CN102873940A - Halogen-free low-dielectric constant high-toughness copper foil-coated laminated board - Google Patents
Halogen-free low-dielectric constant high-toughness copper foil-coated laminated board Download PDFInfo
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- CN102873940A CN102873940A CN 201210363648 CN201210363648A CN102873940A CN 102873940 A CN102873940 A CN 102873940A CN 201210363648 CN201210363648 CN 201210363648 CN 201210363648 A CN201210363648 A CN 201210363648A CN 102873940 A CN102873940 A CN 102873940A
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- dielectric constant
- clad laminate
- high tenacity
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Abstract
The invention discloses a halogen-free low-dielectric constant high-toughness copper foil-coated laminated board, which is characterized in that in a resin glue solution formula, bisphenol A-type cyanate ester is used as main resin; polyfunctional epoxy resin and phenolic resin are added simultaneously; the bisphenol A-type cyanate ester has the characteristics of low dielectric constant, minimal dielectric loss, high glass-transition temperature, low shrinkage, low hydroscopicity, excellent mechanical and adhesion properties. A board prepared through hot pressing molding by the technical scheme of the invention has a low dielectric constant, and good heat resistance; the board has a low expansion factor from ambient temperature to 260 DEG C. Meanwhile, the board has the characteristics of good processability and difficulty for mechanical delamination.
Description
(1) technical field
The present invention relates to a kind of halogen-free copper-clad laminate, relate in particular to a kind of copper-clad laminate that it is characterized in that low-k, high tenacity.
(2) background technology
Europe " WEEE (electric, electronic equipment discarded object) " decree, and in " ROHS (harmful substance is used in the restriction of electric, electronic equipment) " decree to halogen containing flame-retardant (with PBB: PBB, headed by the PBDE, PBDE) limit.Stipulate that to the European market exported product, the halide-containing based flame retardant can be restricted from 2006 May calendar year 2001.In January, 2008, propose to have held the forum that themes as " advancing non-halogen electronic product " by Intel Company, promise will be in several years real Intel Company product non-halogen, and this has started again the upsurge in non-halogen copper-clad plate market.
At present computer, mobile communication and network etc. have penetrated into the every nook and cranny of people's productions, life, so that human society strides forward towards the direction of advanced IT application just steadily, with the information processing technology that high-caliber electronic computer is the theme, what pursue is the high speed of information processing, the increase of memory capacity and the miniaturization of volume; On the other hand, aspect ICT, for guaranteeing ever-increasing traffic capacity, communication modes is developed to digitized signal by analog signal, in order to increase port number, realizes high performance and multifunction, frequency of utilization shifts to ghz band from MHz, enters high frequency even hyperfrequency field.So the development of information processing and ICT impels the copper-clad plate with high frequency characteristics to be developed rapidly.
The copper-clad plate of using at high-frequency circuit must possess good dielectric properties, be low-k and low-dielectric loss angle tangent, generally, signal velocity V=K*C/ ε 2 in the wiring board wire, wherein C is the light velocity, ε is dielectric constant, K is a constant, this shows that ε is less, then spread speed is faster; In addition, the transmission loss during signal is propagated is relevant with conductor internal loss and medium internal loss, and the conductor internal loss is directly proportional with the ε square root, and the medium internal loss is relevant with ε square root and loss angle tangent.Therefore use the baseplate material of low-k and low-dielectric loss, help the high speed of signal to propagate and the loss of signal.
(3) summary of the invention
The object of the present invention is to provide a kind of Halogen, low-k, high tenacity copper-clad laminate, by reducing the dielectric constant of sheet material, realize simultaneously non-halogen environmental protection performance, so that the sheet material after the moulding has Halogen, low-k characteristics, simultaneously by the prescription modification, so that sheet material toughness improves greatly, be difficult for layering, the PCB processing characteristics improves greatly.
For achieving the above object, technical scheme of the present invention is: the resin adhesive liquid prescription is set, adjusts P sheet manufacturing parameter, adjusts compressing technique.
1, resin adhesive liquid prescription, the glue component is counted according to weight quota:
Above solid constituent is dissolved in organic molten machine, and each component fully mixes.
2, prepreg manufacturing parameter:
With the electronic-grade glass fiber cloth gluing, after the vertical gluing machine oven dry, make prepreg, the speed of a motor vehicle is 8-18m/min;
Prepreg production control parameter:
Gelation time 70-100S;
Resin content is 39-46%;
The resin-oatmeal kinetic viscosity is 450-700P.
3, pressing process:
2-10 is opened prepreg carry out first superimposedly, be laminated with Copper Foil again, compressing in vacuum press.
Pressing process control parameter:
Vacuum: 0-0.01MPa
Pressure: 300-460PSI
Temperature of heat plate: 120-220 ℃,
Press time: 100-160min;
The invention has the advantages that:
The sheet material that adopts technical scheme of the present invention to make after hot-forming has lower dielectric constant, and heat resistance is good, and from environment temperature to 260 ℃, sheet material all can possess the lower coefficient of expansion.Sheet material has good machinability simultaneously, is difficult for mechanical layering.
(4) specific embodiment
The below is elaborated to specific embodiments of the invention:
1, impregnation:
Adopt high speed dispersor to carry out the glue modulation in the present embodiment, wherein the component of glue modulation is counted according to weight quota:
In this process each component is fully mixed first, and in high speed dispersor, stirred 4.5 hours, test to such an extent that the glue gelation time is 300S, namely available.
2, gluing:
Use 7628 glass fabric gluings, make prepreg in the vertical gluing machine oven dry, the speed of a motor vehicle is 15m/min, and corresponding prepreg parameter is:
Gelation time is 80S;
Resin content is 40%;
The resin-oatmeal kinetic viscosity is 480P;
3, compacting:
It is superimposed to choose 8 prepregs in the present embodiment, is laminated with Copper Foil again, compressing in vacuum press.The compacting parameter:
Vacuum: 0.01MPa;
Pressure: 400PSI;
Temperature of heat plate: 120-220 ℃;
Press time: 155min;
Wherein during 220 ℃ of temperature of heat plate, corresponding also is high pressure 410PSI, the about 50min of operation this moment.
Claims (5)
1. a Halogen, low-k, high tenacity copper-clad laminate is characterized in that, the resin adhesive liquid prescription, and the glue component is counted according to weight quota:
Above solid constituent is dissolved in organic molten machine, and each component fully mixes.
2. a kind of Halogen according to claim 1, low-k, high tenacity copper-clad laminate, it is characterized in that, in the production process of prepreg, first with the electronic-grade glass fiber cloth gluing, make prepreg after the vertical gluing machine oven dry, the speed of a motor vehicle is 8-18m/min.
3. a kind of Halogen according to claim 1, low-k, high tenacity copper-clad laminate is characterized in that, prepreg production control parameter is:
Gelation time 70-100S;
Resin content is 39-46%;
Resin-oatmeal kinetic viscosity 450-700P.
4. a kind of Halogen according to claim 1, low-k, high tenacity copper-clad laminate is characterized in that, it is superimposed first 2-10 to be opened prepreg in the pressing process, be laminated with Copper Foil again, and compressing in vacuum press.
5. a kind of Halogen according to claim 1, low-k, high tenacity copper-clad laminate is characterized in that, pressing process control parameter is:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210363648 CN102873940A (en) | 2012-09-21 | 2012-09-21 | Halogen-free low-dielectric constant high-toughness copper foil-coated laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210363648 CN102873940A (en) | 2012-09-21 | 2012-09-21 | Halogen-free low-dielectric constant high-toughness copper foil-coated laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102873940A true CN102873940A (en) | 2013-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210363648 Pending CN102873940A (en) | 2012-09-21 | 2012-09-21 | Halogen-free low-dielectric constant high-toughness copper foil-coated laminated board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103254574A (en) * | 2013-05-28 | 2013-08-21 | 北京新福润达绝缘材料有限责任公司 | Glass felt laminated board and preparation method thereof |
| CN108099351A (en) * | 2018-01-10 | 2018-06-01 | 广德龙泰电子科技有限公司 | A kind of copper-clad laminate production technology of the high CTI of Halogen low-k |
| CN108099350A (en) * | 2018-01-10 | 2018-06-01 | 广德龙泰电子科技有限公司 | A kind of copper-clad laminate production technology of low CTE high-breakdown-voltages high tenacity |
| CN113844039A (en) * | 2021-09-27 | 2021-12-28 | 山东金宝电子股份有限公司 | Preparation method of novel low-dielectric-constant copper-clad plate glue solution |
-
2012
- 2012-09-21 CN CN 201210363648 patent/CN102873940A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103254574A (en) * | 2013-05-28 | 2013-08-21 | 北京新福润达绝缘材料有限责任公司 | Glass felt laminated board and preparation method thereof |
| CN103254574B (en) * | 2013-05-28 | 2015-09-09 | 北京新福润达绝缘材料有限责任公司 | Glass felt layers pressing plate its preparation method |
| CN108099351A (en) * | 2018-01-10 | 2018-06-01 | 广德龙泰电子科技有限公司 | A kind of copper-clad laminate production technology of the high CTI of Halogen low-k |
| CN108099350A (en) * | 2018-01-10 | 2018-06-01 | 广德龙泰电子科技有限公司 | A kind of copper-clad laminate production technology of low CTE high-breakdown-voltages high tenacity |
| CN113844039A (en) * | 2021-09-27 | 2021-12-28 | 山东金宝电子股份有限公司 | Preparation method of novel low-dielectric-constant copper-clad plate glue solution |
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| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130116 |