CN102862396A - Chip marking positioning die - Google Patents
Chip marking positioning die Download PDFInfo
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- CN102862396A CN102862396A CN2012102756796A CN201210275679A CN102862396A CN 102862396 A CN102862396 A CN 102862396A CN 2012102756796 A CN2012102756796 A CN 2012102756796A CN 201210275679 A CN201210275679 A CN 201210275679A CN 102862396 A CN102862396 A CN 102862396A
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- wafer
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Abstract
The invention relates to a chip marking positioning die, belonging to the technical field of positioning of a sapphire chip marking tool. The chip marking positioning die comprises a plurality of pits, wherein the pits are used for accommodating chips to be marked, the outline of each pit is formed by closing an arc line, a bit line and a straight line, the arc line is consistent with the outline of the chip to be marked, one end of the straight line is tangential to the arc line, and the other end of the straight line is crossed with the bit line. A working platform provides a vertical reference plane corresponding to a machine printing origin point, the chip marking positioning die is placed on the working platform, the chip to be marked is placed on the chip marking positioning die and is appressed to a vertical face to make the circumferential outline of each chip to be marked appressed to a bit edge and the outline of each die pit, the printing focus height is adjusted, a computer-aided design (CAD) matching template is designed, and the advantage effects of accurately positioning and rapidly marking can be achieved.
Description
Technical field
The invention belongs to the technical field of sapphire wafer mark tool locating, relate in particular to the mould that a kind of sapphire wafer mark is manually located fast.
Background technology
Sapphire claims again the Al2O3 monocrystalline, is commonly called as corundum, is a kind of simple corrdination type oxide crystal.Sapphire crystal has excellent optical property, mechanical performance and chemical stability, intensity is high, hardness is large, resistance to erosion, can under the mal-condition near 2000 ℃ of high temperature, work, thereby be widely used in the window material of infrared military installation, satellite spatial technology, high intensity laser beam.Its unique lattice structure, excellent mechanical property, good thermal property make sapphire crystal become semiconductor GaN/Al2O3 light emitting diode (LED), large scale integrated circuit SOI and the ideal backing materials such as SOS and superconducting nano structural membrane of practical application.In recent years, along with the development of modern science and technology, Secretary is proposed constantly for size, the quality of sapphire crystal material.
In carrying out the Sapphire Substrate wafer production processes, need to carry out radium to wafer and carve number, although full automatic marking machine is arranged at present, its price exceeds several times even tens times than manual equipment, and the speed of mark is slow, cost performance is not good.So the in the industry still manual film releasing mark of choice for use of a lot of producers no matter be front wafer surface mark or back mark, needs supporting frock in order to guarantee the accurate location of mark number on wafer.There are supporting moulds of industrial equipment to mate, just can enhance productivity and the positional precision of mark.
Summary of the invention
For above-mentioned technical problem, the invention provides a kind of wafer marking jig that can accurately locate.
For solving the problems of the technologies described above, the technical solution used in the present invention is, a kind of wafer marking jig, described wafer marking jig comprises a plurality of pits for the treatment of the mark wafer that hold, the profile of described pit is by the circular arc line consistent with treating mark wafer outline, to bit line, and an end and described circular arc line is tangent, the other end and described straight line sealing of intersecting to bit line consist of.
Provide a vertical datum plane (corresponding with machine printing initial point) by workbench, wafer marking jig of the present invention is placed on the workbench, be close to vertical plane, to treat that the mark wafer is placed on the wafer marking jig, make the every excircle configuration for the treatment of the mark wafer, to the circular arc line of limit, position and mould pit profile, press close to mutually to bit line, adjust and print the focal length height, the Design CAD matching template can reach the beneficial effect of accurate location, quick mark.
As a further improvement on the present invention, on described wafer marking jig, be provided with small rut with treating the corresponding arbitrary position of mark wafer outline, when mark is finished, operating personnel tick the mark wafer in the small rut position with finger and get final product, and are convenient and swift; Wafer marking jig aluminium material has guaranteed to treat that the mark wafer is not subjected to the secondary pollution of frock.
Description of drawings
Fig. 1 is the planar structure schematic diagram that the present invention treats the mark wafer;
Fig. 2 is wafer marking jig partial top view of the present invention;
Fig. 3 is that wafer marking jig shown in Figure 2 is along the cutaway view of A-A line.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is made and to further specify.
Shown in Figure 2, wafer marking jig of the present invention, described wafer marking jig comprises a plurality of pits 3 for the treatment of the mark wafer that hold, the profile of described pit 3 is by the circular arc line 5 consistent with treating mark wafer outline, to bit line 6, and an end and described circular arc line are 5 tangent, the other end and described straight line 7 sealings of intersecting to bit line 6 consist of.
Provide a vertical datum plane (corresponding with machine printing initial point) by workbench, wafer marking jig of the present invention is placed on the workbench, be close to vertical plane, the mark wafer for the treatment of shown in Figure 1 is placed on the wafer marking jig, make the every excircle configuration 1 for the treatment of the mark wafer, to the circular arc line 5 of limit, position 2 and mould pit profile, press close to mutually to bit line 6, adjust and print the focal length height, the Design CAD matching template can reach the beneficial effect of accurate location, quick mark.
Fig. 2 and shown in Figure 3, on described wafer marking jig, with treat mark wafer excircle configuration 1,2 corresponding arbitrary positions are provided with small rut 4 to the limit, position, when mark is finished, operating personnel tick the mark wafer in the position of small rut 4 with finger and get final product, and are convenient and swift; Through the Field Force's of company test, this wafer marking jig per hour can mark 300, than in the past mark Speed improving 20%-30%.
Wafer marking jig of the present invention adopts pure aluminum material as substrate, guaranteed to treat that the mark wafer is not subjected to the secondary pollution of frock, once load 20 2 cun wafers, adopt 60 degree oblique angles by point, shorten and treat the site error that the diameter of mark wafer own brings, the site error precision of every wafer mark is controlled in the 0.057mm, satisfied client's requirement, reduce the probability of scrapping because of mark, improved production efficiency, reduced production cost.
The description of above embodiment is comparatively concrete, detailed; but can not therefore be interpreted as the restriction to this patent scope; should be noted that; for the person of ordinary skill of the art; without departing from the inventive concept of the premise; can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (4)
1. wafer marking jig, it is characterized in that: described wafer marking jig comprises a plurality of pits for the treatment of the mark wafer that hold, the profile of described pit is by the circular arc line consistent with treating mark wafer outline, to bit line, and an end and described circular arc line is tangent, the other end and described straight line sealing of intersecting to bit line consist of.
2. wafer marking jig as claimed in claim 1 is characterized in that: on described wafer marking jig, be provided with small rut with treating the corresponding arbitrary position of mark wafer outline.
3. wafer marking jig as claimed in claim 2 is characterized in that: described straight line is 60 degree with angle to bit line.
4. such as wafer marking jig as described in above-mentioned arbitrary claim, it is characterized in that: described wafer marking jig is made by aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102756796A CN102862396A (en) | 2012-08-04 | 2012-08-04 | Chip marking positioning die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102756796A CN102862396A (en) | 2012-08-04 | 2012-08-04 | Chip marking positioning die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102862396A true CN102862396A (en) | 2013-01-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102756796A Pending CN102862396A (en) | 2012-08-04 | 2012-08-04 | Chip marking positioning die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102862396A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01225129A (en) * | 1988-03-03 | 1989-09-08 | Nec Corp | Vessel for semiconductor wafer |
| EP0454496A1 (en) * | 1990-04-27 | 1991-10-30 | Shin-Etsu Handotai Company Limited | A wafer transfer sytem |
| JPH0817902A (en) * | 1994-06-24 | 1996-01-19 | Hitachi Ltd | Wafer clamp and etching apparatus using the same |
| CN2413386Y (en) * | 2000-03-24 | 2001-01-03 | 杨移民 | Positioning silver-plating mould |
| JP2002313888A (en) * | 2001-04-09 | 2002-10-25 | Ibiden Co Ltd | Jig for semiconductor |
| JP2004342834A (en) * | 2003-05-15 | 2004-12-02 | Seiko Epson Corp | Substrate placing tray |
| CN1555330A (en) * | 2001-07-15 | 2004-12-15 | 诚实公司 | Tray for semiconductors |
| TW200622027A (en) * | 2004-12-27 | 2006-07-01 | Steady Design Ltd | Epitaxial equipment and susceptor |
| CN1826185A (en) * | 2003-07-18 | 2006-08-30 | 菲尼萨公司 | Edge bead control method and apparatus |
| JP2009141384A (en) * | 2009-03-05 | 2009-06-25 | Oki Semiconductor Co Ltd | Method for cleaning wafer mounting base |
| CN201623015U (en) * | 2010-04-06 | 2010-11-03 | 河南鸿昌电子有限公司 | Mold easy to place crystal blocks |
| CN202911297U (en) * | 2012-08-04 | 2013-05-01 | 江苏吉星新材料有限公司 | Positioning die for wafer marking |
-
2012
- 2012-08-04 CN CN2012102756796A patent/CN102862396A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01225129A (en) * | 1988-03-03 | 1989-09-08 | Nec Corp | Vessel for semiconductor wafer |
| EP0454496A1 (en) * | 1990-04-27 | 1991-10-30 | Shin-Etsu Handotai Company Limited | A wafer transfer sytem |
| JPH0817902A (en) * | 1994-06-24 | 1996-01-19 | Hitachi Ltd | Wafer clamp and etching apparatus using the same |
| CN2413386Y (en) * | 2000-03-24 | 2001-01-03 | 杨移民 | Positioning silver-plating mould |
| JP2002313888A (en) * | 2001-04-09 | 2002-10-25 | Ibiden Co Ltd | Jig for semiconductor |
| CN1555330A (en) * | 2001-07-15 | 2004-12-15 | 诚实公司 | Tray for semiconductors |
| JP2004342834A (en) * | 2003-05-15 | 2004-12-02 | Seiko Epson Corp | Substrate placing tray |
| CN1826185A (en) * | 2003-07-18 | 2006-08-30 | 菲尼萨公司 | Edge bead control method and apparatus |
| TW200622027A (en) * | 2004-12-27 | 2006-07-01 | Steady Design Ltd | Epitaxial equipment and susceptor |
| JP2009141384A (en) * | 2009-03-05 | 2009-06-25 | Oki Semiconductor Co Ltd | Method for cleaning wafer mounting base |
| CN201623015U (en) * | 2010-04-06 | 2010-11-03 | 河南鸿昌电子有限公司 | Mold easy to place crystal blocks |
| CN202911297U (en) * | 2012-08-04 | 2013-05-01 | 江苏吉星新材料有限公司 | Positioning die for wafer marking |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130109 |