CN102891248B - Flexible thermoelectric conversion system and manufacturing method thereof - Google Patents
Flexible thermoelectric conversion system and manufacturing method thereof Download PDFInfo
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- CN102891248B CN102891248B CN201210395618.3A CN201210395618A CN102891248B CN 102891248 B CN102891248 B CN 102891248B CN 201210395618 A CN201210395618 A CN 201210395618A CN 102891248 B CN102891248 B CN 102891248B
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Abstract
The invention relates to a flexible thermoelectric conversion system and a manufacturing method of the flexible thermoelectric conversion system. The flexible thermoelectric conversion system comprises a flexible thermoelectric generator and a flexible conversion circuit. The flexible thermoelectric generator comprises a first flexible substrate and a second flexible substrate. A plurality of alternately distributed N-type thermoelectric material particle bodies and P-type thermoelectric material particle bodies are arranged between the first flexible substrate and the second flexible substrate. After being connected with the P-type thermoelectric material particle bodies in series, the N-type thermoelectric material particle bodies are electrically connected with the P-type thermoelectric material particle bodies through a first conductive connecting layer on the first flexible substrate and a second conductive connecting layer on the second flexible substrate so as to form thermoelectric material bodies between the first flexible substrate and the second flexible substrate. The thermoelectric material bodies are packaged between the first flexible substrate and the second flexible substrate through flexible insulation heat-insulation potting material bodies. The flexible conversion circuit is electrically connected with the thermoelectric material bodies. The flexible thermoelectric conversion system has the advantages of simple and convenient process, low manufacturing cost, high generating efficiency, and safety and reliability, and the application range of thermoelectric generators is expanded.
Description
Technical field
The present invention relates to a kind of thermoelectric conversion system, especially a kind of flexible thermoelectric conversion system and manufacture method thereof, belong to the technical field of thermoelectricity conversion.
Background technology
Due to the miniaturization trend that portable type electronic product is growing, promote the research and development of compact power supply.Thermoelectric generator is as the self-centered energy of one, heat energy directly can be converted to electric energy according to Seebeck effect by it, can keep actual unlimited useful life at a suitable temperature, this makes it as one of new and high technology focus becoming international research of a kind of energy field.
Thermoelectric generator is generally made up of three parts: thermal source, heat sink and thermoelectric pile.Thermal power transfer can become the thermoelectricity of electric energy to forming (diagram 2) by a series of series connection by thermoelectric pile.Thermoelectricity forms by dissimilar N/P type thermoelectric material, and when its two ends, i.e. heat source side and heat sink end, when there is temperature gradient, its two ends can produce electrical potential difference, as illustrated as shown in 1.
The main operational principle of thermoelectric device is based on Seebeck effect.Seebeck effect is a kind of pyroelectric phenomena that roentgen Seebeck finds.When adding temperature difference Δ T on metallic conductor or semiconductor structure, voltage Δ U can be supervened.And open circuit voltage is proportional to the temperature difference linearly:
Wherein, α
sbe called Seebeck coefficient, also can be described as thermoelectric (al) power.If the Seebeck coefficient of two of thermocouple kinds of constituent materials is respectively α
aand α
b, then the Seebeck coefficient of thermocouple is defined as:
α
ab＝α
a+α
b
When n connects to thermocouple, total Open Output Voltage can be expressed as Δ U
n:
ΔU
n=n·(α
ab·ΔT)
The thermoelectric generator made according to Seebeck effect, its efficiency can be characterized by thermoelectric figure of merit Z:
Wherein, σ is conductivity, and κ is thermal conductivity, and quality factor Z represents heat and the electrical properties of the thermoelectric material that can be used in thermoelectric generator.
Conventional thermoelectric generator, the rectangular-shaped particle adopting thermoelectric material, then press the form of thermoelectric pile, pasted by particles different for N/P on ceramic plate, its particle adopted can reach 1mm more
2* 2mm or less cross section, higher aspect ratio.But its range of application, is subject to the restriction of the material behaviors such as pottery and supporting booster circuit pcb board, pipeline etc. cannot be applied to and needs certain bending place.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of flexible thermoelectric conversion system and manufacture method thereof, its technique is simple and convenient, low cost of manufacture, and generating efficiency is high, safe and reliable, has expanded the scope of application of thermoelectric generator.
According to technical scheme provided by the invention, described flexible thermoelectric conversion system, comprise flexible thermoelectric generator and for described flexible thermoelectric generator is exported electric energy conversion export flexible change-over circuit, described flexible thermoelectric generator comprises the first flexible substrate and is positioned at the second flexible substrate below the first flexible substrate, some alternatively distributed N-type thermoelectric material granules and P type thermoelectric material granule are set between described first flexible substrate and the second flexible substrate, described N-type thermoelectric material granule is electrically connected after being connected with P type thermoelectric material granule by the first conductive tie layers in the first flexible substrate and the second conductive tie layers in the second flexible substrate, the right thermoelectric material body of some thermoelectricity is comprised to be formed between the first flexible substrate and the second flexible substrate, described thermoelectric material body is encapsulated between the first flexible substrate and the second flexible substrate by the adiabatic Embedding Material body of flexible insulation, described flexible change-over circuit is positioned in the second flexible substrate, and flexible change-over circuit is positioned at the outside of the first flexible substrate, and flexible change-over circuit is electrically connected with thermoelectric material body.
Described second flexible substrate is provided with the first connecting electrode and the second connecting electrode that are electrically connected with thermoelectric material body, and described first connecting electrode and the second connecting electrode are positioned at the outside of the first flexible substrate and the adiabatic Embedding Material body of flexible insulation; Flexible change-over circuit is electrically connected with thermoelectric material body by the first connecting electrode and the second connecting electrode.
Described flexible change-over circuit comprises flexible circuit articulamentum, and described flexible circuit articulamentum and the second conductive tie layers are same fabrication layer.
Described first flexible substrate is provided with the through hole of some through described first flexible substrate, and described through hole is positioned at directly over N-type thermoelectric material granule and/or P type thermoelectric material granule.
Described second flexible substrate is provided with the through hole of some through described second flexible substrate, and described through hole is positioned at immediately below N-type thermoelectric material granule and/or P type thermoelectric material granule.
Insulating heat-conductive Embedding Material body is filled with in described through hole.
A manufacture method for flexible thermoelectric conversion system, the manufacture method of described flexible thermoelectric conversion system comprises the steps:
A, provide the first required flexible substrate and the second flexible substrate;
B, electric conducting material is set on the surface needed for the first flexible substrate, optionally shelters and etch described electric conducting material, to obtain the first required conductive tie layers in the first flexible substrate;
C, electric conducting material is set on the surface needed for the second flexible substrate, optionally shelters and etch described electric conducting material, to obtain the second required conductive tie layers and flexible circuit conductive articulamentum in the second flexible substrate;
D, required N-type thermoelectric material granule and both ends corresponding to P type thermoelectric material granule are welded in the first flexible substrate and the second flexible substrate respectively, described N-type thermoelectric material granule is electrically connected after being connected with P type thermoelectric material granule by the first conductive tie layers in the first flexible substrate and the second conductive tie layers in the second flexible substrate, comprises the right thermoelectric material body of some thermoelectricity to be formed between the first flexible substrate and the second flexible substrate;
E, by above-mentioned first flexible substrate, the second flexible substrate and welding formed thermoelectric material body anneal;
F, utilize flexible potting material to carry out embedding to the structure after above-mentioned annealing, thermoelectric material body is encapsulated between the first flexible substrate and the second flexible substrate by the adiabatic Embedding Material body of flexible insulation;
G, on above-mentioned flexible circuit conductive articulamentum, weld required electric elements, to form required flexible circuit.
Also comprise step h, in the first flexible substrate and/or the second flexible substrate, arrange through hole, the through hole in the first flexible substrate is positioned at directly over N-type thermoelectric material granule and/or P type thermoelectric material granule; Through hole in second flexible substrate is positioned at immediately below N-type thermoelectric material granule and/or P type thermoelectric material granule.
Insulating heat-conductive Embedding Material body is filled with in described through hole.In described step e, annealing temperature is 140 DEG C ~ 160 DEG C.
Advantage of the present invention: N-type thermoelectric material granule, be encapsulated between the first flexible substrate and the second flexible substrate by the adiabatic Embedding Material body of flexible insulation after P type thermoelectric material granule forms thermoelectric material body, simultaneously, second flexible substrate arranges flexible change-over circuit, obtain the converting system that flexible change-over circuit is integrated with flexible thermoelectric generator, thus make the thermoelectric generator obtained by the first flexible substrate, second flexible substrate and the adiabatic Embedding Material body of flexible insulation can produce certain bending and do not damage, add its range of application, N-type thermoelectric material, P type thermoelectric material adopts traditional rectangular structure particle, there is higher thermoelectrical efficiency, processing step is simple, reduce manufacturing cost, simple and compact for structure, safe and reliable.
Accompanying drawing explanation
Fig. 1 is the principle schematic of existing thermoelectric generator.
Fig. 2 be formed thermoelectricity to after connection diagram.
Fig. 3 is the structural representation of the embodiment of the present invention 1.
Fig. 4 is view when flexible thermoelectric conversion system bends in Fig. 3.
Fig. 5 is the schematic diagram after the present invention first flexible substrate being formed the first conductive tie layers.
Fig. 6 is the schematic diagram after the present invention second flexible substrate being formed the second conductive tie layers.
Fig. 7 is the cutaway view forming flexible thermoelectric generator in Fig. 3.
Fig. 8 is the structural representation of the embodiment of the present invention 2.
Fig. 9 is the cutaway view of flexible thermoelectric generator in Fig. 8.
Figure 10 is the structural representation of the embodiment of the present invention 3.
Figure 11 is the cutaway view of flexible thermoelectric generator in Figure 10.
Description of reference numerals: 1-thermoelectricity pair, 10-first flexible thermoelectric generator, 20-second flexible thermoelectric generator, 30-the 3rd flexible thermoelectric generator, 100-first flexible substrate, 101-second flexible substrate, 102-first connecting electrode, 103-second connecting electrode, the adiabatic Embedding Material body of 104-flexible insulation, 105-flexible circuit conductive articulamentum, 201-first conductive tie layers, 202-second conductive tie layers, 301-N type thermoelectric material granule, 302-P type thermoelectric material granule, 401-through hole and 501-insulating heat-conductive Embedding Material body.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
Embodiment 1
As shown in Figure 3 and Figure 7: be the structural representation of flexible thermoelectric conversion system, in the present embodiment, flexible thermoelectric conversion system comprises the flexible change-over circuit that the first flexible generating generator 10 and the electric energy conversion for the first flexible thermoelectric generator 10 being exported export, wherein said first flexible thermoelectric generator 10 comprises the first flexible substrate 100 and is positioned at the second flexible substrate 101 below the first flexible substrate 100, between described first flexible substrate 100 and the second flexible substrate 101, some alternatively distributed N-type thermoelectric material granules 301 and P type thermoelectric material granule 302 are set, described N-type thermoelectric material granule 301 is electrically connected after being connected with P type thermoelectric material granule 302 by the first conductive tie layers 201 in the first flexible substrate 100 and the second conductive tie layers 202 in the second flexible substrate 101, with formed between the first flexible substrate 100 and the second flexible substrate 101 comprise some thermoelectricity to 1 thermoelectric material body, described thermoelectric material body is encapsulated between the first flexible substrate 100 and the second flexible substrate 101 by the adiabatic Embedding Material body 104 of flexible insulation.Described flexible change-over circuit is positioned in the second flexible substrate 101, and flexible change-over circuit is positioned at the outside of the first flexible substrate 100, and flexible change-over circuit is electrically connected with thermoelectric material body.
Particularly, described second flexible substrate 101 is provided with the first connecting electrode 102 and the second connecting electrode 103 be electrically connected with thermoelectric material body, and described first connecting electrode 102 and the second connecting electrode 103 are positioned at the outside of the first flexible substrate 100 and the adiabatic Embedding Material body 104 of flexible insulation; Flexible change-over circuit is electrically connected with thermoelectric material body by the first connecting electrode 102 and the second connecting electrode 103.Described flexible change-over circuit comprises flexible circuit articulamentum 105, and described flexible circuit articulamentum 105 and the second conductive tie layers 202 are same fabrication layer.
The material of above-mentioned first flexible substrate 100 and the second flexible substrate 101 comprises PI(Polyimide Film) film.Thermoelectric material body is encapsulated in after between the first flexible substrate 100 and the second flexible substrate 101 by the adiabatic Embedding Material body 104 of flexible insulation, the first flexible thermoelectric generator formed has the flexibility of certain angle of bend, can be used in needing in bending environment, as in the occasion such as exhaust piping, discharge duct, as shown in Figure 4.The adiabatic Embedding Material body 104 of flexible insulation adopts the adiabatic Embedding Material of the flexible insulation of existing routine, known by the art personnel; Meanwhile, the preparation process of N-type thermoelectric material granule 301 and P type thermoelectric material granule 302 is also known by the art personnel.In the thermoelectric material body formed, first conductive tie layers 201 and the second conductive tie layers 202 lay respectively at the two ends of N-type thermoelectric material granule 301 and P type thermoelectric material granule 302, and the syndeton on the first conductive tie layers 201 and the second conductive tie layers 202 is interspersed.
The flexible thermoelectric generator of said structure can be prepared by following processing step, comprises particularly
A, provide the first required flexible substrate 100 and the second flexible substrate 101;
As mentioned above, the material selection PI film of the first flexible substrate 100 and the second flexible substrate 101, also can select other flexible material;
B, electric conducting material is set on the surface needed for the first flexible substrate 100, optionally shelters and etch described electric conducting material, to obtain the first required conductive tie layers 201 in the first flexible substrate 100;
C, electric conducting material is set on the surface needed for the second flexible substrate 101, optionally shelters and etch described electric conducting material, to obtain the second required conductive tie layers 202 and flexible circuit conductive articulamentum 105 in the second flexible substrate 101;
The material of above-mentioned first conductive tie layers 201 and the second conductive tie layers 202 comprises the metal materials such as copper, aluminium, silver, the first connecting electrode 102 and the second connecting electrode 103 is also form while second flexible substrate 101 is formed the second conductive tie layers 202, described first connecting electrode 102 and the second connecting electrode 103 are electrically connected with the second corresponding conductive tie layers 201, follow-up formation thermoelectric material body outwards can be drawn by the first connecting electrode 102 and the second connecting electrode 103, the voltage exported by thermoelectric material body outwards exports.In the embodiment of the present invention, the length of the second flexible substrate 101 is greater than the length of the first flexible substrate 100, as shown in Figure 5 and Figure 6.
In order to the flexible thermoelectric conversion system of integration can be obtained, in the embodiment of the present invention, flexible circuit is also prepared in the second flexible substrate 101, length due to the second flexible substrate 101 is greater than the length of the first flexible substrate 100, is prepared in the second flexible substrate 101 therefore, it is possible to convenient by the first connecting electrode 102 and the second connecting electrode 103 with flexible circuit conductive articulamentum 105; Flexible circuit conductive articulamentum 105 and the first connecting electrode 102 and the second connecting electrode 103 is corresponding is electrically connected.By arranging the required electric elements such as required resistance, electric capacity, logical circuit on flexible circuit conductive articulamentum 105, required flexible circuit just can be formed in the second flexible substrate 101; Meanwhile, the flexible circuit of formation can be electrically connected with the first connecting electrode 102 and the second connecting electrode 103.
D, the both ends of required N-type thermoelectric material granule 301 and P type thermoelectric material granule 302 correspondence are welded in the first flexible substrate 100 and the second flexible substrate 101 respectively, described N-type thermoelectric material granule 301 is electrically connected after being connected with P type thermoelectric material granule 302 by the first conductive tie layers 201 in the first flexible substrate 100 and the second conductive tie layers 202 in the second flexible substrate 101, comprises the right thermoelectric material body of some thermoelectricity to be formed between the first flexible substrate 100 and the second flexible substrate 101;
E, by above-mentioned first flexible substrate 100, second flexible substrate 101 and welding formed thermoelectric material body anneal;
Described annealing temperature is 140 DEG C ~ 160 DEG C, and usually, carrying out annealing temperature is 150 DEG C.After annealing, make the first conductive tie layers 201 in thermoelectric material body and the first flexible substrate 100 and the second conductive tie layers 202 compact siro spinning technology in the second flexible substrate 101.
F, utilize flexible potting material to carry out embedding to the structure after above-mentioned annealing, thermoelectric material body is encapsulated between the first flexible substrate 100 and the second flexible substrate 101 by the adiabatic Embedding Material body 104 of flexible insulation.
After utilizing the adiabatic Embedding Material body 104 of flexible insulation to encapsulate, make the Stability Analysis of Structures of thermoelectric material body in the first flexible substrate 100 and the second flexible substrate 101.
G, on above-mentioned flexible circuit conductive articulamentum 105, weld required electric elements, to form required flexible circuit.
After the encapsulation of step f, the first required flexible thermoelectric generator 10 can be formed; In order to form required flexible circuit, only need corresponding electric elements to be welded on corresponding position on flexible circuit conductive articulamentum 105.When preparing flexible circuit conductive articulamentum 105, the second flexible substrate 101 is provided with the placement location figure of corresponding electric appliance element; Electric elements can be welded on flexible circuit conductive articulamentum 105 by techniques such as conventional solderings, the flexible circuit obtained and the first flexible thermoelectric generator 10 integrated, the bending of certain angle can be carried out simultaneously, extend the scope of application of flexible thermoelectric conversion system.
Embodiment 2
As shown in Figure 8: be the structural representation of the present embodiment flexible thermoelectric conversion system, Fig. 9 is the structural representation of the second flexible thermoelectric generator 20 that in the present embodiment, flexible thermoelectric conversion system comprises, in the present embodiment, in order to the good thermal conductivity with the external world can be realized, first flexible substrate 100 of the second flexible thermoelectric generator 20 is provided with the through hole 401 in through described first flexible substrate 100, described through hole 401 is positioned at directly over N-type thermoelectric material granule 301 or P type thermoelectric material granule 302, simultaneously, through hole 401 also can be positioned at directly over N-type thermoelectric material granule 301 and P type thermoelectric material granule 302 simultaneously.
Further, described second flexible substrate 101 also can be provided with the through hole 401 of through second flexible substrate 101, through hole 401 is positioned at directly over N-type thermoelectric material granule 301 or P type thermoelectric material granule 302, meanwhile, through hole 401 also can be positioned at directly over N-type thermoelectric material granule 301 and P type thermoelectric material granule 302 simultaneously.In the present embodiment, the first flexible substrate 100 and the second flexible substrate 101 are all provided with through hole 401.
In order to obtain the structure of the present embodiment, on preparation technology basis in embodiment 1, also comprise step h, optionally shelter and etch the first flexible substrate 100 and/or the second flexible substrate 101, to form required through hole 401 in the first flexible substrate 100 and/or the second flexible substrate 101, the position of through hole 401 is arranged as mentioned above.In the present embodiment remaining processing step and condition identical with embodiment 1, repeat no more herein.
Embodiment 3
As shown in Figure 10: be the structural representation of the present embodiment flexible thermoelectric conversion system, Figure 11 is the structural representation of the 3rd flexible thermoelectric generator 30 comprised in flexible thermoelectric conversion system in the embodiment of the present invention, in the present embodiment, in the first flexible substrate 100 and the second flexible substrate 101, arrange through hole 401 in 3rd flexible thermoelectric generator 30, the through hole 401 in described first flexible substrate 100 is positioned at directly over N-type thermoelectric material granule 301 and/or P type thermoelectric material granule 302 simultaneously; Through hole 401 in second flexible substrate 101 is positioned at immediately below N-type thermoelectric material granule 301 and/or P type thermoelectric material granule 302.Then in through hole 401, be filled with flexible insulation heat conduction Embedding Material body 501, both reached good heat conduction object by flexible insulation heat conduction Embedding Material body 501, also protective effect is served to internal structure simultaneously.
In order to obtain the structure of the present embodiment, on the preparation technology basis of embodiment 2, by the Embedding Material of embedding insulating heat-conductive in through hole 401, to form flexible insulation heat conduction Embedding Material body 501.
As shown in Fig. 3 ~ Figure 11: during use, according to the use occasion of flexible thermoelectric conversion system, first flexible substrate 100 and the second flexibility are carried out the bending of required angle from very low 101, flexible thermoelectric conversion system and syndeton are fitted, improve installation and the accuracy of detection of whole converting system, the attended operation by inflexibility circuit part and the first connecting electrode 102 and the second connecting electrode 103 is also needed after avoiding the installation of existing flexible thermoelectric generator, easy for installation.During work, the flexible thermoelectric generator in flexible thermoelectric conversion system absorbs heat and is converted to electric energy, and the electric energy of described conversion processes the rear output of conversion again by flexible circuit.
N-type thermoelectric material granule 301 of the present invention, be encapsulated between the first flexible substrate 100 and the second flexible substrate 101 by the adiabatic Embedding Material body 104 of flexible insulation after P type thermoelectric material granule 302 forms thermoelectric material body, simultaneously, second flexible substrate 101 arranges flexible change-over circuit, obtain the converting system that flexible change-over circuit is integrated with flexible thermoelectric generator, thus make the thermoelectric generator obtained by the first flexible substrate 100, second flexible substrate 101 and the adiabatic Embedding Material body 104 of flexible insulation can produce certain bending and do not damage, add its range of application, N-type thermoelectric material, P type thermoelectric material adopts traditional rectangular structure particle, there is higher thermoelectrical efficiency, processing step is simple, reduce manufacturing cost, simple and compact for structure, safe and reliable.
Claims (2)
1. a flexible thermoelectric conversion system, is characterized in that: comprise flexible thermoelectric generator and for described flexible thermoelectric generator is exported electric energy conversion export flexible change-over circuit, described flexible thermoelectric generator comprises the first flexible substrate (100) and is positioned at second flexible substrate (101) of the first flexible substrate (100) below, some alternatively distributed N-type thermoelectric material granules (301) and P type thermoelectric material granule (302) are set between described first flexible substrate (100) and the second flexible substrate (101), described N-type thermoelectric material granule (301) is electrically connected after being connected with P type thermoelectric material granule (302) by the first conductive tie layers (201) in the first flexible substrate (100) and the second conductive tie layers (202) in the second flexible substrate (101), the right thermoelectric material body of some thermoelectricity is comprised to be formed between the first flexible substrate (100) and the second flexible substrate (101), described thermoelectric material body is encapsulated between the first flexible substrate (100) and the second flexible substrate (101) by adiabatic Embedding Material body (104) of flexible insulation, described flexible change-over circuit is positioned in the second flexible substrate (101), and flexible change-over circuit is positioned at the outside of the first flexible substrate (100), and flexible change-over circuit is electrically connected with thermoelectric material body,
Described second flexible substrate (101) is provided with the first connecting electrode (102) and the second connecting electrode (103) that are electrically connected with thermoelectric material body, and described first connecting electrode (102) and the second connecting electrode (103) are positioned at the outside of the first flexible substrate (100) and adiabatic Embedding Material body (104) of flexible insulation; Flexible change-over circuit is electrically connected with thermoelectric material body by the first connecting electrode (102) and the second connecting electrode (103);
Described flexible change-over circuit comprises flexible circuit articulamentum (105), and described flexible circuit articulamentum (105) and the second conductive tie layers (202) are same fabrication layer;
Described first flexible substrate (100) is provided with the through hole (401) of some through described first flexible substrate (100), and described through hole (401) is positioned at directly over N-type thermoelectric material granule (301) and/or P type thermoelectric material granule (302);
Described second flexible substrate (101) is provided with the through hole (401) of some through described second flexible substrate (101), and described through hole (401) is positioned at immediately below N-type thermoelectric material granule (301) and/or P type thermoelectric material granule (302);
Insulating heat-conductive Embedding Material body (501) is filled with in described through hole (401).
2. a manufacture method for flexible thermoelectric conversion system, is characterized in that, the manufacture method of described flexible thermoelectric conversion system comprises the steps:
(a), required the first flexible substrate (100) and the second flexible substrate (101) are provided;
(b), on the surface needed for the first flexible substrate (100), electric conducting material is set, optionally shelter and etch described electric conducting material, to obtain required the first conductive tie layers (201) in the first flexible substrate (100);
(c), on the surface needed for the second flexible substrate (101), electric conducting material is set, optionally shelter and etch described electric conducting material, to obtain required the second conductive tie layers (202) and flexible circuit conductive articulamentum (105) in the second flexible substrate (101);
(d), the both ends of required N-type thermoelectric material granule (301) and P type thermoelectric material granule (302) correspondence are welded in the first flexible substrate (100) and the second flexible substrate (101) respectively, described N-type thermoelectric material granule (301) is electrically connected after being connected with P type thermoelectric material granule (302) by the first conductive tie layers (201) in the first flexible substrate (100) and the second conductive tie layers (202) in the second flexible substrate (101), the right thermoelectric material body of some thermoelectricity is comprised to be formed between the first flexible substrate (100) and the second flexible substrate (101),
(e), by above-mentioned first flexible substrate (100), the second flexible substrate (101) and welding formed thermoelectric material body anneal;
(f), utilize flexible potting material to carry out embedding to the structure after above-mentioned annealing, thermoelectric material body is encapsulated between the first flexible substrate (100) and the second flexible substrate (101) by adiabatic Embedding Material body (104) of flexible insulation;
G (), electric elements needed for the upper welding of above-mentioned flexible circuit conductive articulamentum (105), to form required flexible circuit;
Also comprise step (h), in the first flexible substrate (100) and/or the second flexible substrate (101), arrange through hole (401), the through hole (401) in the first flexible substrate (100) is positioned at directly over N-type thermoelectric material granule (301) and/or P type thermoelectric material granule (302); Through hole (401) in second flexible substrate (101) is positioned at immediately below N-type thermoelectric material granule (301) and/or P type thermoelectric material granule (302);
Insulating heat-conductive Embedding Material body (501) is filled with in described through hole (401);
In described step (e), annealing temperature is 140 DEG C ~ 160 DEG C.
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| CN105322087A (en) * | 2014-07-28 | 2016-02-10 | 中国电子科技集团公司第十八研究所 | BiTe-based flexible film thermoelectric cell |
| CN105322088B (en) * | 2014-07-28 | 2019-01-29 | 中国电子科技集团公司第十八研究所 | The production method of high integration flexible thin film thermobattery |
| US20190181321A1 (en) * | 2016-06-23 | 2019-06-13 | 3M Innovative Properties Company | Flexible thermoelectric module |
| CN107768510A (en) * | 2016-08-22 | 2018-03-06 | 中国科学院物理研究所 | A kind of electrothermal module and preparation method thereof |
| EP3580789B1 (en) * | 2017-02-08 | 2020-11-18 | Magna Seating Inc. | Thermoelectric module |
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