinfilm pattern thereby form region 129a at the Thinfilm pattern from left the 2nd row.These operations, form in the 129a of region and form Thinfilm pattern at all Thinfilm patterns repeatedly.
Before forming region 129a coated thin film material to Thinfilm pattern, from each nozzle bore one of nozzle unit 147a inspection area 129b thin-film material that spues in the same way.To X-direction moving substrate time, carry out spuing of thin-film material, form the land vestige identical with the land vestige for example forming in the embodiment 4 shown in Figure 24 B.Afterwards, identical with embodiment 4, judge to 1 scanning of Y direction whether drop is good from spuing of nozzle bore by linear transducer 167.
Or, can be after inspection area 129b spues thin-film material, do not carry out the drop whether good inspection that spues and just form region 129a at Thinfilm pattern and form Thinfilm pattern.Now, spue to the thin-film material of the inspection area 129b record management for each substrate., as required, can detect land vestige by linear transducer 167 afterwards, and be used in the evaluation of the Thinfilm pattern of substrate 129.
In the time inspection area 129b being set and detect the land vestige in the 129b of inspection area on substrate 129, in storage device 120a, store the position of inspection area 129b on substrate 129.Control device 120 according to the position data control substrate 129 of inspection area 129b that is stored in storage device 120a the movement based on moving stage and thin-film material from the spuing of shower nozzle, and at the inspection area 129b thin-film material that spues.Afterwards, to the below moving substrate 129 of linear transducer 167, and detection is formed at the land vestige of the thin-film material of inspection area 129b.
Because the surface of the substrate 129 forming Thinfilm pattern arranges inspection area 129b, therefore without checking with plate 128.Therefore, can improve cost performance.
In addition, can in the scope of the round action of X-direction, linear transducer 167 be set by the objective table in the time Thinfilm pattern being formed to Thinfilm pattern formation region 129a.Now, without inspection portion 181 (Figure 24 A), thereby can dwindle film forming device area (area of coverage) is set.And, due to the time that can reduce for checking to inspection portion 181 moving substrates 129, so can further enhance productivity.
Nozzle unit number shown in embodiment 5 is the liquid drop jetting apparatus of 1, even if but use the liquid drop jetting apparatus that possesses 6 nozzle units also can check with identical order.
[embodiment 6]
Then, embodiment 6 is described.Below, to describing with the difference of embodiment 3, to identical incomplete structure explanation.Can also, from the nozzle bore thin-film material that spues, detect the land vestige being formed, be used in the relative position of proofreading and correct between shower nozzle or between nozzle unit.
The land vestige (#1) of the thin-film material spuing from the nozzle bore of shower nozzle #1, shower nozzle #2 shown in Figure 25 A, the synoptic diagram of land vestige (#2).In the each rectangle inside with dotted lines, 2 row land vestiges extend to Y direction.In Figure 25 B, amplify the land vestige (#1), the land vestige (#2) that illustrate from the thin-film material of shower nozzle #1, shower nozzle #2.The land vestige of each thin-film material for example has the wire shape of 1mm length in X-direction.Land vestige (#1), land vestige (#2) from the thin-film material of shower nozzle #1, shower nozzle #2 are for example detected by 1 scanning along Y direction of linear transducer 167.
Control device 120 utilizes the view data calculated example of obtaining by linear transducer 167 as the distance along X-direction between the upper left land vestige of land vestige (#1) (being positioned at the land vestige that leans on the thin-film material of Y-axis minus side most of the positive side row of X-axis) and the upper left land vestige of land vestige (#2).And, the distance along X-direction between bottom right land vestige and the bottom right land vestige of land vestige (#2) of calculating land vestiges (#1).Calculate the mean value l of these distances Δ X.
In the manufacture of nozzle unit, for example, shower nozzle #1 and shower nozzle #2 are assembled on nozzle fixture, to become 20 μ m along the mutual distance (configuration space) of X-direction.When assembling, when staff measures between the assembling position of shower nozzle and multiple shower nozzle distance, carry out modestly position adjustment.Therefore working time that, need to be longer.
In embodiment 6, after assembling shower nozzle #1, shower nozzle #2, can obtain the distance along X-direction (configuration space) between shower nozzle #1, shower nozzle #2 by the size of the X-direction of mean value l Δ X and shower nozzle #1, shower nozzle #2.Therefore, without the distance between actual measurement shower nozzle #1, shower nozzle #2, just can be according to spuing departing between calibration of the output results shower nozzle #1, shower nozzle #2.Therefore, for example can shorten the time of shower nozzle assembly working.
Position deviation about Y direction also can be proofreaied and correct in the same manner.Shower nozzle #1, shower nozzle #2 are for example assembled on nozzle fixture in the mode that only departs from 20 μ m in Y direction.Calculate thus the distance along Y direction between the distance along Y direction and the lower-right most point of land vestige (#1) and the lower-right most point of land vestige (#2) between the upper left point of land vestige (#1) and the upper left point of land vestige (#2).Calculate the mean value l of these distances Δ Y.As an example, as mean value l Δ Ywhile being 21 μ m, the assembling along Y direction between shower nozzle #1, shower nozzle #2 being departed from and only reduce 1 μ m.
In addition, about departing from of X-direction, can adjust again the assembling position of shower nozzle, but can also proofread and correct bias from the timing that spues of nozzle bore by controlling thin-film material.Therefore, can be by the mean value l for example calculating Δ Xor the distance along X-direction (configuration space) between shower nozzle #1, shower nozzle #2 is stored in storage device 120a.
[embodiment 7]
Then, embodiment 7 is described.Below to describing with the difference of embodiment 6, to identical incomplete structure explanation.
The coating result of thin-film material shown in Figure 25 C.In Figure 25 C, represent the land vestige from the thin-film material of nozzle bore with solid line, dot the reference position of the land of thin-film material.The land vestige (being for example now the starting point that spues from each nozzle bore) of thin-film material detects with 1 scanning along Y direction of linear transducer 167.
By test example as the land vestige of multiple thin-film materials from the departing from of reference position (X-direction depart from Δ X, Y direction depart from Δ Y), can detect thus depart from (the Δ θ) in the assembling of shower nozzle with θ direction.
And, before being assembled in nozzle fixture, on shower nozzle, be formed with multiple nozzle bores, but on shower nozzle, form in the manufacture process of nozzle bore, likely there is trickle departing from the formation position of nozzle bore.Now, to for example N land trace detection Δ Y, calculate ensemble average value by coating result.Proofread and correct the assembling of shower nozzle to θ direction rotation, so that mean value becomes minimum.Or, can control from the timing that spues of nozzle bore thin-film material, to obtain identical effect.
Also can proofread and correct the departing from of relative position of the θ direction between shower nozzle.
[embodiment 8]
The synoptic diagram of the film forming device 172 based on embodiment 8 shown in Figure 26.Below, to describing with the difference of embodiment 3, to identical incomplete structure explanation.In film forming device 172, aligning station 102, aligning station 105 do not comprise the alignment device that carries out θ correction, and check that the liquid drop jetting apparatus at film forming station 103, inspection film forming station 106 comprises θ objective table 149 and CCD camera 163～166.
The aligning station 102 of film forming device 172, aim at configuration on station 105 as the interim mounting table 148 of alignment device that carries out the simple alignment of not proofreading and correct with θ.Substrate 121～127 loads in aiming at station 102, aiming on the interim mounting table 148 at station 105 by lifter 111, lifter 113, is implemented after the simple alignment such as pressing of steady pin, is delivered to and checks film forming station 103, checks film forming station 106.
Check film forming station 103, check that the liquid drop jetting apparatus at film forming station 106 comprises θ objective table 149 between for example X objective table 144 and chuck plate 145.θ objective table 149 can rotate with in parallel plane of XY the substrate 121～127 that is held in chuck plate 145 around the rotating shaft parallel with Z axis.And liquid drop jetting apparatus comprises the CCD camera 163～166 of the registration mark that detects the table quilt cover that is formed at substrate 121～127.
The substrate 121～127 that be delivered to and check film forming station 103, checks film forming station 106 is adsorbed and is held in chuck plate 145, detects the registration mark of table quilt cover by CCD camera 163～166.Testing result (view data of shooting) is sent to control device 120.
Control device 120 is processed testing result, and calculate direction in the position of substrate 121～127 and real estate posture (towards).Afterwards, by for example driving θ objective table 149 to proofread and correct (θ correction) substrate 121～127 posture in direction in real estate.And control device 120 calculates the size of substrate 121～127 according to the testing result of CCD camera 163～166.Generate the control data that are used to form thin-film material according to the size of calculating.
In film forming device 172, not aim at station 102, aim at station 105 carry out substrate 121～127 θ proofread and correct, but check film forming station 103, check film forming station 106 use θ objective table 149 carry out substrate 121～127 θ proofread and correct.Afterwards, on substrate 121～127, form Thinfilm pattern according to the control data that generate.
In addition, in embodiment 8, also can after finishing, use linear transducer 167 to check whether suitably to carry out spuing from the drop of each nozzle bore of nozzle unit 147a～147f in for example processing substrate of regulation sheet number.
In embodiment 8, also after checking that film forming station 103 forms Thinfilm pattern on substrate 121～127, during the substrate 121～127 that mounting table is inverted on the objective table that checks film forming station 106, in substrate reversion station 104, the Thinfilm pattern that is formed at substrate 121～127 surfaces is formally solidified.Thus, can prevent that scar is attached to the Thinfilm pattern on substrate 121～127 surfaces.Therefore can form the Thinfilm pattern of high-quality.
And the formal of Thinfilm pattern that carries out substrate 121～127 back sides due to the ultraviolet ray by penetrating from ultraviolet lamp 108 solidified, so can prevent from taking out of to the outside of basket 118, scar is attached to the Thinfilm pattern at substrate 121～127 back sides.
Whether in addition, the film forming device based on embodiment 8 is also identical with embodiment 3, can utilize simple structure to check efficiently suitably to carry out from each nozzle bore of nozzle unit 147a～147f drop that spues, and form the Thinfilm pattern of high-quality.
[embodiment 9]
The synoptic diagram of the film forming device 173 based on embodiment 9 shown in Figure 27.Below to describing with the difference of embodiment 3, to identical incomplete structure explanation.Film forming device 173 does not comprise substrate reversion station 104, aims at station 105, inspection film forming station 106 and lifter 112, lifter 113, and this point is different from the film forming device 171 based on embodiment 3.Film forming device 171, film forming device 172 based on embodiment 3 and embodiment 8 can form Thinfilm pattern on the two sides of substrate 121～127, but 173 of the film forming devices based on embodiment 9 for example, form Thinfilm pattern on the one side of substrate 121～124, surface.
In film forming device 173 based on embodiment 9, parallel processing in aiming at station 102 and checking film forming station 103.That is, be formed at the detection of surperficial registration mark and the aligning of substrate 122 of substrate 122 at aligning station 102, during this period, check that in film forming station 103, the surface at substrate 123 forms Thinfilm pattern.During this period, for example conveyer 115 is moved into the substrate 121 that does not form Thinfilm pattern to basket 118.The substrate 124 that the effects on surface that is through with forms after Thinfilm pattern is delivered to conveyer 116 by lifter 114.Load under the state on conveyer 116 at substrate 124, the formal of surperficial Thinfilm pattern that is formed at substrate 124 by the ultraviolet ray of penetrating from ultraviolet lamp 108 solidified.Afterwards, conveyer substrate 124 is taken out of to the outside of basket 118 from taking out of mouth 107 by conveyer 116.
In embodiment 9, be contained in and check that the liquid drop jetting apparatus at film forming station 103 also can utilize simple structure effectively to check whether suitably to carry out from each nozzle bore of nozzle unit 147a～147f drop that spues, and form the Thinfilm pattern of high-quality.
Describe the present invention according to embodiment above, but the invention is not restricted to these embodiment.For those skilled in the art, for example can carry out various changes, improvement and combination etc. should be appreciated that.
For example, in embodiment, only carry out the movement (movement XY plane in) of substrate with respect to nozzle unit by objective table.As other structure example, for example, can make framework move to X-direction, and can make nozzle unit move to Y direction and Z-direction with respect to framework.Nozzle unit and substrate are relatively mobile.But, in XY plane only the structure of moving substrate than can forming to pinpoint accuracy Thinfilm pattern to the structure of XY in-plane moving nozzle unit.
And, in embodiment, on printing distributing board, form the Thinfilm pattern being formed by welding resistance resist, but the film forming device of above-described embodiment can be used in the purposes that forms dielectric film on glass substrate in the manufacture of for example contact panel.
In addition, in embodiment, use 1 linear transducer to carry out the detection of the land vestige of thin-film material, but also can arrange multiple linear transducers and detect along X-direction, so that the orientation of light emitting diode becomes X-direction.By using multiple linear transducers, even in the situation that land vestige is grown to X-direction, also can detect with 1 scanning.

Claims (16)

1. Thinfilm pattern forms a device, and it has:
Objective table, keeps substrate;
Nozzle unit, opposed and be provided with multiple to the spue nozzle bore of drop of thin-film material of described substrate with described substrate;
Travel mechanism, with respect to described nozzle unit, moves described substrate to direction in the face of this substrate;
The 1st filming apparatus, detects the Thinfilm pattern being formed by the thin-film material of coating described substrate; And
Control device,
Described control device makes the drop of thin-film material spue to described substrate from described nozzle unit, forms check pattern by the thin-film material that is attached to described substrate,
Obtain the view data of the described check pattern of taking with described the 1st filming apparatus,
Judge that by analyzing the view data of obtaining whether the nozzle bore of described nozzle unit is good,
Other nozzle units of at least 1 same structure except described nozzle unit; And
Nozzle unit supporting device, can load and unload and support described multiple nozzle unit,
Nozzle unit and described travel mechanism described in described control device control to only use the nozzle unit that is installed on described nozzle unit supporting device, form the Thinfilm pattern as target on described substrate,
Described travel mechanism has any 1 of using in described multiple nozzle unit also can form the stroke as the Thinfilm pattern of target in the whole region of described substrate,
Described Thinfilm pattern formation device further has the apparatus for correcting of the Recovery processing that carries out bad nozzle,
If the number of described nozzle unit bad nozzle bore separately exceedes permissible value, this nozzle unit is judged to be temporary fault by described control device,
Described control device uses the Recovery processing of described apparatus for correcting to being judged to be the nozzle unit of temporary fault,
Described control device uses all described nozzle unit the described nozzle unit after Recovery processing to form the processing of described check pattern, and then obtains the processing of described view data and judge the processing whether described nozzle unit is good.
2. Thinfilm pattern as claimed in claim 1 forms device, wherein,
Described Thinfilm pattern forms device and further has operating personnel and input the input unit of instruction,
Described control device comprises the storage device of storing described permissible value, and will write described storage device from the permissible value of described input unit input.
3. Thinfilm pattern as claimed in claim 1 forms device, wherein,
Described control device is judged to be the number of times of temporary fault by each described nozzle unit storage, exceedes number of stoppages higher limit if be judged to be the number of times of temporary fault, gives the alarm from output device.
4. Thinfilm pattern as claimed in claim 1 forms device, wherein,
The surface of described substrate delimited the target pattern region that should form aimed thin film pattern, and described target pattern region around delimited and had the not use region that does not form aimed thin film pattern,
Described control device forms described check pattern in the described region that do not use.
5. Thinfilm pattern as claimed in claim 1 forms device, wherein,
Described Thinfilm pattern forms device and further has the 2nd filming apparatus, and it can move with respect to shower nozzle, and is configured to and can moves to the position that can take described nozzle bore.
6. Thinfilm pattern as claimed in claim 5 forms device, wherein,
Described the 2nd filming apparatus is installed on described objective table.
7. Thinfilm pattern as claimed in claim 5 forms device, wherein,
The movement of the 2nd filming apparatus described in described control device control, moves to described the 2nd filming apparatus and can take the position that is inferred to be the suspicious region that has bad nozzle bore.
8. Thinfilm pattern as claimed in claim 7 forms device, wherein,
Described Thinfilm pattern forms device and further has the input unit that operating personnel operate, and operating personnel utilize described input unit to input the positional information of described suspicious region, thus the positional information of described suspicious region are offered to described control device.
9. Thinfilm pattern as claimed in claim 5 forms device, wherein,
Described Thinfilm pattern forms device and further has output device, and it shows the image of taking with described the 2nd filming apparatus,
Described control device will be shown in described output device with the image that described the 2nd filming apparatus photographs.
10. Thinfilm pattern as claimed in claim 9 forms device, wherein,
Described Thinfilm pattern forms device and further has apparatus for correcting, and it is accepted from the control of described control device and carries out the Recovery processing of nozzle bore,
If the instruction of carrying out from input unit input correction process and the information of specific bad nozzle bore, apparatus for correcting described in described control device control, to carry out the Recovery processing of described bad nozzle bore.
11. Thinfilm patterns as claimed in claim 8 form device, wherein,
Described film forming device further has apparatus for correcting, and it is accepted from the control of described control device and carries out the Recovery processing of bad nozzle bore,
Described control device moves to described the 2nd filming apparatus can to take from the position of the described suspicious region of described input unit input, and carry out the graphical analysis of captured image, according to the specific bad nozzle bore of graphical analysis result, and control described apparatus for correcting, to carry out the Recovery processing of specific bad nozzle bore.
12. 1 kinds of thin-film pattern forming methods, have:
Spue the drop of thin-film material to form the operation of the check pattern being formed by thin-film material at substrate from thering is the nozzle unit of multiple nozzle bores;
The operation of judging that by observing described check pattern whether described nozzle bore is good; And
Spue the state of thin-film material from being judged to be bad described nozzle bore stopping, from the normal described nozzle bore thin-film material that spues, on substrate, form thus the operation as the Thinfilm pattern of target, in the whether good operation of the described nozzle bore of judgement, if inspection exceedes the nozzle unit of permissible value to the number that is judged to be bad nozzle bore, this nozzle unit is judged to be to temporary fault
And, be judged to be the Recovery processing of the nozzle unit of temporary fault,
After Recovery processing, turn back to the operation that forms described check pattern to form described check pattern.
13. thin-film pattern forming methods as claimed in claim 12, wherein,
Other nozzle units of described nozzle unit and at least 1 same structure are installed in nozzle unit supporting device,
In the whether good operation of the described nozzle bore of judgement, determine whether the nozzle unit that exists the number of times that is judged to be described temporary fault to exceed setting, in the time there is the nozzle unit of the temporary fault that produces the number of times that exceedes setting, using this nozzle unit as persistent fault nozzle unit, from described nozzle unit supporting device dismounting
In the operation of the described Thinfilm pattern of formation, dismantling the state of described persistent fault nozzle unit from described nozzle unit supporting device, forming the Thinfilm pattern as target from being installed on the described nozzle bore of nozzle unit of the described nozzle unit supporting device liquid material that spues at described substrate.
14. thin-film pattern forming methods as claimed in claim 12, it has:
If it is bad that at least 1 nozzle bore is judged as, infer the position that comprises the suspicious region that is judged to be bad nozzle bore, make the 2nd filming apparatus move to the operation of the position that can take described suspicious region;
The operation of taking described suspicious region with described the 2nd filming apparatus; And
According to the operation of the specific bad nozzle bore of image of taking.
15. thin-film pattern forming methods as claimed in claim 14, it further has:
Carry out the Recovery processing of described bad nozzle bore or the operation of carrying out the replacing of shower nozzle according to described spectral discrimination.
The method of adjustment of 16. 1 kinds of film forming devices, described film forming device has:
Objective table, keeps substrate at maintenance face;
Multiple shower nozzles, opposed and be formed with multiple towards the spue nozzle bore of drop of thin-film material of described substrate with the substrate that remains on described objective table;
Travel mechanism, makes described objective table move towards the direction parallel with described maintenance face with respect to the opposing party with a side of described shower nozzle; And
Filming apparatus, can move with respect to described shower nozzle, and is configured to and can moves to the position that can take described nozzle bore,
Described method of adjustment has:
Described filming apparatus is moved to the position that can take described shower nozzle, and take the operation of at least 2 described shower nozzles; And
According to the operation of the relative position of the multiple described shower nozzles of Image Adjusting of the described shower nozzle photographing.
CN201210275135.XA 2011-08-05 2012-08-03 Thin film pattern forming apparatus, thin film pattern forming method and adjustment method for thin film pattern forming apparatus Expired - Fee Related CN102909954B (en)

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JP2012111095A JP2013237004A (en) 2012-05-15 2012-05-15 Thin film forming position, and repairing method and adjusting method for thin film forming device
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* Cited by examiner, † Cited by third party
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KR102340465B1 (en) * 2014-03-11 2021-12-16 가부시키가이샤 스크린 홀딩스 Substrate treatment apparatus and substrate treatment method
KR101445745B1 (en) * 2014-04-21 2014-11-04 주식회사 디앤씨 Inspecting unit and dispensing module having the same and maintain method for nozzle using the same
KR101599040B1 (en) * 2014-07-28 2016-03-14 순천향대학교 산학협력단 Repair apparatus using electro hydro dynamic inkjet
KR101599037B1 (en) * 2014-07-28 2016-03-14 순천향대학교 산학협력단 Repair apparatus using electro hydro dynamic inkjet
JP6423672B2 (en) * 2014-09-26 2018-11-14 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
CN105499069B (en) * 2014-10-10 2019-03-08 住友重机械工业株式会社 Membrane formation device and film forming method
CN104808446B (en) 2015-05-07 2021-02-02 合肥京东方光电科技有限公司 Coating machine
JP6695237B2 (en) * 2016-08-22 2020-05-20 東京エレクトロン株式会社 Droplet ejection device and droplet ejection condition correction method
JP6689540B2 (en) * 2016-08-22 2020-04-28 住友重機械工業株式会社 Film forming apparatus and film forming method
KR102655331B1 (en) * 2016-11-30 2024-04-08 주식회사 탑 엔지니어링 Coating device for monitering the positon and displacement of discharge head and method for controling the same
TWI650618B (en) * 2017-10-03 2019-02-11 財團法人工業技術研究院 Method for fabricating thin films and organic luminescence device
JP6925746B2 (en) * 2017-12-15 2021-08-25 住友重機械工業株式会社 Membrane forming device and film forming method
KR102086411B1 (en) * 2018-06-04 2020-03-09 주식회사 코엠에스 PCB Plate Film Monitoring System
JP7224000B2 (en) * 2018-09-03 2023-02-17 パナソニックＩｐマネジメント株式会社 LIQUID MATERIAL SUPPLY DEVICE AND LIQUID MATERIAL SUPPLY METHOD
CN110239233B (en) * 2019-05-15 2021-07-06 东旭光电科技股份有限公司 Cover plate glass spraying device
JP2021181071A (en) * 2020-05-20 2021-11-25 住友重機械工業株式会社 Ink coating device, control device of the same, and inkjet head inspection method
JP7478029B2 (en) * 2020-06-01 2024-05-02 住友重機械工業株式会社 Image data generating device and image data generating method
CN113522601B (en) * 2021-07-23 2022-07-26 蜂巢能源科技有限公司 Ceramic coating mechanism and pole piece coating system and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101247957A (en) * 2005-08-24 2008-08-20 株式会社石井表记 Ink jet head and its jetting exception detecting method and film forming method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008100138A (en) * 2006-10-17 2008-05-01 Seiko Epson Corp Liquid droplet discharge device, manufacturing method of electrooptical device, electrooptical device and electronic device
KR20080046763A (en) * 2006-11-23 2008-05-28 삼성전자주식회사 Device for jetting of thin film liquid
JP5131450B2 (en) 2007-10-15 2013-01-30 セイコーエプソン株式会社 Droplet discharge amount adjusting method and pattern forming apparatus
JP2009128476A (en) * 2007-11-21 2009-06-11 Toppan Printing Co Ltd Ink head discharge inspection method and discharge inspection apparatus
JP4942689B2 (en) * 2008-03-24 2012-05-30 理想科学工業株式会社 Image recording device
CN102307676B (en) * 2009-02-04 2014-10-29 世联株式会社 Method for inspecting jetting state of inkjet head and apparatus for inspecting jetting state of inkjet head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101247957A (en) * 2005-08-24 2008-08-20 株式会社石井表记 Ink jet head and its jetting exception detecting method and film forming method

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