CN102752000A - Chip and method for processing transmission signal - Google Patents

Chip and method for processing transmission signal Download PDF

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Publication number
CN102752000A
CN102752000A CN2012102129408A CN201210212940A CN102752000A CN 102752000 A CN102752000 A CN 102752000A CN 2012102129408 A CN2012102129408 A CN 2012102129408A CN 201210212940 A CN201210212940 A CN 201210212940A CN 102752000 A CN102752000 A CN 102752000A
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chip
signal
local oscillation
module
oscillation signal
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CN2012102129408A
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王珊
王许旭
李健
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ZTE Corp
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ZTE Corp
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Abstract

The invention provides a chip and a method for processing a transmission signal. The chip comprises a digital-analog conversion module, an in-phase quadrature (IQ) modulation/upper frequency conversion module and a gain control module, wherein the digital-analog conversion module is used for converting a baseband signal inputted to the chip to a middle-frequency analog signal; the IQ modulation/upper frequency conversion module is used for modulating the middle-frequency analog signal after being filtered to a radio frequency signal; and the gain control module is used for adjusting the power of the radio frequency signal to a preset power range. Due to the adoption of the chip and method, the problems in the prior art such as large difficulty in design a transmitter caused by a separation part can be solved, the difficulty in designing the transmitter can be reduced, and the distribution area of the transmitter can be reduced.

Description

Process chip that transmits and method
Technical field
The present invention relates to the communications field, in particular to a kind of process chip that transmits and method.
Background technology
Along with the development of mechanics of communication, in wireless telecommunications, the communication network of various standards is brought in constant renewal in; In order to satisfy the demand that people day by day all increase network; Third generation mobile system (Third Generation abbreviates 3G as) network is commercial in the whole world, the 4th generation mobile communcations system (Fourth Generation; Abbreviate 4G as) the technology of Long Term Evolution (Long Term Evolution abbreviates LTE as) mobile communcations system network also change in continual renovation.The network communication quality and the network coverage have become the leading indicator of each big operator operation competition.Simultaneously, arrange net energy consumption, volume and the unfailing performance of base station also becomes the key factor of cost competition between each big operator.
The sender technology reaches its maturity, and developing direction is also towards miniaturization, and simplicity of design develops.
At present, in the scheme of downstream signal emission, baseband signal transforms the back through digital-to-analogue and obtains analog intermediate frequency signal, and analog intermediate frequency signal carries out upconversion process again and obtains radiofrequency signal, and radiofrequency signal is amplified back output through signal.But handling what use between each modules of various signals is the device that separates, and in design, need consider digital to analog converter (Digital Analog Converter; Abbreviate DAC as) (in signal analysis, often signal being carried out resolution of vectors, is that frequency is identical with signal decomposition just with IQ; Peak amplitude is identical, but two components of phase phasic difference 90 degree, wherein; I refers to homophase (in-phase) component, Q friendship (quadrature) component of making a comment or criticism.) level conversion between the modulator, the factors such as impedance matching between IQ modulator and the signal amplifier, making has increased the design difficulty of transmitter; Simultaneously, because each module is a discrete device, device area occupied compression stroke is limited, and making has increased the fabric swatch area of transmitter, is the bottleneck that transmitter becomes miniaturization.
To above-mentioned problem one of at least in the correlation technique, effective solution is not proposed as yet at present.
Summary of the invention
The invention provides a kind of process chip that transmits and method, to solve at least in the correlation technique because discrete device, and the big problem of transmitter design difficulty that causes.
According to an aspect of the present invention, a kind of process chip that transmits is provided, it comprises: D/A converter module is used for converting the baseband signal of input chip into analog intermediate frequency signal; IQ modulation/up-conversion module is used for filtered analog intermediate frequency signal is modulated to radiofrequency signal; Gain control module is used for the power of radiofrequency signal is adjusted in the preset power bracket.
Preferably, the above-mentioned process chip that transmits also comprises: filtration module is used for analog intermediate frequency signal is carried out filtering.
Preferably; The above-mentioned process chip that transmits also comprises: the local oscillator module; Be used for behind the reference clock signal that receives the system that uses chip, producing the identical local oscillation signal of two-way frequency, wherein; One road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the chip use.
Preferably, the local oscillator module also is used for behind the local oscillation signal that receives the system that uses chip; After the local oscillation signal processing that receives; Produce the identical local oscillation signal of two-way frequency, wherein, the frequency of this two-way local oscillation signal is identical with the frequency of the local oscillation signal that receives; One road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the chip use.
Preferably, IQ modulation/up-conversion module also is used for filtered analog intermediate frequency signal is modulated to radiofrequency signal, and wherein, analog intermediate frequency signal is to carry out filtering through the filter outside the chip.
Preferably, the above-mentioned process chip that transmits also comprises: the voltage matches module, and the voltage that is used between logarithmic mode modular converter and the IQ modulation/up-conversion module matees; Impedance matching module is used for the impedance between IQ modulation/up-conversion module and the gain control module is mated.
Preferably, preset power bracket comprises: [18.5dBm, 13dBm].
According to a further aspect in the invention, a kind of processing method that transmits is provided, it comprises: the baseband signal that the D/A converter module in the chip will be imported chip converts analog intermediate frequency signal into; IQ modulation/up-conversion module in the chip is modulated to radiofrequency signal with filtered analog intermediate frequency signal; Gain control module in the chip is adjusted at the power of radiofrequency signal in the preset power bracket.
Preferably, the IQ modulation/up-conversion module in chip is modulated to filtered analog intermediate frequency signal before the radiofrequency signal, and the above-mentioned processing method that transmits also comprises: the filtration module in the chip carries out filtering to analog intermediate frequency signal.
Preferably; Local oscillator module in the chip is behind the reference clock signal that receives the system that uses chip; Produce the identical local oscillation signal of two-way frequency; Wherein, one road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the chip use.
In the present invention, the process chip that transmits is carried out a series of processing to transmitting, and the baseband signal that the D/A converter module in this chip will be imported said chip converts analog intermediate frequency signal into; IQ modulation/up-conversion module in the said chip is modulated to radiofrequency signal with filtered analog intermediate frequency signal, and then, the gain control module in the said chip is adjusted at the power of radiofrequency signal in the preset power bracket; So that signal is launched, realized in single-chip, accomplishing the preceding a series of processing of signal emission, avoided in correlation technique; Because each signal processor separates, and the needs when the design transmitter that cause can be considered the matching problem between each device, therefore; When the design transmitter; Can accomplish the preceding processing procedure of signal emission through the above-mentioned process chip that transmits, thereby reduce the difficulty of transmitter design, simultaneously; The use of the above-mentioned process chip that transmits helps to reduce the area of transmitter fabric swatch.
Description of drawings
Accompanying drawing described herein is used to provide further understanding of the present invention, constitutes the application's a part, and illustrative examples of the present invention and explanation thereof are used to explain the present invention, do not constitute improper qualification of the present invention.In the accompanying drawings:
Fig. 1 is the structured flowchart according to the process chip that transmits of the embodiment of the invention;
Fig. 2 is the structured flowchart of the process chip that transmits of the another kind according to the embodiment of the invention;
Fig. 3 is the flow chart according to the processing method that transmits of the embodiment of the invention;
Fig. 4 is the sketch map according to the mode of operation 1 of the local oscillator module of the embodiment of the invention;
Fig. 5 is the sketch map according to the mode of operation 2 of the local oscillator module of the embodiment of the invention;
Fig. 6 is the sketch map according to the instance 1 of the processing method that transmits of the embodiment of the invention;
Fig. 7 is the sketch map according to the instance 2 of the processing method that transmits of the embodiment of the invention;
Fig. 8 is the sketch map according to the instance 3 of the processing method that transmits of the embodiment of the invention; And
Fig. 9 is the sketch map according to the instance 4 of the processing method that transmits of the embodiment of the invention.
Embodiment
Hereinafter will and combine embodiment to specify the present invention with reference to accompanying drawing.Need to prove that under the situation of not conflicting, embodiment and the characteristic among the embodiment among the application can make up each other.
A kind of process chip that transmits is provided in the present embodiment, and as shown in Figure 1, this process chip that transmits comprises: D/A converter module 102 is used for converting the baseband signal of input chip into analog intermediate frequency signal; IQ modulation/up-conversion module 104 is connected to D/A converter module 102, is used for filtered analog intermediate frequency signal is modulated to radiofrequency signal; Gain control module 106 is connected to IQ modulation/up-conversion module 104, is used for the power of radiofrequency signal is adjusted in the preset power bracket.
In the above-described embodiments, the process chip that transmits is carried out a series of processing to transmitting, and the baseband signal that the D/A converter module 102 in this chip will be imported said chip converts analog intermediate frequency signal into; IQ modulation/up-conversion module 104 in the said chip is modulated to radiofrequency signal with filtered analog intermediate frequency signal, and then, the gain control module 106 in the said chip is adjusted at the power of radiofrequency signal in the preset power bracket; So that signal is launched, realized in single-chip, accomplishing the preceding a series of processing of signal emission, avoided in correlation technique; Because each signal processor separates, and the needs when the design transmitter that cause can be considered the matching problem between each device, therefore; When the design transmitter; Can accomplish the preceding processing procedure of signal emission through the above-mentioned process chip that transmits, thereby reduce the difficulty of transmitter design, simultaneously; The use of the above-mentioned process chip that transmits helps to reduce the area of transmitter fabric swatch.
Preferably; The above-mentioned process chip that transmits can be applied to communication field Remote Radio Unit (Remote Radio Unit; Abbreviate RRU as) the downstream signal lift-off technology in, with in the process of design transmitter, use said chip to accomplish processing to transmitting; And avoid needing in the prior art to consider the matching problem between each signal processor, thereby reduced the transmitter design difficulty.
In order to realize the filtering to analog intermediate frequency signal, as shown in Figure 2 in this preferred embodiment, the above-mentioned process chip that transmits also comprises: filtration module 108 is used for analog intermediate frequency signal is carried out filtering.
In order to satisfy the demand of different application scene, strengthen the flexibility of present embodiment, as shown in Figure 2; Above-mentioned IQ modulation/up-conversion module 104; Also be used for filtered analog intermediate frequency signal is modulated to radiofrequency signal, wherein, analog intermediate frequency signal is to carry out filtering through the filter outside the chip.Be that analog intermediate frequency signal also can be accomplished filtering through the filter outside the said chip; Therefore; Under the different application scene; It is to adopt the filtration module in the chip to come analog intermediate frequency signal is carried out filtering that the user can select as required neatly, still selects the filter of chip exterior to come analog intermediate frequency signal is carried out filtering.
In order to realize that analog intermediate frequency signal is modulated to radiofrequency signal, in this preferred embodiment, as shown in Figure 2; The above-mentioned process chip that transmits also comprises: local oscillator module 110; Be used for behind the reference clock signal that receives the system that uses chip, producing the identical local oscillation signal of two-way frequency, wherein; One road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the chip use.Promptly after local oscillator module 110 receives the reference clock signal of the system that uses said chip; Local oscillator module 110 produces the identical local oscillation signal of two-way frequency through phase-locked loop according to reference clock signal, to satisfy the required local oscillation signal of IQ modulation/up-conversion module 104 modulated radio signals.
In order to satisfy the demand of different application scene, strengthen the flexibility of present embodiment, as shown in Figure 2; Above-mentioned local oscillator module 110; Also be used for behind the local oscillation signal that receives the system that uses chip, after the local oscillation signal that receives is handled, produce the identical local oscillation signal of two-way frequency; Wherein, The frequency of this two-way local oscillation signal is identical with the frequency of the local oscillation signal that receives, and one road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the chip use.Be that local oscillator module 110 can also receive the local oscillation signal that the outside provides; Through processing such as signal amplifications; Obtain the identical local oscillation signal of two-way frequency; The frequency of this two-way local oscillation signal is identical with the frequency of the local oscillation signal that receives, and road local oscillation signal after will handling is transmitted to IQ modulation/up-conversion module 104 and uses, and the chip that another road local oscillation signal offers outside the said chip uses.Therefore; Under the different application scene; Local oscillator module 110 can be according to reference clock signal that receives or the identical local oscillation signal of local oscillation signal output two-way frequency; So that one road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs, other chips that another road local oscillation signal offers outside the chip use.
In order to realize the coupling between each module, in this preferred embodiment, the above-mentioned process chip that transmits also comprises: the voltage matches module, and the voltage that is used between logarithmic mode modular converter 102 and the IQ modulation/up-conversion module 104 matees; Impedance matching module is used for the impedance between IQ modulation/up-conversion module 104 and the gain control module 106 is mated.Promptly between D/A converter module 102 and IQ modulation/up-conversion module 104, the voltage matches module is set, to realize the voltage matches between the two, preferably, and in the process of design said chip, can be through circuit design to realize the function of voltage matches module; Between IQ modulation/up-conversion module 104 and gain control module 106, impedance matching module is set, to realize the impedance matching between the two, preferably, and in the process of design said chip, can be through circuit design to realize the function of impedance matching module.
Through the use of said chip, gain control module 106 can be adjusted at the power of radiofrequency signal in the preset power bracket, and to satisfy the demand of signal emission, preferably, this preset power bracket can comprise: [18.5dBm, 13dBm].
In this preferred embodiment, a kind of processing method that transmits is provided, as shown in Figure 3, this processing method that transmits comprises that step S302 is to step S306.
Step S302: the baseband signal that the D/A converter module in the chip will be imported chip converts analog intermediate frequency signal into.
Step S304: the IQ modulation/up-conversion module in the chip is modulated to radiofrequency signal with filtered analog intermediate frequency signal.
Step S306: the gain control module in the chip is adjusted at the power of radiofrequency signal in the preset power bracket.
Through above-mentioned steps, the process chip that transmits is carried out a series of processing to transmitting, and the baseband signal that the D/A converter module in this chip will be imported said chip converts analog intermediate frequency signal into; IQ modulation/up-conversion module in the said chip is modulated to radiofrequency signal with filtered analog intermediate frequency signal, and then, the gain control module in the said chip is adjusted at the power of radiofrequency signal in the preset power bracket; So that signal is launched, realized in single-chip, accomplishing the preceding a series of processing of signal emission, avoided in correlation technique; Because each signal processor separates, and the needs when the design transmitter that cause can be considered the matching problem between each device, therefore; When the design transmitter; Can accomplish the preceding processing procedure of signal emission through the above-mentioned process chip that transmits, thereby reduce the difficulty of transmitter design, simultaneously; The use of the above-mentioned process chip that transmits helps to reduce the area of transmitter fabric swatch.
Analog intermediate frequency signal is being carried out in the process of filtering; In order to satisfy the demand of different application scene; Strengthen the flexibility of present embodiment, in this preferred embodiment, the IQ modulation/up-conversion module in chip is modulated to filtered analog intermediate frequency signal before the radiofrequency signal; Can carry out filtering to analog intermediate frequency signal through the filtration module in the chip, also can accomplish filtering through the filter outside the said chip to analog intermediate frequency signal.
In realization analog intermediate frequency signal is modulated in the process of radiofrequency signal,, strengthens the flexibility of present embodiment in order to satisfy the demand of different application scene; In this preferred embodiment, the local oscillator module in the chip can realize two kinds of mode of operations, and is as shown in Figure 4; A kind of is that local oscillator module in the chip is behind the reference clock signal of the system that receive to use chip; Produce the identical local oscillation signal of two-way frequency, wherein, one road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs; As shown in Figure 5, other chips that another road local oscillation signal offers outside the chip use.Another kind is that local oscillator module in the chip is behind the local oscillation signal of the system that receive to use chip; After the local oscillation signal processing that receives; Produce the identical local oscillation signal of two-way frequency, wherein, the frequency of this two-way local oscillation signal is identical with the frequency of the local oscillation signal that receives; One road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the chip use.
Based on two kinds of mode of operations of above-mentioned local oscillator module, and analog intermediate frequency signal carried out the flexible selection of filtering, the above-mentioned processing method that transmits can have several working ways neatly, to satisfy the demand of different application scene.
In the present embodiment, what receive with local oscillator module 110 is reference clock signal, and the filtration module 108 through chip internal comes analog intermediate frequency signal is filtered into example; As shown in Figure 6; Need the baseband digital signal of emission to become analog intermediate frequency signal,, get into IQ modulation/up-conversion module 104 and carry out upward frequency conversion through after filtration module 108 filtering of chip internal through D/A converter module 102; Convert higher frequency to, i.e. radiofrequency signal; Through the adjustment of gain control module 106, export the radiofrequency signal of certain power bracket at last.At this moment, local oscillation signal is produced by chip internal local oscillator module 110, needs to give the reference clock signal of its input system.
In the present embodiment, what receive with local oscillator module 110 is reference clock signal, and the filter through chip exterior comes analog intermediate frequency signal is filtered into example; As shown in Figure 7; Need the baseband digital signal of emission to become analog intermediate frequency signal, after external filter filtering, get into IQ modulation/up-conversion module 104 and carry out upward frequency conversion through D/A converter module 102; Convert higher frequency to, i.e. radiofrequency signal; Through the adjustment of gain control module 106, export the radiofrequency signal of certain power bracket at last.At this moment, local oscillation signal is produced by chip internal local oscillator module 110, needs to give the reference clock signal of its input system.
In the present embodiment, what receive with local oscillator module 110 is the local oscillation signal that the outside provides, and the filtration module 108 through chip internal comes analog intermediate frequency signal is filtered into example; As shown in Figure 8; Need the baseband digital signal of emission to become analog intermediate frequency signal,, get into IQ modulation/up-conversion module 104 and carry out upward frequency conversion through after filtration module 108 filtering of chip internal through D/A converter module 102; Convert higher frequency to, i.e. radiofrequency signal; Through the adjustment of gain control module 106, export the radiofrequency signal of certain power bracket at last.At this moment, local oscillation signal is to be provided by the outside, and 110 of the local oscillator modules of chip internal play a part to amplify and transmit.
In the present embodiment, what receive with local oscillator module 110 is the local oscillation signal that the outside provides, and the filter through chip exterior comes analog intermediate frequency signal is filtered into example; As shown in Figure 9; Need the baseband digital signal of emission to become analog intermediate frequency signal, after external filter filtering, get into IQ modulation/up-conversion module and carry out upward frequency conversion through D/A converter module 102; Convert higher frequency to, i.e. radiofrequency signal; Through the adjustment of gain control module, export the radiofrequency signal of certain power bracket at last.At this moment, local oscillation signal is to be provided by the outside, and inner local oscillator module only plays a part to amplify and transmit.
From above description, can find out that the present invention has realized following technique effect: the process chip that transmits is carried out a series of processing to transmitting; The baseband signal that D/A converter module in this chip will be imported said chip converts analog intermediate frequency signal into, and the IQ modulation/up-conversion module in the said chip is modulated to radiofrequency signal with filtered analog intermediate frequency signal, then; Gain control module in the said chip is adjusted at the power of radiofrequency signal in the preset power bracket, so that signal is launched, has realized in single-chip, accomplishing the preceding a series of processing of signal emission; Avoided in correlation technique; Because each signal processor separates, and the needs when the design transmitter that cause can be considered the matching problem between each device, therefore; When the design transmitter; Can accomplish the preceding processing procedure of signal emission through the above-mentioned process chip that transmits, thereby reduce the difficulty of transmitter design, simultaneously; The use of the above-mentioned process chip that transmits helps to reduce the area of transmitter fabric swatch.Be based under the different application scene; It is to adopt the filtration module in the chip to come analog intermediate frequency signal is carried out filtering that the user can select as required neatly; Still select the filter of chip exterior to come analog intermediate frequency signal is carried out filtering; Local oscillator module 110 can be according to reference clock signal that receives or the identical local oscillation signal of local oscillation signal output two-way frequency; So that one road local oscillation signal is the local oscillation signal that IQ modulation/up-conversion module needs, other chips that another road local oscillation signal offers outside the chip use, and said chip can have several working ways neatly.
Obviously, it is apparent to those skilled in the art that above-mentioned each module of the present invention or each step can realize with the general calculation device; They can concentrate on the single calculation element; Perhaps be distributed on the network that a plurality of calculation element forms, alternatively, they can be realized with the executable program code of calculation element; Thereby; Can they be stored in the storage device and carry out, and in some cases, can carry out step shown or that describe with the order that is different from here by calculation element; Perhaps they are made into each integrated circuit modules respectively, perhaps a plurality of modules in them or step are made into the single integrated circuit module and realize.Like this, the present invention is not restricted to any specific hardware and software combination.
The above is merely the preferred embodiments of the present invention, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.All within spirit of the present invention and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. a process chip that transmits is characterized in that, comprising:
D/A converter module is used for converting the baseband signal of input chip into analog intermediate frequency signal;
IQ modulation/up-conversion module is used for filtered analog intermediate frequency signal is modulated to radiofrequency signal;
Gain control module is used for the power of said radiofrequency signal is adjusted in the preset power bracket.
2. chip according to claim 1 is characterized in that, also comprises:
Filtration module is used for said analog intermediate frequency signal is carried out filtering.
3. chip according to claim 1 and 2 is characterized in that, also comprises:
The local oscillator module; Be used for behind the reference clock signal that receives the system that uses said chip; Produce the identical local oscillation signal of two-way frequency; Wherein, one road local oscillation signal is the local oscillation signal that said IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the said chip use.
4. chip according to claim 3 is characterized in that, said local oscillator module; Also be used for behind the local oscillation signal that receives the system that uses said chip, after the local oscillation signal that receives is handled, produce the identical local oscillation signal of two-way frequency; Wherein, The frequency of this two-way local oscillation signal is identical with the frequency of the local oscillation signal that receives, and one road local oscillation signal is the local oscillation signal that said IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the said chip use.
5. chip according to claim 1; It is characterized in that said IQ modulation/up-conversion module also is used for filtered analog intermediate frequency signal is modulated to radiofrequency signal; Wherein, said analog intermediate frequency signal is to carry out filtering through the filter outside the said chip.
6. chip according to claim 1 is characterized in that, also comprises:
The voltage matches module is used for the voltage between said D/A converter module and the said IQ modulation/up-conversion module is mated;
Impedance matching module is used for the impedance between said IQ modulation/up-conversion module and the said gain control module is mated.
7. chip according to claim 1 is characterized in that, said preset power bracket comprises: [18.5dBm, 13dBm].
8. a processing method that transmits is characterized in that, comprising:
The baseband signal that D/A converter module in the chip will be imported said chip converts analog intermediate frequency signal into;
IQ modulation/up-conversion module in the said chip is modulated to radiofrequency signal with filtered analog intermediate frequency signal;
Gain control module in the said chip is adjusted at the power of said radiofrequency signal in the preset power bracket.
9. method according to claim 8 is characterized in that, the IQ modulation/up-conversion module in said chip also comprises before filtered analog intermediate frequency signal is modulated to radiofrequency signal:
Filtration module in the said chip carries out filtering to said analog intermediate frequency signal.
10. according to Claim 8 or 9 described methods, it is characterized in that,
Local oscillator module in the said chip is behind the reference clock signal that receives the system that uses said chip; Produce the identical local oscillation signal of two-way frequency; Wherein, One road local oscillation signal is the local oscillation signal that said IQ modulation/up-conversion module needs, and other chips that another road local oscillation signal offers outside the said chip use.
CN2012102129408A 2012-06-26 2012-06-26 Chip and method for processing transmission signal Pending CN102752000A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014067363A1 (en) * 2012-11-01 2014-05-08 中兴通讯股份有限公司 Integrated receiving apparatus
US20140225788A1 (en) * 2013-02-08 2014-08-14 Ubiquiti Networks, Inc. Radio system for long-range high speed wireless communication
CN109302241A (en) * 2017-12-12 2019-02-01 上海创远仪器技术股份有限公司 A kind of vector signal generation device and method based on chip
CN109450467A (en) * 2018-12-28 2019-03-08 陕西烽火电子股份有限公司 Device and method based on I/Q modulator interpolation phaselocked loop complex RF signal

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2759063Y (en) * 2004-12-30 2006-02-15 芯通科技(成都)有限公司 Remote-simulated RF transceiver module for wireless substation
CN1901705A (en) * 2005-07-20 2007-01-24 大唐移动通信设备有限公司 Base band chip and method for realizing multiple mode switch based on base band chip mobile terminal
CN201042006Y (en) * 2007-06-07 2008-03-26 杭州中科微电子有限公司 Single-slice integration low-power consumption 2.4GHz receiving and transmission chip
CN101275995A (en) * 2008-03-28 2008-10-01 西安华迅微电子有限公司 Global position system GPS receiver radio frequency chip
CN101316105A (en) * 2008-06-11 2008-12-03 苏州中科半导体集成技术研发中心有限公司 Multi-standard multi-module wireless transceiver
CN201708797U (en) * 2010-05-17 2011-01-12 福建先创通信有限公司 Digital frequency-selecting device for multi-carrier mobile communication relay equipment
WO2011161759A1 (en) * 2010-06-22 2011-12-29 ルネサスエレクトロニクス株式会社 Semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2759063Y (en) * 2004-12-30 2006-02-15 芯通科技(成都)有限公司 Remote-simulated RF transceiver module for wireless substation
CN1901705A (en) * 2005-07-20 2007-01-24 大唐移动通信设备有限公司 Base band chip and method for realizing multiple mode switch based on base band chip mobile terminal
CN201042006Y (en) * 2007-06-07 2008-03-26 杭州中科微电子有限公司 Single-slice integration low-power consumption 2.4GHz receiving and transmission chip
CN101275995A (en) * 2008-03-28 2008-10-01 西安华迅微电子有限公司 Global position system GPS receiver radio frequency chip
CN101316105A (en) * 2008-06-11 2008-12-03 苏州中科半导体集成技术研发中心有限公司 Multi-standard multi-module wireless transceiver
CN201708797U (en) * 2010-05-17 2011-01-12 福建先创通信有限公司 Digital frequency-selecting device for multi-carrier mobile communication relay equipment
WO2011161759A1 (en) * 2010-06-22 2011-12-29 ルネサスエレクトロニクス株式会社 Semiconductor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014067363A1 (en) * 2012-11-01 2014-05-08 中兴通讯股份有限公司 Integrated receiving apparatus
US20140225788A1 (en) * 2013-02-08 2014-08-14 Ubiquiti Networks, Inc. Radio system for long-range high speed wireless communication
US9733797B2 (en) * 2013-02-08 2017-08-15 Ubiquiti Networks, Inc. Radio system for long-range high speed wireless communication
US10452235B2 (en) 2013-02-08 2019-10-22 Ubiquiti Inc. Radio system for long-range high-speed wireless communication
US10656798B2 (en) 2013-02-08 2020-05-19 Ubiquiti Inc. Radio system for long-range high-speed wireless communication
CN109302241A (en) * 2017-12-12 2019-02-01 上海创远仪器技术股份有限公司 A kind of vector signal generation device and method based on chip
CN109302241B (en) * 2017-12-12 2023-12-01 上海创远仪器技术股份有限公司 Chip-based vector signal generating device and method
CN109450467A (en) * 2018-12-28 2019-03-08 陕西烽火电子股份有限公司 Device and method based on I/Q modulator interpolation phaselocked loop complex RF signal
CN109450467B (en) * 2018-12-28 2024-04-05 陕西烽火电子股份有限公司 Device and method for synthesizing radio frequency signal based on IQ modulator interpolation phase-locked loop

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Application publication date: 20121024