CN102883523B - A kind of pcb board with enhancing Copper Foil current carrying capacity - Google Patents
A kind of pcb board with enhancing Copper Foil current carrying capacity Download PDFInfo
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- CN102883523B CN102883523B CN201210373395.0A CN201210373395A CN102883523B CN 102883523 B CN102883523 B CN 102883523B CN 201210373395 A CN201210373395 A CN 201210373395A CN 102883523 B CN102883523 B CN 102883523B
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- pcb board
- copper foil
- plated
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Abstract
The application relates to a kind of pcb board designing technique, specifically a kind of pcb board with enhancing Copper Foil current carrying capacity, its structure is the two-sided Copper Foil that is provided with of pcb board, and offers multiple plated through-holes, and plated through-hole hole wall area is greater than two ends, hole area sum. The application, without the manufacture craft that increases paster and roll tin, has reduced the cost of making pcb board.
Description
Technical field
The application relates to a kind of pcb board designing technique, specifically a kind of have strengthen Copper Foil current carrying capacityPcb board.
Background technology
Along with electronic product develops towards miniaturization, the part in electronic product is also more and more less, the electronics carrying on pcb boardElement is also more and more, and the current carrying capacity of the Copper Foil of laying on pcb board is more and more stronger, therefore under same homalographic, increasesThe current carrying capacity that adds the Copper Foil of laying on pcb board becomes extremely important.
Prior art one, the Chinese patent that application number is 201010242210.3 has been recorded one increases PCB by pasterThe method of line conductor current-carrying capacity, the step of its specific implementation is as follows:
(1) in the time that pcb board designs by copper foil plate line width stenosis or to have the oxide of part stitch perforation place clearReason is totally made into copper foil plate circuit Chip Area;
(2) make copper foil plate paster, get a copper foil plate and remove surface film oxide, then according to designing on copper foil plate circuitTime the copper foil plate circuit Chip Area that reserves shape to cut out copper foil plate paster for subsequent use;
(3) the copper foil plate paster cutting is attached to copper foil plate circuit paster position by rolling tin welding.
In two-sided pcb board, adopt technique scheme to increase PCB line conductor current-carrying capacity, it is being manufacturedThe manufacture craft that needs additionally to increase paster in process and roll tin, has increased the cost of manufacture of pcb board.
Prior art two, pcb board hole metallization technology is one of key technology of pcb board manufacture. Plated through-hole technology isPerforate between top layer and bottom, is plated in thin one deck copper on the inwall in hole the top layer of its object pcb board and the end with chemical reactionThe Copper Foil mutual conduction of layer, instead of in order to increase the bearing capacity of Copper Foil electric current.
Summary of the invention
The application's object is to provide a kind of pcb board that strengthens Copper Foil current carrying capacity that has cheaply.
Provide a kind of the have pcb board that strengthens Copper Foil current carrying capacity, the two-sided Copper Foil that is provided with of pcb board, PCB for this reasonPlate offers multiple plated through-holes, and plated through-hole hole wall area is greater than two ends, hole area sum.
Wherein, all pass through at least one plated through-hole perpendicular to arbitrary cross section of the sense of current.
Wherein, described plated through-hole is circular hole.
Wherein, described plated through-hole diameter is 0.5mm, and hole depth is 1～2mm.
Wherein, described plated through-hole is filled with tin.
Beneficial effect:
The requirement that only need to be greater than two ends, hole area sum according to hole wall area in the process of manufacturing designs goldThe size in genusization hole, the Copper Foil amount at two ends, hole when the Copper Foil amount on hole wall is just greater than not perforate, has been equivalent to increase tappingCopper Foil amount, thus the bearing capacity of electric current strengthened, be compared with the prior art, without the manufacture craft that increases paster and roll tin,Reduce the cost of making pcb board.
Brief description of the drawings
Fig. 1 is the structural representation of a kind of specific embodiment with the pcb board that strengthens Copper Foil current carrying capacity of the present inventionFigure.
Fig. 2 is plated through-hole structural representation.
Reference numeral:
1-plated through-hole, 2-PCB plate.
Detailed description of the invention
As shown in Figure 1, a kind of pcb board with enhancing Copper Foil current carrying capacity, the two-sided Copper Foil that is provided with of pcb board 2,Pcb board 2 offers multiple plated through-holes 1, and plated through-hole 1 hole wall area is greater than two ends, hole area sum, as shown in Figure 2, and arrowIndication place is hole wall, cross-hatching be the area at two ends, hole.
The requirement that only need to be greater than two ends, hole area sum according to hole wall area in the process of manufacturing designs hole,The Copper Foil amount at two ends, hole when Copper Foil amount on hole wall is just greater than not perforate, has increased the Copper Foil amount of tapping, thereby has strengthenedThe bearing capacity of electric current, is compared with the prior art, and without increasing paster and the manufacture craft of rolling tin, has reduced and has made pcb board 2Cost.
Because the maximum current bearing capacity of Copper Foil on monoblock pcb board 2 is subject to perpendicular to Copper Foil on the cross section of the sense of currentMinimum current bearing capacity restriction, therefore, be the carrying that strengthens Copper Foil electric current on monoblock pcb board 2, in the present embodiment perpendicular toArbitrary cross section of the sense of current all passes through at least one plated through-hole 1.
For the ease of manufacturing, described plated through-hole 1 adopts the mode of boring to form circular hole, then by hole wall copper simultaneouslyChange.
Particularly, taking a pcb board 2 with said structure feature as example, as Fig. 1, CD or DC direction are electric current sideTo, AB or BA direction are perpendicular to sense of current, and the plated through-hole 1 on this pcb board 2 is circular hole, and its aperture is 0.5mm,Its hole depth is 1～2mm, and plated through-hole 1 is arranged according to certain rules, and in AB or BA direction, plated through-hole 1 is equidistant, mutually flatRow arranges, and adjacent two row's plated through-hole 1 hole dislocations are arranged, can be through multiple perpendicular to arbitrary cross section of the sense of currentPlated through-hole 1, makes to be enhanced perpendicular to the current carrying capacity of the Copper Foil on arbitrary cross section of the sense of current.
Described plated through-hole 1 use tin is filled, and has further strengthened current carrying capacity.
Finally it should be noted that above embodiment is only in order to technical scheme of the present invention to be described, but not the present invention is protectedProtect the restriction of scope, although the present invention has been done to explain with reference to preferred embodiment, those of ordinary skill in the art shouldWork as understanding, can modify or be equal to replacement technical scheme of the present invention, and not depart from the reality of technical solution of the present inventionMatter and scope.
Claims (3)
1. have a pcb board that strengthens Copper Foil current carrying capacity, the two-sided Copper Foil that is provided with of pcb board, is characterized in that PCBPlate offers multiple plated through-holes, and plated through-hole hole wall area is greater than two ends, hole area sum, in the Copper Foil of pcb board surfaceArbitrary cross section of the sense of current all pass through at least one plated through-hole, plated through-hole is arranged according to certain rules, perpendicular toIn sense of current, plated through-hole is equidistant, is arranged in parallel, and adjacent two row plated through-holes hole dislocations be arranged, goldFill with tin in genusization hole, and current carrying capacity is enhanced.
2. a kind of pcb board that strengthens Copper Foil current carrying capacity that has according to claim 1, is characterized in that described goldGenusization hole is circular hole.
3. a kind of pcb board that strengthens Copper Foil current carrying capacity that has according to claim 2, is characterized in that described goldGenusization bore dia is 0.5mm, and hole depth is 1～2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210373395.0A CN102883523B (en) | 2012-09-27 | 2012-09-27 | A kind of pcb board with enhancing Copper Foil current carrying capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210373395.0A CN102883523B (en) | 2012-09-27 | 2012-09-27 | A kind of pcb board with enhancing Copper Foil current carrying capacity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102883523A CN102883523A (en) | 2013-01-16 |
| CN102883523B true CN102883523B (en) | 2016-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210373395.0A Active CN102883523B (en) | 2012-09-27 | 2012-09-27 | A kind of pcb board with enhancing Copper Foil current carrying capacity |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1296375A (en) * | 1999-11-12 | 2001-05-23 | 荏原优莱特科技股份有限公司 | Method for filling through hole |
| CN101066005A (en) * | 2004-11-24 | 2007-10-31 | 大日本印刷株式会社 | Multilayer wiring board and method for manufacturing same |
| CN101192542A (en) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | Circuit board structure and its manufacture method |
| CN102076174A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity |
| CN202799386U (en) * | 2012-09-27 | 2013-03-13 | 广东易事特电源股份有限公司 | PCB plate enhancing copper foil current bearing capability |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08335754A (en) * | 1995-06-05 | 1996-12-17 | Hewlett Packard Japan Ltd | Guard structure employing via hole/through hole |
-
2012
- 2012-09-27 CN CN201210373395.0A patent/CN102883523B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1296375A (en) * | 1999-11-12 | 2001-05-23 | 荏原优莱特科技股份有限公司 | Method for filling through hole |
| CN101066005A (en) * | 2004-11-24 | 2007-10-31 | 大日本印刷株式会社 | Multilayer wiring board and method for manufacturing same |
| CN101192542A (en) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | Circuit board structure and its manufacture method |
| CN102076174A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity |
| CN202799386U (en) * | 2012-09-27 | 2013-03-13 | 广东易事特电源股份有限公司 | PCB plate enhancing copper foil current bearing capability |
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| Publication number | Publication date |
|---|---|
| CN102883523A (en) | 2013-01-16 |
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