CN102896869B - 利用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法 - Google Patents
利用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法 Download PDFInfo
- Publication number
- CN102896869B CN102896869B CN201110211078.4A CN201110211078A CN102896869B CN 102896869 B CN102896869 B CN 102896869B CN 201110211078 A CN201110211078 A CN 201110211078A CN 102896869 B CN102896869 B CN 102896869B
- Authority
- CN
- China
- Prior art keywords
- substrate
- adhesive
- redox curing
- curing system
- optics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims (6)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110211078.4A CN102896869B (zh) | 2011-07-25 | 2011-07-25 | 利用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法 |
TW101122923A TWI548715B (zh) | 2011-07-25 | 2012-06-27 | 利用紫外輻照固化-氧化還原固化黏合劑體系黏結基底之方法 |
KR1020147001205A KR101952980B1 (ko) | 2011-07-25 | 2012-07-18 | Uv 방사 경화-산화환원 경화 접착제 시스템을 사용하는 기판의 결합 방법 |
PCT/CN2012/078807 WO2013013589A1 (en) | 2011-07-25 | 2012-07-18 | A method for bonding substrates using a uv radiation curing-redox curing adhesive system |
CN201280036338.1A CN103717400B8 (zh) | 2011-07-25 | 2012-07-18 | 使用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法 |
EP12817262.4A EP2736720B1 (en) | 2011-07-25 | 2012-07-18 | A method for bonding substrates using a uv radiation curing-redox curing adhesive system |
JP2014521923A JP6156703B2 (ja) | 2011-07-25 | 2012-07-18 | Uv照射硬化型−レドックス硬化型接着剤系を用いる基材の接着方法 |
US14/162,880 US9039852B2 (en) | 2011-07-25 | 2014-01-24 | Method for bonding substrates using a UV radiation curing-redox curing adhesive system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110211078.4A CN102896869B (zh) | 2011-07-25 | 2011-07-25 | 利用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102896869A CN102896869A (zh) | 2013-01-30 |
CN102896869B true CN102896869B (zh) | 2016-03-02 |
Family
ID=47569499
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110211078.4A Active CN102896869B (zh) | 2011-07-25 | 2011-07-25 | 利用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法 |
CN201280036338.1A Active CN103717400B8 (zh) | 2011-07-25 | 2012-07-18 | 使用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280036338.1A Active CN103717400B8 (zh) | 2011-07-25 | 2012-07-18 | 使用紫外辐照固化-氧化还原固化粘合剂体系粘结基底的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9039852B2 (zh) |
EP (1) | EP2736720B1 (zh) |
JP (1) | JP6156703B2 (zh) |
KR (1) | KR101952980B1 (zh) |
CN (2) | CN102896869B (zh) |
TW (1) | TWI548715B (zh) |
WO (1) | WO2013013589A1 (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150099818A1 (en) | 2013-10-08 | 2015-04-09 | Dymax Corporation | Tri-curable adhesive composition and method |
JP5778304B2 (ja) * | 2014-02-28 | 2015-09-16 | 古河電気工業株式会社 | 電子デバイス封止用樹脂組成物および電子デバイス |
JP5778303B2 (ja) * | 2014-02-28 | 2015-09-16 | 古河電気工業株式会社 | 電子デバイス封止用樹脂組成物および電子デバイス |
US9315695B2 (en) | 2014-06-26 | 2016-04-19 | Dymax Corporation | Actinic radiation and moisture dual curable composition |
WO2016053877A1 (en) | 2014-09-30 | 2016-04-07 | 3M Innovative Properties Company | Free-radical polymerization methods and articles thereby |
WO2016106352A1 (en) | 2014-12-23 | 2016-06-30 | 3M Innovative Properties Company | Dual cure polythioether |
US10174146B2 (en) | 2015-05-14 | 2019-01-08 | Dymax Corporation | Dual cure acrylic formulations and methods to cure thereof |
JP6638125B2 (ja) * | 2015-07-08 | 2020-01-29 | 株式会社ミマキエンジニアリング | インク組成物及び印刷物の製造方法 |
EP3549994A4 (en) | 2016-11-30 | 2020-08-05 | Nitto Denko Corporation | ADHESIVE COMPOSITION, ADHESIVE LAYER, AND ADHESIVE SHEET |
CN107526470A (zh) * | 2017-08-23 | 2017-12-29 | 信利光电股份有限公司 | 一种触摸屏的水胶贴合预固化夹具及预固化方法 |
WO2019157265A1 (en) * | 2018-02-09 | 2019-08-15 | 3M Innovative Properties Company | Primer-initiated cure of structural adhesive film |
EP3749725B1 (en) * | 2018-02-09 | 2024-05-15 | 3M Innovative Properties Company | Film-initiated cure of structural adhesive film |
CN109370505A (zh) * | 2018-09-21 | 2019-02-22 | 苏州吉格邦新材料科技有限公司 | 一种uv-化学双固化双组份胶水及其制备方法 |
EP3924999A4 (en) | 2019-02-15 | 2022-11-02 | Kulicke & Soffa Netherlands B.V. | DYNAMIC RELEASE STRIPS FOR SEPARATE COMPONENT ASSEMBLY |
CN109971370A (zh) * | 2019-02-27 | 2019-07-05 | 惠州市德佑威新材料有限公司 | 双重固化液态光学胶的制备方法及其促进剂的制备方法 |
GB2583920B (en) * | 2019-05-10 | 2023-09-27 | Henkel Ag & Co Kgaa | Method for bonding three-dimensional articles made by additive manufacturing |
DE102019216737B4 (de) * | 2019-10-30 | 2023-08-10 | Volkswagen Aktiengesellschaft | Verfahren zum stoffschlüssigen Verbinden eines ersten Bauteils mit einem zweiten Bauteil |
JP7264024B2 (ja) * | 2019-11-27 | 2023-04-25 | 東洋インキScホールディングス株式会社 | 接着剤 |
EP4078662A4 (en) * | 2019-12-17 | 2024-05-29 | Kulicke & Soffa Netherlands B V | ADHESIVE STRIPS FOR RECEIVING DISCREET COMPONENTS |
WO2023031695A1 (en) * | 2021-09-02 | 2023-03-09 | 3M Innovative Properties Company | Preparation of high molecular weight polymers with minimal gel content |
DE102021131779A1 (de) * | 2021-12-02 | 2023-06-07 | Marelli Stuttgart (Germany) GmbH | Verfahren zum Zusammenbau einer Anzeigeeinheit eines Kraftfahrzeugs und nach dem Verfahren zusammengebaute Anzeigeeinheit |
CN116487585A (zh) * | 2022-01-13 | 2023-07-25 | 宁德时代新能源科技股份有限公司 | 负极极片及其制备方法、二次电池、电池模块、电池包和用电装置 |
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WO2009086492A1 (en) * | 2007-12-28 | 2009-07-09 | E. I. Du Pont De Nemours And Company | Thermally and actinically curable adhesive composition |
CN101482786A (zh) * | 2009-01-08 | 2009-07-15 | 深圳市中显微电子有限公司 | 电容式触摸屏基板贴合方法 |
CN101495293A (zh) * | 2006-07-28 | 2009-07-29 | 洛德公司 | 双重固化粘合剂配制物 |
CN101802119A (zh) * | 2007-09-26 | 2010-08-11 | 电气化学工业株式会社 | 粘合剂组合物及粘接方法 |
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JPS58138763A (ja) * | 1982-02-12 | 1983-08-17 | Kyoritsu Kagaku Sangyo Kk | 接着剤組成物 |
US4605465A (en) * | 1982-04-26 | 1986-08-12 | W. R. Grace & Co. | UV and thermally curable, thermoplastic-containing compositions |
JPS62125913A (ja) * | 1985-11-27 | 1987-06-08 | Kyoritsu Kagaku Sangyo Kk | 自動車用ガラスの取付方法 |
JPH01207371A (ja) * | 1988-02-15 | 1989-08-21 | Seiko Epson Corp | 小型防水装置用接着剤 |
JP2863025B2 (ja) * | 1991-05-21 | 1999-03-03 | アルプス電気株式会社 | 接着構造体の組立方法 |
EP0537006A3 (en) | 1991-10-10 | 1993-06-16 | Elastochem, Inc. | Fluxed composites |
US5385958A (en) | 1993-03-05 | 1995-01-31 | Dymax Corporation | Activator formulation and composition utilizing same |
FR2804121A1 (fr) | 2000-01-24 | 2001-07-27 | Michelin Soc Tech | Composition de caoutchouc pour pneumatique comportant une charge blanche renforcante et un systeme de couplage ( charge blanche/elastomere) |
US6520663B1 (en) | 2000-03-23 | 2003-02-18 | Henkel Loctite Corporation | UV curing lamp assembly |
JP2008059945A (ja) * | 2006-08-31 | 2008-03-13 | Nagase Chemtex Corp | 電子デバイスの製造方法 |
US7910033B2 (en) * | 2007-04-03 | 2011-03-22 | Sony Chemical & Information Device Corporation | Method for manufacturing image display device |
WO2010111316A2 (en) | 2009-03-27 | 2010-09-30 | 3M Innovative Properties Company | Optical assembly having a display panel and methods of making and disassembling same |
SG166693A1 (en) | 2009-05-15 | 2010-12-29 | Hi P Internat Ltd | A method for insert molding glass or an inorganic material |
KR20120041238A (ko) | 2009-08-03 | 2012-04-30 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 반사방지성 투명 emi 차폐 광학 필터 |
CN101654607B (zh) | 2009-09-08 | 2013-01-16 | 烟台德邦科技有限公司 | 一种高纯度光热-双固化胶粘剂及其制备方法 |
KR20110051048A (ko) * | 2009-11-09 | 2011-05-17 | 삼성전기주식회사 | 터치스크린 입력장치 및 그 제조방법 |
SG181534A1 (en) * | 2009-12-17 | 2012-07-30 | 3M Innovative Properties Co | Display panel assembly and methods of making same |
DE102010030437A1 (de) | 2010-06-23 | 2011-12-29 | Henkel Ag & Co. Kgaa | TPU-Kaschierklebstoff |
JP2013253117A (ja) * | 2010-09-28 | 2013-12-19 | Denki Kagaku Kogyo Kk | 硬化性樹脂組成物 |
JP5837320B2 (ja) * | 2011-04-08 | 2015-12-24 | スリーエム イノベイティブ プロパティズ カンパニー | 画像表示装置の製造方法 |
-
2011
- 2011-07-25 CN CN201110211078.4A patent/CN102896869B/zh active Active
-
2012
- 2012-06-27 TW TW101122923A patent/TWI548715B/zh active
- 2012-07-18 CN CN201280036338.1A patent/CN103717400B8/zh active Active
- 2012-07-18 WO PCT/CN2012/078807 patent/WO2013013589A1/en active Application Filing
- 2012-07-18 JP JP2014521923A patent/JP6156703B2/ja active Active
- 2012-07-18 KR KR1020147001205A patent/KR101952980B1/ko active IP Right Grant
- 2012-07-18 EP EP12817262.4A patent/EP2736720B1/en not_active Not-in-force
-
2014
- 2014-01-24 US US14/162,880 patent/US9039852B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101495293A (zh) * | 2006-07-28 | 2009-07-29 | 洛德公司 | 双重固化粘合剂配制物 |
CN101802119A (zh) * | 2007-09-26 | 2010-08-11 | 电气化学工业株式会社 | 粘合剂组合物及粘接方法 |
WO2009086492A1 (en) * | 2007-12-28 | 2009-07-09 | E. I. Du Pont De Nemours And Company | Thermally and actinically curable adhesive composition |
CN101482786A (zh) * | 2009-01-08 | 2009-07-15 | 深圳市中显微电子有限公司 | 电容式触摸屏基板贴合方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103717400A (zh) | 2014-04-09 |
KR20140047072A (ko) | 2014-04-21 |
EP2736720A1 (en) | 2014-06-04 |
WO2013013589A1 (en) | 2013-01-31 |
KR101952980B1 (ko) | 2019-02-27 |
EP2736720B1 (en) | 2016-09-07 |
TWI548715B (zh) | 2016-09-11 |
CN103717400B8 (zh) | 2016-08-10 |
US20140138013A1 (en) | 2014-05-22 |
JP6156703B2 (ja) | 2017-07-05 |
TW201305305A (zh) | 2013-02-01 |
JP2014527099A (ja) | 2014-10-09 |
CN102896869A (zh) | 2013-01-30 |
US9039852B2 (en) | 2015-05-26 |
CN103717400B (zh) | 2016-01-20 |
EP2736720A4 (en) | 2015-02-25 |
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Legal Events
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Effective date of registration: 20151023 Address after: 201203 Zhang Heng Road, Shanghai, Pudong New Area, No. 928 Applicant after: Henkel Co.,Ltd. Applicant after: HENKEL IP & HOLDING GmbH Address before: 201203 Zhang Heng Road, Shanghai, Pudong New Area, No. 928 Applicant before: Henkel Co.,Ltd. Applicant before: Henkel Corp. Effective date of registration: 20151023 Address after: 201203 Zhang Heng Road, Shanghai, Pudong New Area, No. 928 Applicant after: Henkel Co.,Ltd. Applicant after: Henkel Corp. Address before: 201203 Zhang Heng Road, Shanghai, Pudong New Area, No. 928 Applicant before: Henkel Co.,Ltd. |
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Effective date of registration: 20160224 Address after: Dusseldorf Patentee after: HENKEL AG & Co.KGaA Patentee after: HENKEL IP & HOLDING GmbH Address before: 201203 Zhang Heng Road, Shanghai, Pudong New Area, No. 928 Patentee before: Henkel Co.,Ltd. Patentee before: HENKEL IP & HOLDING GmbH |
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Effective date of registration: 20200420 Address after: Room 106A, north side, first floor, sensor Industrial Park, No. 15, Gangao Road, Zhangjiagang Free Trade Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Runbang semiconductor material technology Co.,Ltd. Address before: Dusseldorf Co-patentee before: HENKEL IP & HOLDING GmbH Patentee before: HENKEL AG & Co.KGaA |
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