CN102786721B - High-strength and high-heat conduction insulating material - Google Patents
High-strength and high-heat conduction insulating material Download PDFInfo
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- CN102786721B CN102786721B CN201210277279.9A CN201210277279A CN102786721B CN 102786721 B CN102786721 B CN 102786721B CN 201210277279 A CN201210277279 A CN 201210277279A CN 102786721 B CN102786721 B CN 102786721B
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Abstract
The invention discloses a high-strength and high-heat conduction insulating material. The material comprises a base material and beryllium-containing silicon carbide fiber powder which is treated. The insulating material is prepared by treating the powder through a silane coupling agent and then blending the treated beryllium-containing silicon carbide fiber powder and the base material; the treated beryllium-containing silicon carbide fiber powder is chopped carbon fibers which are prepared by chopping beryllium-containing silicon carbide fibers, wherein the length-diameter ratio of the chopped carbon fibers is 2 to 100; and after the chopped carbon fibers are ground, the chopped carbon fibers are soaked in an aluminum oxide sol, and after filtration, the solution is treated for 3 to 30 minutes at the temperature of 500 to 700 DEG C and then is treated for 1 to 10 hours at the temperature of 1,500 to 1,800 DEG C. A heat-conducting insulating adhesive prepared by treating the high-strength and high-heat conduction insulating material is high in heat conductivity, insulativity and potting ability. The prepared heat-conducting insulating plastic and ceramic are high in heat conductivity. The defects of the current heat-conducting insulating material are overcome, and the performances are improved. Due to the reinforcement effect of the fiber, after curing, the strength of the heat-conducting insulating adhesive, the heat-conducting insulating plastic and ceramic is further improved, and the service life is long. Due to the addition of zinc oxide whiskers, the strength of the potting adhesive, the plastic and the ceramic is further improved, and additional performances, such as an antibacterial effect, are realized.
Description
Technical field
The invention belongs to Novel heat-conducting Material Field, related is a kind of high-strength highly-conductive thermal insulating material of preparing containing beryllium silicon carbide fiber that utilizes high heat conduction.
Background technology
Electronic Packaging density is more and more higher, and the volume of electron device is more and more less, has adapted to the requirement of current unicircuit high-density development, but consequent heat dissipation problem can not be ignored.20 century 70s are between the nineties, and the heat flow density in integrated circuit (IC) chip is from about 10Wcm
-2be increased to 100Wcm
-2magnitude, the at present the highest 200Wcm that reached
-2; The trend that this numerical value increases is still continuing.So large energy density, if can not reasonably carry out heat management design, will cause the inefficacy of microprocessor.
Thermal failure is while working due to device, and the semiconducter device consisting of pin and triode as electric current is subject to after certain impedance, and electric energy changes heat into, causes device inside temperature to raise.When temperature rises to a certain value, device will quit work because of inefficacy moment, when serious, even can cause the burning of packaged material.Except the inefficacy that Yin Wendu rising directly causes, temperature raises also can cause the inefficacy of other pattern, as the mechanical creep of bonding material, parasitic chemical reaction and diffusion of contaminants etc.
Element over-temperature not only can cause product failure, also likely causes accident, causes personal injury difficult to the appraisal and financial loss.According to western medium, the apple ipod player that user holds is on fire suddenly in compartment, causes Tokyo commuter train forced outage 8 minutes.Fortunately do not have personnel injured in this accident.And since in November, 2007, the overheated or event of catching fire of 27 iPodnano music players has occurred in Japan, wherein 4 cause user's slight burns.According to Japanese Industry and Economic News on June 30th, 2110: Sony's issue on the 30th, the notebook computer part type of " bio " by name is from 3 the end of month of this year, in a lot of countries except Japan, because part is crossed existing 39 of the accident of thermal initiation receptacle portion position distortion.In Japanese native country, temporarily do not have this type of accident to occur.Because accident may damage user, Sony takes urgent counte-rplan, recalls object and comprises overseas approximately 530,000 5 thousand, the notebook computer that Japanese native country is approximately 50,000 2 thousand.
The application of the principles such as the high efficiency and heat radiation problem of electronic devices and components and thermal conduction study, hydromeehanics is closely related.The object of dissipation from electronic devices is that the operating temperature of electronics is controlled to (or claiming thermal control), to guarantee stability and the reliability of its work.This has wherein related to and the aspects of contents such as relevant heat radiation or the type of cooling, material that conduct heat.From the angle of application, conventional method mainly contains: the application of the principles such as natural heat dissipation or cooling, forced heat radiation or cooling, liquid cooling, refrigeration modes, the high efficiency and heat radiation problem of dredging electronic devices and components and thermal conduction study, hydromeehanics is closely related.No matter adopt which kind of radiating mode degree the heat of components and parts or the generation of succession circuit need to be transferred to shell or special scatterer.
Heavy-power LED product has covered the market share of whole LED Application Areas approximately 75%, and China's semiconductor lighting in 2012 and the related industries output value are estimated to reach 3,000 hundred million yuan, and the high-power LED illumination product market sales revenue is estimated approximately 1,000 hundred million yuan.Following great power LED will become the main body of LED illumination application, and will replace traditional lighting light source in fields such as backlight, automobile, landscape ornamental, Special Work illumination, general illuminations comprehensively, it is at mobile phone and middle large-scale LCD panel is backlight is all widely used, and market potential is huge.The series of problems such as but at present poor reliability, relevant criterion lack, expensive are perplexing the heat management problems in the development, particularly high-brightness LED illumination system of the bright industry of LED.The brightness meeting of the heat management high-brightness LED of LED lighting system is along with the junction temperature exponentially of chip successively decreases.Therefore, good radiating management is that LED solid-state lighting system is to a key factor of high-power development.The heat radiation of LED solid-state lighting system is the same with the heat radiation of microelectronics Packaging, the heat that device work produces, and the package system being first comprised of through multiple layers of different materials heat conduction is transmitted to hot trap, then is fallen apart in environment by transmission of heat by convection.
Extensively weary in field power cell application such as new-energy automobile, military affairs.At loss of weight with put forward power cell power density under high-power pressure and constantly increase, due to intrinsic internal resistance, battery can generate heat, if even heat is not derived, battery can even be blasted whole system was lost efficacy because overheated and lost efficacy, and causes dangerous accident.
When there is no special special material by embedding or sealing-in bridge joint, heat conducts to shell by the air (thermal conductivity 0.02W/m.K) of thermal conductance rate variance, or very poor that air gap conducts to scatterer by conductivity, cause electronic apparatus integral heat sink poor performance.Traditional joint sealant is as the fixing electronic devices and components of organosilicon, epoxy resin embedding adhesive, but thermal conductivity very low (0.1-0.2W/m.K) still can not meet the needs of modern electronic technology development.
In order to meet the heat dissipation problem of the device blocks that the electric drives such as this electronics, electrical equipment, battery generate heat simultaneously, need a kind of special thermally conductive material that heat is derived outside.Simultaneously because these parts, device are charged, this material require and charged position close contact, so this material should insulate.Other also have to use to facilitate, density can not be too high, environmental resistance will be got well, high voltage applications occasion dielectric strength wants greatly, have certain performance requriementss such as flame retardant resistance.Heat-conducting insulation material is a kind of exotic materials that solves heat dissipation problem.Significant in the heat dissipation problem of thermally conductive material electricity working part, it is after filling heat transfer gap, in the situation that guaranteeing electrical isolation, have heat to be conducted to the heat such as shell or scatterer littlely and enter, dissipation of heat did not lose efficacy or performance reduction because of overheated to assurance system in environment the most at last.
Thermally conductive material has heat conduction joint sealant, moulded heat-conductive insulated plastics, thermal conductive ceramic etc.Thermally conductive material abroad greatly about last century the eighties ，Er China that starts to arouse attention in this century, because heat management problems becomes, seriously start to cause extensive attention.It is liquid that heat conduction joint sealant belongs to before uncured, has mobility, and glue viscosity is distinguished to some extent according to the difference of the material of product, performance, production technique.Joint sealant could be realized its use value after solidifying completely, can play waterproof and dampproof, dustproof, insulation, heat conduction, secret, protection against corrosion, heatproof, shockproof effect after solidifying.Electron pouring sealant kind is very many, from material type, divide, use is at present modal is at most mainly 3 kinds, be epoxy resin embedding adhesive, silicone resin joint sealant, polyurethane pouring sealant, the power density of electric components and parts is increasing, to the heat conductivility of heat conductive insulating joint sealant, requires also more and more higher.The producer that produces at present heat conductive insulating joint sealant is both at home and abroad a lot, and the heat conductive insulating joint sealant performance that each company produces is different.Insulating property generally read to reach volume specific resistance 10
12Ω .cm, thermal conductivity between 0.6-0.9W/m.K, is to have belonged to the product of high thermal conductivity to 1.5W/m.K mostly, also have external product thermal conductivity to reach 3.0W/m.K, but mechanical property is very poor, and intensity is very low, and power has just been pulverized a little.Heat-conducting plastic has application in many electric fields, the structural part of Chang Zuowei excellent radiation performance or functional part, the moulded heat-conductive insulated plastics that each company produces.Insulating property generally read to reach volume specific resistance 10
12Ω .cm, thermal conductivity between 0.6-0.9W/m.K, is also to have belonged to the product of high thermal conductivity to 1.5W/m.K mostly, and the moulded heat-conductive insulated plastics mechanical property that thermal conductivity is high is simultaneously very poor, and intensity is low.At field heat conductive insulating potteries such as Electronic Packaging, have important application, the ceramic thermal conductivity of insulativity generally between 10-40w/m, high reaches as high as 40w/m.K as aluminum oxide.
Summary of the invention
Object of the present invention aims to provide a kind of high-strength highly-conductive thermal insulating material, and cost is low, and good insulating has higher thermal conductivity, can greatly improve the intensity of material for existing insulating material.
Further object of the present invention is, is promoting the heat conduction of material, in the effect of enhancing, make insulating material have certain anti-microbial effect, wear resistance.
The present invention contains beryllium silicon carbide fiber after a series of processing by employing, utilize recombining process to prepare high-strength highly-conductive thermal isolation joint sealant, high heat conductive insulating plastics, these high heat conductive insulating materials of high heat conductive insulating pottery, be mainly used in the fields such as the high electronics embedding of heat dispersion requirement, encapsulation, structural part.This high heat conductive insulating material or also there are the additional properties such as antibacterial.
Technical scheme of the present invention is: a kind of high-strength highly-conductive thermal insulating material, comprise body material, and described body material is ceramic matrix material, plastic matrix material or heat conductive insulating joint sealant matrix glue used; The present invention has also added the powder containing beryllium silicon carbide fiber after treatment, and described insulating material is to be mixed with above-mentioned body material after silane coupling agent is processed by described powder; The described powder containing beryllium silicon carbide fiber is after treatment to be obtained by following mode: by the chopped carbon fiber that is 2-100 containing the chopped one-tenth length-to-diameter ratio of beryllium silicon carbide fiber; After chopped carbon fiber is ground, in alumina sol, soak, after filtration, at 500-700 ℃, process 3-30min again, and then at 1500-1800 ℃ of pyroprocessing 1-10 hour;
The described mass content containing beryllium in beryllium silicon carbide fiber is between 0.5-2.5%;
The mass ratio of described powder and described body material is 0.2-10.
Described is 0.5-10 hour containing beryllium silicon carbide fiber soak time in alumina sol.
Chopped carbon fiber after treatment heat transfer coefficient is 220-280W/m.K.
Described chopped be first with fibre chopping machine, to be cut into the fiber that length is 2-10mm, then use ball mill grinding; Described Ball-milling Time is 5-60min.
In described silane coupling agent KH816, KH550, KH570 one or more.
That uses contains beryllium silicon carbide fiber diameter between 5-500 micron;
Described after treatment containing the powder of beryllium silicon carbide fiber with thermal conductivity between 20-40W/m.K inorganic non-metallic powder, one or both in four pin ZnOws mix, form mixed powder and join in insulating material, the weight ratio accounting in mixed powder containing beryllium silicon carbide fiber is not less than 10%; The mass ratio of described mixed powder and described body material is 0.2-10.
Described inorganic non-metallic powder be aluminum oxide, boron nitride, mica one or more.
Described inorganic non-metallic powder be aluminum oxide, boron nitride, mica one or more.
In described silane coupling agent KH816, KH550, KH570 one or more.
Of the present inventionly can be prepared by the described method of the patent No. 2009100442849.4 containing beryllium silicon carbide fiber, also can be purchased from Hunan Bo Xiang novel material company limited, or on market, other produce the company containing beryllium silicon carbide fiber material.
High-strength highly-conductive thermal insulating material of the present invention, comprises following concrete preparation process:
(1) choose containing beryllium silicon carbide fiber, diameter is 5-500 micron, and wherein the content of beryllium is between 0.5-2.5%.
(2) chopped strand that is 2-100 containing the chopped one-tenth length-to-diameter ratio of beryllium silicon carbide fiber.Described chopped can be first with fibre chopping machine, to be cut into the fiber of length 2-10 millimeter, then grind with the shredder such as ball mill, described Ball-milling Time is preferably 5-60min.
(3) the chopped beryllium silicon carbide fiber that contains also will pass through following processing:
First containing beryllium silicon carbide fiber, in alumina sol, soak 0.5-10 hour, after filtration, at 500-700 ℃, process 3-30min again, and then at 1500-1800 ℃ of pyroprocessing 1-10 hour.
(being further enhanced in electrical insulating property and thermal conductivity containing beryllium silicon carbide fiber after the method is processed)
(4) the inorganic non-metallic powder that the chopped carbon fiber after processing is 20-40W/m.k with thermal conductivity, one or both in four pin ZnOws mix.Described inorganic non-metallic powder is one or more in aluminum oxide, boron nitride, mica, has thermal conductivity larger, and the high feature of insulativity.Because the material four pin ZnOws of selecting have acicular structure, have and strengthen the effect of strength increase wear resistance, antibacterial over-all properties.
(5) with silane coupling agent, process said mixture, increase the consistency of mixture and matrix material.
The preferred KH816 of described silane coupling agent, KH550, in KH570 one or more.
Preparation is when heat conductive insulating joint sealant, the mixed powder that contains beryllium silicon carbide fiber that surface treatment is good mixes with matrix glue according to required thermal conductivity, (matrix glue can be organic silica gel, epoxy resin, urethane etc.,) contain containing the mixed powder of beryllium silicon carbide fiber and the ratio of matrix glue between 0.2-10, if matrix glue is two-pack, two components all need to add mixed powder, the joint sealant mixing is de-bubbled under vacuum condition, packages the hot joint sealant of the high-strength highly-conductive that gets product;
While preparing high heat conductive insulating plastics, according to required thermal conductivity by the good mixed powder that contains beryllium silicon carbide fiber of surface treatment, as filler, mix with plastic substrate raw material, both mass ratios, between 0.2-10, are then prepared high heat-conducting plastic according to existing plastic process;
While preparing high heat conductive insulating pottery, according to required thermal conductivity by the good mixed powder that contains beryllium silicon carbide fiber of surface treatment, as filler, mix with ceramic matrix raw material, both mass ratios, between 0.2-10, are then prepared high heat-conducting ceramic according to existing ceramic process.
Alumina sol collocation method routinely in the present invention, detailed process is: aluminum isopropylate (Al (OC3H7) 3) and water generation hydrolysis reaction:
（Al(OC
3H
7)
3）+H
2O→(OC
3H
7)2AlOH+C
3H
7(OH)
Further there is the polycondensation of dehydration or dealcoholysis in its product, generates and take Al-O as main Al
2o
3colloidal sol.The steps include: alkoxide to add in hot water, after heated and stirred 20min, add hydrolyst-acid, temperature more than C stirs at 85 °; At 95 °, obtain Clear & Transparent Al2O3 colloidal sol after more than C keeping 24 hours.
What the features and advantages of the invention were that first the present invention adopted good insulating through processing contains beryllium silicon carbide fiber, its thermal conductivity can be up to 265/m.K, the beryllium oxide more best than heat conductivility (220W/m.K) be height approximately 20% also, be silicon carbide heat transfer coefficient (84W/m.K) 3-4 doubly, thermal conductivity surpasses most metals.With the beryllium carbon fiber that contains of the present invention, as thermal conducting agent filler, greatly improved the heat conductivility of compound rear material.If but directly adopt, common containing beryllium silicon carbide fiber, still to exist electrical insulating property slightly poor, thermal conductivity can not reach above-mentioned desired quantity, but electrical insulating property is further enhanced after alumina sol surface modification and pyroprocessing, thermal conductivity also approaches ideal value.Meanwhile, also due to the adding of the thermal conducting agent of fiber shape of the present invention, because the enhancement of its fiber has improved the intensity (referring to solidify the intensity of after fixing thing during joint sealant) of material greatly.Containing beryllium silicon carbide, there is good insulativity simultaneously, can make material keep insulation.Adding of the high insulation of high thermal conductivity inorganic non-metallic powder contributes to reduce costs, and improves product cost performance; Have heat conduction, enhancing, anti-microbial effect ZnOw the intensity that adds further raising material, wear resistance and have the additional properties such as antibacterial.
Accompanying drawing explanation
Fig. 1 is the concrete preparation method's of the present invention technical process.
Embodiment
Below in conjunction with embodiment, further illustrate the present invention, and unrestricted the present invention.
Please provide except patent system in 2009 obtain containing the embodiment of beryllium silicon carbide fiber, adopt between other the 200-280W/m.K that meets equally the listed condition of the present invention, the content of beryllium is at the fiber of 0.5-2.5%, and source, the source of buying is provided, and still can make the material of better effects of the present invention.
Embodiment 1:
Adopt 100 microns of diameters containing beryllium silicon carbide macrofiber, it is 0.6% containing beryllium amount, it is the staple fibre of 2 millimeters of the chopped one-tenth length of fibre chopping machine for 150W/m.K that contriver measures its thermal conductivity through fiber measuring thermal conductivity instrument, staple fibre was grinding in ball grinder 30 minutes, obtain the Powdered staple fibre of the about 2-5 of length-to-diameter ratio, powder soaks 1h through alumina sol, filter, process 5min for 600 ℃, and then process 10h at 1600 ℃, (contriver will soak and filter through alumina sol containing beryllium silicon carbide fiber, process 5min for 600 ℃, and then process 10h at 1600 ℃, through fiber measuring thermal conductivity instrument, record thermal conductivity and reach 265W/m.k) silicane tensio-active agent KH816 processing for Powdered staple fibre, Powdered containing after the oven dry of beryllium silicon carbide chopped strand after processing, with fiber: the ratio of matrix glue=6:1 and additional organosilicon glue A, B component is mixed, obtain the hot joint sealant A of high-strength highly-conductive, B component.Joint sealant A, B component are mixed after fixing.The thermal conductivity that records cured article by Laser Scintillation method is 6.21W/m.k, far above the about 1w/m.k of thermal conductivity of market joint sealant.
The tensile strength of measuring joint sealant cured article according to ASTM D638-2003 Chinese edition < < plastic tensile performance measurement method > > is 1.5MPa.Measuring surface resistivity and be greater than 500M Ω, is insulativity.
Comparative example 2:
With the conventional thermal conducting agent Al2O3 in market (the general about 40W/m.K of aluminum oxide thermal conductivity), with KH816, do surface treatment, after oven dry, with Al2O3: the ratio of matrix glue=6:1 is mixed with additional organosilicon glue A, B component, obtains heat conduction joint sealant A, B component.Joint sealant A, B component are mixed after fixing.The thermal conductivity that records cured article by Laser Scintillation method is 2.0W/m.k, situation about using containing beryllium silicon carbide fiber far below embodiment 1.While measuring the tensile strength of joint sealant cured article according to ASTM D638-2003 Chinese edition < < plastic tensile performance measurement method > >, find that cured article is very easy to broken, can not survey intensity, intensity is very low.
Comparative example 3, carries out according to embodiment 1, does not only enter following processing: alumina sol soaks 1h, filters, and processes 5min for 600 ℃, and then processes 10h at 1600 ℃.The joint sealant thermal conductivity of preparation is 3.02W/m.K, lower than the value of embodiment 1; Surface resistivity is 205M Ω, can't meet general service requirements.Visible alumina sol immersion and heat treated surface modification and pyroprocessing are subsequently to have very large benefit to improving thermal conductivity and electrical insulating property.
Embodiment 4:
Adopt 100 microns of diameters containing beryllium silicon carbide macrofiber (purchased from ... company?), it is 0.5% containing beryllium amount, through fiber measuring thermal conductivity instrument, measuring its thermal conductivity is 144W/m.K, staple fibre by 2 millimeters of the chopped one-tenth length of fibre chopping machine, staple fibre was grinding in ball grinder 30 minutes, obtain the Powdered staple fibre of the about 2-5 of length-to-diameter ratio, the chopped beryllium silicon carbide that contains after ball milling soaks 1h at alumina sol, filter, process 5min for 600 ℃, and then process 10h at 1600 ℃, Powdered chopped carbon fiber after processing mixes with 200 order aluminum oxide powder powder according to the ratio of 1:1, mixed powder is processed with silicane tensio-active agent KH816, after after processing, powder is dried, with mixture: the ratio of matrix glue=4:1 and additional organosilicon glue A, B component is mixed, obtain the hot joint sealant A of high-strength highly-conductive, B component.Joint sealant A, B component are mixed after fixing.The thermal conductivity that records cured article by Laser Scintillation method is 4.14W/m.k.The tensile strength of measuring joint sealant cured article according to ASTM D638-2003 Chinese edition < < plastic tensile performance measurement method > > is 1.9MPa.Measuring surface resistivity and be greater than 500M Ω, is insulativity.
Embodiment 5:
Adopt 100 microns of diameters containing beryllium silicon carbide macrofiber, it is 0.5% containing beryllium amount, through fiber measuring thermal conductivity instrument, measuring its thermal conductivity is 144W/m.K, staple fibre by 2 millimeters of the chopped one-tenth length of fibre chopping machine, staple fibre was grinding in ball grinder 30 minutes, obtain the Powdered staple fibre of the about 2-5 of length-to-diameter ratio, the chopped beryllium silicon carbide that contains after ball milling soaks 1h at alumina sol, filter, process 5min for 600 ℃, and then process 10h at 1600 ℃, Powdered staple fibre after processing mixes with (50%200 order boron nitride+50% ZnOw) mixture according to the ratio of 1:1, last mix powder is processed with silicane tensio-active agent KH816, after processing, mixture mixes after post-drying, with mixture: the ratio of matrix glue=3:1 and additional organosilicon glue A, B component is mixed, obtain the hot joint sealant A of high-strength highly-conductive, B component.Joint sealant A, B component are mixed after fixing.The thermal conductivity that records cured article by Laser Scintillation method is 3.52W/m.k, far above the about 1w/m.k of thermal conductivity of market joint sealant.The tensile strength of measuring joint sealant cured article according to ASTMD638-2003 Chinese edition < < plastic tensile performance measurement method > > is 2.5MPa, is greater than the numerical value of the 1.0MPa of market product.Measuring surface resistivity and be greater than 500M Ω, is insulativity.From embodiment 1,2,3,4 can find out that use contains beryllium silicon carbide fiber as the thermal conducting agent adding, and the thermal conductivity of joint sealant is much larger than the thermal conductivity of market product, and intensity is higher.And along with the add-on containing beryllium silicon carbide fiber increases, the thermal conductivity of joint sealant increases.In the < < disinfection technology standard > > that cured article after the heat conductive insulating joint sealant of the present embodiment solidifies is promulgated according to Ministry of Health of the People's Republic of China in November, 2002 under radiation of visible light, Quinn experiment content has been measured antibacterial effect.Experiment shows that sample is greater than 99.00% to the bacteriostasis rate of streptococcus aureus (ATCC 6538), intestinal bacteria (8099), Candida albicans (ATCC 10231), and sample has obvious antibacterial effect.
Embodiment 6:
Adopt 100 microns of diameters containing beryllium silicon carbide macrofiber, it is 0.8% containing beryllium amount, through fiber measuring thermal conductivity instrument, measuring its thermal conductivity is the staple fibre of 2 millimeters of the chopped one-tenth length of fibre chopping machine for 155W/m.K, staple fibre was grinding in ball grinder 30 minutes, obtain the Powdered staple fibre of the about 2-5 of length-to-diameter ratio, the chopped beryllium silicon carbide that contains after ball milling soaks 1h at alumina sol, filter, process 5min for 600 ℃, and then process 10h at 1600 ℃, Powdered staple fibre after processing is processed with silicane tensio-active agent KH550, Powdered containing after the oven dry of beryllium silicon carbide chopped strand after processing, with fiber: the ratio of matrix glue=4:1 is mixed with epoxy resin A component, obtain high-strength highly-conductive hot epoxy resin joint sealant A component.Joint sealant A component and solidifying agent B component (593) (A:B=5:1) are mixed after fixing.The thermal conductivity that records cured article by Laser Scintillation method is 4.22W/m.k, far above the about 1w/m.k of thermal conductivity of market epoxy resin embedding adhesive.The tensile strength of measuring joint sealant cured article according to ASTM D638-2003 Chinese edition < < plastic tensile performance measurement method > > is 60.1MPa, higher than the intensity (about 40MPa) of general epoxy resin.Measuring surface resistivity and be greater than 500M Ω, is insulativity.
Embodiment 7:
Adopt 50 microns of diameters containing beryllium silicon carbide macrofiber, it is 0.5% containing beryllium amount, through fiber measuring thermal conductivity instrument, measuring its thermal conductivity is 144W/m.K, staple fibre by 2 millimeters of the chopped one-tenth length of fibre chopping machine, staple fibre was grinding in ball grinder 30 minutes, obtain the Powdered staple fibre of the about 10-50 of length-to-diameter ratio, the chopped beryllium silicon carbide that contains after ball milling soaks 1h at alumina sol, filter, process 5min for 600 ℃, and then process 10h at 1600 ℃, Powdered staple fibre after processing is processed with silicane tensio-active agent KH570, Powdered containing after the oven dry of beryllium silicon carbide chopped strand after processing, with fiber: the ratio of matrix glue=4.5:1 and urethane A, B component is mixed, obtain the hot polyurethane pouring sealant A of high-strength highly-conductive, B component.Joint sealant A B component component (A:B=1:1) is mixed after fixing.The thermal conductivity that records cured article by Laser Scintillation method is 4.82W/m.k, far above the about 1w/m.k of thermal conductivity of market polyurethane pouring sealant.The tensile strength of measuring joint sealant cured article according to ASTM D638-2003 Chinese edition < < plastic tensile performance measurement method > > is 60.1MPa, belongs to high-strength polyurethane.Measuring surface resistivity and be greater than 500M Ω, is insulativity.
Embodiment 8:
Adopt 100 microns of diameters containing beryllium silicon carbide macrofiber, it is 0.7% containing beryllium amount, through fiber measuring thermal conductivity instrument, measuring its thermal conductivity is 141W/m.K, staple fibre by 2 millimeters of the chopped one-tenth length of fibre chopping machine, staple fibre was grinding in ball grinder 30 minutes, obtain the Powdered staple fibre of the about 2-5 of length-to-diameter ratio, the chopped beryllium silicon carbide that contains after ball milling soaks 1h at alumina sol, filter, process 5min for 600 ℃, and then process 10h at 1600 ℃, Powdered staple fibre after processing is processed with silicane tensio-active agent KH550, Powdered containing after the oven dry of beryllium silicon carbide chopped strand after processing, with fiber: the ratio of matrix plastic raw material=1:1 is mixed with PC raw material, then through PC plastic process, prepare PC composite plastic.The thermal conductivity that records composite plastic by Laser Scintillation method is 13.22W/m.k, far above the about 0.2w/m.k of thermal conductivity of PC plastics.The tensile strength of measuring joint sealant cured article according to ASTM D638-2003 Chinese edition < < plastic tensile performance measurement method > > is 80.1MPa, higher than the intensity (about 60MPa) of general PC plastics.Measuring surface resistivity and be greater than 500M Ω, is insulativity.
Embodiment 9:
Adopt 100 microns of diameters containing beryllium silicon carbide macrofiber, it is 0.5% containing beryllium amount, through fiber measuring thermal conductivity instrument, measuring its thermal conductivity is 140W/m.K, staple fibre by 2 millimeters of the chopped one-tenth length of fibre chopping machine, staple fibre was grinding in ball grinder 30 minutes, obtain the Powdered staple fibre of the about 2-5 of length-to-diameter ratio, the chopped beryllium silicon carbide that contains after ball milling soaks 1h at alumina sol, filter, process 5min for 600 ℃, and then process 10h at 1600 ℃, fiber after processing is with fiber: the ratio of alumina-ceramic raw material=1:1 is mixed with alumina-ceramic raw material, then through ceramic process, prepare alumina composite containing the composite ceramics of beryllium silicon carbide fiber.The thermal conductivity that records composite ceramics by Laser Scintillation method is 83.17W/m.k, far above the about 40w/m.k of alumina-ceramic thermal conductivity.The composite ceramics folding strength of measuring preparation according to the mensuration > > of the GB/T3810.4-2006 < < modulus of rupture and strength at break is 400MPa, belongs to high strength ceramics.Measuring surface resistivity and be greater than 500M Ω, is insulativity.
Claims (9)
1. a high-strength highly-conductive thermal insulating material, comprises body material, and described body material is ceramic matrix material, plastic matrix material or heat conductive insulating joint sealant matrix glue used; It is characterized in that, also add the powder containing beryllium silicon carbide fiber having after treatment, described insulating material is to be mixed with above-mentioned body material after silane coupling agent is processed by described powder; The described powder containing beryllium silicon carbide fiber is after treatment to be obtained by following mode: by the chopped silicon carbide fiber that is 2-100 containing the chopped one-tenth length-to-diameter ratio of beryllium silicon carbide fiber; After chopped silicon carbide fiber is ground, in alumina sol, soak, after filtration, at 500-700 ℃, process 3-30min again, and then at 1500-1800 ℃ of pyroprocessing 1-10 hour;
The described mass content containing beryllium in beryllium silicon carbide fiber is between 0.5-2.5%;
The mass ratio of described powder and described body material is 0.2-10:1.
2. insulating material according to claim 1, is characterized in that, containing beryllium silicon carbide fiber soak time in alumina sol, is 0.5-10 hour.
3. insulating material according to claim 1, is characterized in that, described chopped be first with fibre chopping machine, to be cut into after the fiber that length is 2-10mm, with ball mill grinding; Described Ball-milling Time is 5-60min.
4. insulating material according to claim 1, is characterized in that, described silane coupling agent be in KH550, KH570 one or both.
5. insulating material according to claim 1, is characterized in that, use containing beryllium silicon carbide fiber diameter between 5-500 micron.
6. a high-strength highly-conductive thermal insulating material, comprises body material, and described body material is ceramic matrix material, plastic matrix material or heat conductive insulating joint sealant matrix glue used; It is characterized in that, after treatment containing the powder of beryllium silicon carbide fiber with thermal conductivity between 20-40W/mK inorganic non-metallic powder, one or both in four pin ZnOws mix, form mixed powder and join in insulating material, the weight ratio accounting in mixed powder containing beryllium silicon carbide fiber is not less than 10%; The mass ratio of described mixed powder and described body material is 0.2-10:1; Described insulating material is to be mixed with above-mentioned body material after silane coupling agent is processed by described mixed powder; The described powder containing beryllium silicon carbide fiber is after treatment to be obtained by following mode: by the chopped silicon carbide fiber that is 2-100 containing the chopped one-tenth length-to-diameter ratio of beryllium silicon carbide fiber; After chopped silicon carbide fiber is ground, in alumina sol, soak, after filtration, at 500-700 ℃, process 3-30min again, and then at 1500-1800 ℃ of pyroprocessing 1-10 hour; The described mass content containing beryllium in beryllium silicon carbide fiber is between 0.5-2.5%.
7. insulating material according to claim 6, is characterized in that, described inorganic non-metallic powder is one or more in aluminum oxide, boron nitride, mica.
8. insulating material according to claim 6, is characterized in that, containing beryllium silicon carbide fiber soak time in alumina sol, is 0.5-10 hour.
9. insulating material according to claim 5, is characterized in that, described chopped be first with fibre chopping machine, to be cut into after the fiber that length is 2-10mm, with ball mill grinding; Described Ball-milling Time is 5-60min.
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| CN105199398B (en) * | 2015-10-27 | 2019-04-05 | 湖南博翔新材料有限公司 | A kind of organosilicon composite material and preparation method |
| CN105820546A (en) * | 2016-05-27 | 2016-08-03 | 李红玉 | Charger cooling and packaging material |
| CN107722624A (en) * | 2017-10-24 | 2018-02-23 | 中泽电气科技有限公司 | A kind of light-duty insulating heat-conductive power distribution cabinet |
| CN109486130B (en) * | 2018-11-16 | 2020-11-03 | 泉州市简能环保科技有限公司 | Preparation method of carbon fiber surface grafted tetrapod-like zinc oxide whisker heat-conducting powder |
| CN113133233A (en) * | 2020-01-15 | 2021-07-16 | 浙江盘毂动力科技有限公司 | Insulated heat-conducting encapsulated electrical element and encapsulating method thereof |
| CN112712944B (en) * | 2020-12-24 | 2022-04-08 | 武汉肯达科讯科技有限公司 | High-thermal-conductivity insulating gasket and preparation method thereof |
| CN117264498B (en) * | 2023-09-26 | 2024-03-12 | 沈阳宏远电磁线股份有限公司 | Self-adhesive paint for transposed conductor and coating method thereof |
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