CN102739825A - Mainboard structure and mobile communication terminal - Google Patents
Mainboard structure and mobile communication terminal Download PDFInfo
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- CN102739825A CN102739825A CN201210195398XA CN201210195398A CN102739825A CN 102739825 A CN102739825 A CN 102739825A CN 201210195398X A CN201210195398X A CN 201210195398XA CN 201210195398 A CN201210195398 A CN 201210195398A CN 102739825 A CN102739825 A CN 102739825A
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- mainboard
- receiver
- communication terminal
- earphone interface
- insulation film
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Abstract
The invention discloses a mainboard structure. The mainboard structure comprises a mainboard, an insulating film, an earphone and an earphone interface, wherein a notch is formed in the edge of the mainboard; one surface of the insulating film is partially stuck to the first surface of the mainboard so as to cover the notch; the earphone is overlapped on the other surface of the insulating film and is fixedly arranged on the first surface of the mainboard; and the earphone interface is fixedly arranged on the second surface of the mainboard relative to the earphone. The invention also discloses a mobile communication terminal. In the way, by the mainboard structure and the mobile communication terminal, the earphone interface and the earphone can be mutually overlapped in an assembling space and are not affected mutually in function, and the thickness of the mobile communication terminal is not changed.
Description
Technical field
The present invention relates to field of mobile communication, particularly relate to a kind of mainboard structure and communication terminal.
Background technology
Communication terminal is because the convenience of its use has become necessary article indispensable in life, the work.In order to satisfy user's demand, the design of communication terminal is towards lightening development at present.
What influence communication terminal thickness mainly is assemblies such as earphone interface, receiver.In the prior art, often adopt broken board-like earphone interface to reduce the thickness of communication terminal, broken board-like earphone interface is the earphone interface that occupy little space of a kind of part through mainboard.As shown in Figure 1, Fig. 1 is the vertical view of the mainboard structure of a kind of communication terminal of prior art.This mainboard structure comprises mainboard 110, receiver 120 and earphone interface 130.Be provided with breach (being blocked among the figure) at mainboard 110 edges, earphone interface 130 is inserted in breach, forming broken board-like the connection with mainboard 110, is provided with receiver 120 at mainboard 110 away from the position of breach.The position of receiver 120 generally is positioned at the middle position, top of mainboard 110.
Generally; Industry is thought receiver 120 and earphone interface 130 overlapped each other the thickness that can as far as possible reduce communication terminal is set; But if, then can bring problems with the setting that overlaps each other of receiver of prior art mainboard structure 120 and earphone interface 130.For example; Receiver 120 structurally need form independent sound chamber, get rid of noise with assurance, but breach is arranged on the position of mainboard 110 corresponding receivers 120; It is receiver 120 and earphone interface 130 setting that overlaps each other; Can the independent sound chamber of receiver 120 be exerted an influence, thereby bring noise, influence user experience; Moreover earphone interface 120 communicates with the external world, and when leaking appearred in earphone interface 120, breach will be intake, and will cause that short circuit phenomenon appears in other electron component on receiver 120 and even the mainboard, has influenced the function of receiver 120.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of mainboard structure and communication terminal, can realize that earphone interface and receiver are overlapping each other on the assembly space, on function, are being independent of each other.
For solving the problems of the technologies described above, the present invention provides a kind of mainboard structure that is used for communication terminal, and it comprises mainboard, insulation film, receiver and earphone interface.Edge at mainboard is provided with breach; One face portion of insulation film fits on the first surface of mainboard to cover breach; Receiver is stacked on the another side of insulation film and is fixedly set on the first surface of said mainboard; Earphone interface is fixedly set on the second surface of mainboard with respect to receiver.
Wherein, breach is arranged at the top middle position of mainboard.
Wherein, insulation film is a polyimide film.
Wherein, earphone interface is provided with signal connecting terminal, and correspondence is provided with pad on the second surface of mainboard, and signal connecting terminal is fixedly welded on pad and is electrically connected so that form between earphone interface and the mainboard.
Wherein, receiver is provided with fixed part, and fixed part is pasted and is fixed on the first surface of mainboard.
Wherein, receiver is provided with signal connecting terminal, and correspondence is provided with pad on the first surface of mainboard, and signal connecting terminal is fixedly welded on pad and is electrically connected so that form between receiver and the mainboard.
Wherein, mainboard structure further comprises fore shell, and mainboard is fixedly set in fore shell, and mainboard, insulation film and fore shell surround to form independent sound chamber, and receiver is positioned at independent sound chamber.
For solving the problems of the technologies described above, the present invention also provides a kind of communication terminal, and communication terminal comprises above-mentioned any described mainboard structure.
The invention has the beneficial effects as follows: the situation that is different from prior art; Mainboard structure of the present invention and communication terminal are through being arranged at earphone interface and receiver respectively the both sides of breach on the mainboard; And between receiver and breach, insulation film is set; Can realize that earphone interface and receiver are overlapping each other on the assembly space, on function, are being independent of each other, and keep the thickness of communication terminal constant.
Description of drawings
Fig. 1 is the vertical view of the mainboard structure of a kind of communication terminal of prior art;
Fig. 2 is the front view of mainboard structure first embodiment of the present invention;
Fig. 3 is the vertical view of mainboard structure shown in Figure 2;
Fig. 4 is the front view of the mainboard 210 of mainboard structure shown in Figure 2;
Fig. 5 is the end view of mainboard structure second embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is elaborated.
Please in the lump referring to Fig. 2 and Fig. 3, Fig. 2 is the front view of mainboard structure first embodiment of the present invention, and Fig. 3 is the vertical view of mainboard structure shown in Figure 2.This mainboard structure can be used for communication terminal, and mainboard structure comprises mainboard 210, insulation film 220, receiver 230 and earphone interface 240.
One face portion of insulation film 220 fits in the first surface 2101 of mainboard 210, to cover breach 211.In the present embodiment, insulation film 220 is preferably polyimide film, isolate with mainboard 210 both sides with breach 211 places, and its thickness can have multiple choices.
Earphone interface 240 is fixedly set in respect to receiver 230 on the second surface 2102 of mainboard 210, and promptly on mainboard 210 normal to a surface directions, receiver 230 is realized overlapping each other on assembly space with earphone interface 240.Earphone interface 240 is provided with signal connecting terminal 241, and correspondence is provided with pad (indicate) on the second surface 2102 of mainboard 210, and signal connecting terminal 241 is fixedly welded on pad, is electrically connected so that form between earphone interface 240 and the mainboard 210.
The earphone interface 240 of this mainboard structure forms broken board-like the connection with mainboard 210; Be arranged at the top position of mainboard 210 again with receiver 230; Make receiver 230 and earphone interface 240 on assembly space, overlap each other, practiced thrift assembly space, and be provided with insulation film 220 between earphone interface 240 and the receiver 230; Insulation film 220 makes and on function, is independent of each other earphone interface 240 and receiver 230 mutually insulateds.
See also Fig. 5, the end view of mainboard structure second embodiment of the present invention.Mainboard structure comprises mainboard 310, insulation film 320, receiver 330, earphone interface 340 and fore shell 350.
Be provided with breach (not indicating) at the edge of mainboard 310.One face portion of insulation film 320 fits in a surface of mainboard 310, to cover breach.Receiver 330 is fixedly set on the another side of insulation film 320.Earphone interface 340 is fixedly set in another surface of mainboard 310 with respect to receiver 330.
Mainboard 310 is fixedly set in fore shell 350, and mainboard 310, insulation film 320 and fore shell 350 surround to form independent sound chamber 360, and receiver 330 is positioned at independent sound chamber 360.Independent sound chamber 360 is that receiver 330 is structurally needed, thereby can avoid receiver 330 to receive external environmental interference to produce noise, has guaranteed user's result of use.In practical operation; Owing to need the independent sound chamber of receiver 330 narrow and small as far as possible, can also be provided with on the surface of fore shell 350 contiguous mainboards 310 and enclose bone, enclose the lucky cover of bone and be buckled in receiver 330 and insulation film 320; The butt mainboard 310 again, to form narrow and small independent sound chamber 360, space.
The present invention further provides communication terminal, and communication terminal comprises the mainboard structure of above-mentioned arbitrary embodiment.Because receiver and earphone interface overlap each other on assembly space, can not increase so the thickness of communication terminal is compared prior art.And the cost of insulation film is lower, and the cost of communication terminal also remains unchanged basically.
Usually before communication terminal forms final products, all need pass through reliability testing.The test that drenches with rain is a kind of of reliability testing, is used to test the water proofing property of communication terminal.Because insulation film is kept apart earphone interface and receiver, so when drenching with rain test, the water that earphone interface gets into is insulated film to be stopped, can not flow to receiver, thereby can not cause the receiver short circuit, strengthens the water proofing property of communication terminal.
By the way; Mainboard structure of the present invention and communication terminal are through being arranged at earphone interface and receiver respectively the both sides of breach on the mainboard; And between receiver and breach, insulation film is set; Can realize that earphone interface and receiver are overlapping each other on the assembly space, on function, are being independent of each other, and keep the thickness of communication terminal constant, cost also remains unchanged basically.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (8)
1. a mainboard structure that is used for communication terminal is characterized in that, comprising:
Mainboard is provided with breach at the edge of said mainboard;
Insulation film, a face portion of said insulation film fit on the first surface of said mainboard to cover said breach;
Receiver is stacked on the another side of said insulation film and is fixedly set on the first surface of said mainboard;
Earphone interface is fixedly set in respect to said receiver on the second surface of said mainboard.
2. mainboard structure according to claim 1 is characterized in that, said breach is arranged at the top middle position of said mainboard.
3. mainboard structure according to claim 1 is characterized in that, said insulation film is a polyimide film.
4. mainboard structure according to claim 1; It is characterized in that; Said earphone interface is provided with signal connecting terminal; Correspondence is provided with pad on the second surface of said mainboard, and said signal connecting terminal is fixedly welded on said pad and is electrically connected so that form between said earphone interface and the said mainboard.
5. mainboard structure according to claim 1 is characterized in that said receiver is provided with fixed part, and said fixed part is pasted and is fixed on the first surface of said mainboard.
6. mainboard structure according to claim 1; It is characterized in that; Said receiver is provided with signal connecting terminal, and correspondence is provided with pad on the first surface of said mainboard, and said signal connecting terminal is fixedly welded on said pad and is electrically connected so that form between said receiver and the said mainboard.
7. mainboard structure according to claim 1; It is characterized in that said mainboard structure further comprises fore shell, said mainboard is fixedly set in said fore shell; Said mainboard, said insulation film and said fore shell surround to form independent sound chamber, and said receiver is positioned at said independent sound chamber.
8. a communication terminal is characterized in that, said communication terminal comprises each described mainboard structure of claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210195398XA CN102739825A (en) | 2012-06-13 | 2012-06-13 | Mainboard structure and mobile communication terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210195398XA CN102739825A (en) | 2012-06-13 | 2012-06-13 | Mainboard structure and mobile communication terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102739825A true CN102739825A (en) | 2012-10-17 |
Family
ID=46994593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210195398XA Pending CN102739825A (en) | 2012-06-13 | 2012-06-13 | Mainboard structure and mobile communication terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102739825A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742788A (en) * | 2016-03-31 | 2016-07-06 | 青岛海信移动通信技术股份有限公司 | Mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1094717C (en) * | 1995-11-16 | 2002-11-20 | 松下电器产业株式会社 | PC board and fixing body thereof |
| CN1489362A (en) * | 2002-09-05 | 2004-04-14 | ���Ͽع�����˾ | Structure layout for wireless communication terminal including loudspeaker and earphone |
| JP2011160065A (en) * | 2010-01-29 | 2011-08-18 | Audio Technica Corp | Capacitor headphone unit |
-
2012
- 2012-06-13 CN CN201210195398XA patent/CN102739825A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1094717C (en) * | 1995-11-16 | 2002-11-20 | 松下电器产业株式会社 | PC board and fixing body thereof |
| CN1489362A (en) * | 2002-09-05 | 2004-04-14 | ���Ͽع�����˾ | Structure layout for wireless communication terminal including loudspeaker and earphone |
| JP2011160065A (en) * | 2010-01-29 | 2011-08-18 | Audio Technica Corp | Capacitor headphone unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742788A (en) * | 2016-03-31 | 2016-07-06 | 青岛海信移动通信技术股份有限公司 | Mobile terminal |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121017 |
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| RJ01 | Rejection of invention patent application after publication |