CN102890428A - Method for aligning exposure patterns on two sides of PCB (printed circuit board) - Google Patents
Method for aligning exposure patterns on two sides of PCB (printed circuit board) Download PDFInfo
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- CN102890428A CN102890428A CN2012103499277A CN201210349927A CN102890428A CN 102890428 A CN102890428 A CN 102890428A CN 2012103499277 A CN2012103499277 A CN 2012103499277A CN 201210349927 A CN201210349927 A CN 201210349927A CN 102890428 A CN102890428 A CN 102890428A
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Abstract
The invention discloses an alignment method for aligning exposure patterns on two sides of a PCB (printed circuit board). The PCB is placed on a work piece table, a CCD (charge coupled device) camera is arranged on the PCB, and a marking device is arranged below the PCB; and when the front side of the PCB is exposed, the marking device can generate alignment marks on the reverse side of the PCB, and after the PCB is turned over, the CCD camera can capture the alignment marks on the reverse side for alignment, so that the exposure patterns on the two sides of the PCB can be aligned. According to the invention, the alignment of the exposure patterns on the two sides of the PCB can be implemented, the procedure is simple and the alignment accuracy is high.
Description
Technical field
The present invention relates to the printed-wiring board (PWB) equipment technical field, especially a kind of method that realizes that pcb board two sides exposure figure is aimed at.
Background technology
Laser direct-writing exposure machine exposure aligning method is by the centre coordinate of the centre coordinate of registration holes or feature pattern on the extraction pcb board and the loci on the CAM image and calculates, the CAM image is rotated and translation, realizes the principle that CAM figure and pcb board are complementary.But inner plating is without registration holes or feature pattern in partial circuit plate production process, and what traditional exposure machine then adopted is the two-sided simultaneously exposure of keeping to the side, and contraposition is carried out on the two sides when setting up egative film.The then not simultaneously exposure of two sides of laser direct-writing exposure machine behind the front of having exposed, needs again fluctuating plate, and the circuit board that overturns and be exposed, and makes original downward reverse side, transfers to upwards, then reverse side is begun exposure.Need with the position of the exposure figure of the upper and lower surface of a slice circuit board corresponding one by one, so must carry out contraposition.In the processes such as fluctuating plate, twice placement location in the front and back of circuit board necessarily has deviation.If when the exposure reverse side, the change in location of twice circuit board placement before and after system can not measure, the position of the double-edged exposure figure of so same circuit board is had no idea corresponding one by one.So need to solve the problem that two-side graph is aimed at, the alignment of realization two-side graph just must use other approach that inner plating is produced alignment mark.When gordian technique of the present invention just was to expose the front, marking device produced alignment mark at reverse side, during reprint post-exposure reverse side, by CCD the alignment mark of reverse side was aimed at post-exposure, thereby realized the aligning of two-side graph.Other produce the mode of alignment mark relatively, and technological process of the present invention is simple, and alignment precision is high, and applicability is strong.
Summary of the invention
Technical matters to be solved by this invention is the method that realizes in a kind of laser imaging system that pcb board two sides exposure figure is aimed at.
The present invention is achieved through the following technical solutions:
A kind of method that realizes that pcb board two sides exposure figure is aimed at is characterized in that the top of work stage is provided with the CCD camera, and the below of work stage is provided with a plurality of marking devices, has a through hole on work stage corresponding to each marking device;
Specifically may further comprise the steps:
1) pcb board to be exposed is placed on the work stage, select two suitable marking devices according to the size dimension of pcb board;
2) with the position coordinates of two marking devices selecting in the CCD camera calibration step 1);
3) exposed in the front of pcb board, produce two alignment marks at the reverse side of pcb board in the time of face exposure and by two marking devices selecting in the step 1);
4) upset pcb board, obtain the position coordinates of two alignment marks of reverse side with the CCD camera, carry out coordinate conversion with the position of marking device again, be rotated with translation by the reverse side exposure figure to pcb board and process, and the initial point position of definite exposure, thereby realize the exposure of reverse side aligning.
Described marking device is the concentrator marker that produces specific alignment mark at pcb board.
On the described pcb board without any hole or feature pattern.
Described CCD camera is transportable.
Advantage of the present invention is:
1) method of relatively utilizing drilling machine that inner plating is holed first before exposure, because boring has increased operation, and the difficult quality guarantee of boring, the present invention has simplified technological process, and has improved precision.
2) relatively utilize camera to obtain the method that the pcb board edge image carries out contraposition, the present invention has eliminated owing to the impact of pcb board edge roughness for aligning accuracy.
Description of drawings
Fig. 1 is device schematic diagram of the present invention.
Fig. 2 is the schematic diagram in exposure pcb board of the present invention front.
Fig. 3 is the schematic diagram of exposure pcb board reverse side of the present invention.
Embodiment
As shown in Figure 2, realize the alignment method that circuit board two sides exposure figure is aimed in the laser imaging system, it is characterized in that, place pcb board 6 on the work stage 3, the top of pcb board 6 is provided with CCD camera 1, the below of work stage 3 is provided with marking device 1 and marking device 25, and work stage 3 is provided with two through holes and produces specific alignment mark for marking device 1 and marking device 25 at pcb board 6;
Specifically may further comprise the steps:
1) as shown in Figure 1, is fixed on the marking device 1 of work stage 3 belows and the position coordinates of marking device 25 with 1 demarcation of CCD camera;
2) as shown in Figure 2, pcb board 6 is placed on the work stage 3, in the time of to the pcb board face exposure, marking device 1 produces alignment mark 2 at the pcb board reverse side, and marking device 25 produces alignment mark 7 at the pcb board reverse side, as shown in Figure 3;
3) behind the upset pcb board 6, obtain alignment mark 2 and the alignment mark 7 of reverse side with CCD camera 1, carry out coordinate conversion with the position of marking device 1 and marking device 25, by being rotated with translation, processes the reverse side exposure figure, and the initial point position of definite exposure, thereby realize the exposure of reverse side aligning.
Claims (4)
1. a method that realizes that pcb board two sides exposure figure is aimed at is characterized in that, the top of work stage is provided with the CCD camera, and the below of work stage is provided with a plurality of marking devices, has a through hole on work stage corresponding to each marking device;
Specifically may further comprise the steps:
1) pcb board to be exposed is placed on the work stage, select two suitable marking devices according to the size dimension of pcb board;
2) with the position coordinates of two marking devices selecting in the CCD camera calibration step 1);
3) exposed in the front of pcb board, produce two alignment marks at the reverse side of pcb board in the time of face exposure and by two marking devices selecting in the step 1);
4) upset pcb board, obtain the position coordinates of two alignment marks of reverse side with the CCD camera, carry out coordinate conversion with the position of marking device again, be rotated with translation by the reverse side exposure figure to pcb board and process, and the initial point position of definite exposure, thereby realize the exposure of reverse side aligning.
2. a kind of method that realizes that pcb board two sides exposure figure is aimed at according to claim 1, it is characterized in that: described marking device is the concentrator marker that produces specific alignment mark at pcb board.
3. a kind of method that realizes that pcb board two sides exposure figure is aimed at according to claim 1 is characterized in that: on the described pcb board without any hole or feature pattern.
4. a kind of method that realizes that pcb board two sides exposure figure is aimed at according to claim 1, it is characterized in that: described CCD camera is transportable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103499277A CN102890428A (en) | 2012-09-18 | 2012-09-18 | Method for aligning exposure patterns on two sides of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103499277A CN102890428A (en) | 2012-09-18 | 2012-09-18 | Method for aligning exposure patterns on two sides of PCB (printed circuit board) |
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| CN102890428A true CN102890428A (en) | 2013-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012103499277A Pending CN102890428A (en) | 2012-09-18 | 2012-09-18 | Method for aligning exposure patterns on two sides of PCB (printed circuit board) |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103529660A (en) * | 2013-10-29 | 2014-01-22 | 天津芯硕精密机械有限公司 | Internal layer alignment apparatus for multi-optical path exposure equipment |
| CN103529654A (en) * | 2013-10-29 | 2014-01-22 | 天津芯硕精密机械有限公司 | Alignment method for internal layers in direct writing type photoetching system |
| CN104215644A (en) * | 2014-09-01 | 2014-12-17 | 南通富士通微电子股份有限公司 | Testing tooling and testing method |
| CN104407502A (en) * | 2014-11-19 | 2015-03-11 | 江苏影速光电技术有限公司 | Method for producing inner layer non-porous circuit board by utilizing laser direct imaging device |
| CN104460249A (en) * | 2013-09-23 | 2015-03-25 | 北大方正集团有限公司 | Method for detecting exposure alignment of two sides of inner-layer substrate of circuit board |
| CN105278259A (en) * | 2015-07-27 | 2016-01-27 | 江苏影速光电技术有限公司 | Stand-alone double-table and multi-station automatic printed circuit board (PCB) exposure equipment and exposure method |
| CN106353977A (en) * | 2016-11-25 | 2017-01-25 | 天津津芯微电子科技有限公司 | Aligning method and aligning device for LDI (Laser Direct Image) outer layer |
| CN106707687A (en) * | 2017-01-19 | 2017-05-24 | 广州美维电子有限公司 | PCB (Printed Circuit Board) exposure method and device |
| CN106773566A (en) * | 2017-03-07 | 2017-05-31 | 无锡影速半导体科技有限公司 | Direct-write type lithography machine exposes alignment device and method |
| CN106896653A (en) * | 2017-01-24 | 2017-06-27 | 苏州微影激光技术有限公司 | It is a kind of to be applied to the method that direct write exposure machine makes the non-porous aligning plate of internal layer |
| CN109471337A (en) * | 2018-12-29 | 2019-03-15 | 苏州源卓光电科技有限公司 | A kind of exposure machine and alignment exposure method for the exposure of PCB inner plating |
| CN109613803A (en) * | 2018-12-19 | 2019-04-12 | 江苏影速科技有限公司 | A kind of alignment device of double-sided exposure, method and apparatus |
| CN110441993A (en) * | 2019-07-29 | 2019-11-12 | 合肥芯碁微电子装备有限公司 | A kind of marking method for the imaging contraposition of laser direct imaging equipment front and back sides |
| CN110568734A (en) * | 2019-08-26 | 2019-12-13 | 武汉华星光电技术有限公司 | display panel exposure alignment method and display panel |
| CN111221223A (en) * | 2019-12-05 | 2020-06-02 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| WO2020124406A1 (en) * | 2018-12-19 | 2020-06-25 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
| CN112122787A (en) * | 2020-09-14 | 2020-12-25 | 华通精密线路板(惠州)有限公司 | Double-sided laser etching process |
| CN112631080A (en) * | 2020-12-21 | 2021-04-09 | 苏州源卓光电科技有限公司 | Exposure method of double-workbench exposure machine |
| CN112987517A (en) * | 2021-03-01 | 2021-06-18 | 锡凡半导体无锡有限公司 | Alignment device and alignment method for PCB inner-layer board |
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Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104460249A (en) * | 2013-09-23 | 2015-03-25 | 北大方正集团有限公司 | Method for detecting exposure alignment of two sides of inner-layer substrate of circuit board |
| CN103529654A (en) * | 2013-10-29 | 2014-01-22 | 天津芯硕精密机械有限公司 | Alignment method for internal layers in direct writing type photoetching system |
| CN103529660A (en) * | 2013-10-29 | 2014-01-22 | 天津芯硕精密机械有限公司 | Internal layer alignment apparatus for multi-optical path exposure equipment |
| CN104215644B (en) * | 2014-09-01 | 2016-08-31 | 南通富士通微电子股份有限公司 | Measurement jig and method of testing |
| CN104215644A (en) * | 2014-09-01 | 2014-12-17 | 南通富士通微电子股份有限公司 | Testing tooling and testing method |
| CN104407502A (en) * | 2014-11-19 | 2015-03-11 | 江苏影速光电技术有限公司 | Method for producing inner layer non-porous circuit board by utilizing laser direct imaging device |
| CN105278259A (en) * | 2015-07-27 | 2016-01-27 | 江苏影速光电技术有限公司 | Stand-alone double-table and multi-station automatic printed circuit board (PCB) exposure equipment and exposure method |
| CN106353977A (en) * | 2016-11-25 | 2017-01-25 | 天津津芯微电子科技有限公司 | Aligning method and aligning device for LDI (Laser Direct Image) outer layer |
| CN106353977B (en) * | 2016-11-25 | 2019-05-14 | 天津津芯微电子科技有限公司 | LDI outer layer alignment method and device |
| CN106707687A (en) * | 2017-01-19 | 2017-05-24 | 广州美维电子有限公司 | PCB (Printed Circuit Board) exposure method and device |
| CN106707687B (en) * | 2017-01-19 | 2020-05-22 | 广州美维电子有限公司 | PCB exposure method and device |
| CN106896653A (en) * | 2017-01-24 | 2017-06-27 | 苏州微影激光技术有限公司 | It is a kind of to be applied to the method that direct write exposure machine makes the non-porous aligning plate of internal layer |
| CN106773566A (en) * | 2017-03-07 | 2017-05-31 | 无锡影速半导体科技有限公司 | Direct-write type lithography machine exposes alignment device and method |
| CN109613803A (en) * | 2018-12-19 | 2019-04-12 | 江苏影速科技有限公司 | A kind of alignment device of double-sided exposure, method and apparatus |
| WO2020124406A1 (en) * | 2018-12-19 | 2020-06-25 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
| CN109613803B (en) * | 2018-12-19 | 2021-05-28 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
| CN109471337A (en) * | 2018-12-29 | 2019-03-15 | 苏州源卓光电科技有限公司 | A kind of exposure machine and alignment exposure method for the exposure of PCB inner plating |
| CN109471337B (en) * | 2018-12-29 | 2023-12-05 | 源卓微纳科技(苏州)股份有限公司 | Exposure machine for exposure of PCB inner layer plate and alignment exposure method |
| CN110441993A (en) * | 2019-07-29 | 2019-11-12 | 合肥芯碁微电子装备有限公司 | A kind of marking method for the imaging contraposition of laser direct imaging equipment front and back sides |
| CN110441993B (en) * | 2019-07-29 | 2021-08-13 | 合肥芯碁微电子装备股份有限公司 | Marking method for front and back imaging alignment of laser direct imaging equipment |
| CN110568734A (en) * | 2019-08-26 | 2019-12-13 | 武汉华星光电技术有限公司 | display panel exposure alignment method and display panel |
| CN110568734B (en) * | 2019-08-26 | 2021-10-26 | 武汉华星光电技术有限公司 | Display panel exposure alignment method and display panel |
| CN111221223A (en) * | 2019-12-05 | 2020-06-02 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| CN112122787A (en) * | 2020-09-14 | 2020-12-25 | 华通精密线路板(惠州)有限公司 | Double-sided laser etching process |
| CN112631080A (en) * | 2020-12-21 | 2021-04-09 | 苏州源卓光电科技有限公司 | Exposure method of double-workbench exposure machine |
| CN112987517A (en) * | 2021-03-01 | 2021-06-18 | 锡凡半导体无锡有限公司 | Alignment device and alignment method for PCB inner-layer board |
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Application publication date: 20130123 |