CN102787332A - Method for electroforming pasting board of silver spraying board - Google Patents
Method for electroforming pasting board of silver spraying board Download PDFInfo
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- CN102787332A CN102787332A CN2012102935372A CN201210293537A CN102787332A CN 102787332 A CN102787332 A CN 102787332A CN 2012102935372 A CN2012102935372 A CN 2012102935372A CN 201210293537 A CN201210293537 A CN 201210293537A CN 102787332 A CN102787332 A CN 102787332A
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Abstract
The invention relates to an electroforming process of the holographic anti-counterfeiting printing industry, in particular to a method for electroforming a pasting board of a silver spraying board. The invention provides the method for electroforming the pasting board of the silver spraying board, which is capable of reducing resistance, improving conductivity, reducing inner stress in an electroforming process, improving the success ratio of electroforming the silver board and improving the yield of the silver spraying product. A base material PC (polycarbonate) board is arranged at a center part of a rectangular board hanger; vacant board surfaces are left between the periphery of the base material PC board and the brims of the hanger; the vacant board surface at any one of the left sides and right sides of the hanger and the base material PC board is preserved; insulating tapes are respectively pasted on the other part of the hanger and the other side of the base material PC board and between the upper and lower vacant board surfaces for carrying out sealing; the surface of the hanger, with the base material PC board, is subjected to complete silver spraying, and is conducted by a silver layer; the hanger with the base material PC board is completely soaked into an electrotyping solution of an electrotyping tank to be electroformed, so that the resistance is reduced, the conductivity is improved, the inner stress in the electroforming process is reduced, and the success ratio of electroforming the silver board is improved; the operation step is optimized, and the operation time is shortened; and conductive silver paste is not used, and the dosage of the conductive tape is reduced.
Description
Technical field
The present invention relates to a kind of electroforming process of holographic false proof printing industry, particularly a kind of method of spraying the electroforming of silver plate pasting board.
Background technology
China's tobacco bale printing industry content height that possesses skills, the characteristics of complex process in existing holographic false proof trans-printing production process, adopt directly spray silver on base material PC plate; The use hair dryer dries up; Use the wide conductive tape of 20mm pros and cons bound edge around base material; To stick on the electroforming metal hanger fixing with insulation tape with the base material PC plate that conductive resin posts; Paste around the base material PC plate with conductive tape once more and link to each other with hanger and in order to seal the vacant plate face of hanger; Conductive silver paste is coated at position in that base material links to each other with conductive tape, and its conduction is to realize through the conductive tape around the edge, around the outside at conductive resin bandwidth 1/2nd places, sticks the high-temperature insulation adhesive tape, only the base material conduction behind the reservation spray silver; Following cylinder electroforming is in electroforming, because electric conductivity is low; Resistance ratio is bigger, and current anomaly or excessive makes that the electroforming apparatus heating is serious; Load strengthens, and the internal stress of nickel plate strengthens in the electroforming process, and promptly the big more internal stress of resistance is high more; Be very easy to cause silver plate to scrap, the product qualified rate that causes spraying silver plate reduces, and the problem of how to generate heat through some technical measures raising product percents of pass, solution electroforming apparatus is engineering technical personnel's problems anxious to be solved.
Summary of the invention
The objective of the invention is to be to overcome the defective that above-mentioned prior art exists; A kind of reduction resistance is provided, improves electric conductivity, reduce the internal stress in the electroforming process; Improve silver plate electroforming success ratio, improve a kind of method of spraying the electroforming of silver plate pasting board of the silver-colored product qualified rate of spray.
The objective of the invention is to accomplish through following technical scheme:
A kind of method of spraying the electroforming of silver plate pasting board of the present invention, wherein: its concrete steps are:
The first step: base material PC plate places rectangular plate type hanger central part, and surplus between around the said base material PC plate and the said hanger edge have a vacant plate face;
Second step: keep the vacant plate face in the left and right sides between said hanger and the said base material PC plate, the height of the vacant plate face in the said left and right sides equates with base material PC plate height, sticks the insulation tape sealing on the vacant plate face up and down between all the other hangers and the base material PC plate;
The 3rd step: have the whole spray silver in said hanger surface of said base material PC plate, after spray silver, electroforming changes the mode of conduction through the silver layer conduction;
The 4th step: have the whole interior electroforming of electroforming solution of invading electrotyping bath of said hanger of said base material PC plate.
The method of spray silver plate pasting board of the present invention electroforming; Wherein: said second the step replace with: only keep between said hanger and the said base material PC plate about the vacant plate face of any side; The height of the vacant plate face of any side equates with base material PC plate height about said, and all the other hangers and base material PC plate opposite side reach sticks the insulation tape sealing up and down between the vacant plate face;
The method of spray silver plate pasting board of the present invention electroforming; Wherein: on the facial position of the vacant plate of the said hanger that is retained in any side about base material PC plate, reserve the vertical narrow vacant plate face that is provided with; Be referred to as: vertical slit; The height in said vertical slit equates that with base material PC plate height the insulation tape sealing is all sticked on surface, the said vacant position of all the other of said hanger.
The method of spray silver plate pasting board of the present invention electroforming; Wherein: said second step replaces with: about being retained on the facial position of the vacant plate of the said hanger of the base material PC plate left and right sides respectively a vertical slit is set separately; The height in said vertical slit equates that with base material PC plate height the insulation tape sealing is all sticked on all the other surfaces, said vacant position of whole said hanger.
The method of spray silver plate pasting board of the present invention electroforming, wherein: the width in said vertical slit is 5mm-10mm.
The method of spray silver plate pasting board of the present invention electroforming, wherein: said hanger is the stainless steel hanger.
The method of spray silver plate pasting board of the present invention electroforming, wherein: said insulation tape is the high-temperature insulation adhesive tape.
The present invention is through utilizing the mode of silver layer conduction, overcome passing through the aluminium conductive tape and brushing the drawback that the silver-colored ad hoc contact conduction mode of starching conducts electricity of prior art, improving electrical efficiency.
The present invention has following remarkable advantage:
Compared with prior art, the present invention has the following advantages: reduce resistance, improve electric conductivity, reduce the internal stress in the electroforming process, improve silver plate electroforming success ratio; The Optimizing operation step shortens the activity duration; Do not use conductive silver paste; Reduce the usage quantity of conductive tape; Production application from the inventive method; The method of spray silver plate pasting board of the present invention electroforming can obviously be improved the practical problems that runs into aborning; And can significantly improve yield rate, and enhance productivity, obtained gratifying effect at save energy, aspect such as reduce cost; The stability that the inventive method can guarantee to produce and the use properties of product, and can bring bigger economic benefit for company.
Description of drawings:
Fig. 1: be a kind of method synoptic diagram that sprays the electroforming of silver plate pasting board of the present invention;
Fig. 2: the method synoptic diagram that is another kind of spray silver plate pasting board of the present invention electroforming;
Fig. 3: the method synoptic diagram that is the third spray silver plate pasting board electroforming of the present invention;
Embodiment:
To combine specific embodiment and Comparative Examples that the present invention is done detailed introduction below:
As shown in Figure 1, be the method synoptic diagram of spray silver plate pasting board of the present invention electroforming, a kind of method of spraying the electroforming of silver plate pasting board, its concrete steps are:
In Fig. 1, the first step: base material PC plate 2 places rectangular plate type hanger 1 central part, and surplus between around the said base material PC plate and the said hanger edge have a vacant plate face 3;
Second step: keep the vacant lateral plates 4 in the left and right sides between said hanger 1 and the said base material PC plate 2; The height of the vacant lateral plates 4 in the said left and right sides highly equates with base material PC plate 2, sticks insulation tape 6 sealings on the vacant plate face 3 up and down between all the other hangers 1 and the base material PC plate 2;
The 3rd step: have the whole spray silver in said hanger surface of said base material PC plate, after spray silver, electroforming changes the mode of conduction through the silver layer conduction;
The 4th step: have the whole interior electroforming of electroforming solution of invading electrotyping bath of said hanger of said base material PC plate, said hanger 1 is the stainless steel hanger, and said insulation tape 6 is the high-temperature insulation adhesive tape.
Emphasis of the present invention is to have adopted new silver layer electrically conducting manner, changes original electrically conducting manner through conductive aluminum adhesive tape and conductive silver paste.
Other a kind of method embodiment that sprays the electroforming of silver plate pasting board of the present invention is:
As shown in Figure 2, the first step: base material PC plate 2 places rectangular plate type hanger 1 central part, and surplus around the said base material PC plate 2 and between said hanger 1 edge have a vacant plate face 3;
Second step: the vacant lateral plates 4 of any side about only keeping between said hanger 1 and the said base material PC plate 2; The height of the vacant lateral plates 4 of any side highly equates with base material PC plate 2 about said, and all the other hangers 1 and base material PC plate 2 opposite sides reach and stick insulation tape 6 sealings up and down between the vacant plate face 3; On the facial position of the vacant plate of the said hanger that is retained in base material PC plate about 2 any sides, reserve the vertical narrow vacant plate face that is provided with; Be referred to as: vertical slit 5; The height in said vertical slit 5 highly equates with base material PC plate 2; The width in said vertical slit 5 is 5mm-10mm, and insulation tape 6 sealings are all sticked on surface, the said vacant position of all the other of said hanger 1;
The 3rd step: have the whole spray silver in said hanger 1 surface of said base material PC plate 2, after spray silver, electroforming changes the mode of conduction through the silver layer conduction;
The 4th step: have the said hanger 1 whole interior electroforming of electroforming solution of invading electrotyping bath of said base material PC plate 2, said hanger 1 is the stainless steel hanger, and said insulation tape 6 is the high-temperature insulation adhesive tape.
This embodiment is the most frequently used a kind of embodiment of the present invention, also is best a kind of embodiment.
Embodiment three:
As shown in Figure 3, in Fig. 3, the first step: base material PC plate 2 places rectangular plate type hanger 1 central part, and surplus around the said base material PC plate 2 and between said hanger 1 edge have a vacant plate face 3;
Second step: keep the vacant lateral plates 4 in the left and right sides between said hanger 1 and the said base material PC plate 2; The height of the vacant lateral plates 4 in the said left and right sides highly equates with base material PC plate 2, sticks insulation tape 6 sealings on the vacant plate face 3 up and down between all the other hangers 1 and the base material PC plate 2; About being retained on the facial position of the vacant plate of said hanger 1 of base material PC plate 2 left and right sides respectively a vertical slit 5 is set separately; The height in said vertical slit 5 highly equates with base material PC plate 2; The width in said vertical slit 5 is 5mm-10mm, and insulation tape 6 sealings are all sticked on whole said hanger 1 all the other surfaces, said vacant position;
The 3rd step: have the whole spray silver in said hanger 1 surface of said base material PC plate 2, after spray silver, electroforming changes the mode of conduction through the silver layer conduction;
The 4th step: have the said hanger 1 whole interior electroforming of electroforming solution of invading electrotyping bath of said base material PC plate 2, said hanger 1 is the stainless steel hanger, and said insulation tape 6 is the high-temperature insulation adhesive tape.
Present embodiment three is used for when base material PC plate 2 is bigger, i.e. large size spray silver plate can be provided with a vertical slit 5 separately in the left and right sides, strengthens electric conduction quantity; And for medium size spray silver plate about any side just can meet the demands.
Electrocasting method of the present invention is known electrocasting method, only is that the method for pasting board is different, and the most basic is the change of conduction mode, employing be the characteristic that spray silver back utilizes new spray silver layer, realize that the silver layer conduction accomplishes electroforming.
Spray silver plate pasting board electrocasting method of the present invention has reduced the resistance in the electroforming process, improves electroforming operation electric conductivity, reduces the internal stress in the electroforming process, improves silver plate electroforming success ratio; The Optimizing operation step shortens the activity duration; Do not use conductive silver paste; Reduce the usage quantity of conductive tape; Production application from the inventive method; The method of spray silver plate pasting board of the present invention electroforming can obviously be improved the practical problems that runs into aborning; And can significantly improve yield rate, and enhance productivity, obtained gratifying effect at save energy, aspect such as reduce cost; The stability that the inventive method can guarantee to produce and the use properties of product, and can bring bigger economic benefit for company.
Claims (7)
1. method of spraying the electroforming of silver plate pasting board, it is characterized in that: its concrete steps are:
The first step: base material PC plate (2) places rectangular plate type hanger (1) central part, and said base material PC plate (2) is surplus all around and between said hanger (1) edge to have a vacant plate face (3);
Second step: keep the vacant lateral plates in the left and right sides (4) between said hanger and the said base material PC plate (2); The height of the vacant lateral plates in the said left and right sides (4) highly equates with base material PC plate (2), sticks insulation tape (6) sealing on the vacant plate face (3) up and down between all the other hangers (1) and the base material PC plate (2);
The 3rd step: have the whole spray silver in said hanger (1) surface of said base material PC plate (2), after spray silver, electroforming changes the mode of conduction through the silver layer conduction;
The 4th step: have the whole interior electroforming of electroforming solution of invading electrotyping bath of said hanger (1) of said base material PC plate (2).
2. the method for spray silver plate pasting board according to claim 1 electroforming; It is characterized in that: said second step: the vacant lateral plates of any side (4) about only keeping between said hanger (1) and the said base material PC plate (2); The height of the vacant lateral plates of any side (4) highly equates with base material PC plate (2) about said, and all the other hangers and base material PC plate (2) opposite side reach sticks insulation tape (6) sealing up and down between the vacant plate face (3).
3. the method for spray silver plate pasting board according to claim 2 electroforming; It is characterized in that: be retained on the vacant lateral plates of said hanger (1) (4) position of any side about base material PC plate (2) the vertical narrow vacant plate face that is provided with of reserving; Be referred to as: vertical slit (5); The height in said vertical slit (5) equates highly that with base material PC plate (2) insulation tape (6) sealing is all sticked on surface, the said vacant position of all the other of said hanger (1).
4. the method for spray silver plate pasting board according to claim 1 electroforming; It is characterized in that: said second step: about being retained on the vacant lateral plates of said hanger (1) (4) position of base material PC plate (2) left and right sides respectively a vertical slit (5) is set separately; The height in said vertical slit (5) equates highly that with base material PC plate (2) insulation tape (6) sealing is all sticked on all the other surfaces, said vacant position of whole said hanger (1).
5. according to the method for claim 3 or 4 described spray silver plate pasting board electroforming, it is characterized in that: the width in said vertical slit (5) is 5mm-10mm.
6. the method for spray silver plate pasting board according to claim 1 electroforming is characterized in that: said hanger (1) is the stainless steel hanger.
7. the method for spray silver plate pasting board according to claim 1 electroforming is characterized in that: said insulation tape (6) is the high-temperature insulation adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210293537.2A CN102787332B (en) | 2012-08-17 | 2012-08-17 | Method for electroforming pasting board of silver spraying board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210293537.2A CN102787332B (en) | 2012-08-17 | 2012-08-17 | Method for electroforming pasting board of silver spraying board |
Publications (2)
| Publication Number | Publication Date |
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| CN102787332A true CN102787332A (en) | 2012-11-21 |
| CN102787332B CN102787332B (en) | 2014-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210293537.2A Expired - Fee Related CN102787332B (en) | 2012-08-17 | 2012-08-17 | Method for electroforming pasting board of silver spraying board |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1188519A (en) * | 1996-04-01 | 1998-07-22 | 声音和信息载体股份有限公司索诺布累斯生产公司 | Galvanic deposition cell with substrate holder |
| WO2001048274A1 (en) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| CN1995470A (en) * | 2006-12-15 | 2007-07-11 | 七二国际股份有限公司 | Process for preparing porous foam metal material |
| CN101223304A (en) * | 2005-07-12 | 2008-07-16 | 西门子公司 | Electrode arrangement and method for the electrochemical coating of a workpiece surface |
| CN101634018A (en) * | 2008-07-27 | 2010-01-27 | 比亚迪股份有限公司 | Selective chemical plating method for plastic base material |
-
2012
- 2012-08-17 CN CN201210293537.2A patent/CN102787332B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1188519A (en) * | 1996-04-01 | 1998-07-22 | 声音和信息载体股份有限公司索诺布累斯生产公司 | Galvanic deposition cell with substrate holder |
| WO2001048274A1 (en) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| CN101223304A (en) * | 2005-07-12 | 2008-07-16 | 西门子公司 | Electrode arrangement and method for the electrochemical coating of a workpiece surface |
| CN1995470A (en) * | 2006-12-15 | 2007-07-11 | 七二国际股份有限公司 | Process for preparing porous foam metal material |
| CN101634018A (en) * | 2008-07-27 | 2010-01-27 | 比亚迪股份有限公司 | Selective chemical plating method for plastic base material |
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| CN102787332B (en) | 2014-12-24 |
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Granted publication date: 20141224 Termination date: 20150817 |
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