CN102787332B - Method for electroforming pasting board of silver spraying board - Google Patents
Method for electroforming pasting board of silver spraying board Download PDFInfo
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- CN102787332B CN102787332B CN201210293537.2A CN201210293537A CN102787332B CN 102787332 B CN102787332 B CN 102787332B CN 201210293537 A CN201210293537 A CN 201210293537A CN 102787332 B CN102787332 B CN 102787332B
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- plate
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- hanger
- board
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Abstract
The invention relates to an electroforming process of the holographic anti-counterfeiting printing industry, in particular to a method for electroforming a pasting board of a silver spraying board. The invention provides the method for electroforming the pasting board of the silver spraying board, which is capable of reducing resistance, improving conductivity, reducing inner stress in an electroforming process, improving the success ratio of electroforming the silver board and improving the yield of the silver spraying product. A base material PC (polycarbonate) board is arranged at a center part of a rectangular board hanger; vacant board surfaces are left between the periphery of the base material PC board and the brims of the hanger; the vacant board surface at any one of the left sides and right sides of the hanger and the base material PC board is preserved; insulating tapes are respectively pasted on the other part of the hanger and the other side of the base material PC board and between the upper and lower vacant board surfaces for carrying out sealing; the surface of the hanger, with the base material PC board, is subjected to complete silver spraying, and is conducted by a silver layer; the hanger with the base material PC board is completely soaked into an electrotyping solution of an electrotyping tank to be electroformed, so that the resistance is reduced, the conductivity is improved, the inner stress in the electroforming process is reduced, and the success ratio of electroforming the silver board is improved; the operation step is optimized, and the operation time is shortened; and conductive silver paste is not used, and the dosage of the conductive tape is reduced.
Description
Technical field
The present invention relates to a kind of electroforming process of holographic false proof printing industry, particularly a kind of method of spraying the electroforming of silver plate pasting board.
Background technology
China's tobacco bale printing industry content that possesses skills is high, the feature of complex process, in existing holographic false proof trans-printing production process, adopts directly spray silver on base material PC plate; Use hair dryer dries up; The conductive tape using 20mm wide is at base material surrounding pros and cons bound edge; The base material PC plate insulation tape posted with conductive resin is pasted onto on electroforming metal hanger fixing; Again paste base material PC plate surrounding with conductive tape to be connected with hanger and in order to seal the vacant plate face of hanger; Conductive silver paste is coated at the position be connected with conductive tape at base material, and its conduction is what to be realized by the conductive tape of edge surrounding, sticks high-temperature insulation adhesive tape in the outside surrounding at conductive resin bandwidth 1/2nd place, only retains the base material conduction after spray silver; Lower cylinder electroforming; when electroforming, because electric conductivity is low, resistance ratio is larger; current anomaly or excessive; electroforming apparatus is generated heat serious, load strengthens, and in electroforming process, the internal stress of nickel plate strengthens; namely the larger internal stress of resistance is higher; be very easy to cause silver plate to be scrapped, the problem of the electroforming apparatus heating that causes the product qualified rate of spraying silver plate to reduce, how improve conforming product rate by some technical measures, solves is engineering technical personnel's problems anxious to be resolved.
Summary of the invention
The object of the invention is the defect being to overcome the existence of above-mentioned prior art, there is provided a kind of and reduce resistance, improve electric conductivity, reduce the internal stress in electroforming process, improve silver plate electroforming success ratio, improve a kind of method of spraying the electroforming of silver plate pasting board of the silver-colored product qualified rate of spray.
The object of the invention is to have come by the following technical programs:
A kind of method of spraying the electroforming of silver plate pasting board of the present invention, wherein: its concrete steps are:
The first step: base material PC plate is placed in rectangular plate type hanger central part, has vacant plate face more than between described base material PC plate surrounding and described hanger edge;
Second step: retain the vacant plate face, left and right between described hanger and described base material PC plate, the height in vacant plate face, described left and right is equal with base material PC plate height, insulation tape is sticked in the upper and lower vacant plate face between all the other hangers and base material PC plate and seals;
3rd step: with the described hanger surface integral spray silver of described base material PC plate, after spray silver, electroforming is conducted electricity by silver layer, changes the mode of conduction;
4th step: with electroforming in the electroforming solution of the described hanger entirety intrusion electrotyping bath of described base material PC plate.
The method of spray silver plate pasting board of the present invention electroforming, wherein: described second step replaces with: only retain the vacant plate face, any side, left and right between described hanger and described base material PC plate, the height in vacant plate face, any side, described left and right is equal with base material PC plate height, sticks insulation tape and seal between all the other hangers and base material PC plate opposite side and upper and lower vacant plate face;
The method of spray silver plate pasting board of the present invention electroforming, wherein: about being retained in base material PC plate, the facial position of the vacant plate of described hanger of any side is reserved and a vertical narrow vacant plate face is set, be referred to as: vertical gap, the height in described vertical gap is equal with base material PC plate height, and vacant portion faces described in all the other of described hanger all sticks insulation tape sealing.
The method of spray silver plate pasting board of the present invention electroforming, wherein: described second step replaces with: be retained in the base material PC plate left and right sides described hanger vacant plate face position on respectively left and right a vertical gap is set separately, the height in described vertical gap is equal with base material PC plate height, and whole described hanger vacant portion faces described in all the other all sticks insulation tape sealing.
The method of spray silver plate pasting board of the present invention electroforming, wherein: the width in described vertical gap is 5mm-10mm.
The method of spray silver plate pasting board of the present invention electroforming, wherein: described hanger is stainless steel hanger.
The method of spray silver plate pasting board of the present invention electroforming, wherein: described insulation tape is high-temperature insulation adhesive tape.
The present invention is the mode by utilizing silver layer to conduct electricity, overcome prior art by aluminium conductive tape and the ad hoc contact conduction mode of brush silver slurry carries out the drawback of conducting electricity, improve electrical efficiency.
The present invention has following remarkable advantage:
Compared with prior art, the present invention has the following advantages: reduce resistance, improves electric conductivity, reduces the internal stress in electroforming process, improves silver plate electroforming success ratio; Optimizing operation step, shortens the activity duration; Do not use conductive silver paste; Reduce the usage quantity of conductive tape; From the production application of the inventive method, the method of spray silver plate pasting board of the present invention electroforming can obviously improve the practical problems run into aborning, and can yield rate be significantly improved, enhance productivity, save energy, to reduce costs etc. in achieve gratifying effect, the inventive method can ensure the use properties of stability and the product produced, and can bring larger economic benefit for company.
accompanying drawing illustrates:
Fig. 1: be a kind of method schematic diagram spraying the electroforming of silver plate pasting board of the present invention;
Fig. 2: the method schematic diagram being another kind spray silver plate pasting board of the present invention electroforming;
Fig. 3: the method schematic diagram being the third spray silver plate pasting board electroforming of the present invention;
Embodiment:
Below in conjunction with specific embodiment and comparative example, the present invention will be described in detail:
As shown in Figure 1, be the method schematic diagram of spray silver plate pasting board of the present invention electroforming, a kind of method of spraying the electroforming of silver plate pasting board, its concrete steps are:
In FIG, the first step: base material PC plate 2 is placed in rectangular plate type hanger 1 central part, has vacant plate face 3 more than between described base material PC plate surrounding and described hanger edge;
Second step: retain the vacant lateral plates 4 in left and right between described hanger 1 and described base material PC plate 2, the height of the vacant lateral plates in described left and right 4 is highly equal with base material PC plate 2, insulation tape 6 is sticked in the upper and lower vacant plate face 3 between all the other hanger 1 and base material PC plates 2 and seals;
3rd step: with the described hanger surface integral spray silver of described base material PC plate, after spray silver, electroforming is conducted electricity by silver layer, changes the mode of conduction;
4th step: with electroforming in the electroforming solution of the described hanger entirety intrusion electrotyping bath of described base material PC plate, described hanger 1 is stainless steel hanger, and described insulation tape 6 is high-temperature insulation adhesive tape.
Emphasis of the present invention have employed new silver layer electrically conducting manner, changes original electrically conducting manner by conductive aluminum adhesive tape and conductive silver paste.
The embodiment of the method for another spray silver plate pasting board electroforming of the present invention is:
As shown in Figure 2, the first step: base material PC plate 2 is placed in rectangular plate type hanger 1 central part, has vacant plate face 3 more than between described base material PC plate 2 surrounding and described hanger 1 edge;
Second step is: only retain the vacant lateral plates 4 in any side, left and right between described hanger 1 and described base material PC plate 2, the height of the vacant lateral plates in any side, described left and right 4 is highly equal with base material PC plate 2, sticks insulation tape 6 and seal between all the other hangers 1 and base material PC plate 2 opposite side and upper and lower vacant plate face 3; The described hanger vacant plate face position being retained in any side of base material PC plate about 2 is reserved a vertical narrow vacant plate face is set, be referred to as: vertical gap 5, the height in described vertical gap 5 is highly equal with base material PC plate 2, the width in described vertical gap 5 is 5mm-10mm, and vacant portion faces described in all the other of described hanger 1 is all sticked insulation tape 6 and sealed;
3rd step: with the described hanger 1 surface integral spray silver of described base material PC plate 2, after spray silver, electroforming is conducted electricity by silver layer, changes the mode of conduction;
4th step: with electroforming in the electroforming solution of the described hanger 1 entirety intrusion electrotyping bath of described base material PC plate 2, described hanger 1 is stainless steel hanger, and described insulation tape 6 is high-temperature insulation adhesive tape.
This embodiment is the most frequently used a kind of embodiment of the present invention, is also best a kind of embodiment.
Embodiment three:
As shown in Figure 3, in figure 3, the first step: base material PC plate 2 is placed in rectangular plate type hanger 1 central part, has vacant plate face 3 more than between described base material PC plate 2 surrounding and described hanger 1 edge;
Second step: retain the vacant lateral plates 4 in left and right between described hanger 1 and described base material PC plate 2, the height of the vacant lateral plates in described left and right 4 is highly equal with base material PC plate 2, insulation tape 6 is sticked in the upper and lower vacant plate face 3 between all the other hanger 1 and base material PC plates 2 and seals; Be retained in base material PC plate 2 left and right sides described hanger 1 vacant plate face position on respectively left and right a vertical gap 5 is set separately, the height in described vertical gap 5 is highly equal with base material PC plate 2, the width in described vertical gap 5 is 5mm-10mm, and whole described hanger 1 vacant portion faces described in all the other is all sticked insulation tape 6 and sealed;
3rd step: with the described hanger 1 surface integral spray silver of described base material PC plate 2, after spray silver, electroforming is conducted electricity by silver layer, changes the mode of conduction;
4th step: with electroforming in the electroforming solution of the described hanger 1 entirety intrusion electrotyping bath of described base material PC plate 2, described hanger 1 is stainless steel hanger, and described insulation tape 6 is high-temperature insulation adhesive tape.
The present embodiment three is for when base material PC plate 2 is larger time, and namely large size spray silver plate can arrange a vertical gap 5 separately in the left and right sides, strengthens electric conduction quantity; And for medium size spray silver plate, in left and right, any side just can meet the demands.
Electrocasting method of the present invention is known electrocasting method, is only that the method for pasting board is different, the change of the most basic is conduction mode, employing be the characteristic utilizing new spray silver layer after spray silver, realize silver layer and conducted electricity electroforming.
Spray silver plate pasting board electrocasting method of the present invention reduces the resistance in electroforming process, improves electroforming operation electric conductivity, reduces the internal stress in electroforming process, improves silver plate electroforming success ratio; Optimizing operation step, shortens the activity duration; Do not use conductive silver paste; Reduce the usage quantity of conductive tape; From the production application of the inventive method, the method of spray silver plate pasting board of the present invention electroforming can obviously improve the practical problems run into aborning, and can yield rate be significantly improved, enhance productivity, save energy, to reduce costs etc. in achieve gratifying effect, the inventive method can ensure the use properties of stability and the product produced, and can bring larger economic benefit for company.
Claims (1)
1. spray a method for silver plate pasting board electroforming, it is characterized in that: its concrete steps are:
The first step: base material PC plate (2) is placed in rectangular plate type hanger (1) central part, has vacant plate face (3) more than between described base material PC plate (2) surrounding and described hanger (1) edge;
Second step: retain the vacant lateral plates in the left and right (4) between described hanger and described base material PC plate (2), the height of the vacant lateral plates in described left and right (4) is highly equal with base material PC plate (2), the upper and lower vacant plate face (3) between hanger (1) and base material PC plate (2) sticks insulation tape (6) and seals;
3rd step: with described hanger (1) the surface integral spray silver of described base material PC plate (2), after spray silver, electroforming is conducted electricity by silver layer, changes the mode of conduction;
4th step: with electroforming in the electroforming solution of described hanger (1) the entirety intrusion electrotyping bath of described base material PC plate (2).
2. the method for spray silver plate pasting board according to claim 1 electroforming, it is characterized in that: described second step is: only retain the vacant lateral plates in any side, left and right (4) between described hanger (1) and described base material PC plate (2), the height of the vacant lateral plates in any side, described left and right (4) is highly equal with base material PC plate (2), sticks insulation tape (6) and seal between hanger and base material PC plate (2) opposite side and upper and lower vacant plate face (3).
3. according to the method for the spray silver plate pasting board electroforming described in claim 2, it is characterized in that: reserve on described hanger (1) vacant lateral plates (4) position being retained in any side, base material PC plate (2) left and right and a vertical narrow vacant plate face is set, be referred to as: vertical gap (5), the height of described vertical gap (5) is highly equal with base material PC plate (2), and vacant portion faces described in all the other of described hanger (1) all sticks insulation tape (6) sealing.
4. the method for spray silver plate pasting board according to claim 1 electroforming, it is characterized in that: described second step: on described hanger (1) vacant lateral plates (4) position being retained in base material PC plate (2) left and right sides, left and right arranges a vertical gap (5) separately respectively, the height of described vertical gap (5) is highly equal with base material PC plate (2), and whole described hanger (1) vacant portion faces described in all the other all sticks insulation tape (6) sealing.
5. the method for the spray silver plate pasting board electroforming according to claim 3 or 4, is characterized in that: the width of described vertical gap (5) is 5mm-10mm.
6. the method for spray silver plate pasting board according to claim 1 electroforming, is characterized in that: described hanger (1) is stainless steel hanger.
7. the method for spray silver plate pasting board according to claim 1 electroforming, is characterized in that: described insulation tape (6) is high-temperature insulation adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210293537.2A CN102787332B (en) | 2012-08-17 | 2012-08-17 | Method for electroforming pasting board of silver spraying board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210293537.2A CN102787332B (en) | 2012-08-17 | 2012-08-17 | Method for electroforming pasting board of silver spraying board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102787332A CN102787332A (en) | 2012-11-21 |
| CN102787332B true CN102787332B (en) | 2014-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210293537.2A Expired - Fee Related CN102787332B (en) | 2012-08-17 | 2012-08-17 | Method for electroforming pasting board of silver spraying board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1188519A (en) * | 1996-04-01 | 1998-07-22 | 声音和信息载体股份有限公司索诺布累斯生产公司 | Galvanic deposition cell with substrate holder |
| CN1995470A (en) * | 2006-12-15 | 2007-07-11 | 七二国际股份有限公司 | Process for preparing porous foam metal material |
| CN101223304A (en) * | 2005-07-12 | 2008-07-16 | 西门子公司 | Electrode arrangement and method for the electrochemical coating of a workpiece surface |
| CN101634018A (en) * | 2008-07-27 | 2010-01-27 | 比亚迪股份有限公司 | Selective chemical plating method for plastic base material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632335B2 (en) * | 1999-12-24 | 2003-10-14 | Ebara Corporation | Plating apparatus |
-
2012
- 2012-08-17 CN CN201210293537.2A patent/CN102787332B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1188519A (en) * | 1996-04-01 | 1998-07-22 | 声音和信息载体股份有限公司索诺布累斯生产公司 | Galvanic deposition cell with substrate holder |
| CN101223304A (en) * | 2005-07-12 | 2008-07-16 | 西门子公司 | Electrode arrangement and method for the electrochemical coating of a workpiece surface |
| CN1995470A (en) * | 2006-12-15 | 2007-07-11 | 七二国际股份有限公司 | Process for preparing porous foam metal material |
| CN101634018A (en) * | 2008-07-27 | 2010-01-27 | 比亚迪股份有限公司 | Selective chemical plating method for plastic base material |
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| Publication number | Publication date |
|---|---|
| CN102787332A (en) | 2012-11-21 |
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Granted publication date: 20141224 Termination date: 20150817 |
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