CN102702994A - Adhesive for flexible printed circuit board and preparation method thereof - Google Patents
Adhesive for flexible printed circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN102702994A CN102702994A CN2012101633958A CN201210163395A CN102702994A CN 102702994 A CN102702994 A CN 102702994A CN 2012101633958 A CN2012101633958 A CN 2012101633958A CN 201210163395 A CN201210163395 A CN 201210163395A CN 102702994 A CN102702994 A CN 102702994A
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- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- adhesive
- preparation
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Abstract
The invention relates to an adhesive for a flexible printed circuit board and a preparation method of the adhesive. The adhesive is characterized in that the adhesive for the flexible printed circuit board mainly comprises butadiene-acrylonitrile rubber, phenol-formaldehyde resin, epoxy resin, superfine calcium silicate, light calcium carbonate, zinc oxide, stearic acid, lecithin and butanone and the like. The adhesive for the flexible printed circuit board has the characteristics of high bonding strength, good toughness of a glued layer, and easiness in curing.
Description
Technical field
The present invention relates to a kind of used for flexible printed circuit board tackiness agent and preparation method thereof, belong to the electronic printing circuit field.
Background technology
The substrate of printed circuit board is exactly a kind of sheet material that on the synthetic resin board of isolator, forms the loop with metallic substance such as copper.Its kind can be divided into hard circuit base plate and flexible printed substrate from material.
The existing abroad patent report of flexible printed base board, and dropped into suitability for industrialized production, domestic report to the flexible printed circuit board aspect then seldom, reasonably selecting suitable tackiness agent for use is the gordian technique in the flexible printed circuit board industrial production.For this reason, we stick with glue agent to FPC and have carried out a large amount of research, at present; For the bonding problem of Copper Foil and flexible parent metal, abroad be to be main, but the Joint strength of this type of tackiness agent is not high with the thermoplastic polyester resin tackiness agent; The glue-line poor toughness is prone to produce defectives such as thermal distortion.
Summary of the invention
The object of the invention is exactly the defective that is to solve and overcome above-mentioned existence; A kind of bonding strength height that has is provided; The bonding layer good toughness; Be prone to a kind of used for flexible printed circuit board tackiness agent of solidified and preparation method thereof, this used for flexible printed circuit board tackiness agent mainly by: nitrile rubber, resol, epoxy resin, ultra-fine Calucium Silicate powder, light calcium carbonate, zinc oxide, Triple Pressed Stearic Acid, Yelkin TTS, butanone etc. are formed.
By counting: nitrile rubber 35～50 with mass parts; Resol 15～30; Epoxy resins 10～20; Ultra-fine silicic acid acid calcium 3～8; Light calcium carbonate 2～5; Zinc oxide 1～3; Triple Pressed Stearic Acid 100～120; Yelkin TTS 1～3; Butanone 250～350 is formed.
Its preparation method is: mentioned component is packed in the enamel reaction still successively, be heated to about 70 ℃, mix 5h; Brush copper foil surface then equably, shelve 2min aloft, repeat above-mentioned steps again and reach certain thickness until glued membrane in treated mistake; And the rete thickness is answered uniformity, tiles Copper Foil then on film substrate, excluding air; In baking oven,, be annealed to room temperature and take out with pressure sulfidization molding under certain temperature-time of 10kPa～30kPa.
The practical implementation method
1, takes by weighing nitrile rubber 45 by mass parts respectively; Resol 25; Epoxy resin 15; Ultra-fine silicic acid acid calcium 5; Light calcium carbonate 3; Zinc oxide 2; Triple Pressed Stearic Acid 110; Yelkin TTS 2; 300 parts of butanone.
2, preparation method
Mentioned component is packed in the enamel reaction still successively, be heated to about 70 ℃, mix 5h; Brush copper foil surface then equably, shelve 2min aloft, repeat above-mentioned steps again and reach certain thickness until glued membrane in treated mistake; And the rete thickness is answered uniformity, tiles Copper Foil then on film substrate, excluding air; In baking oven,, be annealed to room temperature and take out with pressure sulfidization molding under certain temperature-time of 10kPa～30kPa.
Claims (3)
1. used for flexible printed circuit board tackiness agent and preparation method thereof.It is characterized in that this flexible print circuit board glue with stick mainly by: nitrile rubber, resol, epoxy resin, ultra-fine Calucium Silicate powder, light calcium carbonate, zinc oxide, Triple Pressed Stearic Acid, Yelkin TTS, butanone etc. are formed.
According to right 1 described a kind of used for flexible printed circuit board tackiness agent by counting with mass parts: nitrile rubber 35～50; Resol 15～30; Epoxy resin 10～20; Ultra-fine Calucium Silicate powder 3～8; Light calcium carbonate 2～5; Zinc oxide 1～3; Triple Pressed Stearic Acid 100～120; Yelkin TTS 1～3; Butanone 250～350 is formed.
3. according to right 1 and 2 described a kind of used for flexible printed circuit board tackiness agent.Its preparation method is: mentioned component is packed in the enamel reaction still successively, be heated to about 70 ℃, mix 5h; Brush copper foil surface then equably, shelve 2min aloft, repeat above-mentioned steps again and reach certain thickness until glued membrane in treated mistake; And the rete thickness is answered uniformity, tiles Copper Foil then on film substrate, excluding air; In baking oven,, be annealed to room temperature and take out with pressure sulfidization molding under certain temperature-time of 10kPa～30kPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101633958A CN102702994A (en) | 2012-05-23 | 2012-05-23 | Adhesive for flexible printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101633958A CN102702994A (en) | 2012-05-23 | 2012-05-23 | Adhesive for flexible printed circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102702994A true CN102702994A (en) | 2012-10-03 |
Family
ID=46896056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101633958A Pending CN102702994A (en) | 2012-05-23 | 2012-05-23 | Adhesive for flexible printed circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102702994A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103173175A (en) * | 2013-03-23 | 2013-06-26 | 广东新展化工新材料有限公司 | Organic silicone modified epoxy resin sealant and preparation method thereof |
| CN107298954A (en) * | 2017-05-19 | 2017-10-27 | 江苏东昇光伏科技有限公司 | A kind of ageing-resistant glued membrane used for solar batteries and preparation method thereof |
| CN108949045A (en) * | 2018-07-28 | 2018-12-07 | 钱万琦 | A kind of based Wood Adhesives |
-
2012
- 2012-05-23 CN CN2012101633958A patent/CN102702994A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103173175A (en) * | 2013-03-23 | 2013-06-26 | 广东新展化工新材料有限公司 | Organic silicone modified epoxy resin sealant and preparation method thereof |
| CN103173175B (en) * | 2013-03-23 | 2014-07-02 | 广东新展化工新材料有限公司 | Organic silicone modified epoxy resin sealant and preparation method thereof |
| CN107298954A (en) * | 2017-05-19 | 2017-10-27 | 江苏东昇光伏科技有限公司 | A kind of ageing-resistant glued membrane used for solar batteries and preparation method thereof |
| CN108949045A (en) * | 2018-07-28 | 2018-12-07 | 钱万琦 | A kind of based Wood Adhesives |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121003 |