CN102820571B - Adapter - Google Patents

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Publication number
CN102820571B
CN102820571B CN201210187684.1A CN201210187684A CN102820571B CN 102820571 B CN102820571 B CN 102820571B CN 201210187684 A CN201210187684 A CN 201210187684A CN 102820571 B CN102820571 B CN 102820571B
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China
Prior art keywords
electronic component
adapter
contact
recess
plate portion
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Active
Application number
CN201210187684.1A
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Chinese (zh)
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CN102820571A (en
Inventor
长谷川严水
木村毅
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TE Connectivity Corp
Original Assignee
Tyco Electronics Corp
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Publication date
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Publication of CN102820571A publication Critical patent/CN102820571A/en
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder preforms; Transferring prefabricated solder patterns

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The present invention relates to adapter, it is provided that possess electronic component reduce the adapter of number of components and manufacturing process although a kind of.Adapter (1) possesses and has the insulation shell (11) of plate portion (111), multiple metal strip (12) and be connected to the electronic component (14) of multiple metal strip (12).Multiple metal strips (12) are configured at mutually the plate portion (111) of insulation shell (11) abreast.Insulation shell (11) is provided with the recess (111r) keeping electronic component between multiple metal strips (12).

Description

Adapter
Technical field
The present invention relates to adapter.
Background technology
It is being connected to mate the adapter of the electronic component of side, in addition to the conductor of conducted signal or electric power, is also being built-in with electronic component, realizes positive function as circuit.
Such as, in patent documentation 1, it is shown that a kind of cable assembly, this cable assembly possesses the circuit board being provided with the component as the electronic component carrying out signal adjustment in housing, has the conductor of electric contact piece and cable at this welding circuit board.
Fig. 1 is the axonometric chart of the example showing the adapter with tellite.
Adapter 8 shown in Fig. 1 is such as to be installed on not shown circuit substrate in figure the chimeric adapter of matching connector not shown with figure.Adapter 8 possesses 82,4 substrates of 81,4 contacts of tellite and connects terminal 83 and 2 electronic components 84.At adapter 8, it is also equipped with the insulation shell worked as shell., in FIG, in order to easily watch internal structure, display removes the state of insulation shell.
Contact 82 and substrate are connected terminal 83 electricity relaying by tellite 81.Tellite 81 is formed with conductive pattern 811 on the surface of insulation board.At conductive pattern 811, it is welded with contact 82 and substrate connects terminal 83.1 of electronic component 84 is connected to 2 in 4 strip conductor patterns 811, and remaining 1 of electronic component 84 is connected to remaining 2 strip conductor patterns 811.
Adapter 8 is by being built-in with tellite 81, and this tellite 81 is equipped with electronic component 84, thus plays the function that electronic component 84 is played.
Patent documentation 1: Japanese Unexamined Patent Application Publication 2000-502494 publication.
Summary of the invention
The problem that invention is to be solved
The tellite 81 being built in adapter 8 is manufactured by the operation as the tellite being built in general electronic equipment.That is, on insulation board, form conductive pattern 811 by printing and etching, manufacture tellite 81.Subsequently, processed by such as solder reflow and electronic component 84 is soldered to conductive pattern 811.It addition, contact 82 and substrate connect terminal 83 is also welded to conductive pattern 811.Processed by solder reflow and before electronic component 84 is soldered to tellite 81, it is necessary in advance electronic component 84 is positioned on tellite 81, and it is empty fixing to utilize bonding agent etc..
It addition, as the structure in addition to the structure shown in Fig. 1, it is considered to electronic component is connected to via welding wire contact., fixing insufficient due to welding wire, thus it may be necessary the post forming (overmold) of resin and contact and electronic component are closed and fixes.Even the connection of welding wire, when using resin-blocked, in order to prevent electronic component from offseting, it is also desirable to the void that the bonding grade of electronic component is caused is fixed.
So, if being intended to possess electronic component at adapter, then, structure becomes complicated, it addition, increase the manufacture of printed base plate and the manufacturing process such as void is fixing.
The present invention solves the problems referred to above point, its object is to, it is provided that possess electronic component reduce the adapter of number of components and manufacturing process although a kind of.
Technical teaching for solving the problem was
Reach the 1st adapter in the present invention of above-mentioned purpose, possess:
Insulation shell, has plate portion;
Multiple metal strips, are configured at the plate portion of above-mentioned insulation shell the most abreast;And
Electronic component, is connected to above-mentioned multiple metal strip, wherein,
Above-mentioned insulation shell is provided with the recess keeping above-mentioned electronic component between above-mentioned multiple metal strips.
In the 1st adapter of the present invention, between multiple metal strips of insulation shell, it is provided with the recess keeping electronic component.Therefore, it is not necessary to use the printed wiring board being formed with conductive pattern.It addition, in the manufacture of adapter, as long as electronic component to be inserted the recess of insulation shell, just electronic component location void are fixed between multiple metal strip.So, structure is succinct, reduces number of components and manufacturing process.
Here, in the 1st adapter of the invention described above, it is preferable that the face of the side contrary with the face towards above-mentioned plate portion of above-mentioned multiple metal strips, form the most common face with the electronic component being held in above-mentioned recess.Here, within " face of metal strip forms the most common face with electronic component " refers to 1/2 degree of the thickness that difference is metal strip in the face of metal strip and the face of electronic component.
Metal strip and electronic component form common face, thus, in the case of metal strip and electronic component being welded, easily apply solder(ing) paste throughout metal strip and electronic component such as being processed by solder reflow.
It addition, in the 1st adapter of the invention described above, it is preferable that at above-mentioned plate portion, being formed with groove, the part being configured at this plate portion of above-mentioned multiple metal strips is embedded in this groove,
Above-mentioned multiple metal strip is configured in above-mentioned groove, forms common face with above-mentioned plate portion.
Metal strip and plate portion form common face, and thus, the coating of solder(ing) paste becomes easy further.
It addition, in the 1st adapter of the invention described above, it is preferable that at above-mentioned multiple metal strips, it is provided with the recess keeping above-mentioned electronic component in position opposite one another.
It addition, the 2nd adapter reached in the adapter of the present invention of above-mentioned purpose, possess:
Insulation shell, has plate portion;
Multiple metal strips, are configured at the plate portion of above-mentioned insulation shell abreast;And
Electronic component, is connected to above-mentioned multiple metal strip, wherein,
Above-mentioned multiple metal strip has the recess keeping above-mentioned electronic component in position opposite one another.
In the 2nd adapter of the present invention, it is not necessary that use the printed wiring board being formed with conductive pattern.It addition, in the manufacture of adapter, as long as electronic component is inserted in the way of being held in the recess of multiple metal strip, just electronic component location void are fixed between multiple metal strip.So, structure is succinct, reduces manufacturing process.
Additionally, about the 2nd adapter of the present invention, notice and only show its basic mode at this, this is intended merely to be avoided repeating, and the 2nd adapter of the present invention not only includes above-mentioned basic mode, but also includes the various modes corresponding with the 1st adapter of the present invention.
Invention effect
As described above, according to the present invention, it is achieved a kind of possess electronic component and but reduce the adapter of number of components and manufacturing process.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the example showing the adapter with tellite.
Fig. 2 is the axonometric chart of the 1st embodiment of the adapter showing the present invention.
Fig. 3 is the amplification stereogram of the adapter showing the 1st variation as the 1st embodiment.
Fig. 4 is the amplification stereogram of the adapter showing the 2nd variation as the 1st embodiment.
Fig. 5 is the axonometric chart of the 2nd embodiment of the adapter showing the present invention.
Fig. 6 is the amplification stereogram of the adapter showing the 1st variation as the 2nd embodiment.
Fig. 7 is the amplification stereogram of the adapter showing the 2nd variation as the 2nd embodiment.
Fig. 8 is the axonometric chart of the 3rd embodiment of the adapter showing the present invention.
Fig. 9 is the amplification stereogram of a part for the contact of the adapter showing the variation as the 3rd embodiment.
Figure 10 is the axonometric chart of the 4th embodiment of the adapter showing the present invention.
Figure 11 is the partial plan of the differently configured variation of the contact of the adapter that the present invention is described and electronic component.
Detailed description of the invention
Hereinafter, referring to the drawings, embodiments of the present invention are described.
[the 1st embodiment]
Fig. 2 is the axonometric chart of the 1st embodiment of the adapter showing the present invention.
Adapter 1 shown in Fig. 2 is such as soldered to not shown circuit substrate in figure, and coupling part not shown with figure is the most chimeric.Adapter 1 possesses 11,4 contacts 12 of insulation shell and 2 electronic components 14.
Insulation shell 11 is formed by the resin material of such as insulating properties, has plate portion 111.Insulation shell 11 accommodates and keeps contact 12, and, surround the entirety of the remaining parts of adapter 1, also serve as the outer casing of adapter 1 and work.But, in fig. 2, in order to easily watch internal structure, only show the plate portion 111 in insulation shell 11.Figure afterwards is also such.
4 contacts 12 are configured on the plate portion 111 of insulation shell 11 mutually abreast.The face being configured with contact 12 of plate portion 111 becomes tabular.Each of contact 12 is the metal strip extended longlyer.Contact 12 is such as formed by the metallic plate of electric conductivity is carried out punch press process and bending process, has rectangular-shaped section.Contact 12, at one end has the contact site 121 of the conductor Elastic Contact of mating part not shown with figure, has the connecting portion 122 being soldered to not shown circuit substrate in figure at the other end.Contact 12 will be electrically coupled between coupling part not shown in figure and circuit substrate.
Here, contact 12 is equivalent to an example of metal strip of the present invention.
Contact 12 abuts with plate portion 111.More specifically, 4 contacts 12 be generally parallel to each other side by side.The part in way between contact site 121 and the connecting portion 122 of contact 12 is placed on plate portion 111.Additionally, contact 12 can also be fixed on plate portion 111 by bonding grade, or, it is also possible to by the part in addition to plate portion 111 being fixed in insulation shell 11, thus indirectly fix relative to plate portion 111.
Electronic component 14 is the so-called chip element being fabricated to chip shape.Electronic component 14 e.g. has rectangular shape and is provided with the chip resister of electrode 141 at two ends.But, as the kind of electronic component 14, additionally it is possible to use other active components such as passive element or quasiconductor such as capacitor or the module being combined into by element according to purposes and the function of adapter 1.The adapter 1 of present embodiment has 2 electronic components 14, in fig. 2, constructs to easily watch the holding of electronic component 14, and display removes the state of the electronic component of a side.About later figure, also it is such.
In 2 electronic components 14 1 is connected to adjacent 2 in 4 contacts 12, remaining 1 remaining adjacent 2 being connected in 4 contacts 12.The group of the contact 12 the most corresponding with 2 electronic components 14, has the structure being mutually identical, thus the symbol in figure is marked at the side of easily viewing according to explanation.
Electronic component 14 is configured between adjacent 2 contact 12, and 2 electrodes 141 that electronic component 14 is had are respectively connecting to 2 contacts 12 by welding.
At the plate portion 111 of insulation shell 11, between 2 contacts 12, it is provided with the recess 111r keeping electronic component 14.Recess 111r has shape corresponding with the shape of electronic component 14.Here, recess 111r is rectangular-shaped.The bottom surface portions of electronic component 14 embeds recess 111r.The height of the posture being configured at plate portion 111 being of a depth approximately equal to electronic component 14 of recess 111r and the difference of the height (i.e. thickness of slab) of contact 12.
It is configured at adjacent each other 2 contact 12 therebetween at electronic component 14, is provided with recess 12r in position opposite one another.The recess 12r of contact 12 has the substantially rectangular shape of electrode 141 partial response part for contact 12 being cut into electronic component 14.The recess 12r of contact 12, in the position of the recess 111r being provided with plate portion 111, is set to continuous with the recess 111r of plate portion 111.
When electronic component 14 inserts the recess 111r of plate portion 111, the recess 12r being partially into contact 12 of the electrode 141 of electronic component 14.More specifically, the bottom surface portions of electronic component 14 enters the recess 111r of plate portion 111, the recess 12r being partially into contact 12 of the electrode 141 from the prominent part of plate portion 111 of electronic component 14.The electrode 141 of electronic component 14 contacts with contact 12, or, there is the gap of degree that melted scolding tin enters betwixt and close.
It addition, the height of electronic component 14 is substantially equal to the degree of depth of recess 111r and the sum of the thickness of slab of contact 12.Therefore, constitute such so-called altogether relation of plane: the above 12u of contact 12, the face of i.e. contrary with the face towards plate portion 111 side, form common face S with the electronic component 14 being held in recess 111r.
Electrode 141 and the contact 12 of electronic component 14 are electrically coupled by scolding tin not shown in figure.
[assemble method of adapter]
In the assembling of adapter 1, first, make and include insulation shell 11 and the contact 12 of plate portion 111.The recess 111r of plate portion 111 is formed with other partial concurrence when the molding of insulation shell 11.It addition, the recess 12r of contact 12 is also formed with other partial concurrence when punch press process.
Then, contact 12 is combined with insulation shell 11, thus, become the state that the position of contact 12 is fixed on the plate portion 111 of insulation shell 11 directly or indirectly.Now, the position consistency of the recess 111r of the position of the recess 12r of contact 12 and plate portion 111.
Then, electronic component 14 is inserted the recess 111r of plate portion 111.Electronic component 14 inserts the recess 111r of plate portion 111, and thus, location void are fixed between contact 12.
Then, the part near electrode 141 in the electrode 141 and contact 12 of electronic component 14, the scolding tin of coating paste.The above 12u of the contact 12 of the adapter 1 of present embodiment and electronic component 14 constitute so-called relation of plane altogether, thus the scolding tin of paste is applied throughout both without interruption by silk screen printing.
Then, solder reflow device the assembly being made up of plate portion 111, contact 12 and electronic component 14 is carried out heat treatment.Thus, the scolding tin of paste melts, and contact 12 and electronic component 14 are electrically coupled and are mechanically fixed against.
Then, in the way of surrounding above-mentioned assembly, insulation shell 11 is assembled.Thus, adapter 1 completes.
Here, utilizing the stage before scolding tin fixed contact therefor 12 and electronic component 14, i.e. apply the stage of the scolding tin of paste and put into the stage of solder reflow device, electronic component 14 not being fixed on contact 12., in the present embodiment, owing to electronic component 14 inserts the recess 111r of plate portion 111, thus electronic component 14 location void are fixed between contact 12.It addition, the location of electronic component 14 and void are fixing by the recess 12r enhancing of contact 12.
So, according to the adapter 1 of present embodiment, do not use such as tellite or empty fixing bonding agent.So, reduce number of components and manufacturing process.
It addition, after being welded, the recess 111r of the plate portion 111 and recess 12r of contact 12 makes the fixation of electronic component 14.Therefore, there is no need to the fixing of electronic component 14 based on such as post forming.
[the 1st variation of the 1st embodiment]
It follows that explanation is not provided with the 1st variation and the 2nd variation of the recess 12r of contact 12 relative to the 1st above-mentioned embodiment.
Fig. 3 is the amplification stereogram of the adapter showing the 1st variation as the 1st embodiment.In figure 3, in order to easily watch structure, the part having discrepant electronic component periphery in variation is cut off and amplified display.
Adapter 1A shown in Fig. 3, is not clipping electronic component 14A and adjacent 2 contact 12A arrange recess.The interval of 2 contact 12A, identical with the length of the electronic component 14A on the direction side by side of contact 12A.So, the electronic component 14A being configured between 2 contact 12A is electrically connected to this 2 contact 12A.
Adapter 1A shown in Fig. 3, is provided with the recess 111Ar as the adapter 1 shown in Fig. 1, electronic component 14A at plate portion 111A and inserts recess 111Ar.In the manufacture process of adapter 1A, electronic component 14A location void are fixed between contact 12A.
[the 2nd variation of the 1st embodiment]
Fig. 4 is the amplification stereogram of the adapter showing the 2nd variation as the 1st embodiment.A part for the periphery of the 1 of adapter electronic component is also cut off and amplifies display in the same manner as Fig. 3 by Fig. 4.
Adapter 1B shown in Fig. 4, is clipping electronic component 14B and adjacent 2 contact 12B are provided with the protuberance 12Bp prominent along direction opposite one another.The interval of 2 the contact 12B length than the electronic component 14B on the direction side by side of contact 12B is longer, and the interval of 2 protuberance 12Bp is roughly equal.So, it is configured between 2 contact 12B, more specifically, the electronic component 14B being configured between 2 protuberance 12Bp is electrically connected to this 2 contact 12A.
Adapter 1B shown in Fig. 4, is also provided with the recess 111Br as the adapter 1 shown in Fig. 1, electronic component 14B at plate portion 111B and inserts recess 111Br.In the manufacture process of adapter 1B, electronic component 14B location void are fixed between contact 12B.
[the 2nd embodiment]
Then, the 2nd embodiment of the present invention is illustrated.During 2 embodiment below explanation, to the key element labelling identical with each key element in the 1st embodiment and show identical symbol, the difference different from aforesaid embodiment is illustrated.
Fig. 5 is the axonometric chart of the 2nd embodiment of the adapter showing the present invention.
Adapter 2 shown in Fig. 5, the plate portion 211 at insulation shell 21 is provided with embedment 4 groove 211s of 4 contacts 12.4 contacts 12 are respectively arranged in groove 211s.Groove 211s as one man has, with the shape of contact 12, the shape extended with linearity.The degree of depth of groove 211s, roughly equal with the thickness of slab of the part being configured at plate portion 211 of contact 12.It addition, the width of groove 211s, roughly equal with the width of the part being configured at plate portion 211 of contact 12.
It addition, be formed at the degree of depth of the recess 211r of insulation shell 21, roughly equal with the height of electronic component 14B.
Adapter 2 shown in Fig. 5, constitutes such so-called relation of plane altogether: these 3 parts of the above 12u of contact 12, the electronic component 14 being held in recess 211r and plate portion 211 form common face S.Therefore, in the manufacture process of adapter 2, when applying the scolding tin of paste by printing, prevent the scolding tin of paste from entering the gap between contact 12 and contact 12.
[the 2nd embodiment the 1st variation]
Fig. 6 is the amplification stereogram of the adapter showing the 1st variation as the 2nd embodiment.
Recess is not set at contact 12A in the same manner as 1st variation of the 1st embodiment shown in adapter 2A with Fig. 3 shown in Fig. 6.The interval of 2 contact 12A, identical with the length of the electronic component 14A on the direction side by side of contact 12A.So, the electronic component 14A being configured between 2 contact 12A is electrically connected to this 2 contact 12A.
Adapter 2A shown in Fig. 6, in the same manner as the adapter 2 shown in Fig. 5, inserts the recess 211Ar of plate portion 211A by electronic component 14A.So, in the manufacture process of adapter 1A, electronic component 14A location void are fixed between contact 12A.It addition, contact 12A, electronic component 14A and plate portion 211A form common face, scolding tin is configured at appropriate region.
[the 2nd embodiment the 2nd variation]
Fig. 7 is the amplification stereogram of the adapter showing the 2nd variation as the 2nd embodiment.
Adapter 1B shown in Fig. 7, in the same manner as the 2nd variation of the 1st embodiment shown in Fig. 4, is clipping electronic component 14B and adjacent 2 contact 12B are provided with the protuberance 12Bp prominent along direction opposite one another.Being configured between 2 contact 12B, more specifically, the electronic component 14B being configured between 2 protuberance 12Bp is electrically connected to this 2 contact 12B.
Adapter 2B shown in Fig. 7, also in the same manner as the adapter 2 shown in Fig. 5, inserts the recess 211Br of plate portion 211B by electronic component 14B.In the manufacture process of adapter 1B, electronic component 14B location void are fixed between contact 12B.It addition, contact 12B, electronic component 14B and plate portion 211B form common face, scolding tin is configured at appropriate region.
[the 3rd embodiment]
Then, the 3rd embodiment of the present invention is illustrated.During 3 embodiment below explanation, to the key element labelling identical with each key element in the 1st embodiment and show identical symbol, the difference different from aforesaid embodiment is illustrated.
Fig. 8 is the axonometric chart of the 3rd embodiment of the adapter showing the present invention.
At the plate portion 311 of the adapter 3 shown in Fig. 8, it is not provided with the recess inserted by electronic component 14.Electronic component 14 is placed on flat plate portion 311, more prominent than the above 12u of contact 12.
The contact 12 of adapter 3, in the same manner as the situation of the adapter 1 of the 1st embodiment shown in Fig. 2, is provided with the recess 12r keeping electronic component 14.Electronic component 14 enters the recess 12r of contact 12, welds with contact 12.
In the manufacture process of adapter 3, in the stage before contact 12 and electronic component 14 are fixed by scolding tin, electronic component 14 is not secured to contact 12., in the present embodiment, electronic component 14 is held in the recess 12r of contact 12, thus electronic component 14 location void are fixed between contact 12.It addition, after being welded, the recess 12r of contact 12 makes the fixing of electronic component 14 become firm.
So, according to the adapter 3 of present embodiment, do not use such as empty fixing bonding agent.
[variation of the 3rd embodiment]
Fig. 9 is the amplification stereogram of a part for the contact of the adapter showing the variation as the 3rd embodiment.
The outline shape of the recess 12Ar of the contact 12A shown in Fig. 9 is consistent, for rectangular-shaped with the shape of the part of the electrode 141 (with reference to Fig. 8) of electronic component 14.More specifically, recess 12Ar has and is formed at the protuberance J on 3 limits in addition to the edge of contact 12A and is surrounded and the depressed part K lower than protuberance J by the protuberance J on 3 limits.Protuberance J is the ridge extended along 3 limits.The recess 12Ar being made up of protuberance J and depressed part K, it is also possible in the same manner as the recess 12r of the contact 12 shown in Fig. 8, keeps electronic component 14.
[the 4th embodiment]
Then, the 4th embodiment of the present invention is illustrated.During 4 embodiment below explanation, to the key element labelling identical with each key element in the 3rd embodiment hereto illustrated and show identical symbol, the difference different from the 3rd embodiment is illustrated.
Figure 10 is the axonometric chart of the 4th embodiment of the adapter showing the present invention.
The contact 12 of the adapter 4 shown in Figure 10, in the way of the part being configured on plate portion 311, is provided with bending and floats portion 42f from what plate portion 311 left.The recess 42r keeping electronic component 14 of contact 42 is located at and floats portion 42f.Contact 42 float portion 42f, floating the above 44w of portion 42f and the electronic component 14 being placed in plate portion 311 with this becomes the degree of identical height and leaves from plate portion 311.The shape of the recess 42r of contact 42, as the recess 12r of the adapter 3 of the 3rd embodiment.Therefore, constitute such so-called altogether relation of plane: the above 12w floating portion 42f of contact 42, the face of i.e. contrary with the face towards plate portion 311 side, form common face S2 with electronic component 14.
In the manufacture process of adapter 4, electronic component 14 is held in the recess 12r of contact 12, thus electronic component 14 location void are fixed between contact 12.It addition, apply the scolding tin of paste throughout electrode 141 and the floating portion 42f of contact 12 of the fixing electronic component 14 of void and heat.In adapter 4 in the present embodiment, the above 12w floating portion 42f of contact 12 and electronic component 14 constitute so-called relation of plane altogether, apply the scolding tin of paste without interruption throughout both thereby through printing.
Additionally, in the above-described embodiment, as the example of adapter of the present invention, display has 4 contacts (metal strip) and the adapter of 2 electronic components.But, the adapter in the present invention is not limited to this, for example, it is also possible to have the multiple metal strips in addition to 4 and the electronic component of the quantity beyond 2.
It addition, in the above-described embodiment, as the example of adapter of the present invention, the structure being configured with electronic component between 4 contacts adjacent 2 contact the most side by side and wherein is shown.But, metal strip and the configuration of electronic component in the present invention are not limited to this.
Figure 11 be illustrate the present invention adapter about contact and the partial plan of the variation of the configuration of electronic component.
Adapter 5 shown in Figure 11 possesses the contact 52 that mate feature contacts not shown with figure and is soldered to the connection terminal 53 of not shown circuit substrate in figure.Here, each of contact 52 and connection terminal 53 is equivalent to an example of the multiple metal strips in the present invention.Contact 52 and connection terminal 53, on plate portion 511, each along the direction extended side by side on straight line.At plate portion 511, being provided with recess 511r between contact 52 and connection terminal 53, electronic component 14 is held in recess 511r.The metal strip of the adapter of the present invention can also be the metal strip of the such as configuration shown in Figure 11.
It addition, in the above-described embodiment, as the example of electronic component of the present invention, display has the electronic component 14 of 2 electrodes 141.But, the electronic component in the present invention is not limited to this, for example, it is also possible to have the electrode of more than 3.It addition, the shape of electronic component is also not necessarily limited to rectangular shape, for example, it is also possible to be cylindrical shape, taper or taper type.
It addition, in the above-described embodiment, as metal strip of the present invention and the example of electronic component, the contact of display welding and electronic component.But, metal strip and electronic component in the present invention are not limited to welding, it is also possible to connected by wire bond or conductive adhesive.
It addition, in the above-described embodiment, as the example of adapter of the present invention, such as, the adapter the most chimeric with coupling part is shown.But, the adapter in the present invention is not limited to this, for example, it is also possible to be coupled to the socket of IC.
Furthermore, the above of the above and electronic component of contact not necessarily must become common relation of plane, such as, as long as within 1/2 degree of the thickness of slab that above difference is contact of the above and electronic component of contact.
Symbol description
1,1A, 1B, 2,3,4,5 adapter
11,21 insulation shell
111,111A, 111B, 211,211A, 211B, 311,511 plate portion
111r, 111Ar, 111Br, 211r, 211Ar, 211Br, 511r recess
12,12A, 12B, 42,52 contact
12r, 12Ar, 42r recess
14,14A, 14B electronic component
53 connect terminal
The face that S, S2 are common.

Claims (4)

1. an adapter, possesses:
Insulation shell, has plate portion;
Multiple metal strips, are configured at the plate portion of described insulation shell the most abreast;And
Electronic component, is connected to the plurality of metal strip,
Wherein,
Described insulation shell is provided with the first recess keeping described electronic component between the plurality of metal strip,
At the plurality of metal strip, position opposite one another and with described first recess continuous print position, be provided with direction opposite one another and jointly keep the second recess of described electronic component with this first recess.
Adapter the most according to claim 1, it is characterised in that
The face of the side contrary with the face towards described plate portion of the plurality of metal strip, forms the most common face with the electronic component being held in described first recess and the second recess.
Adapter the most according to claim 1 and 2, it is characterised in that
At described plate portion, being formed with groove, the part being configured at this plate portion of the plurality of metal strip is embedded in this groove,
The plurality of metal strip is configured in described groove, forms common face with described plate portion.
4. an adapter, possesses:
Insulation shell, has plate portion;
Multiple metal strips, are configured at the plate portion of described insulation shell abreast;And
Electronic component, is connected to the plurality of metal strip,
Wherein,
The plurality of metal strip has in position opposite one another towards direction opposite one another and the recess that keeps described electronic component.
CN201210187684.1A 2011-06-08 2012-06-08 Adapter Active CN102820571B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-128158 2011-06-08
JP2011128158A JP5693387B2 (en) 2011-06-08 2011-06-08 connector

Publications (2)

Publication Number Publication Date
CN102820571A CN102820571A (en) 2012-12-12
CN102820571B true CN102820571B (en) 2016-08-03

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JP2016091992A (en) * 2014-10-30 2016-05-23 株式会社テージーケー Terminal unit, motor actuator and terminal holder

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CN2349703Y (en) * 1998-10-09 1999-11-17 元硕股份有限公司 Improved structure for GSM subscriber identifying chip card connector
JP2000243518A (en) * 1999-02-22 2000-09-08 Shizuki Electric Co Inc Electric part
CN2417576Y (en) * 2000-03-16 2001-01-31 富士康(昆山)电脑接插件有限公司 Electronic card connector

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JP5693387B2 (en) 2015-04-01
KR20120136286A (en) 2012-12-18
CN102820571A (en) 2012-12-12
JP2012256476A (en) 2012-12-27

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