CN110938357A - Multilayer structure and method for manufacturing substrate - Google Patents
Multilayer structure and method for manufacturing substrate Download PDFInfo
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- CN110938357A CN110938357A CN201911039279.3A CN201911039279A CN110938357A CN 110938357 A CN110938357 A CN 110938357A CN 201911039279 A CN201911039279 A CN 201911039279A CN 110938357 A CN110938357 A CN 110938357A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
- C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09D171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09D171/12—Polyphenylene oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/23—Magnetisable or magnetic paints or lacquers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
- B32B2315/085—Glass fiber cloth or fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Abstract
The invention discloses a manufacturing method of a multilayer structure and a substrate, and the manufacturing method of the multilayer structure comprises the following steps: forming a resin composition containing a magnetic filler on a substrate layer to obtain a multilayer structure; applying an external magnetic field to the multilayer structure along the thickness direction to generate magnetic field alignment, wherein the time of the magnetic field alignment is 0.01 to 1000 seconds, and the magnetic field intensity is 0.1 to 10T; and drying the multilayer structure at a temperature between 50 and 500 ℃. The invention also discloses a manufacturing method of the substrate, which comprises the following steps: providing two multi-layer structures, and laminating the multi-layer structures oppositely for 1 to 10 hours at a temperature of 150 to 250 ℃ under a pressure of 5 to 50kg to obtain a substrate with a thickness of 50 to 500 μm. The multilayer structure and the manufacturing method of the substrate effectively improve the heat conductivity between the substrates and reduce the dielectric constant and the dielectric loss.
Description
Technical Field
The present invention relates to a method for manufacturing a multilayer structure, and more particularly, to a method for manufacturing a resin-coated multilayer structure without using a glass cloth.
Background
In recent years, with the trend of electronic systems towards multi-functionality, high density, high reliability and light weight, printed circuit boards are used in a variety of high-speed digital communication applications, and are the main tools for routing, switching and data storage. As networks become explosive and grow exponentially, the need for faster data transfer rates continues to increase.
Therefore, in the related art, due to the demands of high speed, high density, densification and lamination, a substrate with high thermal conductivity, lower dielectric and high insulating material is required. The prior art copper clad laminate is generally of a copper clad/dielectric layer/copper clad structure, and most of the dielectric layers sandwiched therebetween are poor thermal conductive resin, glass cloth (glass cloth), or insulating paper, thus resulting in poor thermal conductivity of the copper clad laminate.
Therefore, how to improve the thermal conductivity of the multi-layer structure and reduce the dielectric constant and dielectric loss by improving the process design has become one of the important issues to be solved by the industry.
Disclosure of Invention
The present invention is directed to a method for manufacturing a multilayer structure and a substrate.
In order to solve the above technical problem, one technical solution of the present invention is to provide a method for manufacturing a multilayer structure, including: applying a resin composition onto a substrate layer, wherein the resin composition comprises 0.1 to 80.0 parts by weight of a magnetic filler; applying an external magnetic field to the resin composition to generate magnetic field alignment on the magnetic filler; and drying the resin composition at a temperature of between 50 and 500 ℃; wherein the time of the magnetic field alignment is between 0.01 and 1000 seconds, and the magnetic field strength is between 0.1 and 10T (Tesla).
Preferably, the resin composition comprises: (a)1.0 part by weight of a crosslinkable monomer having a biphenyl group; (b)1.0 to 20.0 parts by weight of a polyphenylene ether; and (c)0.1 to 10.0 parts by weight of a hardening; wherein (d) the magnetic filler is selected from thermally conductive compounds surface-modified with iron-containing oxides. The resin composition may further include, if necessary: (e)0.001 to 0.05 parts by weight of a free radical initiator.
Preferably, the (d) magnetic filler further comprises: 0.01 to 10.0 wt% of a coupling agent.
In order to solve the above-mentioned technical problem, another technical solution of the present invention is to provide a method for manufacturing a substrate, including: providing two multilayer structures of the invention; and oppositely pressing the multilayer structure to obtain a substrate with the thickness of 50-500 μm; wherein the pressing pressure is between 5 and 50kg, the pressing temperature is between 150 and 250 ℃, and the pressing time is between 1 hour and 10 hours.
Preferably, the method of manufacturing a substrate further includes: sandwiching a prepreg between the two multilayer structures; wherein the prepreg comprises a reinforcing material impregnated in a prepreg composition.
Preferably, the prepreg composition comprises: (a)1.0 part by weight of a crosslinkable monomer having a biphenyl group; (b)1.0 to 20.0 parts by weight of a polyphenylene ether; (c)0.1 to 10.0 parts by weight of a crosslinking agent; and (d)0.1 to 80.0 parts by weight of a magnetic filler, wherein the magnetic filler (d) is selected from a thermally conductive compound surface-modified with an iron-containing oxide, the thermally conductive compound may be at least one selected from boron nitride, aluminum nitride, silicon carbide, alumina, carbon nitride, and octahedral carbon, and the magnetic filler (d) is in the form of a sheet or a needle. More specifically, the reinforcing material is at least one selected from glass, ceramic, carbon material and resin, and the reinforcing material is in the form of fiber, powder, sheet or woven fabric.
One of the advantages of the present invention is that the method for manufacturing a multilayer structure and the method for manufacturing the same provided by the present invention can generate magnetic field alignment by applying an external magnetic field to the multilayer structure along the thickness direction, wherein the time for the magnetic field alignment is between 0.01 and 1000 seconds, and the magnetic field strength is between 0.1 and 10T, so as to improve the thermal conductivity between the substrates and lower the dielectric constant and dielectric loss.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
FIG. 1 is a flow chart of a method of manufacturing a multilayer structure according to the present invention.
FIG. 2 is a schematic view of the magnetic field alignment of the manufacturing method of the multi-layer structure of the present invention.
Fig. 3 is a schematic cross-sectional view of a multilayer structure according to an embodiment of the invention.
FIG. 4 is a flow chart of a method for manufacturing a substrate according to the present invention.
Fig. 5 is a schematic cross-sectional view of a substrate according to an embodiment of the invention.
Fig. 6 is a schematic cross-sectional view of a substrate according to another embodiment of the invention.
Detailed Description
The following is a description of the embodiments of the present disclosure relating to "multilayer structure and method for manufacturing substrate" by specific embodiments, and those skilled in the art will understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
Referring to fig. 1, the method for manufacturing a multi-layer structure of the present invention includes: s100, forming a resin composition containing a magnetic filler on a substrate layer to obtain a multilayer structure; s102, applying a magnetic field to the multilayer structure along the thickness direction to generate magnetic field alignment; and S104 drying the multilayer structure at a temperature between 50 and 500 ℃.
Specifically, the magnetic field alignment time is between 0.01 and 1000 seconds, and the magnetic field strength is between 0.1 and 10T, and the stronger the magnetic field strength, the shorter the magnetic field alignment time, and vice versa. The magnetic field alignment is an effect of increasing the thermal conductivity in the thickness direction by applying a magnetic field in the thickness direction, that is, in the direction perpendicular to the plane of the multilayer structure, to orient the magnetic filler in the resin composition in the thickness direction.
Referring further to fig. 2, a schematic diagram of a manufacturing system M for a multi-layer structure according to the manufacturing method of the present invention is shown, which includes: a coating device 2, a magnetizing device 3 and a drying device 4; the coating device 2 includes a glue tank 22, a plurality of guide wheels 24, and a plurality of squeegee wheels 26, wherein the glue tank 22 is loaded with a resin composition, the base layer 12 is guided to the glue tank 22 by the guide wheels 24, one surface of the base layer 12 is coated with the resin composition, and the excess resin composition is removed by nipping by the squeegee wheels 26 and then enters the magnetizing device 3.
The magnetization device 3 includes a first magnetization unit 32 and a second magnetization unit 34, the first magnetization unit 32 and the second magnetization unit 34 are oppositely disposed and have different magnetic poles, for example, the first magnetization unit 32 is an N pole, the second magnetization unit 34 is an S pole, the magnetic field strength of the magnetization device 3 is between 0.1 and 10T, the magnetic field strength can also be adjusted by the distance between the first magnetization unit 32 and the second magnetization unit 34, and the strength of the magnetic field is in inverse proportion to the distance; the time of the magnetic alignment is between 0.01 and 1000 seconds, in other words, the magnetic alignment is completed after passing through the magnetization device 3 via the working direction. After completing the magnetic field matching, the drying device 4 is continued to perform the drying step, the drying temperature is between 50 and 500 ℃, so as to obtain the multilayer structure of the invention.
The multilayer structure 1 of the present invention is shown in fig. 3 and includes a base layer 12 and a resin composition layer 14, the base layer 12 being a copper foil, a polymer film (e.g., a polyimide film, a polyethylene terephthalate film, or other polymer film), or the like. When the base layer 12 is a copper foil, the step of applying the resin composition to the base layer 12 is a so-called Resin Coated Copper (RCC) process.
Further, the resin composition layer or the resin composition of the present invention includes:
(a)1.0 part by weight of a crosslinkable monomer having a biphenyl group;
(b)1.0 to 20.0 parts by weight of a polyphenylene ether;
(c)0.1 to 10.0 parts by weight of a crosslinking agent; and
(d)0.1 to 80.0 parts by weight of a magnetic filler;
optionally, the method may further comprise:
(e)0.001 to 0.05 parts by weight of a free radical initiator. For example, (e) the free radical initiator may be a photoinitiator, a thermal initiator, or a combination thereof. If the proportion of the radical initiator (e) is too high, the molecular weight of the resin composition after crosslinking tends to be low, resulting in poor physical properties. If the proportion of the radical initiator (e) is too low, the curing becomes insufficient, resulting in poor processability.
In one embodiment, (a) the crosslinkable monomer having a biphenyl group has the following structure:
wherein R is1is-CH2-, -C (═ O) -, or- (CH)2)-(C6H4) -; and R2Is H or CH3. For example, the following structure:
in this example, (b) the polyphenylene ether has a weight average molecular weight of 1000 to 7000, and if (b) the polyphenylene ether has a weight average molecular weight that is too high, the reactive group of the resin is too small and solubility is not good, resulting in poor mechanical properties of the substrate. If the weight average molecular weight of the polyphenylene ether (b) is too low, the substrate characteristics are brittle, specifically, the polyphenylene ether (b) has the following structure:
wherein Ar is an aromatic group, R3Are each H, CH3、、
And R is4Is composed of
m and n are positive integers, and m + n is from 6 to 300.
In this embodiment, the (c) crosslinking agent is selected from at least one of triallyl isocyanate (TAIC), triethyleneamine, and triallyl cyanate (TAC).
In one embodiment, (a) the crosslinkable monomer having a biphenyl group has the following structure:
wherein R is7Is- (CH)2)n-, and n is a positive integer of 1 to 3; and R8Is H or CH3。
In one aspect of this embodiment, (b) the polyphenylene ether has the following structure:
wherein Ar is an aromatic group, R3Are each H, CH3、
And
and R is4Is composed of
m and n are positive integers, and m + n is from 6 to 300.
In aspects of this embodiment, the (c) crosslinker comprises an active ester, a polyamine, a polyol. For example, the active ester can be 8000-65T, 8150-60T, or 8100-65T, available from DIC. The polyamine can have at least two amine groups and the polyol can have at least two alcohol groups. For example, the polyamine can be 4, 4-diaminodiphenyl sulfone (DDS), JER-113, or 4,4' -diaminodiphenylmethane (DDM). The polyol may be ethylene glycol, propylene glycol or polyethylene glycol.
In another aspect of this embodiment, (b) the polyphenylene ether has the following structure:
wherein Ar is an aromatic group, R3Are each H, CH3、
And R is4Is composed of
m and n are positive integers, and m + n is from 6 to 300.
Furthermore, in this aspect, the resin composition of the present invention further comprises: 1.0 to 10.0 parts by weight of (f) a compatibilizer having the structure:
wherein R is5is-CH2-or-C (CH)3)2-; and R6Is- (CH)2)n-, and n is a positive integer of 1 to 3. If the proportion of the (f) compatibilizing agent is too high, poor thermal conductivity will result. If the proportion of (f) the compatibilizing agent is too low, the (a) crosslinkable monomer having a biphenyl group and the (b) polyphenylene ether will be incompatible with each other to cause phase separation.
In this example version, the crosslinker used in the SA90 system (polyphenylene ether with hydroxyl groups at the end) is DIC8000-65T (esters)/amine/phenol crosslinker, while the crosslinker used in the SA9000 system (polyphenylene ether with alkenyl groups at the end) is a common free radical initiator (e.g., peroxide).
The resin composition of the present invention, wherein (a) the crosslinkable monomer having a biphenyl group, (b) the polyphenylene ether, and (c) the crosslinking agent are as described above, is adjusted as required.
In addition, (d) the magnetic filler is selected from a thermally conductive compound surface-modified with an iron-containing oxide, and the thermally conductive compound may be selected from at least one of boron nitride, aluminum nitride, silicon carbide, aluminum oxide, carbon nitride, and carbon of an octahedral structure. Specifically, the heat-conducting compound may be powder, and the particle size is between 0.1 μm and 110 μm. If the particle size of the heat conductive compound powder is too small, the alignment direction of the magnetic heat conductive material is difficult to control by a magnetic field due to the influence of the thermal effect. If the particle size of the heat-conducting compound is too large, it is not easily controlled and aligned by the magnetic field due to the gravity effect.
More specifically, the iron-containing oxide is present in an amount of 0.05 to 50 wt% based on the weight of the magnetic filler, and the iron-containing oxide is an oxide of iron and another metal, for example, nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof.
In addition, the (d) magnetic filler may further include 0.01 to 10.0 wt% of a coupling agent for increasing compatibility between the (d) magnetic filler and other organic materials in the resin composition. If the proportion of the coupling agent is too high, the biological properties may be deteriorated. For example, the coupling agent may be a silane, titanate, zirconate, or combinations thereof. Further, the silane may contain amine groups, epoxy groups, acrylic groups, vinyl groups, or combinations thereof. More preferably, in the actual mixing step, the coupling agent and the magnetic filler may be mixed first, so that the coupling agent and the magnetic filler are grafted, thereby further improving the compatibility between the (d) magnetic filler and other organic materials in the resin composition.
As shown in fig. 4, the present invention also provides a method for manufacturing a substrate, including: s200 provides two inventive multilayer structures comprising a base layer 12 and an opposing resin composition layer 14; s202, oppositely pressing the two multilayer structures by contacting the resin composition layer 14 to obtain a substrate with the thickness of 50-500 μm; optionally, the method for manufacturing a substrate of the present invention further includes: s201 sandwiches a prepreg between two multilayer structures.
Specifically, the pressing pressure is between 5 and 50kg, the pressing temperature is between 150 and 250 ℃, and the pressing time is between 1 hour and 10 hours.
Further referring to fig. 5, it is a schematic diagram of a substrate manufactured by the method of manufacturing a substrate according to the present invention, which includes two multi-layer structures 1, each multi-layer structure 1 includes a base layer 12 and an opposite resin composition layer 14, and is formed by laminating the resin composition layers 14 in opposite directions.
Referring to fig. 6, a schematic diagram of a substrate prepared by the method of manufacturing a substrate according to the present invention includes two multi-layer structures 1, and a prepreg 16 sandwiched between the two multi-layer structures 1, that is, a resin composition layer 14 is disposed on the upper and lower surfaces of the prepreg 16.
Specifically, the prepreg 16 includes a reinforcing material impregnated in the prepreg composition to enhance the mechanical strength of the substrate. Preferably, the prepreg composition comprises:
(a)1.0 part by weight of a crosslinkable monomer having a biphenyl group;
(b)1.0 to 20.0 parts by weight of a polyphenylene ether;
(c)0.1 to 10.0 parts by weight of a crosslinking agent; and
(d)0.1 to 80.0 parts by weight of a magnetic filler,
wherein (d) the magnetic filler is a thermally conductive compound surface-modified with an iron-containing oxide, and the thermally conductive compound may be at least one selected from boron nitride, aluminum nitride, silicon carbide, aluminum oxide, carbon nitride, and octahedral carbon.
The reinforcing material is at least one selected from glass, ceramic, carbon material and resin, and the reinforcing material is in the form of fiber, powder, sheet or woven fabric. More preferably, the reinforcing material is fiberglass cloth.
In order to describe the multilayer structure and the method for manufacturing the substrate in more detail, the present invention includes the following synthesis examples and embodiments, but is not limited thereto.
Synthesis example 1 crosslinkable monomer having Biphenyl group
40.0g of 4,4 '-bis (2,3, 6-trimethylphenol) (4,4' -Bi (2,3, 6-trimethyphenol), TMP-BP, available from Mitsubishi chemical corporation) and 33.9g of Allyl chloride (Allyl chloride, available from Jingming chemical Co., Ltd.) were added to 40.0g of Dimethyl sulfoxide (DMSO), and a trace amount of Tetra-n-butyl ammonium salt (Tetra-n-butyl ammonium, available from Jingming chemical Co., Ltd.) and sodium hydroxide were added, and the mixture was heated to 80 ℃ and reacted for 3 hours. And after complete reaction, cooling the temperature to room temperature, and filtering and purifying to obtain the product.
The above product has the following formula:
the spectrum of the product of the above formula is as follows: 1H NMR (500MHz, CDCl 3): δ 6.69(s,2H),6.12-6.04(m,2H),5.39(d, J ═ 17.5Hz,2H),5.20(d, J ═ 10.5Hz,2H),4.25(d, J ═ 5.5Hz,4H),2.18(s,6H),2.16(s,6H),1.83(s, 6H).
Synthesis example 2 crosslinkable monomer having Biphenyl group
40.0g of TMP-BP and 40.2g of acryloyl chloride (acryloyl chloride, available from Jingming chemical industry) were taken, placed in 100.0g of tetrahydrofuran, and then a trace amount of triethylamine (triethylamine, available from Jingming chemical industry) and sodium hydroxide were added, reacted at a temperature below-30 ℃ with continuous stirring until the temperature reached above room temperature. After complete reaction, the product is obtained by filtration and purification. The above product has the following formula:
the spectrum of the product of the above formula is as follows: 1H NMR (500MHz, CDCl 3): δ 6.85(s,2H),6.66(d, J ═ 17.5Hz,2H),6.40(dd, J ═ 17.5Hz, J ═ 10.5Hz,2H),6.05(d, J ═ 10.5Hz,2H),2.12(s,6H),2.10(s,6H),1.94(s, 6H).
Synthesis example 3 crosslinkable monomer having Biphenyl group
Taking 40.0g of TMP-BP and 67.8g of 4-chloromethyl styrene (4-vinyl benzyl chloride, purchased from Jingming chemical industry), putting into 200.0g of Methyl Ethyl Ketone (MEK) solvent, adding trace tetra-n-butylammonium salt and Potassium carbonate (Potassium carbonate), reacting at the temperature of below 90 ℃ for about 4 hours, cooling the temperature to room temperature after complete reaction, and filtering and purifying to obtain the product. The above product has the following formula:
the spectrum of the product of the above formula is as follows: 1H NMR (500MHz, CDCl 3): δ 7.49 to 7.45(m,8H),6.81(s,2H),6.75(dd, J ═ 17.5Hz,2H),5.78(d, J ═ 17.5Hz,2H),5.27(d, J ═ 12Hz,2H),4.83(s,4H),2.30(s,6H),2.28(s,6H),1.94(s, 6H).
Synthesis example 4 magnetic Filler
Taking boron nitride (the average grain diameter is 1.5 mu m), adding deionized water to form a first solution, adding nickel, zinc and iron elements, adding deionized water to form a second solution, mixing the first solution and the second solution, heating to 80 ℃, adding a sodium hydroxide aqueous solution to adjust to be alkaline, continuously stirring for 30 minutes, heating to 800 ℃, and then cooling to room temperature to obtain the magnetic filler.
Synthesis example 5 magnetic Filler
Further, 10.0g of the magnetic filler and 0.05g of a coupling agent silane (Z6012 available from DOW CORNING) were prepared in a 250.0mL aqueous solution to obtain a magnetic filler containing a coupling agent.
Examples 1 to 1
30.05g (1.0 part by weight) of the crosslinkable monomer having a biphenyl group of Synthesis example 1, 30.05g (1.0 part by weight) of polyphenylene ether having an alkenyl group at the end (SA9000 available from Sabic, having a structure wherein m + n ═ 6 to 300), 12.91g (0.43 part by weight) of triallyl isocyanate, 4.53g of polystyrene-butadiene-styrene (0.15 part by weight), 0.64g (0.021 part by weight) of radical initiator Perbutyl-P available from Japanese oil and fat, and 32.2g (1.07 part by weight) of the magnetic filler of Synthesis example 4 were taken, 4.23g (0.14 part by weight) of silica FB-5SDC (available from Denka) were added, 50.0mL of a cosolvent (toluene/xylene/cyclohexanone) was added, and mixed uniformly to form a resin composition.
The resin composition of example 1-1 was coated on a copper foil, subjected to magnetic alignment for 600 seconds by an external magnetic field of 0.8T and dried at a temperature of 160 ℃ to obtain a multilayer structure of example 1-1. The resin composition may be further heated at 190 ℃ for 2 hours and then at 230 ℃ for 3 hours to cure the resin composition.
The resin composition in the above-mentioned production process of the multilayer structure had a thickness of about 120 μm, a thermal conductivity of 1.31W/mK (measurement standard: ASTM-D5470), a dielectric constant of 2.88@10GHz, and a dielectric loss of 0.0036@10GHz (measurement standard: JIS C2565).
Examples 1 to 2
Two multi-layer structures of example 1-1 were pressed against each other at a pressure of 20Kg, and were hot-pressed at 190 ℃ for 1 hour and then at 230 ℃ for 2 hours to form a substrate, which had a thickness of about 220 μm. The thermal conductivity was 1.16W/mK (measurement standard: ASTM-D5470), the dielectric constant was 2.98@10GHz, and the dielectric loss was 0.0043@10GHz (measurement standard: JISC 2565).
Example 2-1
6.45g (1.0 part by weight) of a crosslinkable monomer having a biphenyl group (YX4000, available from Mitsubishi chemical Co., Ltd., as shown in the following formula (I), wherein R is7is-CH2-，R8Is H), 30.04g (4.66 parts by weight) of a polyphenylene ether having an alkenyl group at the end (SA9000, available from Sabic, as shown in the following formula (II), wherein m + n is 6 to 300), 6.45g (1.0 part by weight) of a hydrogenated epoxy resin monomer YX8000 (available from Mitsubishi chemical Co., Ltd., as shown in the following formula (III), wherein R is5is-C (CH)3)2-，R6is-CH2-) as a compatibilizer, 3.16g (0.49 parts by weight) of a polyamine JER-123 (available from mitsubishi chemical corporation as shown in the following formula (IV) as a crosslinking agent, 12.92g (2.0 parts by weight) of triallyl isocyanate as a crosslinking agent, 4.52g of polystyrene-butadiene-styrene (0.70 parts by weight), 0.59g (0.092 parts by weight) of a radical initiator Perbutyl-P (available from japan oil and fat), and 39.27g (6.09 parts by weight) of the magnetic filler containing a coupling agent in synthesis example 5, 5.47g (0.85 parts by weight) of silica FB-5SDC (available from Denka), 50.0mL of a cosolvent (toluene/xylene/cyclohexanone) were added and mixed uniformly to form the resin composition of example 2-1.
A multilayer structure was formed in accordance with the method of example 1-1, and a substrate was formed in accordance with the method of example 1-2, which had a thickness of about 250 μm, a thermal conductivity of 1.49W/mK (ASTM-D5470), a dielectric constant of 2.99@10GHz, and a dielectric loss of 0.0147@10GHz (JIS C2565).
Examples 2 to 2
Taking 6.45g (1.0 part by weight) of a polymer having a biphenyl groupCross-linkable monomer (YX4000, available from Mitsubishi chemical, where R is7is-CH2-，R8H), 30.04g (4.66 parts by weight) of a polyphenylene ether having an alkenyl group at the end (SA9000 available from Sabic, wherein m + n is 6 to 300), 6.45g (1.0 part by weight) of a hydrogenated epoxy resin monomer YX8000 available from Mitsubishi chemical corporation, wherein R is5is-C (CH)3)2-，R6is-CH2-) as a compatibilizer, 3.16g (0.49 parts by weight) of a polyamine JER-123 (available from mitsubishi chemical corporation) as a crosslinking agent, 12.92g (2.0 parts by weight) of triallyl isocyanate as a crosslinking agent, 4.52g of polystyrene-butadiene-styrene (0.70 parts by weight), 0.59g (0.092 parts by weight) of a radical initiator Perbutyl-P (available from japan oil and fat), and 14.14g (2.19 parts by weight) of the magnetic filler containing silane of synthesis example 5, 1.95g (0.30 parts by weight) of silica FB-5SDC (available from Denka) were added, and 50.0mL of a cosolvent (toluene/xylene/cyclohexanone) was added and mixed uniformly to form the resin composition of example 2-2.
A glass fiber cloth (available from #1027 of ASCO of japan) was impregnated in the prepreg composition so that the weight of the prepreg composition/(the weight of the prepreg composition + the weight of the glass fiber cloth) was 73 wt%, and then the glass fiber cloth was put into an oven at 160 ℃ to dry the prepreg composition, thereby forming a prepreg having a thickness of 0.05 mm. The prepreg was sandwiched between two multilayer structures of example 2-1, pressed against each other at a pressure of 20Kg, and hot-pressed at 190 ℃ for 1 hour and then at 230 ℃ for 2 hours to form a substrate. The substrate had a thickness of 0.26mm, a thermal conductivity of 0.93W/mK (measurement standard: ASTM-D5470), a dielectric constant of 3.08@10GHz, and a dielectric loss of 0.0123@10GHz (measurement standard: JIS C2565).
Example 3
20g (1.0 part by weight) of the crosslinkable monomer having a biphenyl group of Synthesis example 2, 20g (1.0 part by weight) of polyphenylene ether having an alkenyl group at the end (MGC 1200 available from Mitsubishi, as represented by the aforementioned formula (II) wherein m + n is 6 to 300), 8g (0.4 part by weight) of triallyl isocyanate as a crosslinking agent, 6g of polystyrene-butadiene-styrene (0.3 part by weight), 0.476g (0.024 part by weight) of a radical initiator Perbutyl-P (available from Japanese oil) and 16.3g (0.82 part by weight) of the magnetic filler of Synthesis example 4 were taken, and 50.0mL of a cosolvent (toluene/xylene/cyclohexanone) was added and mixed uniformly to form the resin composition of EXAMPLE 3.
The resin composition of example 3 was coated on a copper foil, subjected to magnetic field alignment for 3 seconds by an external magnetic field of 0.8T and dried at a temperature of 160 ℃ to obtain a multilayer structure of example 1-1. The resin composition may be further heated at 190 ℃ for 2 hours and then at 230 ℃ for 3 hours to cure the resin composition.
A multilayer structure was formed according to the method of example 1-1, and a substrate was formed according to the method of example 1-2. The substrate had a thickness of about 125 μm, a thermal conductivity of 1.26W/mK (measurement standard: ASTM-D5470), a dielectric constant of 2.82@10GHz, and a dielectric loss of 0.0048@10GHz (measurement standard: JIS C2565).
Example 4
9712.46g (1.0 part by weight) of the crosslinkable monomer having a biphenyl group of Synthesis example 3, 9712.46g (1.0 part by weight) of a polyphenylene ether having an alkenyl group at the end (MGC 1200 available from Mitsubishi, as represented by the aforementioned formula (II) wherein m + n is 6 to 300), 3885g (0.40 part by weight) of triallyl isocyanate as a crosslinking agent, 1457.12g of polystyrene-butadiene-styrene (0.15 part by weight) were taken, 188.82g (0.019 parts by weight) of a radical initiator Perbutyl-P (available from Japan fats and oils) and 4690.92g (0.48 parts by weight) of the magnetic filler of Synthesis example 4 were added 3518.42g (0.36 parts by weight) of silica FB-5SDC (available from Denka), 38.68g (0.004 parts by weight) of a silane coupling agent Z-6030(Dow Corning) were added to 13278ml of a co-solvent (toluene/butanone/cyclohexanone) and mixed uniformly to form a resin composition of example 4.
A glass fiber cloth (available from #1027 of ASCO of japan) was impregnated in a prepreg composition, with a weight of the prepreg composition/(weight of the prepreg composition + weight of the glass fiber cloth) of 81 wt%, and magnetic field alignment was generated by applying a magnetic field at 0.8T, and then the glass fiber cloth was put into an oven at 160 ℃ to dry the prepreg composition, thereby forming a prepreg having a thickness of 0.075 mm. The prepreg was sandwiched between two multi-layered structures of example 3, pressed against each other at a pressure of 20Kg, and hot-pressed at 190 ℃ for 1 hour and then at 230 ℃ for 2 hours to form a substrate. The substrate had a thickness of 250 μm, a thermal conductivity of 0.96W/mK (measurement standard: ASTM-D5470), a dielectric constant of 3.01@10GHz, and a dielectric loss of 0.0053@10GHz (measurement standard: JIS C2565).
Comparative example 1
A resin composition was prepared using exactly the same composition as in example 4, and a glass fiber cloth (# 1027 available from ASCO of japan) was impregnated into the prepreg composition so that the weight of the prepreg composition/(the weight of the prepreg composition + the weight of the glass fiber cloth): 81 wt%, and direct drying was performed without magnetic field alignment, to obtain a prepreg having a thickness of 0.075 mm. The prepreg was sandwiched between two multi-layered structures of example 3, pressed against each other at a pressure of 20Kg, and hot-pressed at 190 ℃ for 1 hour and then at 230 ℃ for 2 hours to form a substrate. The substrate had a thickness of 250 μm, a thermal conductivity of 0.82W/mK (measurement standard: ASTM-D5470), a dielectric constant of 2.99@10GHz, and a dielectric loss of 0.0049@10GHz (measurement standard: JIS C2565).
Advantageous effects of the embodiments
One of the advantages of the present invention is that the method for manufacturing a multilayer structure and the method for manufacturing the same provided by the present invention can generate magnetic field alignment by applying an external magnetic field to the multilayer structure along the thickness direction, wherein the time for the magnetic field alignment is between 0.01 and 1000 seconds, and the magnetic field strength is between 0.1 and 10T, so as to improve the thermal conductivity between the substrates and lower the dielectric constant and dielectric loss.
Furthermore, the multilayer structure of the invention does not contain glass fiber cloth, the thickness of the multilayer structure, even the substrate, can be greatly reduced, and the manufacturing method of the invention is more beneficial to mass production and continuous process.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.
Claims (15)
1. A method of manufacturing a multilayer structure, comprising:
applying a resin composition onto a substrate layer, wherein the resin composition comprises 0.1 to 80.0 parts by weight of a magnetic filler;
applying an external magnetic field to the resin composition to generate magnetic field alignment on the magnetic filler; and
drying the resin composition at a temperature of between 50 and 500 ℃;
wherein, the time of the magnetic field alignment is between 0.01 and 1000 seconds, and the magnetic field intensity is between 0.1 and 10T.
2. The method of manufacturing a multilayer structure according to claim 1, wherein the resin composition further comprises:
(a)1.0 part by weight of a crosslinkable monomer having a biphenyl group;
(b)1.0 to 20.0 parts by weight of a polyphenylene ether; and
(c)0.1 to 10.0 parts by weight of a crosslinking agent;
wherein (d) the magnetic filler is a thermally conductive compound surface-modified with an iron-containing oxide, the thermally conductive compound being at least one selected from the group consisting of boron nitride, aluminum nitride, silicon carbide, aluminum oxide, carbon nitride, and octahedral structure carbon.
3. The method of manufacturing a multilayer structure according to claim 2, wherein the resin composition further comprises: (e)0.001 to 0.05 parts by weight of a free radical initiator.
4. The method of manufacturing a multilayer structure according to claim 2, wherein the (d) magnetic filler further comprises: 0.01 to 10.0 wt% of a coupling agent.
5. The method of manufacturing a multilayer structure according to claim 2, wherein the (a) crosslinkable monomer having a biphenyl group has the following structure:
wherein R is1is-CH2-, -C (═ O) -, or- (CH)2)-(C6H4) -; and R2Is H or CH3。
6. The method for producing a multilayer structure according to claim 1, wherein the polyphenylene ether (b) has the following structure:
wherein Ar is an aromatic group, R3Are each H, CH3、
And R is4Is composed of
m and n are positive integers, and m + n is from 6 to 300; and
wherein the crosslinking agent (c) is at least one selected from triallyl isocyanate, triethylene amine and triallyl cyanate.
7. The method of manufacturing a multilayer structure according to claim 2, wherein the (a) crosslinkable monomer having a biphenyl group has the following structure:
wherein R is7Is- (CH)2)n-, and n is a positive integer of 1 to 3; and R8Is H or CH3。
8. The method for producing a multilayer structure according to claim 1, wherein the polyphenylene ether (b) has the following structure:
wherein Ar is an aromatic group, R3Are each H, CH3、
And R is4Is composed of
m and n are positive integers, and m + n is from 6 to 300; and
wherein the crosslinking agent (c) comprises at least one of an active ester, a polyamine, and a polyol.
9. The method of manufacturing a multilayer structure according to claim 1, wherein the resin composition further comprises: 1.0 to 10.0 parts by weight of (f) a compatibilizer having the structure:
wherein R is5is-CH2-or-C (CH)3)2-; and R6Is- (CH)2)n-, and n is a positive integer of 1 to 3.
10. The method for producing a multilayer structure according to claim 1, wherein the polyphenylene ether (b) has the following structure:
wherein Ar is an aromatic radical, R3Respectively equal to H, CH3、
And R is4In the composition of particles
m is equal to n, and m + n is equal to , and is 6-300.
11. The method of manufacturing a multilayer structure according to claim 9, wherein the (c) crosslinking agent comprises (c1) at least one selected from triallyl isocyanate, trivinyl amine, and triallyl cyanate; and (c2) at least one selected from the group consisting of an active ester, a polyamine, and a polyol.
12. A method for manufacturing a substrate, comprising:
providing two multi-layer structures prepared by the method of claim 1, said multi-layer structures comprising a substrate layer and an opposing resin composition layer; and
laminating the two multilayer structures to obtain a substrate with the thickness of 50-500 mu m, wherein the resin composition layers of the two multilayer structures are connected;
wherein the pressing pressure is between 5 and 50kg, the pressing temperature is between 150 and 250 ℃, and the pressing time is between 1 hour and 10 hours.
13. The method of claim 12, wherein the step of laminating the two multi-layer structures comprises sandwiching a prepreg between the two multi-layer structures: wherein the prepreg comprises a reinforcing material impregnated in a prepreg composition.
14. The method of manufacturing a substrate according to claim 13, wherein the prepreg composition comprises:
(a)1.0 part by weight of a crosslinkable monomer having a biphenyl group;
(b)1.0 to 20.0 parts by weight of a polyphenylene ether;
(c)0.1 to 10.0 parts by weight of a crosslinking agent; and
(d)0.1 to 80.0 parts by weight of a magnetic filler,
wherein (d) the magnetic filler is at least one selected from the group consisting of a thermally conductive compound surface-modified with an iron-containing oxide, boron nitride, aluminum nitride, silicon carbide, aluminum oxide, carbon nitride, and carbon having an octahedral structure, and the magnetic filler (d) is in the form of a sheet or a needle.
15. The method of manufacturing a substrate according to claim 13, wherein the reinforcing material is at least one selected from glass, ceramic, carbon, and resin, and is present in the form of a fiber, powder, sheet, or woven fabric.
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