CN102842398B - A kind of preparation method of chip Ceramic sensible devices and corresponding product thereof - Google Patents
A kind of preparation method of chip Ceramic sensible devices and corresponding product thereof Download PDFInfo
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- CN102842398B CN102842398B CN201210307903.5A CN201210307903A CN102842398B CN 102842398 B CN102842398 B CN 102842398B CN 201210307903 A CN201210307903 A CN 201210307903A CN 102842398 B CN102842398 B CN 102842398B
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Abstract
The invention discloses preparation method of a kind of chip Ceramic sensible devices and products thereof, the method comprises: in potsherd upper and lower surface respectively successively processing metal conductive layer, transition zone and easily layer to form upper/lower electrode, and be cut into multiple senser main body; Substrate is processed to form multiple rectangular area being respectively used to place single senser main body; First and second electrodes are set respectively in each rectangular area, and two electrodes are all towards the parallel extraction in phase the same side of rectangular area belonging to them; Each senser main body is arranged on the first electrode, and its top electrode is connected with the second electrode; Sealed envelope senser main body and connection wire thereof, and respectively the first and second electrodes are drawn by drawing wire, obtain senser finished product thus.By the present invention, non-ohmic contact when adopting silver electrode can be eliminated, draw wire parallel extraction without the need to bending, and it is low and be convenient to the product of standardized production to obtain good conductivity, cost.
Description
Technical field
The invention belongs to sensing measurement technical field, more specifically, relate to a kind of preparation method and corresponding product thereof of chip Ceramic sensible devices.
Background technology
Senser refers to can experience measured variable and the components and parts responded in systems in which delicately, usually used as the part that energy direct feeling in transducer is measured.Senser, according to its Cleaning Principle, can be divided into mechanical property senser, electro permanent magnetic senser, optical senser, electrochemistry senser and microbes senser; According to the kind of its constituent material, semiconductor sensitive element, metal sensitization sensing unit, Ceramic sensible devices can be divided into, organic polymer senser, enzyme senser and microbe-sensitive element etc.In recent years, use the senser of ceramic material to get more and more, due to it possess stable performance, with low cost, be suitable for other materials compound to obtain new characteristic, and be convenient to the advantages such as flaking making, thus possess vast potential for future development.Such as, two or more metal oxide in the elements such as manganese, silicon, cobalt, nickel, iron and copper can be utilized through fully mixing, shaping, sintering process formation semiconductive ceramic, obtain the ceramic composite possessing negative temperature coefficient (Negative Temperature Coefficient, is abbreviated as NTC) thermistor phenomenon thus; In addition, can be base with barium titanate and other the polycrystalline ceramics of adulterating, obtain the ceramic composite possessing positive temperature coefficient (Positive Temperature Coefficient, is abbreviated as PTC) thermistor phenomenon thus.
But, in the preparation method of current Ceramic sensible devices, normally adopt silver as electrode, and to be encapsulated by glass or single ended leads epoxy mode performs encapsulation.Although silver electrode has the advantage of good conductivity, there is the problem that material cost is high, especially silver ion easily moves and produces the defect such as non-ohmic contact, the blending of silver-colored soldering layer; Secondly, when performing glass encapsulation or single ended leads epoxy mode encapsulates, the electrode of Ceramic sensible devices draws wire needs bending, sometimes even ruptures, thus can cause adverse effect to the quality of final finished; In addition, be perform the resistance test of senser again after encapsulation finished product in the preparation method of prior art, also cannot adjust even if resistance test is defective like this, correspondingly cause that rate of finished products is low, cost raising and be unfavorable for the problems such as standardized production.
After acquisition finished product, resistance test is performed again often in prior art, also cannot adjust even if resistance test is defective like this, correspondingly cause that rate of finished products is low, cost improves and be unfavorable for the problems such as standardized production, in the present invention can be in the fabrication process, for example by modes such as laser resistor trimmings, a part is suitably cut away to the electrode layer not comprising Electrode connection part in the senser after test, the resistance value after cutting is made to reach designing requirement thus, correspondingly, rate of finished products can be improved, reduce costs, and be convenient to high efficiency operation.
According to another aspect of the present invention, additionally provide corresponding Ceramic sensible devices product.
In general, according to the preparation method and products thereof of Ceramic sensible devices of the present invention, compared with prior art, following advantage is mainly possessed:
1, by adjustment to senser electrode layer structure, can reduce costs while the measurement performance precision ensureing senser, and especially can eliminate when adopting silver electrode due to non-ohmic contact phenomenon that the migration of silver ion causes;
2, by arranging the base main body it possessing parallel extraction electrode, corresponding change can encapsulate flow process and make the electrode of senser under the state being substantially in a plane, outside can be led to by parallel wire, correspondingly, the wire in conventional machining can be avoided to bend even phenomenon of rupture, and be conducive to the quality improving finished product;
3, according to encapsulation step of the present invention, resistance adjustment can be performed to senser in process of production, which thereby enhance rate of finished products, reduce costs, and convenient operation;
4, high according to preparation method's mechanization of the present invention, automaticity, be suitable for large batch of standardized production, and the strong product of good conductivity, thermal matching energy and adhesion can be obtained.
Summary of the invention
For above defect and the technical need of prior art, the object of the present invention is to provide a kind of preparation method and corresponding product thereof of Ceramic sensible devices, upper wherein by Ceramic sensible devices, the aspect such as lower electrode arrangement and packaged type thereof adjusts, non-ohmic contact phenomenon when adopting silver electrode should be able to be eliminated mutually, and the parallel extraction of extraction wire of senser electrode is without the need to bending, and resistance test and the adjustment of senser can be performed before encapsulation, good conductivity can be obtained thus, thermal matching can and adhesion strong, and cost is lower and be convenient to the senser product of standardized production.
According to one aspect of the present invention, provide a kind of preparation method of chip Ceramic sensible devices, this preparation method comprises the following steps:
The preparation process of (a) senser main body:
The difference easy layer of processing metal conductive layer, intermediate metal and metal successively in the upper and lower surface of flaky pottery material, form the senser entire body structure with upper and lower electrode thus, be then cut into multiple senser main body being of a size of unified specification;
The preparation process of (b) senser substrate:
Select Al
2o
3ceramic wafer or printed circuit board (PCB) are as the substrate of Ceramic sensible devices, and process multiple cutting on the substrate, thus whole substrate is divided into multiple rectangular area, wherein each rectangular area is respectively used to be placed through each senser main body that step (a) obtains;
(c) overall package step, this step specifically comprises following sub-step:
(c1) senser substrate each described in the first electrode and the second electrode that are spaced are set respectively in rectangular area, and the first and second electrodes are all towards the parallel extraction in phase the same side of rectangular area belonging to them;
(c2) each senser main body is arranged on the first electrode in senser substrate rectangular area described in each, and by being welded to connect wire, the top electrode of senser main body is connected with the second electrode in this rectangular area;
(c3) by gluing process, each senser main body and connection wire thereof are given sealed envelope, then cut line by line according to the described grooving of senser substrate, and the extraction wire be parallel to each other by welding two after dicing respectively by the every row of senser substrate each described in the first and second electrodes in region drawn;
(c4) by the port sealing of gluing process by described extraction wire, and then according to senser substrate described grooving and along row direction cut one by one, obtain single Ceramic sensible devices finished product thus.
By above design, silver electrode layer of the prior art is replaced by the electrode adopting three-layer metal layer jointly to form, can reduce costs while the measurement performance precision ensureing senser, and especially can eliminate when adopting silver electrode due to non-ohmic contact phenomenon that the migration of silver ion causes; By arranging for senser main body the substrate possessing two parallel extraction electrodes, first the upper/lower electrode of senser main body can be drawn out on two electrodes on substrate respectively, then under the state being substantially in a plane, outside can be led to by parallel wire, correspondingly, the wire in conventional machining can be avoided to bend even phenomenon of rupture, and be conducive to the quality improving finished product; In addition, by processing cutting to form the region of multiple accommodation senser main body on substrate, being convenient to large batch of standardization like this and generating, and can working (machining) efficiency be improved.
As further preferably, described flaky pottery material is NTC or PTC pottery, and the easy layer of metal conducting layer, intermediate metal and metal that its upper and lower surface is processed respectively is followed successively by layers of copper, nickel dam and tin layers.
By the above concrete restriction to flaky pottery material and metal level thereof, more test and practice show, the layers of copper as metal conducting layer can form good conductivity with NTC or PTC pottery, possesses stronger adhesion simultaneously; Nickel dam as transition zone effectively can avoid the disengaging that may cause because coefficient of thermal expansion is different between layers of copper from tin layers; In addition, the tin layers as easy layer can be convenient to process the wire that welding is for example silver-colored line above.
As further preferably, the specification of described senser main body is: long × wide in the scope of 0.2mm × 0.2mm to 1.0mm × 1.0mm, and height is in the scope of 0.2mm to 0.4mm; On senser substrate, described in each, the specification in region is: long × wide in the scope of 0.5mm × 0.5mm to 2.0mm × 2.0mm, thickness is in the scope of 0.5mm to 1.0mm.
As further preferably, described first electrode is interconnected by two rectangles and forms and at junction form right angle, described second electrode is rectangular, and the second electrode is in the inner side of the first electrode institute form right angle.
By setting two electrodes of above given shape on senser substrate, being convenient to so on the one hand for example mount senser main body by some glue mode on the first electrode, and the compactedness of design can be improved; Can be convenient to by welding lead extraction electrode in follow-up encapsulation operation on the other hand, to avoid drawing wire, bending or fracture occur.
As further preferably, after step (c2), resistance detection can also be performed to completing each senser after Electrode connection, and corresponding controller resistance value.
Accompanying drawing explanation
Fig. 1 has been processed with more metal layers according to of the present invention and be cut into the overall structure schematic diagram of the senser main body of multiple unified specification;
Fig. 2 is for holding the board structure schematic diagram of senser main body according to the present invention;
Fig. 3 is the structural representation of the senser substrate after being provided with the first and second electrodes;
Fig. 4 has been the structural representation between senser main body and substrate after Electrode connection;
Fig. 5 a is to the structural representation after senser main body adjusting resistance according to one embodiment of the invention;
Fig. 5 b is to the structural representation after senser main body adjusting resistance according to another embodiment of the present invention;
Fig. 6 completes senser main body according to the present invention and connects the structural representation after the sealed envelope between wire.
Fig. 7 be achieved in accordance with the invention by welding two parallel wires electrode is drawn after structural representation;
Fig. 8 be according to the present invention will draw wire port sealing and perform cutting obtain the structural representation of single finished product;
Fig. 9 be single senser is put into container sealed after structural representation.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Fig. 1 ~ 8 show the different structure schematic diagram according to obtaining in preparation method's process of the present invention.As shown in fig. 1, first, the preparation process of senser main body is performed.For NTC ceramic, can larger sheet cut into (such as, the rectangle of φ 50mm disc or 50mm × 50mm) NTC ceramic upper and lower surface on, such as respectively first layer metal conductive layer to be attached on NTC ceramic sheet by modes such as printing, evaporation, sputterings.In the present embodiment, the metal conducting layer adopted is layers of copper, and sputtering thickness is 1 micron.Then, on this ground floor, the same modes such as printing, evaporation, sputtering of passing through adhere to second layer metal transition zone and the easy layer of third layer metal successively.In the present embodiment, the intermediate metal adopted is nickel dam, and its sputtering thickness is 2 microns; The easy layer of the metal adopted is tin layers, and its sputtering thickness is 1 micron, thereby is achieved and respectively comprises three-layer metal layer up and down, and the senser entire body structure of the upper and lower electrode layer of corresponding formation.Finally, by multiple for this overall structure senser main body being of a size of unified specification, structure as shown in Figure 1 is formed thus.In the present embodiment, the specification of senser main body can be set as: long × wide in the scope of 0.2mm × 0.2mm to 1.0mm × 1.0mm, and height is in the scope of 0.2mm to 0.4mm.
As shown in Figure 2, Al can be selected
2o
3ceramic wafer or printed circuit board (PCB) are as the substrate of Ceramic sensible devices, and process multiple cutting on the substrate, thus whole substrate is divided into multiple rectangular area, wherein each rectangular area is respectively used to each senser main body that placement preceding processes obtains.A size merchandiser senser main body of senser substrate is correlated with, in the present embodiment, on senser substrate, the specification of the rectangular area that each is formed by cutting is: long × wide in the scope of 0.5mm × 0.5mm to 2.0mm × 2.0mm, thickness is in the scope of 0.5mm to 1.0mm.
As shown in Figure 3, can for example by gluing process in each rectangular area of senser substrate, the first electrode and the second electrode that are spaced are set respectively, and the first and second electrodes are all towards the parallel extraction in phase the same side of rectangular area belonging to them.In a preferred embodiment, as shown in Figure 3, wherein the first electrode is interconnected by two rectangles and forms and at junction form right angle, described second electrode is rectangular, and the second electrode is in the inner side of the first electrode institute form right angle.Like this, be convenient on the one hand for example mount senser main body by some glue mode on the first electrode, and the compactedness of design can be improved; Can be convenient to by welding lead extraction electrode in follow-up encapsulation operation on the other hand, to avoid drawing wire, bending or fracture occur.
As shown in Figure 4, after the first and second electrodes are arranged to each rectangular area, then each senser main body is arranged on the first electrode in each rectangular area of senser substrate, and by being welded to connect wire, the top electrode of senser main body is connected with the second electrode in this rectangular area.Like this, first the upper/lower electrode of senser main body can be drawn out on two electrodes on substrate respectively.
As shown in Figure 5, in the manufacture process of senser, resistance detection can be performed to unit according to the present invention, and the adjustment of corresponding execution resistance.Such as, the resistance of probe test unit can be adopted at 25 DEG C, and for example by laser resistor trimming mode, suitably a part is cut away to the electrode layer not comprising Electrode connection part in the senser after test, make the resistance value after cutting to reach designing requirement thus.Its concrete adjustment mode is multiple, can be cut resistance trimming as illustrated in fig. 5 a along the direction of triangle oblique line, also can give resistance trimming along the position of rectangle as illustrated in fig. 5b.After execution adjustment, sent to 50 DEG C of constant temperature field, adopt probe to measure each unit resistance, and automatic computing element B value (also namely obtaining tangent line efficiency value relative to resistance v. temperature change curve).To standard resistance or the rear resistance still non-compliant unit of adjustment cannot be adjusted to individually, then make sphere shaped markup, point out it to be waste product.
As in Fig. 6 and as shown in Fig. 7, for example by gluing process, each senser main body and connection wire thereof can be given sealed envelope, then cut line by line according to the described grooving of senser substrate, and the extraction wire be parallel to each other by welding two after dicing respectively by the every row of senser substrate each described in the first and second electrodes in region drawn.Like this, electrode can lead to outside by parallel wire under the state being substantially in a plane, correspondingly, the wire in conventional machining can be avoided to bend even phenomenon of rupture, and is conducive to the quality improving finished product.In addition, by processing the mode of cutting on substrate, being convenient to large batch of standardization and generating, and can working (machining) efficiency be improved.
Fig. 8 be according to the present invention will draw wire port sealing and perform cutting obtain the structural representation of single finished product.As shown in Figure 8, for example can will draw the port sealing of wire by gluing process, and then according to the described grooving of senser substrate and the direction along row cut one by one, obtain single Ceramic sensible devices finished product thus.In addition, obtained single finished product can also be placed on such as test tube container in sealed, this test tube size and senser size match, and element can just be put in test tube, play automatic positioning action.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a preparation method for chip Ceramic sensible devices, is characterized in that, this preparation method comprises the following steps:
The preparation process of (a) senser main body:
The difference easy layer of processing metal conductive layer, intermediate metal and metal successively in the upper and lower surface of flaky pottery material, form the senser entire body structure with upper and lower electrode thus, be then cut into multiple senser main body being of a size of unified specification;
The preparation process of (b) senser substrate:
Select Al
2o
3ceramic wafer or printed circuit board (PCB) are as the substrate of Ceramic sensible devices, and process multiple cutting on the substrate, thus whole substrate is divided into multiple rectangular area, wherein each rectangular area is respectively used to be placed through each senser main body that step (a) obtains;
(c) overall package step, this step specifically comprises following sub-step:
(c1) senser substrate each described in rectangular area, the first electrode and the second electrode that are spaced are set respectively, and this first and second electrode is all towards the parallel extraction in phase the same side of rectangular area belonging to them;
(c2) each senser main body is arranged on described first electrode in senser substrate rectangular area described in each, and by being welded to connect wire, the described top electrode of each senser main body is connected with described second electrode in this rectangular area, make the described upper and lower electrode of each senser main body be drawn out on described second electrode and the first electrode respectively thus;
(c3) by gluing process, each senser main body and connection wire thereof are given sealed envelope, then cut line by line according to the described cutting of senser substrate, and the extraction wire be parallel to each other by welding two after dicing respectively by the every row of senser substrate each described in the first and second electrodes in rectangular area drawn; In this way, described first electrode and the second electrode are able to lead to outside by parallel wire being under conplane state, correspondingly avoid wire bending in the course of processing or phenomenon of rupture;
(c4) by the port sealing of gluing process by described extraction wire, and then according to senser substrate described cutting and along row direction cut one by one, obtain single Ceramic sensible devices finished product thus.
2. preparation method as claimed in claim 1, it is characterized in that, described flaky pottery material is NTC ceramic or PTC pottery, and the easy layer of described metal conducting layer, intermediate metal and metal that its upper and lower surface is processed respectively is followed successively by layers of copper, nickel dam and tin layers.
3. preparation method as claimed in claim 1 or 2, it is characterized in that, the specification of described senser main body is: long × wide in the scope of 0.2mm × 0.2mm to 1.0mm × 1.0mm, and height is in the scope of 0.2mm to 0.4mm; On senser substrate, described in each, the specification of rectangular area is: long × wide in the scope of 0.5mm × 0.5mm to 2.0mm × 2.0mm, thickness is in the scope of 0.5mm to 1.0mm.
4. preparation method as claimed in claim 1, is characterized in that, described first electrode is interconnected by two rectangles and forms and at junction form right angle; Described second electrode is rectangular, and this second electrode is in the inner side of described first electrode institute form right angle; In this way, be not only convenient to mount senser main body by some glue mode on the first electrode, improve property compact to design, and be convenient in encapsulation operation, carry out extraction electrode by welding described extraction wire follow-up, avoid drawing wire and bending or fracture occur.
5. preparation method as claimed in claim 4, it is characterized in that, after step (c2), also perform resistance detection to completing each senser after Electrode connection, and by a part of to the electrode layer cutting not comprising Electrode connection part in the senser after detection, its resistance value of corresponding adjustment.
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| CN103310926B (en) * | 2013-06-08 | 2015-11-18 | 好利来（中国）电子科技股份有限公司 | Microminiature surface attaching type overcurrent overtemperature protection system and preparation method thereof |
| CN103698035B (en) * | 2013-12-05 | 2015-12-02 | 宁波工程学院 | The preparation technology of the single arm structure of thermoelectric semiconductor temperature sensing sheet |
| DE102015107322A1 (en) * | 2015-05-11 | 2016-11-17 | Borgwarner Ludwigsburg Gmbh | Heating resistor and method for producing a heating resistor |
| CN108109791A (en) * | 2017-12-20 | 2018-06-01 | 广东爱晟电子科技有限公司 | A kind of surface-adhered type thermal-sensitive electric resistance device and preparation method thereof |
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