CN102822729A - 显示装置的制造方法 - Google Patents
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Abstract
本发明提供一种在不使用溅射法的情况下在玻璃基板设置导电膜的显示装置的制造方法。所述制造方法包括:化学研磨工序,使显示装置用玻璃基板表面与浸蚀液接触,由此将玻璃表面的算术平均粗糙度Ra设在0.7nm-70nm的范围;成膜工序,对化学研磨工序后的玻璃表面涂布导电性聚合物,形成400-1200Ω/sq的导电膜;将成膜工序后的玻璃基板的全光线透过率设成板厚0.5mm的玻璃基板的全光线透过率的87%以上。
Description
技术领域
本发明涉及一种在玻璃基板的表面设有透光性导电膜的显示装置的制造方法。
背景技术
液晶显示装置通过在由一对玻璃基板构成的贴合玻璃基板之间封入液晶来构成。公知的有如下结构:若玻璃基板带静电,则对液晶的显示动作带来不良影响,因此通过在玻璃基板的表面设置导电膜来防止带电(例如,专利文献1)。
在此,作为导电膜一般使用氧化铟锡(ITO:Indium Tin Oxide),透明电极通过溅射法(sputtering)成膜。
现有技术文献
专利文献
专利文献1:特开平8-241626
发明内容
发明要解决的课题
但是,不仅构成ITO的铟是稀有金属,而且只要采用溅射法,就会具有使目标材料(ITO)产生不少废料的问题。
在此,对于向使用者露出的露出侧玻璃基板表面的带电防止膜,并不要求像透明电极那么低的电阻率,只要能够发挥防止带电的导电性就足够了。
本发明是鉴于上述问题而提出的,其目的在于提供一种在不使用溅射法的情况下在玻璃基板设置导电膜的显示装置的制造方法。
解决课题的方法
为了达到上述目的,本发明的显示装置的制造方法,其特征在于,所述制造方法包括:化学研磨工序,使显示装置用玻璃基板表面与浸蚀液接触,由此将玻璃表面的算术平均粗糙度Ra设在0.7nm-70nm的范围;成膜工序,对化学研磨工序后的玻璃表面涂布导电性聚合物,形成400-1200Ω/sq的导电膜;当玻璃基板的板厚为0.5mm时,使成膜工序后的玻璃基板的全光线透过率在87%以上。
在本发明的化学研磨工序中,将玻璃表面的算术平均粗糙度Ra设为0.7nm-70nm,因此能实现与导电性聚合物之间的可靠的粘着性。与此相比,若Ra<0.7nm使玻璃表面过于平坦,则导电性聚合物的导电膜粘着性变差,在密合实验中产生容易被乙醇等剥落的缺点。另一方面,若Ra>70nm使玻璃表面过于粗糙,则无法作为显示装置维持清晰的显示特性。
另外,在本发明的成膜工序中,在玻璃表面涂布导电性聚合物形成400-1200Ω/sq的导电膜。其中,电阻率不是体积电阻率(VolumeResistivity:Ω·cm)而是每单位面积(cm2)的表面电阻率(SurfaceResistivity:Ω/sq)=体积电阻率/膜厚。在液晶显示装置等的透明电极的情形下,要求5-40Ω/sq左右的表面电阻值,但在防止带电的用途方面,即使是400-1200Ω/sq也是充分的。但优选成膜工序后的玻璃基板的表面电阻率设定在1000Ω/sq以下。
在本发明中,优选地,当玻璃基板的板厚为0.5mm时,成膜工序后的玻璃基板的HAZE率小于1.5%。其中,HAZE率意味着扩散透射率/全光线透过率×100,并以JIS K7136为基准特别规定的值。
一般,导电膜的膜厚越厚,则表面电阻率就越低从而导电性提高,但相反地,会使HAZE增加而透明性降低。因此,考虑这一点,优选将导电性聚合物的膜厚设为100nm-250nm。
本发明的玻璃基板优选由无碱玻璃构成,但更优选由铝硅酸盐玻璃构成。另外,作为导电性聚合物最好使用聚乙炔,聚噻吩类等,但更优选的是应当使用聚噻吩基导电性聚合物。
对于本发明的浸蚀液而言,只要能使玻璃表面变得适当粗糙便可,并不特别限制,但优选含有0.5-3重量%的氢氟酸、0-10重量%的盐酸、0-5重量%的硫酸而构成。
此外,本发明的显示装置优选为液晶显示装置,导电性聚合物成膜在贴合玻璃基板的露出侧的表面。
发明的效果
根据上述说明的本发明,在不使用溅射法的情况下能够在玻璃基板形成导电膜,并能廉价地成膜带电防止膜。
具体实施方式
下面对实施例进行说明,但本发明并非限定于此。
<供试玻璃>
准备了多张100mm×100mm×0.6mm的铝硅酸盐玻璃的玻璃板。
<操作顺序>
(1)对各玻璃板进行水洗,用浸蚀液进行化学研磨。此外,作为浸蚀液准备了各种组分并适当变更了研磨时间。
(2)对各玻璃板进行水洗之后,浸渍在IPA(iso-Propyl alcohol:异丙醇)中进行置换处理,并用干燥机干燥。
(3)在玻璃板的表面涂布作为聚噻吩基导电性聚合物的导电性高分子涂料(SEPLEGYDA,信越聚合制)。使用No6、No8、No10号线的刮棒涂布机,生成了以120nm、160nm、200nm左右的膜厚涂布的三组玻璃板。
(4)涂布导电性聚合物后的干燥是在干燥炉中在150℃下实行了10分钟。
<结果评价>
(1)密合实验
对干燥好的玻璃板使用透明胶(cellophane tape)实施剥离实验,并验证了各玻璃板的密合性和化学研磨后的算术平均粗糙度Ra的关系。
其结果,证实了只要算术平均粗糙度Ra=0.7nm-70nm左右,就能维持玻璃和导电膜之间的密合性。
此外,若浸蚀液的组分和研磨时间有变化,则化学研磨后的玻璃板的算术平均粗糙度Ra也产生变化,一般研磨时间越长,还有氢氟酸浓度越浓,则算术平均粗糙度Ra就越大。
因此,在考虑上述倾向和操作性时,发现:使用由0.5-3重量%的氢氟酸、0-10重量%的盐酸、0-5重量%的硫酸构成且剩余的由水构成的浸蚀液的、几分钟(1-2分钟)的化学研磨工序中,将玻璃表面以5μm(单面2.5μm)左右浸蚀是优选的。
(2)光学特性
因此,对经过以上述条件设定的化学研磨工序的三组玻璃板,测量全光线透过率、表面电阻率以及HAZE率,其结果如下。其中,使用分光色差计SD-5000(日本电色工业)并以JIS K7361-1为基准对透过率进行了测量。另外,使用浊度计NDH5000(日本电色工业)并以JIS K7136为基准对HAZE率进行了测量。使用电阻率计(ロレスタ)MCP-T250(三菱化学)以JIS K7194为基准对表面电阻进行了测量。
[表1]
第一组(No6) | 第二组(No8) | 第三组(No10) | |
透过率(平均值) | 88.5% | 88.2% | 87.0% |
电阻率 | 800-1100 | 600-800 | 400-600 |
HAZE率 | 0.86-1.08 | 0.96-1.02 | 1.1-1.5 |
Claims (7)
1.一种显示装置的制造方法,其特征在于,
所述制造方法包括:
化学研磨工序,使显示装置用玻璃基板表面与浸蚀液接触,由此将玻璃表面的算术平均粗糙度Ra设在0.7nm-70nm的范围,
成膜工序,对化学研磨工序后的玻璃表面涂布导电性聚合物,形成400-1200Ω/sq的导电膜;
当玻璃基板的板厚为0.5mm时,使成膜工序后的玻璃基板的全光线透过率在87%以上。
2.权利要求1所述的制造方法,其中,当玻璃基板的板厚为0.5mm时,成膜工序后的玻璃基板的HAZE率小于1.5%。
3.权利要求1或2所述的制造方法,其中,所述导电性聚合物的膜厚为100nm-250nm。
4.权利要求1-3任一项所述的制造方法,其中,所述玻璃基板由铝硅酸盐玻璃构成。
5.权利要求1-4任一项所述的制造方法,其中,使用聚噻吩基导电性聚合物。
6.权利要求1-5任一项所述的制造方法,其中,所述浸蚀液含有0.5-3重量%的氢氟酸、0-10重量%的盐酸、0-5重量%的硫酸而构成。
7.权利要求1-6任一项所述的制造方法,其中,所述显示装置为液晶显示装置,所述导电性聚合物成膜在贴合玻璃基板的露出侧的表面。
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Application Number | Priority Date | Filing Date | Title |
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JP2010013355A JP5431186B2 (ja) | 2010-01-25 | 2010-01-25 | 表示装置の製造方法 |
JP2010-013355 | 2010-05-31 | ||
PCT/JP2011/050630 WO2011089990A1 (ja) | 2010-01-25 | 2011-01-17 | 表示装置の製造方法 |
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KR (1) | KR101401678B1 (zh) |
CN (1) | CN102822729A (zh) |
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WO (1) | WO2011089990A1 (zh) |
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WO2013021854A1 (ja) * | 2011-08-05 | 2013-02-14 | Hoya株式会社 | 携帯機器用カバーガラス及びその製造方法 |
CN108296901A (zh) | 2011-08-29 | 2018-07-20 | 旭硝子株式会社 | 玻璃板及玻璃板的制造方法 |
CN104718581B (zh) * | 2012-10-17 | 2018-04-13 | 旭硝子株式会社 | 带导电性薄膜的玻璃基板、薄膜太阳能电池、低辐射玻璃基板、带导电性薄膜的玻璃基板的制造方法 |
JP6519475B2 (ja) * | 2013-08-09 | 2019-05-29 | 日本ケミコン株式会社 | 色素増感太陽電池 |
GB201403223D0 (en) | 2014-02-24 | 2014-04-09 | Pilkington Group Ltd | Coated glazing |
JP2017071516A (ja) * | 2015-10-05 | 2017-04-13 | AvanStrate株式会社 | ガラス基板の製造方法 |
JP6910854B2 (ja) * | 2017-06-02 | 2021-07-28 | 信越ポリマー株式会社 | 導電性高分子分散液、導電性基板及びその製造方法 |
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- 2011-01-17 CN CN2011800156156A patent/CN102822729A/zh active Pending
- 2011-01-17 KR KR1020127022178A patent/KR101401678B1/ko active IP Right Grant
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JP2008300063A (ja) * | 2007-05-29 | 2008-12-11 | Shin Etsu Polymer Co Ltd | 導電性インク、透明導電層、入力デバイス及び表示デバイス |
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Also Published As
Publication number | Publication date |
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KR20120129925A (ko) | 2012-11-28 |
JP5431186B2 (ja) | 2014-03-05 |
KR101401678B1 (ko) | 2014-06-02 |
WO2011089990A1 (ja) | 2011-07-28 |
TWI576644B (zh) | 2017-04-01 |
TW201142447A (en) | 2011-12-01 |
JP2011150254A (ja) | 2011-08-04 |
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