CN102886334A - Selective spraying machine and selective spraying method - Google Patents
Selective spraying machine and selective spraying method Download PDFInfo
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- CN102886334A CN102886334A CN2012103648036A CN201210364803A CN102886334A CN 102886334 A CN102886334 A CN 102886334A CN 2012103648036 A CN2012103648036 A CN 2012103648036A CN 201210364803 A CN201210364803 A CN 201210364803A CN 102886334 A CN102886334 A CN 102886334A
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Abstract
The embodiment of the invention discloses a selective spraying machine and a selective spraying method. The selective spraying machine has simple structure and strong operability; a welding flux can be saved; and the subsequent cleaning process can be reduced. The method disclosed by the embodiment of the invention comprises the following steps of: receiving a PCB (Printed Circuit Board) conveyed by a transportation part; and spraying scaling powder on the PCB according to a preset spraying mode. The selective spraying machine disclosed by the embodiment of the invention comprises the transportation part and a spraying part, wherein the transportation part is used for driving the PCB to move according to a preset direction; the spraying part is used for spraying the scaling powder on the PCB according to the preset spraying mode; the transportation part comprises a transportation guide rail, a transmission chain and a first motor; the transmission chain is paved on the upper surface of the transportation guide rail; the first motor is used for driving the transmission chain; the spraying part comprises a spray nozzle, a driving belt and a second motor; the driving belt is used for driving the spray nozzle; and the second motor is used for driving the driving belt. The selective spraying machine disclosed in the embodiment of the invention has simple structure and strong operability; the welding flux can be saved; and the subsequent cleaning process can be reduced.
Description
Technical field
The present invention relates to art of printed circuit boards, relate in particular to a kind of selective spraying machine and selective spray method.
Background technology
Printed circuit board (PCB) (PCB, Printed Circuit Board) wave-soldering or selective wave-soldering are adopted in welding mostly, wave soldering can not be carried out for each solder joint on the pcb board parameter and be regulated, so the ratio of defects of welding PCB out is very high, selective wave soldering can be regulated for each solder joint on the pcb board, has greatly improved the yield rate of pcb board.
Before pcb board is welded, need to apply scaling powder to pcb board, the spraying machine that uses when applying scaling powder to pcb board mostly is economical spraying machine, this spraying machine can only entirely spray pcb board and cover, and can not select the region point spray, like this, the place that does not much need to spray has all adhered to scaling powder, and these scaling powders are difficult to recycle, thereby have caused very large waste and environmental pollution.
Summary of the invention
The embodiment of the invention discloses a kind of selective spraying machine and selective spray method, simple in structure, workable, save solder flux and reduce follow-up cleaning process.
The selective spraying machine that the embodiment of the invention provides comprises:
Transport section is used for driving the printing board PCB plate and advances by default direction;
The spraying parts are used for by default spray pattern described pcb board spraying scaling powder;
Described transport section comprises: transport guide rails, transmission chain and the first motor, described transmission chain are laid on above the described transport guide rails, and described the first motor is used for driving described transmission chain;
Described spraying parts comprise: shower nozzle, driving-belt and the second motor, and described driving-belt is used for driving described shower nozzle, and described the second motor is used for driving described conveyer belt.
Alternatively, the angle of the plane that forms of the axis of orientation at the axis of orientation at described transport section place and spraying parts place and horizontal plane is 3 to 4 to spend.
Alternatively, described transport guide rails is broad-adjustable transport guide rails.
Alternatively, on the described spraying parts optoelectronic switch that whether is in spraying area for detection of pcb board is installed.
Alternatively, on the described shower nozzle magnetic valve that sprays be used to controlling described shower nozzle is installed.
The selective spray method that the embodiment of the invention provides is characterized in that, comprising:
The transportation pcb board;
By default spray pattern described pcb board is sprayed scaling powder.
Alternatively, described spray pattern comprises full jet mould formula and some jet mould formula, and described full jet mould formula is namely carried out whole plate spraying to described pcb board, and described some jet mould formula namely sprays each preset of described pcb board.
Alternatively, described when being chosen as a some jet mould formula, by default program the preset is sprayed and to comprise:
Shower nozzle moves to program the first preset;
The first preset is sprayed;
Seek next preset by relative coordinate;
Next preset is sprayed.
Alternatively, after the pcb board step that described reception transport section is transported and described by default spray pattern to comprising also whether detect pcb board is in spraying area before the described pcb board spraying scaling powder step, if then execution in step sprays scaling powder to described pcb board.
In the embodiment of the invention, after the pcb board that spraying parts reception transport section is transported, just can be by default spray pattern to described pcb board spraying scaling powder.Like this just can select spray pattern according to the situation of the required coating of pcb board, then spray, when the solder joint of needs sprayings is a lot of, can selects full jet mould formula simple flow and improve automaticity, when only needing the several solder joint of spraying, can selected element jet mould formula save solder flux and reduce follow-up cleaning process.
Description of drawings
Fig. 1 is selective spraying machine example structure figure in the embodiment of the invention;
Fig. 2 is selective spray method embodiment flow chart in the embodiment of the invention;
Fig. 3 is selective another embodiment flow chart of spray method in the embodiment of the invention;
Among above-mentioned Fig. 1:
Transport section 101, spraying parts 102, transport guide rails 1011, transmission chain 1012, the first motor 1013, shower nozzle 1021, driving-belt 1022, the second motor 1023.
The specific embodiment
The embodiment of the invention discloses a kind of selective spraying machine and selective spray method, simple in structure, workable, save solder flux and reduce follow-up cleaning process.
See also Fig. 1, selective spraying machine embodiment comprises in the embodiment of the invention:
Transport section 101 is used for driving the printing board PCB plate and advances by default direction;
Spraying parts 102 are used for by default spray pattern described pcb board spraying scaling powder;
Transport section comprises: transport guide rails 1011, transmission chain 1012 and the first motor 1013, and transmission chain 1012 is laid on above the transport guide rails 1011, and the first motor 1013 is used for driving transmission chain 1012;
The spraying parts comprise: shower nozzle 1021, driving-belt 1022 and the second motor 1023, driving-belt 1022 are used for driving shower nozzle 1021, the second motors 1023 and are used for driving conveyer belt 1022.
Selective spraying machine in the present embodiment may further include:
Optoelectronic switch is installed in above the spraying parts, whether enters spraying area for detection of pcb board;
Magnetic valve is installed in above the shower nozzle, is used for the spray time of control shower nozzle.
For ease of understanding, the below is described with the process of a concrete application scenarios to each the parts co-ordination of selective spraying machine in the present embodiment:
In the present embodiment, pcb board places on the transmission chain 1012, the first motor 1013, can be a servo motor, drive transmission chain 1012, so that pcb board can move to the shower nozzle direction, when the optoelectronic switch on the shower nozzle 1021 detects pcb board and has entered spraying area, the spray pattern of checking this moment is full jet mould formula or some jet mould formula, and above-mentioned full jet mould formula is namely carried out whole plate spraying to pcb board, and some jet mould formula namely sprays the preset, when being full jet mould formula, magnetic valve is opened always, and the second motor 1023 can be synchronizing wheel, drive conveyer belt 1022, can for the supporting Timing Belt of synchronizing wheel, conveyer belt 1022 drives shower nozzles 1021,1021 pairs of pcb boards of shower nozzle spray entirely; When being some jet mould formula, shower nozzle 1021 moves to the first preset points according to default program, this moment, default time end is opened and continued to magnetic valve, shower nozzle 1021 carries out a spray, then shower nozzle moves to next preset points according to relative coordinate and next preset is sprayed, above-mentionedly move to next preset points according to relative coordinate and can understand like this: see also Fig. 1, take spraying parts direction as Y-axis, the transport section direction is X-axis, the below intersection point of both intersections is initial point, the first preset is (0,3), the second preset is (5,6), suppose that it is (0 that the shower nozzle initial position is in initial point, 0) locates, shower nozzle 3 distance to the first preset points of can moving on the Y-axis then, then spray, after the spraying end of the first preset, seek the second preset according to the relative coordinate rule, above-mentioned relative coordinate rule is for to choose the difference of Y-axis coordinate as the movement value of shower nozzle, the coordinate difference of X-axis is as the movement value of pcb board, shower nozzle this moment mobile 5-3 on the Y-axis then, namely 2 relative distance gets final product, before spraying, shower nozzle needs to confirm whether pcb board has moved the distance of the coordinate difference of X-axis, if then this preset is sprayed, this moment, the second preset became the first preset, continued to seek the second preset and namely sprayed next preset, until all preset sprayings is complete.
Whether above-mentioned affirmation pcb board has moved the distance of the coordinate difference of X-axis can be understood like this, the programme-control pcb board is mobile first, and then the control shower nozzle moves and can realize, also can both move simultaneously, but shower nozzle can wait for that a rational time sprays again according to translational speed and the distance of pcb board, can guarantee that so also shower nozzle sprays the preset, concrete implementation is a variety of in addition, does not do herein restriction.
After finishing spraying, shower nozzle 1021 can continue the position that is parked in the original place or moves to beginning, if shower nozzle 1021 rests on the position of end point spray, when then spray next time, if full jet mould formula then can move to first an end, entirely spray again process, if some jet mould formula, then directly move to the first preset according to relative coordinate, then carry out a spray process.
Alternatively, the angle of the plane that forms of the axis of orientation at the axis of orientation at described transport section 101 places and spraying parts 102 places and horizontal plane is 3 to 4 to spend in the above-described embodiments.
Alternatively, in the above-described embodiments transport guide rails is broad-adjustable transport guide rails.
In the embodiment of the invention, transport section 101 moves pcb board to shower nozzle 1021 directions, optoelectronic switch detects pcb board and whether is in spraying area, if then select spray pattern, when being chosen as full jet mould formula, pcb board is carried out whole plate spraying, when being chosen as a some jet mould formula, by default program the preset is sprayed, like this just can select spray pattern according to the situation of the required coating of pcb board, then spray, when the solder joint of needs sprayings is a lot of, can selects full jet mould formula simple flow and improve automaticity, when only needing the several solder joint of spraying, can selected element jet mould formula save solder flux and reduce follow-up cleaning process.
The above describes selective sprayer of the present invention in detail, and the below is described in detail an embodiment of the selective spray method of the present invention.See also Fig. 2, an embodiment of selective spray method comprises in the embodiment of the invention:
201, transportation pcb board;
Transport section is after the spraying parts transport pcb board, and the spraying parts can detect pcb board and whether be in spraying area, and concrete detection method can be described in next embodiment.
202, by default spray pattern described pcb board is sprayed scaling powder.
When definite pcb board placed spraying area, shower nozzle sprayed according to default spray pattern, and above-mentioned spray pattern can have a variety of, can for full jet mould formula, also can be a jet mould formula.When being preset as full jet mould formula, shower nozzle carries out the spraying of whole plate to pcb board, when being preset as a some jet mould formula, by the program that presets the preset is sprayed.
In the embodiment of the invention, after the pcb board that the reception transport section is transported, just can be by default spray pattern to described pcb board spraying scaling powder.Like this just can select spray pattern according to the situation of the required coating of pcb board, then spray, when the solder joint of needs sprayings is a lot of, can selects full jet mould formula simple flow and improve automaticity, when only needing the several solder joint of spraying, can selected element jet mould formula save solder flux and reduce follow-up cleaning process.
The above has simply introduced an embodiment of the selective spray method of the present invention, the below is described in detail another embodiment of the selective spray method of the present invention, see also Fig. 2, another embodiment of selective spray method comprises in the embodiment of the invention:
301, transportation pcb board;
The detailed process of the step 301 in the present embodiment is identical with the step 201 among the first embodiment, repeats no more herein.
302, detect pcb board and whether be in spraying area, if execution in step 303 then;
The method whether the detection pcb board is in spraying area can be to utilize the optoelectronic switch that is installed in the shower nozzle place to detect the edge of pcb board, can determine that when detecting the pcb board edge pcb board has entered or withdrawed from spraying area, specifically enter or withdraw from and to judge according to original records, if front once being recorded as enters, can know that so now current testing result is that pcb board withdraws from spraying area.
303, by default spray pattern described pcb board is sprayed scaling powder;
When definite pcb board placed spraying area, shower nozzle sprayed according to default spray pattern, and above-mentioned spray pattern can have a variety of, can for full jet mould formula, also can be a jet mould formula.When being preset as full jet mould formula, shower nozzle carries out the spraying of whole plate to pcb board, when being preset as a some jet mould formula, and execution in step 304.
304, shower nozzle moves to program the first preset and the first preset is sprayed;
305, seek next preset by relative coordinate and next preset is sprayed;
The below is described in detail step 304 and 305 in order to concrete application examples:
Referring to Fig. 1, take spraying parts direction as Y-axis, the transport section direction is X-axis, the below intersection point of both intersections is initial point, the first preset is (0,3), the second preset is (5,6), supposes that it is (0 that the shower nozzle initial position is in initial point, 0) locates, then then shower nozzle 3 distance to the first preset points of can moving on the Y-axis sprays, after the spraying of the first preset is finished, seek the second preset according to the relative coordinate rule, above-mentioned relative coordinate rule is for to choose the difference of Y-axis coordinate as the movement value of shower nozzle, and the coordinate difference of X-axis is as the movement value of pcb board, then shower nozzle mobile 5-3 on the Y-axis at this moment, namely 2 relative distance gets final product, needed before shower nozzle sprays to confirm whether pcb board has moved the distance of the coordinate difference of X-axis, if then this preset is sprayed, this moment, the second preset became the first preset, continue to seek the second preset and namely spray next preset, until all preset sprayings is complete.
Whether above-mentioned affirmation pcb board has moved the distance of the coordinate difference of X-axis can be understood like this, the programme-control pcb board is mobile first, and then the control shower nozzle moves and can realize, also can both move simultaneously, but shower nozzle can wait for that a rational time sprays again according to translational speed and the distance of pcb board, can guarantee that so also shower nozzle sprays the preset, concrete implementation is a variety of in addition, does not do herein restriction.
In the embodiment of the invention, after the pcb board that the reception transport section is transported, just can be by default spray pattern to described pcb board spraying scaling powder.Like this just can select spray pattern according to the situation of the required coating of pcb board, then spray, when the solder joint of needs sprayings is a lot of, can selects full jet mould formula simple flow and improve automaticity, when only needing the several solder joint of spraying, can selected element jet mould formula save solder flux and reduce follow-up cleaning process.
One of ordinary skill in the art will appreciate that all or part of step that realizes in above-described embodiment method is to come the relevant hardware of instruction to finish by program, described program can be stored in a kind of computer-readable recording medium, the above-mentioned storage medium of mentioning can be read-only storage, disk or CD etc.
More than a kind of selective spraying machine provided by the present invention and selective spray method are described in detail, for one of ordinary skill in the art, thought according to the embodiment of the invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (9)
1. a selective spraying machine is characterized in that, comprising:
Transport section is used for driving the printing board PCB plate and advances by default direction;
The spraying parts are used for by default spray pattern described pcb board spraying scaling powder;
Described transport section comprises: transport guide rails, transmission chain and the first motor, described transmission chain are laid on above the described transport guide rails, and described the first motor is used for driving described transmission chain;
Described spraying parts comprise: shower nozzle, driving-belt and the second motor, and described driving-belt is used for driving described shower nozzle, and described the second motor is used for driving described driving-belt.
2. selective spraying machine according to claim 1 is characterized in that, the plane that the axis of orientation at the axis of orientation at described transport section place and spraying parts place forms and the angle of horizontal plane are 3 to 4 degree.
3. selective spraying machine according to claim 1 is characterized in that, described transport guide rails is broad-adjustable transport guide rails.
4. selective spraying machine according to claim 1 is characterized in that, on the described spraying parts optoelectronic switch that whether is in spraying area for detection of pcb board is installed.
5. selective spraying machine according to claim 1 is characterized in that, the magnetic valve that sprays be used to controlling described shower nozzle is installed on the described shower nozzle.
6. a selective spray method is characterized in that, comprising:
The transportation pcb board;
By default spray pattern described pcb board is sprayed scaling powder.
7. selective spray method according to claim 6, it is characterized in that, described spray pattern comprises full jet mould formula and some jet mould formula, and described full jet mould formula is namely carried out whole plate spraying to described pcb board, and described some jet mould formula namely sprays each preset of described pcb board.
8. selective spray method according to claim 7 is characterized in that, each preset of described pcb board sprays and comprises:
Shower nozzle moves to program the first preset;
The first preset is sprayed;
Seek next preset by relative coordinate;
Next preset is sprayed.
9. selective spray method according to claim 6, it is characterized in that, after the pcb board step that described reception transport section is transported and described by default spray pattern to comprising also whether detect pcb board is in spraying area before the described pcb board spraying scaling powder step, if then execution in step sprays scaling powder to described pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103648036A CN102886334A (en) | 2012-09-26 | 2012-09-26 | Selective spraying machine and selective spraying method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012103648036A CN102886334A (en) | 2012-09-26 | 2012-09-26 | Selective spraying machine and selective spraying method |
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| CN102886334A true CN102886334A (en) | 2013-01-23 |
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| CN2012103648036A Pending CN102886334A (en) | 2012-09-26 | 2012-09-26 | Selective spraying machine and selective spraying method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103648239A (en) * | 2013-12-17 | 2014-03-19 | 东莞爱电电子有限公司 | Wave soldering production line with coating travel of soldering flux automatically adjustable based on width of PCB (Printed Circuit Board) |
| CN108551727A (en) * | 2018-04-02 | 2018-09-18 | 郑州云海信息技术有限公司 | A kind of scaling powder atomizing device and spraying implementation method based on PCBA |
| CN109550634A (en) * | 2018-11-16 | 2019-04-02 | 华普通用技术研究（广州）有限公司 | A kind of automatic coating device and control method of high-performance scaling powder |
| CN111356550A (en) * | 2017-11-28 | 2020-06-30 | 诺信公司 | Synchronous motion selective welding apparatus and method |
| CN114669413A (en) * | 2022-03-23 | 2022-06-28 | 美的集团股份有限公司 | Selective spraying device and method and wave-soldering equipment |
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| CN103648239A (en) * | 2013-12-17 | 2014-03-19 | 东莞爱电电子有限公司 | Wave soldering production line with coating travel of soldering flux automatically adjustable based on width of PCB (Printed Circuit Board) |
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| CN109550634A (en) * | 2018-11-16 | 2019-04-02 | 华普通用技术研究（广州）有限公司 | A kind of automatic coating device and control method of high-performance scaling powder |
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| CN114669413A (en) * | 2022-03-23 | 2022-06-28 | 美的集团股份有限公司 | Selective spraying device and method and wave-soldering equipment |
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Application publication date: 20130123 |