CN102738052B - Tool and electronic component film coating method utilizing the same - Google Patents
Tool and electronic component film coating method utilizing the same Download PDFInfo
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- CN102738052B CN102738052B CN201110094121.3A CN201110094121A CN102738052B CN 102738052 B CN102738052 B CN 102738052B CN 201110094121 A CN201110094121 A CN 201110094121A CN 102738052 B CN102738052 B CN 102738052B
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- China
- Prior art keywords
- electronic component
- storage tank
- instrument
- plating process
- film plating
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Abstract
The invention relates to a tool and an electronic component film coating method utilizing the same, wherein the film coating method is used for carrying out film coating on at least on electronic component having the component height. The film coating method comprises the following steps: providing a tool, wherein at least one accommodation groove with a shape identical with that of at least one component side of the electronic component is arranged at a bearing surface of the tool in a concave way and the height of the accommodation groove is less than the component height; placing the at least one electronic component in the accommodation groove, so that the at least one side wall surface of the accommodation groove and the component side are in tight contact; and carrying out at least one conductive film coating process on the electronic component, so that a conductive coating layer is formed on the top surface of the electronic component and a portion of the component side. In addition, the invention also discloses the structure of the tool.
Description
Technical field
The present invention relates to the film plating process of a kind of instrument and a kind of electronic component, relate in particular to a kind of electronic component of avoiding and when follow-up welding, because climbing tin, cause the instrument and the film plating process that utilizes this instrument of short circuit.
Background technology
In circuit design, such as wire, circuit board and various big or small electronic component all can generate electromagnetic waves, and the electromagnetic wave that these different elements produce likely can exert an influence to overall circuit performance, we are called electromagnetic interference (Electro Magnetic Interference this phenomenon, EMI), with current technology, for electromagnetic interference, do not have basic solution, but good circuit design and wires design can drop to minimum by the problem of electromagnetic interference.
And in the middle of existing technology; for the electromagnetic interference between isolated each electronic component; the method of the most often using, for utilizing metal-back that the electronic component frame of wish protection is lived, blocks electromagnetic wave to form a conductor screen, and then reduces the harm of electromagnetic interference to circuit.
But along with scientific and technological fast development, electronic component rapid miniaturization, high frequency and distribution density are more and more higher, the mobile communication product of present stage for example,, towards WiFi, BT and GPS etc. wireless module is integrated into the future development in single module, also therefore the problem of electromagnetic interference just seems more thorny.
Therefore, prior art develops the plated surface last layer conductive coating of electronic component is blocked to electromagnetic technology, refer to Fig. 1 and Fig. 2, Fig. 1 is the schematic diagram that electronic component is arranged at flat instrument, and Fig. 2 is for to plate the schematic diagram after conductive coating to electronic component.To block electromagnetic wave by the mode of plated film, generally speaking, base material 11 inside or the upper surface of electronic component 100 must have access area 111, this access area 111 can be circuit pattern or ground plane, and must expose to the side of electronic component 100, in addition, conventionally on base material 11, can be provided with chip 12, and the adhesive body 13 of coated this chip 12; At the beginning, electronic component 100 must be positioned on the flat instrument 200 that is a plane, and then towards electronic component 100, carry out plated film program C1, with the upper surface in electronic component 100 and side, form conductive coating 14, due to conductive coating 14 meetings and access area 111 electrically connects that expose to electronic component 100 sides, therefore just can for electronic component 100, block battery ripple in use.
Refer to Fig. 3,3 Fig. 3 are that welding electronic elements is in the schematic diagram of circuit board.Because conductive coating 14 can be formed at the whole side of electronic component 100, therefore, when electronic component 100 is welded in the circuit pattern 31 of circuit board 300, be easy to will because of scolding tin 32 climb tin phenomenon, make circuit pattern 31 produce short circuit with conductive coating 14 electric property couplings.
Summary of the invention
Technical problem and object that institute of the present invention wish solves:
Edge this, main purpose of the present invention is to provide a kind of electronic component of avoiding when follow-up welding, because climbing tin, to cause the instrument of short circuit, and the film plating process that utilizes this instrument, this instrument and film plating process can avoid the side bottom of electronic component when plated film program, to form conductive coating.
The technological means that the present invention deals with problems:
An instrument, in order to carry at least one electronic component to carry out at least one conduction plated film program, this electronic component has an element heights, and this kit is containing tool body and storage tank; Tool body has a loading end; Storage tank is arranged with in this loading end, has at least one side wall surface, and the degree of depth of this storage tank is less than this element heights, and this side wall surface around shape identical with the external form of at least one element side of this electronic component.
In a preferred embodiment of the present invention, this loading end and this storage tank are coated with an insulating varnish.
In a preferred embodiment of the present invention, this side wall surface of this storage tank also has a clamping element, to clamp the element side of this electronic component.
The present invention also discloses a kind of film plating process of electronic component, in order at least one electronic component is carried out to plated film, this electronic component has an element heights, this film plating process comprises following steps: an instrument is provided, one loading end of this instrument is concaved with the identical storage tank of external form of at least one element side of at least one and this electronic component, and the degree of depth of this storage tank is less than this element heights; At least one electronic component is positioned in this storage tank, makes at least one side wall surface of this storage tank be connivent in this element side; Towards this electronic component, carry out at least one conduction plated film program, with the end face in this electronic component and this element side of part, form a conductive coating.
In a preferred embodiment of the present invention, the component side mask of this electronic component has at least one access area, and this access area bottom depth of this storage tank at least up of being positioned at this element side.
In a preferred embodiment of the present invention, this side wall surface of this storage tank also has a clamping element, to be positioned over after this storage tank in this electronic component, clamps the element side of this electronic component.
In a preferred embodiment of the present invention, the top layer of this instrument is coated with an insulating varnish.
In a preferred embodiment of the present invention, this conduction plated film program package containing smearing, pressing, plating, sputter and vapour deposition one of at least.
In a preferred embodiment of the present invention, this conductive coating by copper, nickel, gold and aluminium one of at least form.
In a preferred embodiment of the present invention, this film plating process, after this conductive coating forms, also comprises a step: towards this electronic component, carry out at least one insulation plated film program, to form an insulating coating outside this conductive coating; Further, this insulating coating comprise baking vanish, stainless steel, anti-coating and pottery one of at least.
The present invention's effect against existing technologies:
Compared to existing electronic component film plating process, instrument of the present invention is owing to having the storage tank of this element side bottom of can fitting, while therefore coordinating film plating process of the present invention, can avoid forming conductive coating in element side bottom, when welding electronic elements is during in circuit board, can not make the circuit pattern of circuit board and conductive coating electric property coupling cause short circuit because climbing tin yet.
Below in conjunction with the drawings and specific embodiments, describe the present invention, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that electronic component is arranged at flat instrument;
Fig. 2 is for to plate the schematic diagram after conductive coating to electronic component;
Fig. 3 is that welding electronic elements is in the schematic diagram of circuit board;
Fig. 4 is the schematic diagram of electronic component;
Fig. 5 is the schematic diagram of instrument of the present invention;
Fig. 6 is the schematic diagram that electronic component is positioned over storage tank;
Fig. 7 forms the schematic diagram of conductive coating in electronical elements surface;
Fig. 8 forms the schematic diagram of insulating coating in electronical elements surface;
Fig. 9 is that welding electronic elements after plated film is in the schematic diagram of circuit board; And
Figure 10 is film plating process flow chart of the present invention.
Wherein, Reference numeral
Electronic component 100
Base material 11
Access area 111
Chip 12
Adhesive body 13
Conductive coating 14
Flat instrument 200
Circuit board 300
Circuit pattern 31
Scolding tin 32
Plated film program C1
Electronic component 400
Base material 41
Access area 411
Chip 42
Sealing unit 43
Element side 44
Conductive coating 45
Insulating coating 46
Element heights h
Instrument 500
Tool body 51
Loading end 511
Storage tank 52
Side wall surface 521
Insulating varnish 53
Depth d
Conduction plated film program C2
Insulation plated film program C3
Circuit board 600
Circuit pattern 61
Scolding tin 62
Embodiment
The present invention is about the film plating process of a kind of instrument and a kind of electronic component, and espespecially a kind of electronic component of avoiding causes the instrument and the film plating process that utilizes this instrument of short circuit when follow-up welding because climbing tin.Below hereby enumerate a preferred embodiment with explanation the present invention, so those skilled in the art all know that this is only one for example, and not in order to limit invention itself.The detailed description of relevant this preferred embodiment is as follows.
Refer to Fig. 4 and Fig. 5, the schematic diagram that Fig. 4 is electronic component, the schematic diagram that Fig. 5 is instrument of the present invention.Instrument 500 of the present invention is to carry at least one electronic component 400 to carry out at least one conduction plated film program, and this electronic component 400 has an element heights h, and this instrument 500 is to comprise tool body 51 and storage tank 52; In the present embodiment, only using a simple electronic component structure as demonstration, electronic component 400 can have base material 41, chip 42 and sealing unit 43, base material 41 can be buried in inside access area 411 underground, certainly access area 411 also can be arranged at the upper surface of base material 41, as long as this access area 411 exposes to the element side 44 of electronic component 400; 42 of chips are arranged on base material 41, and coated with sealing unit 43.
Tool body 51 is to have a loading end 511; Storage tank 52 is to be arranged with in this loading end 511, has at least one side wall surface 521, and the depth d of this storage tank 52 is to be less than this element heights h, and 521 of this side wall surfaces around shape be identical with the external form of at least one element side 44 of this electronic component 400.
In a preferred embodiment of the present invention, this loading end 511 is to be coated with an insulating varnish 53 with this storage tank 52, and side or the bottom surface of tool body 51 also can be coated with insulating varnish 53 certainly, but do not affect the function of this instrument 500.
In a preferred embodiment of the present invention, this side wall surface 521 of this storage tank 52 can also have a clamping element (not shown), to clamp the element side 44 of this electronic component 400, the execution mode of this clamping element can have a variety of aspects, for example the clamping face with sheet coordinates spring to clamp this electronic component 400, or clamp this electronic component 400 with knob moving sheet clamping face, as long as the element side 44 of the electronic component 400 that can make to fit.
Please refer to Fig. 6, Fig. 7, Fig. 8, Fig. 9 and Figure 10, Fig. 6 is the schematic diagram that electronic component is positioned over storage tank, Fig. 7 forms the schematic diagram of conductive coating in electronical elements surface, Fig. 8 forms the schematic diagram of insulating coating in electronical elements surface, Fig. 9 be welding electronic elements after plated film in the schematic diagram of circuit board, Figure 10 is the anti-method flow diagram of plating of the present invention.Film plating process of the present invention is that this electronic component 400 is to have an element heights h in order at least one electronic component 400 is carried out to plated film, and this film plating process comprises following steps:
S101 a: instrument 500 is provided, and a loading end 511 of this instrument 500 is concaved with the identical storage tank 52 of external form of at least one element side 44 of at least one and this electronic component 400, and the depth d of this storage tank 52 is less than this element heights h.
S103: at least one electronic component 400 is positioned in this storage tank 52, makes at least one side wall surface 521 of this storage tank 52 be connivent in this element side 44.
S105: carry out at least one conduction plated film program C2 towards this electronic component 400, form a conductive coating 45 with the end face in this electronic component 400 and this element side 44 exposing to outside storage tank 52.
In a preferred embodiment of the present invention, the element side 44 of this electronic component 400 has at least one access area 411, and the bottom that this access area 411 is positioned at this element side 44 is the depth d place of this storage tank 52 at least up, therefore when conducting electricity plated film program C2, conductive coating 45 can with access area 411 electrically connects.
In addition, as described earlier, this side wall surface 521 of this storage tank 52 can also have a clamping element, to be positioned over after this storage tank 52 in this electronic component 400, clamps the element side 44 of this electronic component 400; Also further, the top layer of this instrument 500 is coated with an insulating varnish 53, to avoid the precision when conduction plated film program C2 has influence on batch plated film gradually because be subject to plated film simultaneously.
In a preferred embodiment of the present invention, above-mentioned conduction plated film program C2 can comprise smear, pressing, plating, sputter, vapour deposition or other can form in electronic component 400 surfaces the method for conduction plated films; In addition this conductive coating can be comprised of copper, nickel, gold, aluminium or other conductor.
In a preferred embodiment of the present invention, this film plating process, after step S105, can also comprise:
S107: carry out at least one insulation plated film program C3 towards this electronic component 400, with in outer formation one insulating coating 46 of this conductive coating 45, with the chance that further prevents that conductive coating 45 from being touched, also can make the external form of electronic component 400 also for attractive in appearance simultaneously; Also further, this insulating coating 46 can be baking vanish, stainless steel, anti-coating, pottery or other insulating material; For example, the plated film program C3 if insulate, in abovementioned steps S105, can carry out the conduction plated film program C2 of twice, first plated with copper coating is usingd as blocking electromagnetic main coating for the first time, and then plated with nickel coating again, to allow follow-up insulation during plated film program C3, can make smoothly insulating coating 46 be attached to outside conductive coating 45.
After above-mentioned steps is implemented, the electronic component after plated film 400 can be taken out from instrument 500, when electronic component 400 will be welded in the circuit pattern 61 of circuit board 600, even if having produced, scolding tin 62 climbs tin phenomenon, be also difficult to touch conductive coating 45.
Comprehensive the above, compared to existing electronic component film plating process, instrument 500 of the present invention is owing to having the storage tank 52 of these 44 bottoms, element side of can fitting, while therefore coordinating film plating process of the present invention, can avoid 44 bottoms in element side to form conductive coating 45, when electronic component 400 is welded in circuit board 600, can not make the circuit pattern 61 of circuit board 600 cause short circuit with conductive coating 45 electric property couplings because climbing tin yet.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (10)
1. an instrument, in order to carry at least one electronic component to carry out at least one conduction plated film program, this electronic component has an element heights, and the component side mask of this electronic component has at least one access area, it is characterized in that, and this kit contains:
One tool body, has a loading end; And
One storage tank, be arranged with in this loading end, there is at least one side wall surface, the degree of depth of this storage tank is less than this element heights, and this side wall surface around shape identical with the external form of at least one element side of this electronic component, the bottom that this access area is positioned at this element side is the depth of this storage tank at least up.
2. instrument according to claim 1, is characterized in that, this loading end and this storage tank are coated with an insulating varnish.
3. instrument according to claim 1, is characterized in that, this side wall surface of this storage tank also has a clamping element, to clamp the element side of this electronic component.
4. a film plating process for electronic component, in order at least one electronic component is carried out to plated film, this electronic component has an element heights, and the component side mask of this electronic component has at least one access area, it is characterized in that, and this film plating process comprises following steps:
One instrument is provided, one loading end of this instrument is concaved with the identical storage tank of external form of at least one element side of at least one and this electronic component, and the degree of depth of this storage tank is less than this element heights, the bottom that this access area is positioned at this element side is the depth of this storage tank at least up;
At least one electronic component is positioned in this storage tank, makes at least one side wall surface of this storage tank be connivent in this element side; And
Towards this electronic component, carry out at least one conduction plated film program, with the end face in this electronic component and this element side of part, form a conductive coating.
5. the film plating process of electronic component according to claim 4, is characterized in that, this side wall surface of this storage tank also has a clamping element, to be positioned over after this storage tank in this electronic component, clamps the element side of this electronic component.
6. the film plating process of electronic component according to claim 4, is characterized in that, the top layer of this instrument is coated with an insulating varnish.
7. the film plating process of electronic component according to claim 4, is characterized in that, this conduction plated film program package containing smearing, pressing, plating, sputter and vapour deposition one of at least.
8. the film plating process of electronic component according to claim 4, is characterized in that, this conductive coating by copper, nickel, gold and aluminium one of at least form.
9. the film plating process of electronic component according to claim 4, is characterized in that, after this conductive coating forms, also comprises a step: towards this electronic component, carry out at least one insulation plated film program, to form an insulating coating outside this conductive coating.
10. the film plating process of electronic component according to claim 9, is characterized in that, this insulating coating comprise baking vanish, stainless steel, anti-coating and pottery one of at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110094121.3A CN102738052B (en) | 2011-04-13 | 2011-04-13 | Tool and electronic component film coating method utilizing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110094121.3A CN102738052B (en) | 2011-04-13 | 2011-04-13 | Tool and electronic component film coating method utilizing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102738052A CN102738052A (en) | 2012-10-17 |
| CN102738052B true CN102738052B (en) | 2014-08-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110094121.3A Expired - Fee Related CN102738052B (en) | 2011-04-13 | 2011-04-13 | Tool and electronic component film coating method utilizing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102738052B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442033A (en) * | 2000-04-21 | 2003-09-10 | 电子设备屏蔽公司 | EMI and RFI shielding for printed circuit boards |
| CN201204788Y (en) * | 2008-04-18 | 2009-03-04 | 环隆电气股份有限公司 | Encapsulation assembly for shielding electromagnetic interference |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007165101A (en) * | 2005-12-13 | 2007-06-28 | Orion Denki Kk | Electronic equipment equipped with antistatic function |
-
2011
- 2011-04-13 CN CN201110094121.3A patent/CN102738052B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442033A (en) * | 2000-04-21 | 2003-09-10 | 电子设备屏蔽公司 | EMI and RFI shielding for printed circuit boards |
| CN201204788Y (en) * | 2008-04-18 | 2009-03-04 | 环隆电气股份有限公司 | Encapsulation assembly for shielding electromagnetic interference |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102738052A (en) | 2012-10-17 |
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Granted publication date: 20140813 |