CN102902024B - Method for realizing optical coupling of multi-core fiber and photoelectron chip array - Google Patents
Method for realizing optical coupling of multi-core fiber and photoelectron chip array Download PDFInfo
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- CN102902024B CN102902024B CN201210380270.0A CN201210380270A CN102902024B CN 102902024 B CN102902024 B CN 102902024B CN 201210380270 A CN201210380270 A CN 201210380270A CN 102902024 B CN102902024 B CN 102902024B
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Abstract
The invention relates to a method for realizing the optical coupling of a multi-core fiber and a photoelectron chip array. The method comprises the steps of fixing a cushion block in a pipe casing, then laying solder in a small groove on the cushion block, laying a photoelectron chip in a corresponding groove, so as to ensure the solder is molten to fix the photoelectron chip, accomplishing the electrical connection of the photoelectron chip in a wire bonding way, aligning the end surface of a multilayer waveguide to a light-emitting surface of the cushion block, then fixing the multilayer waveguide, adjusting and fixing the position of a fixed lens assembly, then aligning the fixed lens assembly to a multi-core fiber, and fixing the multi-core fiber, so that the optical coupling of the multi-core fiber and the photoelectron chip array is realized. The method adopts the multilayer waveguide, ensures that the multi-core fiber speckle which is distributed in a central symmetry way is converted into the multi-core fiber speckle which is distributed linearly, has the advantages that the volume is small, packaging is suitable for being performed in the pipe casing, and the like, and is easy to realize low-cost and large-scale application.
Description
Technical field
The invention belongs to communication field of optoelectronic devices.Relate to a kind of method realizing multi-core fiber and the optically-coupled of opto chip array.
Background technology
Along with the explosive growth of information, the demand of the network bandwidth is increased continuously and healthily.Obtain larger optical communication capability, a direction uses device more at a high speed, and the optical device of such as 100G, 400G, the technical threshold of these high-speed optical devices is very high, and cause the R&D cycle long, production cost is high.Another direction is exploitation space division multiplexing technology, uses multi-core fiber to carry out transmitting optical signal.As shown in Figure 1, the size of multi-core fiber and conventional single mode fiber is suitable, but is dispersed with many fibre cores equably in covering, these fibre cores can simultaneously transmitting optical signal independently, therefore, under same capacity requirement, greatly can reduce the requirement to device speed, technical threshold is relatively low.
Also bring a new problem while using this multi-core fiber, namely how to realize the optically-coupled of multi-core fiber and opto chip array easily.The arrangement because the fibre core in multi-core fiber is normally centrosymmetric, and opto chip array is normally arranged in a linear, the coupling scheme between traditional single-mode fiber and opto chip are obviously no longer applicable.A suitable mould field converter must be added, to realize centrosymmetric mode distributions and the mutual conversion linearly between pattern field distribution between multi-core fiber and opto chip array.
Existing implementation has three kinds, and one utilizes bulk optical element to realize, and uses lens combination to be scattered by the light in multi-core fiber, then is coupled and aligned with the fibre bundle of the arrangement that is centrosymmetric, and finally carries out interconnected at the other end of fibre bundle and device.This device realizes very complicated, and volume is comparatively large, and production cost is high, is not suitable for large-scale application.
Another kind utilizes tapered fiber bundle to realize, and puts together heat and draw cone by multifiber, then cut from centre, and the fibre bundle one end energy obtained like this and the fibre core coupling of multi-core fiber, the other end is then the optical fiber of dispersion, can be used to carry out interconnected with device.The space that this mode takies is also very large, is not suitable for being placed in shell encapsulating together with device.
Last a kind of scheme utilizes three-dimensional waveguide chip to realize, and use femto-second laser directly in backing material, to process three-dimensional waveguide, its one end is centrosymmetric distribution, and mate with multi-core fiber, the other end is arranged in a linear, and mates with fiber array.This mode of waveguide being carried out to Three-dimension process, correlation technique is also immature, and cost is very high.In addition because laser writing technology is more suitable for processing straight wave guide, and inevitably there is light path turnover in which, so can bring extra loss.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of little, the applicable low cost of volume, large-scale application of taking in the method realizing multi-core fiber and the optically-coupled of opto chip array.
For solving the problems of the technologies described above, the invention provides a kind of method realizing multi-core fiber and the optically-coupled of opto chip array, comprising and cushion block is fixed in shell, in the little groove then on cushion block, putting into solder; Opto chip is placed in corresponding groove, solder is melted with fixed light electronic chip, then is completed the electrical connection of opto chip by routing mode; After the end face of multilayer waveguide is aimed at the exiting surface of cushion block, fixing multilayer waveguide; Adjust and the position of fixed lens group, then aim at multi-core fiber and fix, realizing multi-core fiber and the optically-coupled of opto chip array.
Described multilayer waveguide making step is as follows:
Step 10, backing material deposits one deck low-index material do covering, form two Luciola substriata figures by photoetching, then form ground floor high index waveguide by the method for diffusion or ion implantation;
Step 11, step 10 formed ground floor waveguide chip on deposit one deck substrate layer, its height is corresponding with the fibre core spacing of described multi-core fiber, form three Luciola substriata figures by photoetching again, and form second layer high index waveguide by the method for diffusion or ion implantation;
Step 12, step 11 formed second layer waveguide chip on deposit one deck substrate layer, its height is corresponding with the core distance of described multi-core fiber, form two Luciola substriata figures by photoetching again, and form third layer high index waveguide by the method for diffusion or ion implantation;
Step 13, growth layer protective layer, through cleavage, end face processing, after the techniques such as plated film, obtains multilayer waveguide.
The implementation step of described cushion block is as follows:
First process the platform with three differing heights, its difference in height is corresponding with the fibre core spacing of described multi-core fiber;
In the opto chip installation site of correspondence, make groove, its size and opto chip consistent size by the method for etching;
Etch a little groove in a groove again, finally on platform, print required circuit.
A kind of method realizing multi-core fiber and the optically-coupled of opto chip array provided by the invention, core component is a multilayer waveguide, and adopt planar optical waveguide processes, its advantage is as follows:
1. can make full use of existing process conditions.One piece of wafer once can produce a large amount of multilayer waveguide chip, be applicable to extensive, low cost, high conforming production.
2. the small volume that takies of multilayer waveguide, regular shape, can be placed in shell easily, is therefore more suitable for encapsulating together with the opto chip of purposes with various shape.
Accompanying drawing explanation
Fig. 1 is that a kind of that the embodiment of the present invention provides realizes multi-core fiber schematic cross-section in the method for multi-core fiber and the optically-coupled of opto chip array;
Fig. 2 is that a kind of that the embodiment of the present invention provides realizes multi-core fiber and opto chip array optical interconnection schematic diagram in the method for multi-core fiber and the optically-coupled of opto chip array;
Fig. 3 is that a kind of that the embodiment of the present invention provides realizes the end view that in the method for multi-core fiber and the optically-coupled of opto chip array, multilayer waveguide is coupled with multi-core fiber;
Fig. 4 is a kind of end view realizing multilayer waveguide and opto chip array couples in the method for multi-core fiber and the optically-coupled of opto chip array that the embodiment of the present invention provides;
Fig. 5 is that a kind of that the embodiment of the present invention provides realizes the cushion block schematic diagram after opto chip array is housed in the method for multi-core fiber and the optically-coupled of opto chip array;
Fig. 6 is that a kind of that the embodiment of the present invention provides realizes the V groove schematic diagram after cylindrical light electronic chip array is housed in the method for multi-core fiber and the optically-coupled of opto chip array;
Fig. 7-11 is a kind of Making programme schematic diagram realizing multilayer waveguide in the method for multi-core fiber and the optically-coupled of opto chip array that the embodiment of the present invention provides;
Figure 12 be that the embodiment of the present invention provides a kind of realize multilayer waveguide in the method for multi-core fiber and the optically-coupled of opto chip array complete after design sketch;
Figure 13 is a kind of schematic cross-section realizing cushion block in the method for multi-core fiber and the optically-coupled of opto chip array that the embodiment of the present invention provides;
Wherein, 1-multi-core fiber, 2-lens combination, 3-multilayer waveguide, 4-cushion block, 5-opto chip, 6-multilayer waveguide towards the end face of multi-core fiber, 7-multilayer waveguide towards the end face of opto chip array, 8-solder, 9-substrate layer, 10-16-waveguide, 17-groove, 18-little groove.
Embodiment
As shown in figures 1-13, the invention provides a kind of method realizing multi-core fiber 1 and the optically-coupled of opto chip 5 array, be coupled as example with laser array and seven core fibres, the present invention is described in detail.The concrete grammar realizing laser array and the coupling of seven core fibres comprises the following steps:
Step 1, cushion block 4 is fixed in shell, in the little groove 18 then on cushion block 4, puts into solder 8;
Step 2, opto chip 5 is placed in corresponding groove 17, solder 8 is made to melt to be fixed by opto chip 5, the electrical connection of opto chip 5 is completed again by routing mode, just occurred horizontal direction linearly property at the end face of cushion block 4, vertical direction has the mode distributions of equidistant difference in height;
Step 3, the end face of multilayer waveguide 3 is aimed at the exiting surface of cushion block 4 after, fixing multilayer waveguide 3; The mode distributions be centrosymmetric can be there is like this on the end face of multilayer waveguide 3;
Step 4, adjustment the position of fixed lens group 2, then aim at multi-core fiber 1 and fixing, can realize multi-core fiber 1 and the optically-coupled of opto chip 5 array.
Before carrying out optically-coupled, required multilayer waveguide 3 and cushion block 4 must be gone out according to the dimensioned of multi-core fiber 1.
As illustrated in figures 7-11, multilayer waveguide 3 can realize by slab guide processing technology.The preparation realizing multilayer waveguide 3 comprises the following steps:
Step 10, backing material deposits one deck low-index material do covering, form two Luciola substriata figures by photoetching, then form by the method for diffusion or ion implantation the waveguide chip that one deck has the waveguide 10 and 11 of two highs index of refraction;
Step 11, one deck waveguide chip of being formed in step 10 deposit one deck substrate layer 9, and its height and the core of multi-core fiber 1 apart from corresponding, then make three waveguides 12,13,14 by the method for step 10;
Step 12, one deck waveguide chip of being formed in step 11 deposit one deck substrate layer 9 highly same with step 11 again, forms two waveguides 15,16 with step 10 or 11 same methods;
Step 13, regrowth one deck substrate layer 9 as protective seam, through cleavage, section process, techniques such as plated film, thus obtain multilayer waveguide 3.After multilayer waveguide 3 machines, its effect as shown in figure 12.
As shown in figure 13, cushion block 4 is by preparing with under type:
Step 20, elder generation process the platform with three differing heights on cushion block 4;
Step 30, on platform the installation site of opto chip 5 correspondence, make groove 17, its size and opto chip 5 consistent size by the method for etching, its difference in height is necessary consistent with difference in height between multilayer waveguide 3;
Step 40, in groove 17, etch a little groove 18 again, then on platform, print required circuit.After cushion block 4 machines, its end face as shown in figure 13.
As shown in Figure 1, multi-core fiber 1, its fibre core is centrosymmetric arrangement, and typical fibre core quantity is seven, also can be other number.As shown in Figure 2, lens combination 2, its effect is that the light field between multi-core fiber 1 and multilayer waveguide 3 is carried out suitable convergence and collimation, to increase coupling tolerance and to improve coupling efficiency.Lens combination 2 can be single lens, also can be lens combination.Under some can carry out the occasion of accurate coupling, lens combination 2 can save, and is directly aimed at by the end face of multi-core fiber 1 and multilayer waveguide 3.As shown in Figure 3, multilayer waveguide 3 is a kind of waveguiding structures with multilayer multicore, and its effect realizes Central Symmetry mode distributions and the mutual conversion linearly between pattern field distribution.An end face 6 of multilayer waveguide 3, its waveguide is centrosymmetric distribution, distributes mate with multi-core fiber 1 fibre core.As shown in Figure 4, multilayer waveguide 3 other end 7, linearly distributes in the horizontal direction, vertical direction has certain difference in height.As shown in Figure 5, cushion block 4 controls position and the height of opto chip 5, to realize direct docking of multilayer waveguide 3 and opto chip 5 array.Opto chip 5 installation site is corresponding with the waveguide position of multilayer waveguide other end 7.Conveniently opto chip 5 is placed and is fixed, and needs to etch groove 17 in opto chip 5 installation position, fills out solder 8 bottom groove 17.Conveniently the electrical connection of opto chip 5 row, cushion block 4 must process circuit by demand.When opto chip 5 array is cylindrical, cushion block can be processed into the form of v groove, as shown in Figure 6.In the present embodiment, opto chip 5 can be the active chip, passive chip or the optical fiber that communicate, as chip of laser, and detector chip, optical fiber, semiconductor optical amplifier chip, Erbium-Doped Fiber Amplifier (EDFA) chip etc.
If opto chip 5 is semiconductor optical amplifiers, Erbium-Doped Fiber Amplifier (EDFA) chip etc., two ends all need to interconnect with multi-core fiber 1, then need to re-use a multilayer waveguide 3 and a lens combination 2 at the other end of opto chip 5 array, realize the optically-coupled with another root multi-core fiber 1.
A kind of method realizing multi-core fiber and the optically-coupled of opto chip array provided by the invention, its core component multilayer waveguide adopts planar optical waveguide processes, can make full use of existing process conditions.One piece of wafer once can produce a large amount of multilayer waveguide chip, be applicable to extensive, low cost, high conforming production.The small volume that multilayer waveguide takies, regular shape, can be placed in shell easily, is therefore more suitable for and is applicable to encapsulating together with the opto chip of purposes with various shape.
It should be noted last that, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to example to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (3)
1. realize a method for multi-core fiber and the optically-coupled of opto chip array, it is characterized in that, comprising:
Cushion block is fixed in shell, in the little groove then on cushion block, puts into solder;
Opto chip is placed in corresponding groove, solder is melted with fixed light electronic chip, then is completed the electrical connection of opto chip by routing mode;
After the end face of multilayer waveguide is aimed at the exiting surface of cushion block, fixing multilayer waveguide;
Adjust and the position of fixed lens group, then aim at multi-core fiber and fix, realizing multi-core fiber and the optically-coupled of opto chip array; Described multilayer waveguide is obtained by following steps:
By doing covering at deposited on substrates low-index material, forming waveguide pattern by photoetching, then with the way formation of diffusion or ion implantation, there is high index of refraction multilayer waveguide; Described multilayer waveguide is obtained by following steps:
Step 10, backing material deposits one deck low-index material do covering, form two Luciola substriata figures by photoetching, then form ground floor high index waveguide by the method for diffusion or ion implantation;
Step 11, step 10 formed ground floor waveguide chip on deposit one deck substrate layer, its height is corresponding with the fibre core spacing of described multi-core fiber, form three Luciola substriata figures by photoetching again, and form second layer high index waveguide by the method for diffusion or ion implantation;
Step 12, step 11 formed second layer waveguide chip on deposit one deck substrate layer, its height is corresponding with the fibre core spacing of described multi-core fiber, form two Luciola substriata figures by photoetching again, and form third layer high index waveguide by the method for diffusion or ion implantation;
Step 13, growth layer protective layer, through cleavage, end face processing, after coating process, obtains multilayer waveguide; The implementation step of described cushion block is as follows:
First process the platform with three differing heights, its difference in height is corresponding with the fibre core spacing of described multi-core fiber;
In the opto chip installation site of correspondence, make groove, its size and opto chip consistent size by the method for etching;
Etch a little groove in a groove again, finally on platform, print required circuit; Described multi-core fiber fibre core is centrosymmetric arrangement; Described multilayer waveguide one end is centrosymmetric distribution, and the described multilayer waveguide other end linearly distributes in the horizontal direction, has difference in height at vertical direction.
2. method according to claim 1, is characterized in that, described lens combination is single lens or lens combination.
3. method according to claim 1, is characterized in that: described opto chip is active chip, passive chip or optical fiber.
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| CN201210380270.0A CN102902024B (en) | 2012-09-29 | 2012-09-29 | Method for realizing optical coupling of multi-core fiber and photoelectron chip array |
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| CN201210380270.0A CN102902024B (en) | 2012-09-29 | 2012-09-29 | Method for realizing optical coupling of multi-core fiber and photoelectron chip array |
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| US11880071B2 (en) | 2021-08-23 | 2024-01-23 | Corning Research & Development Corporation | Optical assembly for interfacing waveguide arrays, and associated methods |
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| CN108873184A (en) * | 2018-07-17 | 2018-11-23 | 武汉恩达通科技有限公司 | A kind of laser writing optical fiber connector with lateral V-shaped groove |
| JP7071636B2 (en) * | 2018-07-19 | 2022-05-19 | 日本電信電話株式会社 | Multi-core fiber connector |
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| WO2022249868A1 (en) * | 2021-05-24 | 2022-12-01 | 住友電気工業株式会社 | Optical connection component and optical wiring |
| US11914193B2 (en) | 2021-06-22 | 2024-02-27 | Corning Research & Development Corporation | Optical assembly for coupling with two-dimensionally arrayed waveguides and associated methods |
| CN114236686A (en) * | 2021-12-21 | 2022-03-25 | 南京邮电大学 | Multi-layer multi-dimensional photon integrated chip light/light inlet/outlet structure and preparation method thereof |
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| JPH06334262A (en) * | 1993-03-23 | 1994-12-02 | Mitsubishi Electric Corp | Semiconductor laser array device, semiconductor laser device, and their manufacture |
| US5887097A (en) * | 1997-07-21 | 1999-03-23 | Lucent Technologies Inc. | Apparatus for pumping an optical fiber laser |
| JP3885602B2 (en) * | 2001-04-23 | 2007-02-21 | オムロン株式会社 | Optical element and optical transceiver and other optical apparatus using the optical element |
| GB0711822D0 (en) * | 2007-06-19 | 2007-07-25 | Univ Heriot Watt | Waveguide devices |
| CN101782669B (en) * | 2009-01-20 | 2014-07-09 | 住友电气工业株式会社 | Optical communication system and arrangement converter |
| JP2011237782A (en) * | 2010-04-13 | 2011-11-24 | Sumitomo Electric Ind Ltd | Optical branch element and optical communication system including the same |
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| US11880071B2 (en) | 2021-08-23 | 2024-01-23 | Corning Research & Development Corporation | Optical assembly for interfacing waveguide arrays, and associated methods |
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