CN102746808A - High-conductivity graphene conducting resin and preparation method thereof - Google Patents
High-conductivity graphene conducting resin and preparation method thereof Download PDFInfo
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- CN102746808A CN102746808A CN2012102632967A CN201210263296A CN102746808A CN 102746808 A CN102746808 A CN 102746808A CN 2012102632967 A CN2012102632967 A CN 2012102632967A CN 201210263296 A CN201210263296 A CN 201210263296A CN 102746808 A CN102746808 A CN 102746808A
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Abstract
The invention discloses high-conductivity graphene conducting resin and a preparation method thereof. The conducting resin comprises, by mass, 0.1-98% of graphene and 2-99.9% of a binding agent; the grapheme contains polarity functional groups, the polarity functional groups account for 0-30% of the quantity of the grapheme, the binding agent is a polymer or/and a polymer monomer, when the polymer is used as a binding agent, the conducting resin also contains a solvent, the conducting resin comprises, by mass, 1-90% of the solvent, and the sum of all quantity contents of components in the conducting resin is 100%. According to the conducting resin, the electrical conductivity is excellent, the heat radiation performance is good, the conducting resin has adjustable light transmission performance and good ductility and elasticity, the preparation method is simple, the industrialization is easy to achieve.
Description
Technical field
The invention belongs to the material technology field, particularly relate to a kind of high conductivity graphene conductive glue and preparation method thereof.
Background technology
Graphene is a kind of two-dimentional carbon atom crystal of finding in 2004, is a kind of carbon material as thin as a wafer of single or multiple lift.That day from finding, just become one of hot research fields such as carbon material, nanotechnology, Condensed Matter Physics and functional materials.Graphene is to construct
Sp 2 The basic source material of hydridization carbon material, it can form soccerballene, materials such as carbon nanotube and graphite through modes such as curling or stacks.Graphene has a lot of peculiar physico-chemical properties, and Graphene is a kind of material that does not have energy gap, shows metallicity; In the Graphene of individual layer, each carbon atom all has the not electronics of Cheng Jian, therefore has extraordinary electroconductibility; Hole and electronics in the Graphene are separated from each other, and have caused the generation of new electronic conduction phenomenon, for example irregular quantum hall effect; Graphene also has good mechanical performance, optical property, thermal property; The surface property of Graphene is outstanding simultaneously, has excellent energy storage characteristic.Graphene has the physico-chemical property of excellence like this, no matter make the pure science research or the practical field of engineering technology on its basis, all has broad application prospects.Graphene can be used as the experiment porch of quantum electrodynamics, can also be used to preparing nano electron device, thermally conductive material, and electro-conductive material, the mechanics material, optical material also can be brought into play enormous function aspect energy storage.
Excellent electroconductibility is of outbalance in the numerous advantages of Graphene, and Graphene can be applied in the conductive resin to thin character and electroconductibility to gentle.Conductive resin is the sizing agent that has certain conductivity after a kind of curing or the drying; It is that conducting particles is main moity with matrix resin and conductive filler material usually; Bonding effect through matrix resin combines conducting particles; Form conductive path, realize being connected by the conduction of sticking material.The conducting particles of existing conductive resin is mainly metallic particles or graphite material, and the volume of these materials is bigger, and is difficult to form effectively connection.Because the densification of miniaturized, microminiaturization and printed substrate and the developing rapidly of Highgrade integration of electronic component, conductive resin can be processed slurry, realizes very high linear resolution.And conductive resin technology is simple, and easy handling can be enhanced productivity, so conductive resin is to substitute the slicker solder welding, realizes that the ideal of conduction connection is selected.At present the Graphene product form also is varied, like the Graphene powder, and the Graphene dispersion liquid, based on the thin-film material of Graphene, based on three-dimensional assembly of Graphene or the like, these materials all have wide application space in every field.But Graphene is reunited in practical application easily, and reunion influences the performance of its performance, and the Graphene good dispersion can directly be provided, and the graphene conductive glue of stable in properties seems particularly important.
Summary of the invention
Technical problem to be solved by this invention is: the deficiency that remedies above-mentioned prior art; A kind of high conductivity graphene conductive glue and preparation method thereof is proposed; This conductive resin excellent electric conductivity, thermal diffusivity is good, has adjustable light transmission and good ductility and elasticity; The preparation method is simple, is prone to realize industriallization.
Technical problem of the present invention solves through following technical scheme:
A kind of high conductivity graphene conductive glue comprises Graphene and sticker, and in conductive resin, the mass content of said Graphene is 0.1 ~ 98%, and the mass content of said sticker is 2 ~ 99.9%; Contain polar functional group in the said Graphene, said polar functional group accounts for 0 ~ 30% of said Graphene quality, and said caking agent is that polymkeric substance is or/and polymer monomer; When independent use polymkeric substance during as caking agent, also contain solvent in this conductive resin, the mass content of said solvent in conductive resin is 1-90%, the mass content sum of each component is 100% in the conductive resin.
In the above technical scheme, the electroconductibility of Graphene lamella itself is just very excellent, again the synergistic effect through sticker; Can form good, the uniform dispersion between sticker and the Graphene lamella, avoid the reunion of Graphene, simultaneously; Use contains the Graphene of polar functional group, because the similar compatibility principle, has between Graphene and the polar sticker of polar functional group and has better mutual solubility; An amount of polar functional group that contains makes sticker and Graphene have better dispersiveness and homogeneity; More help the performance of the conductivity of Graphene,, can realize the electroconductibility adjusting through regulating the content of Graphene in conductive resin; Graphene has thermal conductivity well; Through the homodisperse of Graphene lamella in conductive resin; Guaranteed the heat dispersion of this conductive resin, utilized the thermal conductivity of this excellence, helped conductive resin timely heat that ohm effect of electric current is produced in practical application and leave; Reduce the conductive resin temperature, prevent that conductive resin lost efficacy; Single-layer graphene can see through 97.7% visible light, can realize that through the Graphene addition in the adjusting conductive resin light transmission of conductive resin is regulated.
Preferably, the mass content of said Graphene is 5 ~ 30%.
Preferably, said polar functional group is at least a in carboxyl, hydroxyl, epoxy group(ing), carbonyl, amino, the nitro; Said polar functional group preferably accounts for 0.5 ~ 20% of said Graphene quality.
Preferably, said caking agent is a rate elongation greater than 10% polymkeric substance or/and can generate the polymer monomer of rate elongation greater than 10% polymkeric substance; The mass content of said sticker in conductive resin is preferably 20 ~ 90%.
In this preferable range, more help realizing the homogeneous and the stable dispersion of Graphene, reduce the gathering of Graphene; Guarantee the ductility and the elasticity of conductive resin simultaneously, rate elongation is greater than 50% when making resistivity less than 100 m Ω cm.
Preferably, said polymkeric substance is at least a in styrene-butadiene rubber(SBR), epoxy resin, silicone resin, polyimide resin, resol, urethane, vinyl resin, Xylo-Mucine, pvdf, tetrafluoroethylene, ROHM, polyacrylonitrile, polymethyl acrylate, polyethyl acrylate, the ROHM-vinylbenzene.
Preferably; Said polymer monomer is the monomer of at least a polymkeric substance below generating, and said polymkeric substance is styrene-butadiene rubber(SBR), silicone resin, polyimide resin, resol, urethane, vinyl resin, Xylo-Mucine, pvdf, tetrafluoroethylene, ROHM, polyacrylonitrile, polymethyl acrylate, polyethyl acrylate, ROHM-vinylbenzene.
Preferably, also comprise auxiliary component, said auxiliary component is at least a in carbon nanotube, carbon nano fiber, super conductive carbon, graphitized carbon black, acetylene black, carbon dust, the nano metal powder; The mass content of said auxiliary component in conductive resin is 0 ~ 95%, 0% not get, and the mass content sum of each component is 100% in the conductive resin.
Adopt above technical scheme, adding auxiliary component can produce synergistic effect with Graphene, sticker, has further improved the electroconductibility of this conductive resin, through the ratio of regulation and control auxiliary component in conductive resin, also can realize the electroconductibility adjusting.
Preferably, said solvent is N-Methyl pyrrolidone, water, acetone, ethanol, N, at least a in dinethylformamide, methylene dichloride, trichloromethane, propyl alcohol, Virahol, the terepthaloyl moietie.
A kind of preparation method of above-mentioned each described high conductivity graphene conductive glue comprises the steps:
Static eliminator premix: polymer monomer is mixed with Graphene, perhaps polymer monomer, polymkeric substance are mixed with Graphene, obtain the preceding aggressiveness of conductive resin;
Conductive resin preparation: before said conductive resin, add initiator in the aggressiveness, perhaps use light-initiated, thermal initiation, make said polymer monomer polymerization to prepare conductive resin.
Perhaps, comprise the steps:
Static eliminator premix: in Graphene, add appropriate solvent and mix, make that Graphene is soaked into;
Polymkeric substance premix: in polymkeric substance, add appropriate solvent and mix, make polymkeric substance by swelling;
Conductive resin preparation: above-mentioned static eliminator pre-composition and polymkeric substance pre-composition are mixed, add stirring solvent and prepare conductive resin;
Perhaps, comprise the steps: that Graphene, polymkeric substance and solvent are directly mixed stirring obtains conductive resin.
Preferably, when the static eliminator premix, also add auxiliary component, perhaps when Graphene, polymkeric substance and solvent directly being mixed stirring, also add auxiliary component; The mass content of said auxiliary component in conductive resin is 0 ~ 95%, 0% not get.
The present invention further has the following advantages: 1, existing conductive resin generally presents fragility after solidifying; And graphene conductive glue of the present invention is a kind of flexible glue; Still have good ductility and elasticity after the curing, this conductive resin more helps cushioning the deformation in the use; When 2, utilizing polymer monomer for the feedstock production conductive resin, this polymer monomer itself can also need not to add any solvent again as solvent, reduce production cost, and this preparation technology is simple, is easy to realize industrialization.
Embodiment
Below in conjunction with preferred embodiment the present invention is carried out detailed elaboration.
The present invention provides a kind of high conductivity graphene conductive glue, in one embodiment, comprises Graphene and sticker, and in conductive resin, the mass content of Graphene is 0.1 ~ 98%, and the mass content of sticker is 2 ~ 99.9%; Contain polar functional group in the Graphene, polar functional group accounts for 0 ~ 30% of Graphene quality, and caking agent is that polymkeric substance is or/and polymer monomer; When independent use polymkeric substance during as caking agent, also contain solvent in this conductive resin, the mass content of solvent in conductive resin is 1-90%, the mass content sum of each component is 100% in the conductive resin.
In other embodiments, one or more in can preferred following scheme:
The mass content of Graphene is 5 ~ 30%.
Polar functional group is at least a in carboxyl, hydroxyl, epoxy group(ing), carbonyl, amino, the nitro.
Polar functional group accounts for 0.5 ~ 20% of said Graphene quality.
Caking agent is a rate elongation greater than 10% polymkeric substance or/and can generate the polymer monomer of rate elongation greater than 10% polymkeric substance.
The mass content of sticker in conductive resin is preferably 20 ~ 90%.
Polymkeric substance is at least a in styrene-butadiene rubber(SBR), epoxy resin, silicone resin, polyimide resin, resol, urethane, vinyl resin, Xylo-Mucine, pvdf, tetrafluoroethylene, ROHM, polyacrylonitrile, polymethyl acrylate, polyethyl acrylate, the ROHM-vinylbenzene.
Polymer monomer is the monomer of at least a polymkeric substance below generating, and polymkeric substance is styrene-butadiene rubber(SBR), silicone resin, polyimide resin, resol, urethane, vinyl resin, Xylo-Mucine, pvdf, tetrafluoroethylene, ROHM, polyacrylonitrile, polymethyl acrylate, polyethyl acrylate, ROHM-vinylbenzene.
Also comprise auxiliary component, auxiliary component is at least a in carbon nanotube, carbon nano fiber, super conductive carbon, graphitized carbon black, acetylene black, carbon dust, the nano metal powder.
The mass content of auxiliary component in conductive resin is 0 ~ 95%, 0% not get, and the mass content sum of each component is 100% in the conductive resin.
Solvent is N-Methyl pyrrolidone, water, acetone, ethanol, N, at least a in dinethylformamide, methylene dichloride, trichloromethane, propyl alcohol, Virahol, the terepthaloyl moietie.
The present invention also provides the preparation method of the described high conductivity graphene conductive of a kind of above-mentioned arbitrary embodiment glue, comprises the steps:
Static eliminator premix: polymer monomer is mixed with Graphene, perhaps polymer monomer, polymkeric substance are mixed with Graphene, obtain the preceding aggressiveness of conductive resin;
Conductive resin preparation: add initiator in the aggressiveness before the conductive glue, perhaps use light-initiated, thermal initiation, make the polymer monomer polymerization to prepare conductive resin.
Perhaps, comprise the steps:
Static eliminator premix: in Graphene, add appropriate solvent and mix, make that Graphene is soaked into;
Polymkeric substance premix: in polymkeric substance, add appropriate solvent and mix, make polymkeric substance by swelling;
Conductive resin preparation: above-mentioned static eliminator pre-composition and polymkeric substance pre-composition are mixed, add stirring solvent and prepare conductive resin;
Perhaps, comprise the steps: that Graphene, polymkeric substance and solvent are directly mixed stirring obtains conductive resin.
Preferably, when the static eliminator premix, also add auxiliary component, perhaps when Graphene, polymkeric substance and solvent directly being mixed stirring, also add auxiliary component; The mass content of auxiliary component in conductive resin is 0 ~ 95%, 0% not get.
Below through embodiment more specifically the present invention is set forth in detail.Embodiment 1
Step 1; The static eliminator premix: get 140 g carboxyl mass content and be 2% with epoxy group(ing) quality content be 5% Graphene, 20 g graphitized carbon blacks; Premix in N-Methyl pyrrolidone (N-methyl-2-pyrrolidone, initialism the are NMP) solvent of 600g utilizes ultrasonic mixing 1 hour; Ultransonic power is 200 W, makes that Graphene and graphitized carbon black are soaked into;
Step 2, the caking agent premix: the nmp solvent that in the pvdf (PVDF) of 40 g, adds 600g mixes, and utilizes ultrasonic mixing 2 hours, and ultransonic power is 300 W, makes pvdf by swelling;
Step 3, the conductive resin preparation: the static eliminator pre-composition mixes with the caking agent pre-composition, and the nmp solvent that adds 600g utilizes mechanical stirring under 200 rpm rotating speeds, to stir 8 hours, prepares this conductive resin.
Embodiment 2
Present embodiment and embodiment 1 adopts identical raw material parameter and method, just with carboxyl-content be 2% with epoxy group content be that the addition of 5% Graphene changes 1980 g into, the addition of PVDF changes 160g into.
Embodiment 3
Present embodiment and embodiment 1 adopts identical raw material parameter and method, just with carboxyl-content be 2% with epoxy group content be that the addition of 5% Graphene changes 45g into, the addition of PVDF changes 160g into.
Embodiment 4
Step 1; The static eliminator premix: get 140 g carboxyl mass content and be 15% with epoxy group(ing) quality content be 5% Graphene, 20 g nano carbon fibers; Premix in the N-Methyl pyrrolidone that wherein adds 600g (N-methyl-2-pyrrolidone, initialism are NMP) solvent utilizes ultrasonic mixing 1 hour; Ultransonic power is 200 W, makes that Graphene and auxiliary component are soaked into;
Step 2, the caking agent premix: the nmp solvent that in the tetrafluoroethylene of 40 g, adds 600g mixes, and utilizes ultrasonic mixing 2 hours, and ultransonic power is 300 W, makes tetrafluoroethylene by swelling;
Step 3, the conductive resin preparation: the static eliminator pre-composition mixes with the caking agent pre-composition, and the nmp solvent that adds 600g utilizes mechanical stirring under 200 rpm rotating speeds, to stir 8 hours, prepares this conductive resin.
Embodiment 5
Present embodiment adopts identical raw material parameter and method with embodiment 1, just changes solvent NMP into N, dinethylformamide (N, N-Dimethylformamide, initialism are DMF).
Embodiment 6
Present embodiment adopts identical raw material parameter and method with embodiment 1, just changes sticker PVDF into silicone resin.
Embodiment 7
Present embodiment and embodiment 1 adopts identical raw material parameter and method, just with carboxyl-content be 2% with epoxy group content be that 5% Graphene changes the Graphene that contains nitro into, the mass content of nitro is 30% of a Graphene.
Embodiment 8
Present embodiment adopts identical raw material parameter and method with embodiment 7, just changes solvent NMP into water.
Embodiment 9
Present embodiment adopts identical raw material parameter and method with embodiment 8, just changes the sticker pvdf into Xylo-Mucine.
Embodiment 10
Present embodiment adopts identical raw material parameter and method with embodiment 8, just changes graphitized carbon black into carbon nanotube.
Embodiment 11
Get 140 g Graphenes and join in the nmp solvent of 1800g, add PVDF and the 20 g graphitized carbon blacks of 40 g then, utilize ultrasonic mixing 4 hours, ultransonic power is 300 W, can obtain graphene conductive glue.
Embodiment 12
Step 1, premix: get 20 g Graphenes, 20 g graphitized carbon blacks, to the methyl acrylate that wherein adds 60g, utilize ultrasonic mixing 1 hour, ultransonic power is 200 W, obtains the preceding aggressiveness of conductive resin;
Step 2, conductive resin preparation: to carrying out illumination in the aggressiveness before the conductive resin of step 1 preparation,, can control illumination condition and make methyl acrylate partly or entirely be polymerized to polymethyl acrylate, prepare this conductive resin according to actual requirement.
Embodiment 13
Present embodiment adopts identical raw material parameter and method with embodiment 12, and just the addition with Graphene changes 100g into.
Embodiment 14
Step 1, premix: get the 5g Graphene, 475 g nano-silver powders to the ethyl propenoate that wherein adds 20g, utilized ball mill mixing 10 hours, and rotating speed is 400rpm, obtained the preceding aggressiveness of conductive resin;
Step 2, conductive resin preparation: to carrying out illumination in the aggressiveness before the conductive resin of step 1 preparation,, can control illumination condition and make methyl acrylate partly or entirely be polymerized to polymethyl acrylate, prepare this conductive resin according to actual requirement.
Embodiment 15
Present embodiment adopts identical raw material parameter and method with embodiment 13, and just the addition with methyl acrylate changes 10.6g into.
Embodiment 16
Present embodiment adopts identical raw material parameter and method with embodiment 12, and just the addition with methyl acrylate changes 760g into.
Embodiment 17
Present embodiment adopts identical raw material parameter and method with embodiment 12, does not just add any auxiliary component.
Embodiment 18
Step 1, premix: get the 2g Graphene, to the ethyl propenoate that wherein adds 1980g, utilize ultrasonic mixing 1 hour, ultransonic power is 200 W, obtains the preceding aggressiveness of conductive resin;
Step 2, conductive resin preparation: to carrying out illumination in the aggressiveness before the conductive resin of step 1 preparation,, can control illumination condition and make methyl acrylate partly or entirely be polymerized to polymethyl acrylate, prepare this conductive resin according to actual requirement.
Embodiment 19
Step 1, premix: get the 98g Graphene, to the ethyl propenoate that wherein adds 2g, utilized ball mill mixing 20 hours, rotating speed is 400rpm, obtains the preceding aggressiveness of conductive resin;
Step 2, conductive resin preparation: to carrying out illumination in the aggressiveness before the conductive resin of step 1 preparation,, can control illumination condition and make methyl acrylate partly or entirely be polymerized to polymethyl acrylate, prepare this conductive resin according to actual requirement.
Embodiment 20
Step 1, the static eliminator premix: get 20 g Graphenes, 20 g graphitized carbon blacks, to the methyl acrylate that wherein adds 30g, utilize ultrasonic mixing 2 hours, ultransonic power is 200 W, obtains the preceding aggressiveness of conductive resin;
Step 2, the caking agent premix: the nmp solvent that in the pvdf (PVDF) of 160 g, adds 20g mixes, and utilizes ultrasonic mixing 2 hours, and ultransonic power is 300 W, makes pvdf by swelling;
Step 3; The conductive resin preparation: the static eliminator pre-composition mixes with the caking agent pre-composition; The methyl acrylate that adds 10g utilizes mechanical stirring under 200 rpm rotating speeds, to stir 8 hours, subsequently it is carried out illumination, according to actual requirement; Can control illumination condition and make methyl acrylate partly or entirely be polymerized to polymethyl acrylate, prepare this conductive resin.
The comparative example
Step 1, the static eliminator premix: get 160 g graphitized carbon blacks, premix in the nmp solvent that wherein adds 600g utilizes ultrasonic mixing 1 hour, and ultransonic power is 200 W, and it is soaked into;
Step 2, the caking agent premix: the nmp solvent that in the pvdf (PVDF) of 40 g, adds 600g mixes, and utilizes ultrasonic mixing 2 hours, and ultransonic power is 300 W, makes pvdf by swelling;
Step 3, the conductive resin preparation: the static eliminator pre-composition mixes with the caking agent pre-composition, and the nmp solvent that adds 600g utilizes mechanical stirring under 200 rpm rotating speeds, to stir 8 hours, prepares this conductive resin.
More than each embodiment and comparative example's resistivity and rate elongation test:
Resistivity measurement method: utilize coating device that testing sample is evenly applied one deck 20 cm * 20 cm conductive resins on insulative plastic substrate; Thickness is 0.1 mm; It is dried 5h in 80 ℃ of vacuum drying ovens; Utilize the four point probe resistivity meter that resistivity measurement is carried out in 5 positions of conductive adhesive layer picked at random, get its MV.
The rate elongation testing method: utilize coating device that testing sample is applied one deck 20 cm * 20 cm conductive resins in substrate, it is dried 5h in 80 ℃ of vacuum drying ovens after, conductive resin and substrate are peeled off, it is wide to be cut into 1 cm, length is the conductive adhesive layer of 10 cm.Then the one of which end is fixed,, measured its length variations its pulling force that applies 10 N.Its MV is got in each sample random test 5 times.
To the rate elongation of polymkeric substance, also be to adopt the testing method identical among the present invention with the rate elongation of above-mentioned conductive resin.
Test result is following:
| The sample name | Resistivity (m Ω cm) | Rate elongation |
| Embodiment 1 | 7.6 | 56% |
| Embodiment 2 | 0.69 | 41% |
| Embodiment 3 | 54 | 227% |
| Embodiment 4 | 7.9 | 52% |
| Embodiment 5 | 7.4 | 53% |
| Embodiment 6 | 7.6 | 56% |
| Embodiment 7 | 18.6 | 53% |
| Embodiment 8 | 17.5 | 51% |
| Embodiment 9 | 17.8 | 52% |
| Embodiment 10 | 17.7 | 51% |
| Embodiment 11 | 7.5 | 53% |
| Embodiment 12 | 41 | 197% |
| Embodiment 13 | 21 | 99.60% |
| Embodiment 14 | 2.9 | 32% |
| Embodiment 15 | 0.87 | 47.00% |
| Embodiment 16 | 76 | 276% |
| Embodiment 17 | 58 | 245% |
| Embodiment 18 | 107 | 311% |
| Embodiment 19 | 0.42 | 20% |
| Embodiment 20 | 31 | 168% |
| The comparative example | 1046 | 60.7% |
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, do not breaking away under the prerequisite of the present invention design, make some being equal to substitute or obvious modification, and performance or purposes are identical, all should be regarded as belonging to protection scope of the present invention.
Claims (10)
1. high conductivity graphene conductive glue, it is characterized in that: comprise Graphene and sticker, in conductive resin, the mass content of said Graphene is 0.1 ~ 98%, and the mass content of said sticker is 2 ~ 99.9%; Contain polar functional group in the said Graphene, said polar functional group accounts for 0 ~ 30% of said Graphene quality, and said caking agent is that polymkeric substance is or/and polymer monomer; When independent use polymkeric substance during as caking agent, also contain solvent in this conductive resin, the mass content of said solvent in conductive resin is 1-90%, the mass content sum of each component is 100% in the conductive resin.
2. high conductivity graphene conductive glue as claimed in claim 1 is characterized in that: the mass content of said Graphene is 5 ~ 30%.
3. according to claim 1 or claim 2 high conductivity graphene conductive glue is characterized in that: said polar functional group is at least a in carboxyl, hydroxyl, epoxy group(ing), carbonyl, nitro, the amino; Said polar functional group preferably accounts for 0.5 ~ 20% of said Graphene quality.
4. high conductivity graphene conductive glue as claimed in claim 1 is characterized in that: said caking agent is a rate elongation greater than 10% polymkeric substance or/and can generate the polymer monomer of rate elongation greater than 10% polymkeric substance; The mass content of said sticker in conductive resin is preferably 20 ~ 90%.
5. like claim 1 or 4 described high conductivity graphene conductive glue, it is characterized in that: said polymkeric substance is at least a in styrene-butadiene rubber(SBR), epoxy resin, silicone resin, polyimide resin, resol, urethane, vinyl resin, Xylo-Mucine, pvdf, tetrafluoroethylene, ROHM, polyacrylonitrile, polymethyl acrylate, polyethyl acrylate, the ROHM-vinylbenzene.
6. like claim 1 or 4 described high conductivity graphene conductive glue; It is characterized in that: said polymer monomer is the monomer of at least a polymkeric substance below generating, and said polymkeric substance is styrene-butadiene rubber(SBR), silicone resin, polyimide resin, resol, urethane, vinyl resin, Xylo-Mucine, pvdf, tetrafluoroethylene, ROHM, polyacrylonitrile, polymethyl acrylate, polyethyl acrylate, ROHM-vinylbenzene.
7. according to claim 1 or claim 2 high conductivity graphene conductive glue; It is characterized in that: also comprise auxiliary component, said auxiliary component is at least a in carbon nanotube, carbon nano fiber, super conductive carbon, graphitized carbon black, acetylene black, carbon dust, the nano metal powder; The mass content of said auxiliary component in conductive resin is 0 ~ 95%, 0% not get, and the mass content sum of each component is 100% in the conductive resin.
8. high conductivity graphene conductive glue as claimed in claim 1; It is characterized in that: said solvent is N-Methyl pyrrolidone, water, acetone, ethanol, N, at least a in dinethylformamide, methylene dichloride, trichloromethane, propyl alcohol, Virahol, the terepthaloyl moietie.
9. the preparation method of each described high conductivity graphene conductive glue of claim 1-8 is characterized in that, comprises the steps:
Static eliminator premix: polymer monomer is mixed with Graphene, perhaps polymer monomer, polymkeric substance are mixed with Graphene, obtain the preceding aggressiveness of conductive resin;
Conductive resin preparation: before said conductive resin, add initiator in the aggressiveness, perhaps use light-initiated, thermal initiation, make said polymer monomer polymerization to prepare conductive resin;
Perhaps, comprise the steps:
Static eliminator premix: in Graphene, add appropriate solvent and mix, make that Graphene is soaked into;
Polymkeric substance premix: in polymkeric substance, add appropriate solvent and mix, make polymkeric substance by swelling;
Conductive resin preparation: above-mentioned static eliminator pre-composition and polymkeric substance pre-composition are mixed, add stirring solvent and prepare conductive resin;
Perhaps, comprise the steps: that Graphene, polymkeric substance and solvent are directly mixed stirring obtains conductive resin.
10. preparation method as claimed in claim 9 is characterized in that: when the static eliminator premix, also add auxiliary component, perhaps when Graphene, polymkeric substance and solvent directly being mixed stirring, also add auxiliary component; The mass content of said auxiliary component in conductive resin is 0 ~ 95%, 0% not get.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110076391A1 (en) * | 2009-09-29 | 2011-03-31 | Adam Franklin Gross | Adhesive compositions and methods for their use and preparation |
| CN102153976A (en) * | 2011-03-01 | 2011-08-17 | 华南理工大学 | Preparation method of graphene/nano silver epoxy conductive adhesive |
| CN102417643A (en) * | 2011-10-17 | 2012-04-18 | 佛山市日丰企业有限公司 | Grapheme-containing reinforced wear-resistant material composition, reinforced wear-resistant material and preparation method thereof |
-
2012
- 2012-07-27 CN CN2012102632967A patent/CN102746808A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110076391A1 (en) * | 2009-09-29 | 2011-03-31 | Adam Franklin Gross | Adhesive compositions and methods for their use and preparation |
| CN102153976A (en) * | 2011-03-01 | 2011-08-17 | 华南理工大学 | Preparation method of graphene/nano silver epoxy conductive adhesive |
| CN102417643A (en) * | 2011-10-17 | 2012-04-18 | 佛山市日丰企业有限公司 | Grapheme-containing reinforced wear-resistant material composition, reinforced wear-resistant material and preparation method thereof |
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