CN102786721A - High-strength and high-heat conduction insulating material - Google Patents
High-strength and high-heat conduction insulating material Download PDFInfo
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- CN102786721A CN102786721A CN2012102772799A CN201210277279A CN102786721A CN 102786721 A CN102786721 A CN 102786721A CN 2012102772799 A CN2012102772799 A CN 2012102772799A CN 201210277279 A CN201210277279 A CN 201210277279A CN 102786721 A CN102786721 A CN 102786721A
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Abstract
The invention discloses a high-strength and high-heat conduction insulating material. The material comprises a base material and beryllium-containing silicon carbide fiber powder which is treated. The insulating material is prepared by treating the powder through a silane coupling agent and then blending the treated beryllium-containing silicon carbide fiber powder and the base material; the treated beryllium-containing silicon carbide fiber powder is chopped carbon fibers which are prepared by chopping beryllium-containing silicon carbide fibers, wherein the length-diameter ratio of the chopped carbon fibers is 2 to 100; and after the chopped carbon fibers are ground, the chopped carbon fibers are soaked in an aluminum oxide sol, and after filtration, the solution is treated for 3 to 30 minutes at the temperature of 500 to 700 DEG C and then is treated for 1 to 10 hours at the temperature of 1,500 to 1,800 DEG C. A heat-conducting insulating adhesive prepared by treating the high-strength and high-heat conduction insulating material is high in heat conductivity, insulativity and potting ability. The prepared heat-conducting insulating plastic and ceramic are high in heat conductivity. The defects of the current heat-conducting insulating material are overcome, and the performances are improved. Due to the reinforcement effect of the fiber, after curing, the strength of the heat-conducting insulating adhesive, the heat-conducting insulating plastic and ceramic is further improved, and the service life is long. Due to the addition of zinc oxide whiskers, the strength of the potting adhesive, the plastic and the ceramic is further improved, and additional performances, such as an antibacterial effect, are realized.
Description
Technical field
The invention belongs to novel thermally conductive material field, related is a kind of high-strength highly-conductive thermoinsulating material that contains the preparation of beryllium silicon carbide fiber that utilizes high heat conduction.
Background technology
Electronic Packaging density is increasingly high, and the volume of electron device is more and more littler, has adapted to the requirement of present unicircuit high-density development, but consequent heat dissipation problem can not be ignored.The seventies in 20th century, the heat flow density in the IC chip was from about 10Wcm between the nineties
-2Be increased to 100Wcm
-2Magnitude, the highest at present 200Wcm that reached
-2; The trend that this numerical value increases is still continuing.So big energy density if can not reasonably carry out the heat management design, will cause the inefficacy of microprocessor.
Thermal failure is because device when work, and after the semiconducter device of forming through pin and triode like electric current received certain impedance, electric energy changed heat into, causes the device inside temperature to raise.When temperature rises to a certain value, device will quit work because of inefficacy moment, when serious even can cause the burning of packaged material.Except Yin Wendu raises the inefficacy directly cause, temperature raises also can cause the inefficacy of other pattern, like mechanical creep, parasitic chemical reaction and diffusion of contaminants of bonding material or the like.
Element over-temperature not only can cause product failure, also might cause accident, causes personal injury difficult to the appraisal and financial loss.According to western medium, the apple ipod player that user holds is on fire suddenly in the compartment, causes that outskirts of a town, Tokyo train is compelled stopped transport 8 minutes.Fortunately there are not personnel injured in this accident.And since in November, 2007,27 overheated or incidents of catching fire of iPodnano music player have taken place in Japan, and wherein 4 cause user's slight burns.According to Japanese Industry and Economic News on June 30th, 2110: Sony's issue on the 30th, the notebook computer part type of " bio " by name be from 3 the end of month of this year, in a lot of countries except that Japan, crosses the accident that thermal initiation receptacle portion position is out of shape because of part and have 39.Temporarily there is not this type of accident to take place in Japanese native country.Because of accident may damage the user, Sony takes urgent counte-rplan, recalls object and comprises overseas about 530,000 5 thousand, the notebook computer that Japanese native country is about 50,000 2 thousand.
The application of principles such as the high efficiency and heat radiation problem of electronic devices and components and thermal conduction study, hydromeehanics is closely related.The purpose of dissipation from electronic devices is that the operating temperature of electronics is controlled (or claiming thermal control), with stability and the safety that guarantees its work.This has wherein related to and relevant heat radiation or the many-sided content such as the type of cooling, material of conducting heat.See that from application point of view method commonly used mainly contains: the application of principles such as natural heat dissipation or cooling, forced heat radiation or cooling, liquid cooling, refrigeration modes, the high efficiency and heat radiation problem of dredging electronic devices and components and thermal conduction study, hydromeehanics is closely related.Be transferred to shell or special scatterer no matter adopt which kind of radiating mode degree need or inherit the heat that circuit produces with components and parts.
The great power LED product has covered the market share of whole LED Application Areas about 75%, and China's semiconductor lighting in 2012 and the related industries output value are estimated to reach 3,000 hundred million yuan, and the high-power LED illumination product market sales revenue is estimated about 1,000 hundred million yuan.Following great power LED will become the main body of LED illumination application; And will replace the traditional lighting light source in fields such as backlight, automobile, landscape ornamental, Special Work illumination, general illuminations comprehensively; It is at mobile phone and middle large-scale LCD panel is backlight all is widely used, and market potential is huge.But at present poor reliability, relevant criterion a series of problems such as lack, cost an arm and a leg are perplexing the heat management problems in the development, particularly high-brightness LED illumination system of the bright industry of LED.The brightness meeting of the heat management high-brightness LED of LED lighting system is along with the junction temperature exponentially of chip successively decreases.Therefore, good radiating management is the key factor of LED solid-state lighting system to high-power development.The heat radiation of LED solid-state lighting system is the same with the heat radiation of microelectronics Packaging, the heat that device work produces, and the package system of at first being made up of through multiple layers of different materials heat conduction is transmitted to hot trap, is loose in environment by transmission of heat by convection again.
Use wide weary at field power cells such as new-energy automobile, military affairs.The power cell power density constantly increases under the pressure of loss of weight and raising power, because the inherent internal resistance, battery can generate heat; If even heat is not derived; Battery can be because overheated and lost efficacy, even blast total system was lost efficacy, and causes dangerous accident.
When not having special special material through embedding or sealing-in bridge joint; Heat conducts to shell through the air (thermal conductivity 0.02W/m.K) of thermal conductance rate variance; Or very poor that air gap conducts to scatterer through conductivity, cause electronic apparatus integral heat sink poor performance.Traditional joint sealant such as organosilicon, epoxy resin embedding adhesive be electronic devices and components fixedly, but thermal conductivity very low (0.1-0.2W/m.K) still can not satisfy the needs that modern electronic technology develops.
Drive the heat dissipation problem of the device blocks of heating simultaneously in order to satisfy electricity such as this electronics, electrical equipment, battery, it is outside to need a kind of special thermally conductive material that heat is derived.Owing to these parts, device are charged, this material require closely contacts with charged position simultaneously, and therefore this material should insulate.Other also have to use to make things convenient for, density can not be too high, environmental resistance will be got well, high voltage applications occasion dielectric strength wants big, and certain performance requriementss such as flame retardant resistance arranged.Heat-conducting insulation material is a kind of exotic materials that solves heat dissipation problem.The thermally conductive material electrician does in the heat dissipation problem of parts significant; It is after filling the heat transfer gap; Heat is conducted to heat such as shell or scatterer littlely and advance guaranteeing to have under the situation of electrical isolation, heat is dispersed into that the assurance system did not lose efficacy or the performance reduction because of overheated in the environment the most at last.
Thermally conductive material has heat conduction joint sealant, moulded heat-conductive insulated plastics, thermal conductive ceramic etc.Thermally conductive material abroad greatly about last century the eighties begin to arouse attention, China seriously begins to cause extensive attention in this century owing to heat management problems becomes.It is liquid that the heat conduction joint sealant belongs to before uncured, has flowability, and the glue viscosity is according to the difference of the material of product, performance, production technique and difference to some extent.Could realize its use value after the joint sealant completely solidified, can play waterproof and dampproof, dustproof, insulation, heat conduction after the curing, maintain secrecy, protection against corrosion, heatproof, shockproof effect.The electron pouring sealant kind is very many; Divide from the material type; Use at present is modal at most to be mainly 3 kinds; Be epoxy resin embedding adhesive, silicone resin joint sealant, polyurethane pouring sealant, the power density of electric components and parts is increasing, and is also increasingly high to the heat conductivility requirement of heat conductive insulating joint sealant.The producer that produces the heat conductive insulating joint sealant at present both at home and abroad is a lot, and the heat conductive insulating joint sealant performance that each company produces is different.Insulating property generally read to reach volume specific resistance 10
12Ω .cm, thermal conductivity between 0.6-0.9W/m.K, are to have belonged to the product of high thermal conductivity to 1.5W/m.K mostly, also have the external product thermal conductivity to reach 3.0W/m.K, but mechanical property are very poor, and intensity is very low, and power has just been pulverized a little.Heat-conducting plastic has application in many electric fields, the structural part of Chang Zuowei excellent radiation performance or functional part, the moulded heat-conductive insulated plastics that each company produces.Insulating property generally read to reach volume specific resistance 10
12Ω .cm, thermal conductivity between 0.6-0.9W/m.K, also are to have belonged to the product of high thermal conductivity to 1.5W/m.K mostly, and the moulded heat-conductive insulated plastics mechanical property that thermal conductivity is high simultaneously is very poor, and intensity is low.At field heat conductive insulating potteries such as Electronic Packaging important application is arranged, generally between 10-40w/m, high reaches as high as 40w/m.K like aluminum oxide to the thermal conductivity of the pottery of insulativity.
Summary of the invention
The object of the invention aims to provide a kind of high-strength highly-conductive thermoinsulating material, and cost is low, and good insulating has higher thermal conductivity, for existing insulating material, can improve the intensity of material greatly.
Further object of the present invention is, in the heat conduction that promotes material, enhanced effect, makes insulating material have certain anti-microbial effect, wear resistance.
The present invention contains the beryllium silicon carbide fiber through after a series of processing through employing; Utilize recombining process to prepare high-strength highly-conductive thermal isolation joint sealant, high heat conductive insulating plastics, these high heat conductive insulating materials of high heat conductive insulating pottery, be mainly used in fields such as the demanding electronics embedding of heat dispersion, encapsulation, structural part.This high heat conductive insulating material perhaps also has additional properties such as antibiotic.
Technical scheme of the present invention is: a kind of high-strength highly-conductive thermoinsulating material, comprise body material, and described body material is the used matrix glue of ceramic matrix material, plastic matrix material or heat conductive insulating joint sealant; The present invention has also added the powder that contains the beryllium silicon carbide fiber after treatment, and described insulating material is to be mixed and made into above-mentioned body material after silane coupling agent is handled by described powder; The described powder that contains the beryllium silicon carbide fiber after treatment is to be obtained by following mode: will contain beryllium silicon carbide fiber weak point and be cut into the chopped carbon fiber that length-to-diameter ratio is 2-100; After the chopped carbon fiber grinding, in alumina sol, soak, handle 3-30min at 500-700 ℃ again after the filtration, and then at 1500-1800 ℃ of pyroprocessing 1-10 hour;
The described mass content that contains beryllium in the beryllium silicon carbide fiber is between 0.5-2.5%;
The mass ratio of described powder and described body material is 0.2-10.
It is described that to contain beryllium silicon carbide fiber soak time in alumina sol be 0.5-10 hour.
Chopped carbon fiber heat transfer coefficient after treatment is 220-280W/m.K.
It is to use the fiber cutter to be cut into the fiber of length as 2-10mm earlier that described weak point is cut, and uses ball mill grinding again; The described ball milling time is 5-60min.
Among described silane coupling agent KH816, KH550, the KH570 one or more.
That uses contains beryllium silicon carbide fiber diameter between the 5-500 micron;
The said powder that contains the beryllium silicon carbide fiber after treatment and thermal conductivity between 20-40W/m.K inorganic non-metallic powder, in the four pin ZnOws one or both mix; Form mixed powder and join in the insulating material, contain the weight ratio that the beryllium silicon carbide fiber accounts in the mixed powder and be not less than 10%; The mass ratio of described mixed powder and described body material is 0.2-10.
Described inorganic non-metallic powder be aluminum oxide, SP 1, mica one or more.
Described inorganic non-metallic powder be aluminum oxide, SP 1, mica one or more.
Among described silane coupling agent KH816, KH550, the KH570 one or more.
The beryllium silicon carbide fiber that contains of the present invention promptly can be prepared by the patent No. 2009100442849.4 described methods, also can be available from the rich Xiang novel material ltd in Hunan, or other productions contain the company of beryllium silicon carbide fiber material on the market.
High-strength highly-conductive thermoinsulating material of the present invention comprises following concrete preparation process:
(1) choose and contain the beryllium silicon carbide fiber, diameter is the 5-500 micron, and wherein the content of beryllium is between 0.5-2.5%.
(2) contain beryllium silicon carbide fiber weak point and be cut into the chopped strand that length-to-diameter ratio is 2-100.It can be the fiber that is cut into length 2-10 millimeter earlier with the fiber cutter that said weak point is cut, and grinds with shredders such as ball mills again, and the described ball milling time is preferably 5-60min.
(3) short cutting contains the beryllium silicon carbide fiber and also will pass through following processing:
At first contain the beryllium silicon carbide fiber and in alumina sol, soaked 0.5-10 hour, handle 3-30min at 500-700 ℃ again after the filtration, and then at 1500-1800 ℃ of pyroprocessing 1-10 hour.
(the beryllium silicon carbide fiber that contains through after this method processing is further enhanced on electrical insulating property and thermal conductivity)
(4) chopped carbon fiber after handling is the inorganic non-metallic powder of 20-40W/m.k with thermal conductivity, in the four pin ZnOws one or both mix.Said inorganic non-metallic powder is one or more in aluminum oxide, SP 1, the mica, and it is bigger to have a thermal conductivity, and the high characteristics of insulativity.Because the material four pin ZnOws of selecting for use have acicular structure, have to strengthen effect, the antimicrobial over-all properties that intensity increases wear resistance.
(5) handle said mixture with silane coupling agent, increase the consistency of mixture and matrix material.
The preferred KH816 of described silane coupling agent, KH550, among the KH570 one or more.
When being prepared in the heat conductive insulating joint sealant; The mixed powder that contains the beryllium silicon carbide fiber that surface treatment is good mixes with matrix glue according to required thermal conductivity; (matrix glue can be organic silica gel, epoxy resin, urethane etc.;) contain the beryllium silicon carbide fiber the ratio of mixed powder and matrix glue between 0.2-10, if matrix glue is two-pack, two components all need add mixed powder; The joint sealant that mixes is de-bubbled under vacuum condition, packs the hot joint sealant of the high-strength highly-conductive that gets product;
During preparation high heat conductive insulating plastics; Then be that the mixed powder that contains the beryllium silicon carbide fiber that surface treatment is good is according to required thermal conductivity; As filler and plastic substrate raw materials mix, both mass ratios prepare high heat-conducting plastic according to existing plastic process then between 0.2-10;
During preparation high heat conductive insulating pottery; Be that the mixed powder that contains the beryllium silicon carbide fiber that surface treatment is good is according to required thermal conductivity; As filler and ceramic matrix raw materials mix, both mass ratios prepare high heat-conducting ceramic according to existing ceramic process then between 0.2-10.
Alumina sol obtains getting final product by the collocation method of routine among the present invention, and detailed process is: aluminum isopropylate (Al (OC3H7) 3) and water hydrolytic reactions:
（Al(OC
3H
7)
3）+H
2O→(OC
3H
7)2AlOH+C
3H
7(OH)
Its product further dewaters or the polycondensation of dealcoholysis, and generating with Al-O is main Al
2O
3Colloidal sol.The steps include: alkoxide is added in the hot water, behind the heated and stirred 20min, add hydrolyst-acid, temperature stirs more than the C at 85 °; Obtain Clear & Transparent Al2O3 colloidal sol 95 ° of maintenances more than the C after 24 hours.
Characteristics of the present invention and advantage are that the present invention has at first adopted and contain the beryllium silicon carbide fiber through the good insulating handled; Its thermal conductivity can be up to 265/m.K; Go back high about 20% than the best beryllium oxide of heat conductivility (220W/m.K); Be silit heat transfer coefficient (84W/m.K) 3-4 doubly, thermal conductivity surpasses most metal.As the thermal conducting agent filler, improved the heat conductivility of compound back material with the beryllium thomel that contains of the present invention greatly.But common contain the beryllium silicon carbide fiber still to exist electrical insulating property poor slightly if directly adopt; Thermal conductivity can not reach above-mentioned desired quantity; But be further enhanced through electrical insulating property after alumina sol surface-treated and the pyroprocessing, thermal conductivity is also near ideal value.Simultaneously, also because the adding of the thermal conducting agent of fiber shape of the present invention, because the enhancement of its fiber has improved the intensity (referring to solidify the intensity of after fixing thing during joint sealant) of material greatly.Containing beryllium silit simultaneously has good insulativity, can make material keep insulation.The adding of the high insulation of high thermal conductivity inorganic non-metallic powder helps to reduce cost, and improves the product price ratio; Adding with ZnOw of heat conduction, enhancing, anti-microbial effect further improves intensity, the wear resistance of material and additional properties such as antibiotic is arranged.
Description of drawings
Fig. 1 is the concrete preparing method's of the present invention technical process.
Embodiment
Further specify the present invention below in conjunction with embodiment, and unrestricted the present invention.
Please provide except that the embodiment that contains the beryllium silicon carbide fiber that patent system in 2009 gets; Adopt between other the 200-280W/m.K that meets the listed condition of the present invention equally; The content of beryllium is at the fiber of 0.5-2.5%, and source, the source of buying is provided, and still can make the material of better effects of the present invention.
Embodiment 1:
That adopts 100 microns of diameters contains beryllium silit macrofiber, and it contains the beryllium amount is 0.6%, and it is 150W/m.K is cut into 2 millimeters of length with fiber cutter weak point staple fibre that the contriver measures its thermal conductivity through fiber measuring thermal conductivity appearance; Staple fibre obtains the Powdered staple fibre of the about 2-5 of length-to-diameter ratio grinding in ball grinder 30 minutes, and powder soaks 1h through alumina sol; Filter; Handle 5min for 600 ℃, and then handle 10h at 1600 ℃, (contriver will contain the beryllium silicon carbide fiber and soak filtration through alumina sol; Handle 5min for 600 ℃; And then handle 10h at 1600 ℃, and recording thermal conductivity through fiber measuring thermal conductivity appearance and reach 265W/m.k) Powdered staple fibre handles with silicane tensio-active agent KH816, after handling that the back is Powdered and containing beryllium silit chopped strand and dry; With fiber: the ratio of matrix glue=6:1 is mixed with add-on type organic silica gel A, B component, obtains the hot joint sealant A of high-strength highly-conductive, B component.Joint sealant A, B component are mixed after fixing.The thermal conductivity that uses the laser scintillation method to record cured article is 6.21W/m.k, far above the about 1w/m.k of the thermal conductivity of market joint sealant.
The tensile strength of measuring the joint sealant cured article according to ASTM D638-2003 Chinese edition " plastic tensile performance measurement method " is 1.5MPa.Measure surface resistivity greater than 500M Ω, be insulativity.
Comparative Examples 2:
With market thermal conducting agent Al2O3 (the generally about 40W/m.K of aluminum oxide thermal conductivity) commonly used, do the surface processing with KH816, after the oven dry, with Al2O3: the ratio of matrix glue=6:1 is mixed with add-on type organic silica gel A, B component, obtains heat conduction joint sealant A, B component.Joint sealant A, B component are mixed after fixing.The thermal conductivity that uses the laser scintillation method to record cured article is 2.0W/m.k, uses the situation that contains the beryllium silicon carbide fiber far below embodiment 1.It is broken to find that cured article is very easy to when measuring the tensile strength of joint sealant cured article according to ASTM D638-2003 Chinese edition " plastic tensile performance measurement method ", can not survey intensity, and intensity is very low.
Comparative Examples 3 is carried out according to embodiment 1, does not advance following processing only: alumina sol soaks 1h, filters, and handles 5min for 600 ℃, and then handles 10h at 1600 ℃.The joint sealant thermal conductivity of preparation is 3.02W/m.K, is lower than the value of embodiment 1; Surface resistivity is 205M Ω, can't satisfy general request for utilization.It is thus clear that alumina sol immersion and heat treated surface-treated and pyroprocessing subsequently are that very big benefit is arranged to improving thermal conductivity and electrical insulating property.
Embodiment 4:
Adopt 100 microns of diameters contain beryllium silit macrofiber (available from ... Company?), it contains the beryllium amount is 0.5%, measuring its thermal conductivity through fiber measuring thermal conductivity appearance is 144W/m.K; Be cut into the staple fibre of 2 millimeters of length with fiber cutter weak point, staple fibre obtains the Powdered staple fibre of the about 2-5 of length-to-diameter ratio grinding in ball grinder 30 minutes; Weak point behind the ball milling is cut and is contained beryllium silit and soak 1h at alumina sol, filters, and handles 5min for 600 ℃; And then at 1600 ℃ of processing 10h; Powdered chopped carbon fiber after the processing is according to ratio and the 200 order aluminum oxide powder powder of 1:1, and mixed powder is handled with silicane tensio-active agent KH816, after powder is dried after handling; With mixture: the ratio of matrix glue=4:1 is mixed with add-on type organic silica gel A, B component, obtains the hot joint sealant A of high-strength highly-conductive, B component.Joint sealant A, B component are mixed after fixing.The thermal conductivity that uses the laser scintillation method to record cured article is 4.14W/m.k.The tensile strength of measuring the joint sealant cured article according to ASTM D638-2003 Chinese edition " plastic tensile performance measurement method " is 1.9MPa.Measure surface resistivity greater than 500M Ω, be insulativity.
Embodiment 5:
That adopts 100 microns of diameters contains beryllium silit macrofiber, and it contains the beryllium amount is 0.5%, and measuring its thermal conductivity through fiber measuring thermal conductivity appearance is 144W/m.K; Be cut into the staple fibre of 2 millimeters of length with fiber cutter weak point, staple fibre obtains the Powdered staple fibre of the about 2-5 of length-to-diameter ratio grinding in ball grinder 30 minutes; Weak point behind the ball milling is cut and is contained beryllium silit and soak 1h at alumina sol, filters, and handles 5min for 600 ℃; And then at 1600 ℃ of processing 10h; Powdered staple fibre after the processing mixes with (50%200 order SP 1+50% ZnOw) mixture according to the ratio of 1:1, and last mix powder is handled with silicane tensio-active agent KH816, after mixture mixes the back oven dry after handling; With mixture: the ratio of matrix glue=3:1 is mixed with add-on type organic silica gel A, B component, obtains the hot joint sealant A of high-strength highly-conductive, B component.Joint sealant A, B component are mixed after fixing.The thermal conductivity that uses the laser scintillation method to record cured article is 3.52W/m.k, far above the about 1w/m.k of the thermal conductivity of market joint sealant.The tensile strength of measuring the joint sealant cured article according to ASTMD638-2003 Chinese edition " plastic tensile performance measurement method " is 2.5MPa, greater than the numerical value of the 1.0MPa of market product.Measure surface resistivity greater than 500M Ω, be insulativity.From embodiment 1,2,3,4 can find out that use contains the beryllium silicon carbide fiber as the thermal conducting agent that adds, and the thermal conductivity of joint sealant is much larger than the thermal conductivity of market product, and intensity is higher.And along with the add-on that contains the beryllium silicon carbide fiber increases, the thermal conductivity of joint sealant increases.Cured article after the heat conductive insulating joint sealant of present embodiment solidifies has been measured antibacterial effect according to Quinn experiment content in " disinfection technology standard " of Ministry of Health of the People's Republic of China's in November, 2002 promulgation under radiation of visible light.Experiment show sample to the bacteriostasis rate of streptococcus aureus (ATCC 6538), intestinal bacteria (8099), Candida albicans (ATCC 10231) greater than 99.00%, sample has tangible antibacterial effect.
Embodiment 6:
That adopts 100 microns of diameters contains beryllium silit macrofiber, and it contains the beryllium amount is 0.8%, and measuring its thermal conductivity through fiber measuring thermal conductivity appearance is 155W/m.K is cut into 2 millimeters of length with fiber cutter weak point staple fibre; Staple fibre was grinding in ball grinder 30 minutes; Obtain the Powdered staple fibre of the about 2-5 of length-to-diameter ratio, the weak point behind the ball milling is cut and is contained beryllium silit and soak 1h at alumina sol, filters; Handle 5min for 600 ℃; And then handle 10h at 1600 ℃, the Powdered staple fibre after the processing is handled with silicane tensio-active agent KH550, after handling that the back is Powdered and containing beryllium silit chopped strand and dry; With fiber: the ratio of matrix glue=4:1 is mixed with epoxy resin A component, obtains high-strength highly-conductive hot epoxy resin joint sealant A component.Joint sealant A component and solidifying agent B component (593) (A:B=5:1) are mixed after fixing.The thermal conductivity that uses the laser scintillation method to record cured article is 4.22W/m.k, far above the about 1w/m.k of the thermal conductivity of market epoxy resin embedding adhesive.The tensile strength of measuring the joint sealant cured article according to ASTM D638-2003 Chinese edition " plastic tensile performance measurement method " is 60.1MPa, is higher than the intensity (about 40MPa) of general epoxy resin.Measure surface resistivity greater than 500M Ω, be insulativity.
Embodiment 7:
Adopt 50 microns of diameters contain beryllium silit macrofiber its to contain the beryllium amount be 0.5%, measuring its thermal conductivity through fiber measuring thermal conductivity appearance is 144W/m.K, is cut into the staple fibre of 2 millimeters of length with fiber cutter weak point; Staple fibre was grinding in ball grinder 30 minutes; Obtain the Powdered staple fibre of the about 10-50 of length-to-diameter ratio, the weak point behind the ball milling is cut and is contained beryllium silit and soak 1h at alumina sol, filters; Handle 5min for 600 ℃; And then handle 10h at 1600 ℃, the Powdered staple fibre after the processing is handled with silicane tensio-active agent KH570, after handling that the back is Powdered and containing beryllium silit chopped strand and dry; With fiber: the ratio of matrix glue=4.5:1 is mixed with urethane A, B component, obtains the hot polyurethane pouring sealant A of high-strength highly-conductive, B component.Joint sealant A B component component (A:B=1:1) is mixed after fixing.The thermal conductivity that uses the laser scintillation method to record cured article is 4.82W/m.k, far above the about 1w/m.k of the thermal conductivity of market polyurethane pouring sealant.The tensile strength of measuring the joint sealant cured article according to ASTM D638-2003 Chinese edition " plastic tensile performance measurement method " is 60.1MPa, belongs to high-strength polyurethane.Measure surface resistivity greater than 500M Ω, be insulativity.
Embodiment 8:
Adopt 100 microns of diameters contain beryllium silit macrofiber its to contain the beryllium amount be 0.7%, measuring its thermal conductivity through fiber measuring thermal conductivity appearance is 141W/m.K, is cut into the staple fibre of 2 millimeters of length with fiber cutter weak point; Staple fibre was grinding in ball grinder 30 minutes; Obtain the Powdered staple fibre of the about 2-5 of length-to-diameter ratio, the weak point behind the ball milling is cut and is contained beryllium silit and soak 1h at alumina sol, filters; Handle 5min for 600 ℃; And then handle 10h at 1600 ℃, the Powdered staple fibre after the processing is handled with silicane tensio-active agent KH550, after handling that the back is Powdered and containing beryllium silit chopped strand and dry; With fiber: the ratio of matrix plastic raw material=1:1 and PC raw materials mix prepare the PC composite plastic through the PC plastic process then.The thermal conductivity that uses the laser scintillation method to record composite plastic is 13.22W/m.k, far above the about 0.2w/m.k of the thermal conductivity of PC plastics.The tensile strength of measuring the joint sealant cured article according to ASTM D638-2003 Chinese edition " plastic tensile performance measurement method " is 80.1MPa, is higher than the intensity (about 60MPa) of general PC plastics.Measure surface resistivity greater than 500M Ω, be insulativity.
Embodiment 9:
That adopts 100 microns of diameters contains beryllium silit macrofiber, and it contains the beryllium amount is 0.5%, and measuring its thermal conductivity through fiber measuring thermal conductivity appearance is 140W/m.K; Be cut into the staple fibre of 2 millimeters of length with fiber cutter weak point, staple fibre obtains the Powdered staple fibre of the about 2-5 of length-to-diameter ratio grinding in ball grinder 30 minutes; Weak point behind the ball milling is cut and is contained beryllium silit and soak 1h at alumina sol; Filter, handle 5min for 600 ℃, and then handle 10h at 1600 ℃; Fiber after the processing is with fiber: the ratio of alumina-ceramic raw material=1:1 and alumina-ceramic raw materials mix prepare the compound composite ceramics that contains the beryllium silicon carbide fiber of aluminum oxide through ceramic process then.The thermal conductivity that uses the laser scintillation method to record composite ceramics is 83.17W/m.k, far above the about 40w/m.k of alumina-ceramic thermal conductivity.The composite ceramics folding strength of measuring preparation according to GB/T3810.4-2006 " mensuration of the modulus of rupture and strength at break " is 400MPa, belongs to high-strength pottery.Measure surface resistivity greater than 500M Ω, be insulativity.
Claims (8)
1. a high-strength highly-conductive thermoinsulating material comprises body material, and described body material is the used matrix glue of ceramic matrix material, plastic matrix material or heat conductive insulating joint sealant; It is characterized in that, add also that the powder that contains the beryllium silicon carbide fiber after treatment, described insulating material are arranged is to handle the back and above-mentioned body material is mixed and made into by described powder through silane coupling agent; The described powder that contains the beryllium silicon carbide fiber after treatment is to be obtained by following mode: will contain beryllium silicon carbide fiber weak point and be cut into the chopped carbon fiber that length-to-diameter ratio is 2-100; After the chopped carbon fiber grinding, in alumina sol, soak, handle 3-30min at 500-700 ℃ again after the filtration, and then at 1500-1800 ℃ of pyroprocessing 1-10 hour;
The described mass content that contains beryllium in the beryllium silicon carbide fiber is between 0.5-2.5%;
The mass ratio of described powder and described body material is 0.2-10.
2. according to the said material of claim 1, it is characterized in that containing beryllium silicon carbide fiber soak time in alumina sol is 0.5-10 hour.
3. according to the said material of claim 1, it is characterized in that the described beryllium silicon carbide fiber heat transfer coefficient that contains after treatment is 220-280W/m.K.
4. according to the said material of claim 1, it is characterized in that it is after using the fiber cutter to be cut into the fiber of length as 2-10mm earlier, to use ball mill grinding that described weak point is cut; The described ball milling time is 5-60min.
5. according to the said material of claim 1, it is characterized in that, among described silane coupling agent KH816, KH550, the KH570 one or more.
6. according to the said material of claim 1, it is characterized in that, use contain beryllium silicon carbide fiber diameter between the 5-500 micron.
7. according to each said material of claim 1-6; It is characterized in that; The said powder that contains the beryllium silicon carbide fiber after treatment and thermal conductivity between 20-40W/m.K inorganic non-metallic powder, in the four pin ZnOws one or both mix; Form mixed powder and join in the insulating material, contain the weight ratio that the beryllium silicon carbide fiber accounts in the mixed powder and be not less than 10%; The mass ratio of described mixed powder and described body material is 0.2-10.
8. according to the said material of claim 7, it is characterized in that, described inorganic non-metallic powder be aluminum oxide, SP 1, mica one or more.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105199398A (en) * | 2015-10-27 | 2015-12-30 | 湖南博翔新材料有限公司 | Organosilicon composite material and preparation method thereof |
| CN105820546A (en) * | 2016-05-27 | 2016-08-03 | 李红玉 | Charger cooling and packaging material |
| CN107722624A (en) * | 2017-10-24 | 2018-02-23 | 中泽电气科技有限公司 | A kind of light-duty insulating heat-conductive power distribution cabinet |
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| CN101891926A (en) * | 2010-07-22 | 2010-11-24 | 西北工业大学 | Polystyrene heat conducting composite and preparation method thereof |
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| CN101891926A (en) * | 2010-07-22 | 2010-11-24 | 西北工业大学 | Polystyrene heat conducting composite and preparation method thereof |
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| CN107722624A (en) * | 2017-10-24 | 2018-02-23 | 中泽电气科技有限公司 | A kind of light-duty insulating heat-conductive power distribution cabinet |
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| CN112712944B (en) * | 2020-12-24 | 2022-04-08 | 武汉肯达科讯科技有限公司 | High-thermal-conductivity insulating gasket and preparation method thereof |
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| CN117264498B (en) * | 2023-09-26 | 2024-03-12 | 沈阳宏远电磁线股份有限公司 | Self-adhesive paint for transposed conductor and coating method thereof |
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