CN102699821A - Method and device for increasing precision polishing machining speed and improving surface quality of workpiece - Google Patents
Method and device for increasing precision polishing machining speed and improving surface quality of workpiece Download PDFInfo
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- CN102699821A CN102699821A CN2012102007078A CN201210200707A CN102699821A CN 102699821 A CN102699821 A CN 102699821A CN 2012102007078 A CN2012102007078 A CN 2012102007078A CN 201210200707 A CN201210200707 A CN 201210200707A CN 102699821 A CN102699821 A CN 102699821A
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Abstract
The invention discloses a method and a device for increasing the precision polishing machining speed and improving the surface quality of a workpiece. The method is characterized by comprising the following steps of: 1, putting a polishing machine into a closed cover to prevent external dust from entering a polishing region and influencing the polishing quality; 2, filling matched gas into the closed cover to adjust the gas pressure, the temperature and the humidity in the closed cover; and 3, arranging sensors for detecting the pressure, the temperature and the humidity in the closed cover, and controlling a system to automatically adjust gas supply parameters, wherein aims of increasing the material removal rate and improving the surface quality of the workpiece can be fulfilled. The key point of the device is that necessary machining equipment is arranged in the closed cover. According to the method and the device, the material removal rate can be obviously increased, and the surface smoothness can be improved.
Description
Technical field
The present invention relates to a kind of precision processing technology, especially a kind of polishing processing technique field, specifically a kind of method and device that improves precise polished process velocity and workpiece surface quality.
Background technology
As everyone knows, polishing is a kind of precision, ultraprecise process, is widely used in the whole road processing of multiple material.The environment of polish is very important factor, and like ambient humidity, humidity, air pressure etc., the material of influence polishing is removed and surface quality.All kinds of polishing machines that generally use at present, many places can't avoid dust, temperature, humidity, air pressure in the external environment to the influence of quality of finish in the environment of full open model when work.If the polishing environment is sneaked into bigger dust, surface of the work will form the cut equivalent damage.Environment temperature and humidity change too greatly, the process of influence polishing processing and the final surface quality of workpiece; For some materials responsive especially to temperature and humidity, temperature and humidity change too greatly, can cause workpiece cracking or deliquescence.Higher ambient pressure possibly promote to polish the carrying out of processing.
Chinese patent 101966691 discloses a kind of built-in dust-filtering system of metal slide fastener polishing machine.This system comprises fully closed metal slide fastener polishing machine enclosure main body, water tank with strainer, dust suction air blast, blast pipe, sweep-up pipe in the chassis body, and the dust that metal slide fastener polishing is produced is reclaimed fully.Chinese patent 201279731 has been announced a kind of polishing machine with deduster, comprises polishing machine, blower fan and deduster, has solved the big situation of dust content in the workplace air.Above situation is all considered the influence of dust to polishing processing, but can't avoid in the environment temperature and humidity to the influence of quality of finish, and especially some all can't directly utilize during to the responsive material of temperature and humidity in processing, must improve.
Summary of the invention
The objective of the invention is provides a kind of polishing system of processing of confining gas environment to uncontrollable influences of factor such as the gas in the present polishing processing environment and temperature thereof, humidity, air pressure.Adopt the mode of enclosed hood with polish sealing and feeding gas; Realize reaching the purpose of control gaseous environment; The gas of control polish and temperature thereof, humidity, air pressure etc.; Hinder the entering of dust, provide the air ambient that is beneficial to processing, improve the material removing rate of polishing and the surface quality of workpiece.
One of technical scheme of the present invention is:
A kind of method that improves precise polished process velocity and workpiece surface quality is characterized in that:
At first, polishing machine is placed enclosed hood, to prevent that extraneous dust from getting into burnishing surface and influencing quality of finish;
Secondly, in enclosed hood, charge into the gas that matches, to regulate gas pressure, the temperature and humidity in the seal closure;
The 3rd, the sensor that is used for detected pressures, temperature and humidity is installed in seal closure, so that the control system regulates the air feed parameter automatically, reach the purpose that improves material removing rate and surface quality.
Described gas pressure is a 2-10 atmospheric pressure, and described humidity is 10-80%, described temperature is-and 20-50 ℃.
Described gas is one or more the combination in argon gas, nitrogen, oxygen, the carbon dioxide.
Two of technical scheme of the present invention is:
A kind of device that improves precise polished process velocity and workpiece surface quality; It comprises polishing machine 1 and polishing fluid feed system 2; It is characterized in that described polishing machine 1 is installed in the enclosed hood 5, described polishing fluid feed system 2 is installed in the jet head of directly giving polishing pad feed flow or said polishing fluid feed system 2 in the enclosed hood 5 and stretches in the enclosed hood to the polishing pad feed flow; The gas supply system 3 that is used for improving enclosed hood air pressure, temperature, humidity is through stretching into the air supply pipe air feed in seal closure 5 in the enclosed hood 5; Bottom or side at enclosed hood 5 are provided with the liquid waste treatment system 6 that supplies the polishing waste liquid to store and/or discharge, and in described enclosed hood 5, also are equipped with to be used to detect the sensor 4 that shows its internal pressure, temperature and humidity.
The pressure of the described gas that in enclosed hood, feeds is 2-10 atmospheric pressure.
The combination of one or more in the argon gas that the described gas that in seal closure, feeds is regulated for the process temperature and humidity, nitrogen, oxygen, the carbon dioxide.
Be used for detecting sensor 4 dispersions of enclosed hood 5 pressure, temperature and humidity or installing concentratedly in enclosed hood 5.
Beneficial effect of the present invention:
The present invention can be airtight with the polishing system of processing owing to having adopted enclosed hood, avoided the influence of external environment to crudy, the introducing of special dust.
The present invention can introduce the gas that helps processing according to the characteristic of machined material owing to adopted gas supply system, avoids the unicity of tradition polishing gas.The gas that feeds can be one or more the combination in argon gas, nitrogen, oxygen, the carbon dioxide, and the temperature of gas, humidity can be adjusted to the optimum value that satisfies instructions for use in advance.
The present invention can feed controlled gases such as temperature, humidity and air pressure according to the kind and the processing request of sensitive material, reaches the purpose of control polishing environment, promotes the carrying out of polishing, improves quality of finish.Controlled gases such as described temperature, humidity and air pressure can be selected for use like one or more the combination in argon gas, nitrogen, oxygen, the carbon dioxide.
The present invention conveniently monitors and controls the polishing gaseous environment owing to adopted sensor.Can be according to the characteristic of machined material, temperature, humidity and the air pressure etc. of control gas promote the carrying out that polishing is processed, and improve the surface quality of material processed clearance and workpiece.Described sensor can be selected one or more the combination in temperature, humidity, the air pressure for use.
Description of drawings
Fig. 1 is the structural representation of airtight polishing processing device of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further described.
Embodiment one.
A kind of device that improves precise polished process velocity and workpiece surface quality, it comprises polishing machine 1, polishing fluid feed system 2, enclosed hood 5, gas supply system 3, sensor 4 and liquid waste treatment system.Polishing machine 1 outside is provided with enclosed hood 5; Offer a plurality of circular holes on the enclosed hood 5; Polishing fluid feed system 2 and gas supply system 3 are arranged on the both sides of enclosed hood 5, and the top of enclosed hood 5 is provided with temperature and humidity sensor 4, and the bottom of enclosed hood 5 is provided with the polishing fluid waste liquid and stores and discharge system 6.Can be known that by Fig. 1 polishing machine 1 is installed in the enclosed hood 5, described polishing fluid feed system 2 can be installed in directly gives the polishing pad feed flow in the enclosed hood 5, also can make to stretch into the circular hole of jet head from enclosed hood 5 and give the polishing pad feed flow in the enclosed hood; The gas supply system 3 that is used for improving enclosed hood air pressure, temperature, humidity is through stretching into the air supply pipe air feed in seal closure 5 in the enclosed hood 5; Supply gas pressure is a 2-10 atmospheric pressure; Institute's supplied gas can be one or more the combination in the argon gas regulated through temperature and humidity, nitrogen, oxygen, the carbon dioxide; Bottom or side at enclosed hood 5 are provided with the liquid waste treatment system 6 that supplies the polishing waste liquid to store and/or discharge; The sensor 4 that is used to detect its internal pressure of demonstration, temperature and humidity also is installed in described enclosed hood 5, and sensor 4 disperses or installs concentratedly in enclosed hood 5.
Embodiment two.
A kind of method that improves precise polished process velocity and workpiece surface quality, it may further comprise the steps:
At first, polishing machine is placed transparent enclosed hood, to prevent that extraneous dust from getting into burnishing surface and influencing quality of finish;
Secondly, in transparent enclosed hood, charge into all gas of corresponding air pressure, temperature and humidity according to the characteristic of machined material, to regulate gas pressure, the temperature and humidity in the seal closure through overregulating;
The 3rd, the sensor that is used for detected pressures, temperature and humidity is installed in seal closure, so that the control system regulates the air feed parameter automatically, reach the purpose that improves material removing rate and surface quality.
According to the difference of institute's rapidoprint, the gas of feeding can be one or more the combination in argon gas, nitrogen, oxygen, the carbon dioxide.
According to the difference of institute's rapidoprint, the gas pressure of feeding is that to be 10-80%, temperature be-20-50 ℃ for 2-10 atmospheric pressure, humidity.
Through processing instance the present invention is further described below.
Adopt sealing polishing system of processing polishing associated materials of the present invention and traditional polishing system to compare; Tradition polishing system environmental condition is for what open, and room temperature (being about 20 ℃), humidity are 40%; Air pressure is in the air of an about 100kPa of atmospheric pressure, and other machined parameters are identical.
Instance one.
Polish soft crisp easy deliquescence CLBO (CLBO) crystal, adopting temperature is 24 ℃, and humidity is 10%; In the air of 200kpa (being about 2 atmospheric pressure); Material removing rate improves 40%, and surface quality improves 30%, does not have the deliquescence phenomenon (under the tradition polishing environment; The crystal deliquescence is very serious), no particle scratches.
If adopt oxygen and the nitrogen mixture body of 800kpa, then material removing rate improves 300%, and surface quality improves 100%, does not also have the deliquescence phenomenon, and no particle scratches.
Instance two.
Polish soft crisp easy deliquescence cesium triborate (CBO) crystal, adopting temperature is 30 ℃, and humidity is 10%; In the air of 200kpa, material removing rate improves 100%, and surface quality improves 30%; Do not have deliquescence phenomenon (under the tradition polishing environment, the crystal deliquescence is very serious), no particle scratches.
If temperature is 35 ℃, humidity is 10%, and in the air of 300kpa (being about 3 atmospheric pressure), material removing rate improves 150%, and surface quality improves 70%, does not also have the deliquescence phenomenon, and no particle scratches.
If temperature is 35 ℃, humidity is 10%, the oxygen of 500kpa and nitrogen gas, and material removing rate improves 400%, and surface quality improves 130%, does not also have the deliquescence phenomenon, and no particle scratches.
Instance three.
Polish soft crisp easy deliquescence potassium dihydrogen phosphate crystal (KDP) crystal, adopting temperature is 25 ℃, and humidity is 10%; In the air of 200kpa, material removing rate improves 60%, and surface quality improves 80%; Do not have deliquescence phenomenon (under the tradition polishing environment, the crystal deliquescence is very serious), no particle scratches.
Instance four.
Polishing K9 glass, adopting temperature is 50 ℃, and humidity is 20%, and in the oxygen of 500kpa, material removing rate improves 250%, and surface quality improves 200%.
If adopting temperature is 35 ℃, humidity is 80%, and in the argon gas of 700kpa (being about 7 atmospheric pressure), material removing rate improves 60%, and surface quality improves 100%.
If adopting temperature is-10 ℃, humidity is 50%, and in the nitrogen of 200kpa, material removing rate improves 10%, and surface quality improves 70%.
Instance five.
Polished silicon slice glass, adopting temperature is 40 ℃, and humidity is 20%, and in the oxygen of 500kpa, material removing rate improves 180%, and surface quality improves 300%.
If adopting temperature is 30 ℃, humidity is 30%, and in the carbon dioxide of 1000kpa (being about 10 atmospheric pressure), material removing rate improves 20%, and surface quality improves 30%.
If adopting temperature is-20 ℃, humidity is 50%, and in the nitrogen of 400kpa, material removing rate improves 25%, and surface quality improves 150%.
The present invention does not relate to all identical with the prior art prior art that maybe can adopt of part and realizes.
Claims (9)
1. method that improves precise polished process velocity and workpiece surface quality is characterized in that:
At first, polishing machine is placed enclosed hood, to prevent that extraneous dust from getting into polish and influencing quality of finish;
Secondly, in enclosed hood, charge into the gas that matches, to regulate gas pressure, the temperature and humidity in the seal closure;
The 3rd, the sensor that is used for detected pressures, temperature and humidity is installed in seal closure, so that the control system regulates the air feed parameter automatically, reach the purpose that improves material removing rate and surface quality.
2. method according to claim 1 is characterized in that described gas pressure is a 2-10 atmospheric pressure.
3. method according to claim 1 is characterized in that described gas is one or more the combination in argon gas, nitrogen, oxygen, the carbon dioxide.
4. method according to claim 1 is characterized in that described humidity is 10-80%.
5. method according to claim 1 is characterized in that described temperature is-20-50 ℃.
6. device that improves precise polished process velocity and workpiece surface quality; It comprises polishing machine (1) and polishing fluid feed system (2); It is characterized in that described polishing machine (1) is installed in the enclosed hood (5), described polishing fluid feed system (2) is installed in the jet head of directly giving polishing pad feed flow or said polishing fluid feed system (2) in the enclosed hood (5) and stretches in the enclosed hood to the polishing pad feed flow; The gas supply system (3) that is used for improving enclosed hood air pressure, temperature, humidity is through stretching into the air supply pipe air feed in seal closure (5) in the enclosed hood (5); Bottom or side at enclosed hood (5) are provided with the liquid waste treatment system (6) that supplies the polishing waste liquid to store and/or discharge, and in described enclosed hood (5), also are equipped with to be used to detect the sensor (4) that shows its internal pressure, temperature and humidity.
7. device according to claim 6, the pressure that it is characterized in that the described gas that in enclosed hood, feeds are 2-10 atmospheric pressure.
8. device according to claim 6 is characterized in that the described gas that in seal closure, feeds is one or more the combination in the argon gas regulated through temperature and humidity, nitrogen, oxygen, the carbon dioxide.
9. device according to claim 6, the sensor (4) that it is characterized in that being used for detecting enclosed hood (5) pressure, temperature and humidity disperses or installs concentratedly in enclosed hood (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102007078A CN102699821A (en) | 2012-06-18 | 2012-06-18 | Method and device for increasing precision polishing machining speed and improving surface quality of workpiece |
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| CN2012102007078A CN102699821A (en) | 2012-06-18 | 2012-06-18 | Method and device for increasing precision polishing machining speed and improving surface quality of workpiece |
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| CN2012102007078A Pending CN102699821A (en) | 2012-06-18 | 2012-06-18 | Method and device for increasing precision polishing machining speed and improving surface quality of workpiece |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104999368A (en) * | 2015-08-13 | 2015-10-28 | 厦门理工学院 | Device and method for automatically controlling buffing humidity |
| CN104999369A (en) * | 2015-08-13 | 2015-10-28 | 厦门理工学院 | Buffing humidity detection error correcting method |
| CN106827544A (en) * | 2017-02-12 | 2017-06-13 | 冯增瑞 | A kind of FDM formulas 3D printing finished product polishing robot |
| CN108526998A (en) * | 2017-03-01 | 2018-09-14 | 维嘉数控科技（苏州）有限公司 | A kind of machine tool environment control device and lathe |
| CN110052952A (en) * | 2019-06-05 | 2019-07-26 | 广州立奔杯业有限公司 | A kind of device of polishing and CuO surface |
| CN110605653A (en) * | 2019-10-16 | 2019-12-24 | 浙江工业大学 | Through hole polishing device and method for polishing through hole by using negative pressure |
| CN115070543A (en) * | 2022-08-24 | 2022-09-20 | 安徽新境界自动化技术有限公司 | Control system of automatic polishing robot |
| CN117773697A (en) * | 2024-02-23 | 2024-03-29 | 山东旭辉玻璃科技有限公司 | Cutting corner polishing equipment for agricultural machinery glass |
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| JP2006231419A (en) * | 2005-02-22 | 2006-09-07 | Tokyo Seimitsu Co Ltd | Polishing device and method |
| CN201140345Y (en) * | 2007-12-25 | 2008-10-29 | 上海机床厂有限公司 | Temperature feedback type dry freeze grinding device |
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| CN201970173U (en) * | 2010-12-30 | 2011-09-14 | 黄运权 | Automatic grinder |
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| JP2001280734A (en) * | 2000-03-31 | 2001-10-10 | Sanyo Electric Co Ltd | Cold air generating device |
| CN101693354A (en) * | 2002-12-27 | 2010-04-14 | 株式会社荏原制作所 | Substrate polishing apparatus |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104999368A (en) * | 2015-08-13 | 2015-10-28 | 厦门理工学院 | Device and method for automatically controlling buffing humidity |
| CN104999369A (en) * | 2015-08-13 | 2015-10-28 | 厦门理工学院 | Buffing humidity detection error correcting method |
| CN104999368B (en) * | 2015-08-13 | 2017-10-31 | 厦门理工学院 | Buffing Humidity Automatic Control device and its control method |
| CN106827544A (en) * | 2017-02-12 | 2017-06-13 | 冯增瑞 | A kind of FDM formulas 3D printing finished product polishing robot |
| CN108526998A (en) * | 2017-03-01 | 2018-09-14 | 维嘉数控科技（苏州）有限公司 | A kind of machine tool environment control device and lathe |
| CN110052952A (en) * | 2019-06-05 | 2019-07-26 | 广州立奔杯业有限公司 | A kind of device of polishing and CuO surface |
| CN110052952B (en) * | 2019-06-05 | 2020-06-23 | 宝应县增厚铜业有限公司 | Device for polishing and oxidizing copper surface |
| CN110605653A (en) * | 2019-10-16 | 2019-12-24 | 浙江工业大学 | Through hole polishing device and method for polishing through hole by using negative pressure |
| CN115070543A (en) * | 2022-08-24 | 2022-09-20 | 安徽新境界自动化技术有限公司 | Control system of automatic polishing robot |
| CN117773697A (en) * | 2024-02-23 | 2024-03-29 | 山东旭辉玻璃科技有限公司 | Cutting corner polishing equipment for agricultural machinery glass |
| CN117773697B (en) * | 2024-02-23 | 2024-05-14 | 山东旭辉玻璃科技有限公司 | Cutting corner polishing equipment for agricultural machinery glass |
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Application publication date: 20121003 |