CN102695819A - Electrolytic hard gold plating solution and plating method using same - Google Patents
Electrolytic hard gold plating solution and plating method using same Download PDFInfo
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- CN102695819A CN102695819A CN2010800528667A CN201080052866A CN102695819A CN 102695819 A CN102695819 A CN 102695819A CN 2010800528667 A CN2010800528667 A CN 2010800528667A CN 201080052866 A CN201080052866 A CN 201080052866A CN 102695819 A CN102695819 A CN 102695819A
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- plating solution
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- salt
- tunicle
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Disclosed is a plating solution which does not result in pinholes in a metal film even if the metal film is less than 0.1[mu]m thick. Partial plating is performed using an electrolytic hard gold plating solution containing gold cyanide and/or gold cyanide salt, water-soluble cobalt salt or water-soluble nickel salt, conducting salts of organic acids, an aromatic sulfonic acid compound, a combination of one or more items selected from a group consisting of carboxylic acids, oxycarboxylic acids, and the salts thereof, and a nitrogen-containing five-membered heterocyclic compound. Consequently, pinholes are not caused in a metal film even if the metal film is less than 0.1[mu]m thick.
Description
Technical field
Even it is thin to the present invention relates to the plating tunicle, also be difficult for producing pin hole, can form the electrolysis hard gold plating solution of fine and close plating tunicle and the method for plating that uses this plating solution.Particularly relate to the electrolysis hard gold plating solution of the local plating that is suitable for electronic units such as junctor and use the method for plating of this plating solution.
Background technology
Because I T development of technology in recent years, the lightweight of electronicss such as mobile phone, notebook PC, miniaturized, high performance are just fast-developing.Follow this fast development, constitute the requirement that miniaturized and the safety of the electronic unit of these electronicss promote and also improving.Constitute the gold-plated processing of the many employings of electronic unit of these electronicss.
For example, on the contact component that becomes electric contact of the junctor that is electrically connected between with electronics and electronic unit, implement the excellent hard gold plating of wear resistance.
Usually, the method below the contact component of electronic unit uses is made.At first, implement nickel plating, form nickel flashing on the surface of the copper product that becomes base material etc.Then, on nickel flashing, implement hard gold plating, form golden tunicle.Thus, obtain on copper product, being formed with in order the contact component of nickel flashing, golden tunicle.
Because the price of gold lattice are high, therefore seek to save gold through attenuate gold tunicle.But,, be to produce many pin holes on the golden tunicle below the 0.1 μ m at thickness using existing golden plating solution to form the occasion of golden tunicle.When forming pin hole on the golden tunicle, the nickel flashing of substrate receives atmospheric oxidation through pin hole, and its result generates nickel oxide.This nickel oxide makes the resistance rising of contact portion etc., and the electrical characteristic of electronics are changed.Consequently, in electronics, produce fault.
That is the golden tunicle that, the is formed with many pin holes nickel flashing that can not adequately protect.Therefore, hope on golden tunicle, do not have pin hole.
Put down in writing the method for using the hard gold plating solution docking point parts that comprise lustering agent to implement local plating in the patent documentation 1.The uniformly-coating property of this plating solution is high.But the lustering agent composition in this plating solution gets in the golden tunicle.When lustering agent becomes to grade additive component when getting in the golden tunicle, the golden purity drop of golden tunicle.Its result increases the contact resistance of contact component, and solidity to corrosion is worsened.
The prior art document
Patent documentation
Patent documentation 1: specially permit communique No. 3933930
Summary of the invention
Invent problem to be solved
The problem that the present invention will solve is, a kind of electrolysis hard gold plating solution is provided, and it is suitable for local plating processing etc., even form the golden tunicle below the thickness 0.1 μ m, on golden tunicle, also can not produce pin hole.
Other problem that the present invention will solve is, a kind of method for plating that uses this electrolysis hard gold plating solution is provided.
Be used to solve the means of problem
In order to solve above-mentioned problem, the inventor etc. at first handle local plating and study.Its result finds, when in plating solution, cooperating organic oxidizing agent, can suppress separating out of gold significantly in low current density areas, thereby has carried out patented claim (the special 2009-165730 of hope).This organic oxidizing agent is at low current density areas (the not enough 20A/dm of current density
2) in, thereby the redox potential that improves gold significantly suppresses separating out of gold.On the other hand, in～areas of high current density (current density 20～200A/dm
2) in, do not suppress separating out of gold.Therefore, through control current density, may command forms the position of plating tunicle.According to said reason, cooperate the electrolysis hard gold plating solution of organic oxidizing agent can be used for local plating processing suitably.
Then, inventor etc. studies the filmization of golden tunicle.Its result finds, when in said plating solution, cooperating organic crystal regulator of the present invention, even the thickness of golden tunicle is about 0.05 μ m, on golden tunicle, also can not produce pin hole.The inventor etc. find that also said plating solution forms the high golden tunicle of golden purity.The inventor etc. have accomplished the present invention based on above discovery.
The present invention who solves said problem is the invention of following record.
﹝1﹞
A kind of electrolysis hard gold plating solution is characterized in that, contains:
Gold tricyanide and gold tricyanide salt at least a;
Water soluble cobaltous salt or water soluble nickel salt;
The organic acid conducting salt;
The aromatic sulfonic acid compound;
Be selected from by 1 in carboxylic acid, hydroxycarboxylic acid and their group that salt constituted or the combination more than 2 kind; With
Nitrogenous 5-membered heterocycles compound.
﹝2﹞
The electrolysis hard gold plating solution of in ﹝ 1 ﹞, putting down in writing, the said nitrogenous 5-membered heterocycles compound concentrations in the said electrolysis hard gold plating solution is 1～50g/L.
﹝3﹞
The electrolysis hard gold plating solution of in ﹝ 1 ﹞, putting down in writing, pH is in 3～7 scope.
﹝4﹞
A kind of method for plating, the electrolysis hard gold plating solution spraying plating that Tong Guo puts down in writing in ﹝ 1 ﹞ is hoping that at the position of hoping plating the plating position forms golden tunicle.
The invention effect
The golden tunicle that uses electrolysis hard gold plating solution of the present invention to form even thickness is about 0.05 μ m, can not form pin hole yet.Owing to being covered by golden tunicle fully, the nickel flashing surface is protected, and therefore high by the solidity to corrosion of plating material, in addition, can reduce the usage quantity of gold, economy is excellent.
Embodiment
< electrolysis hard gold plating solution >
Below, electrolysis hard gold plating solution of the present invention is elaborated.
In electrolysis hard gold plating solution of the present invention, be combined with at least a of gold tricyanide and gold tricyanide salt as Jin Yuan.Also can cooperate both.As gold tricyanide salt, example has potassium auric cyanide, gold sodium cyanide, gold tricyanide ammonium.They can cooperate separately, also can cooperate two or more.
The gold tricyanide of electrolysis hard gold plating solution of the present invention and the concentration of gold tricyanide salt add up to 0.1～20g/L as gold concentration, are preferably 2～15g/L, are preferably 3～10g/L especially.When gold concentration deficiency 0.1g/L, cathode efficiency is poor, therefore can not get the golden tunicle of regulation thickness.Even gold concentration surpasses 20g/L,, therefore there is not to improve especially the advantage of gold concentration because cathode efficiency can not increase with gold concentration pro rata yet.In addition, in plating was handled, the drag-out of plating solution increased, and the loss of plating solution increases.
In electrolysis hard gold plating solution of the present invention, be combined with the aromatic sulfonic acid compound.The aromatic sulfonic acid compound plays a role as organic oxidizing agent.As the aromatic sulfonic acid compound, can enumerate: 2-nitrobenzene-sulfonic acid, 3-nitrobenzene-sulfonic acid, 4-nitrobenzene-sulfonic acid, 2,4-dinitrobenzene sulfonic acid, 2-aniline sulfonic acid, 3-aniline sulfonic acid, 4-aniline sulfonic acid and their salt.Among them, also preferably has nitro as substituent aromatic sulfonic acid compound.They can cooperate separately, also can cooperate more than 2 kinds.
Be combined with the electrolysis hard gold plating solution of these aromatic sulfonic acid compounds, at low current density areas (the not enough 20A/dm of current density
2) in, obviously improve golden redox potential.Consequently, in low current density areas, suppress separating out of gold.On the other hand, be combined with the electrolysis hard gold plating solution of these aromatic sulfonic acid compounds, in～areas of high current density (current density 20～200A/dm
2) in can not suppress the gold separate out.Consequently, in～areas of high current density forms normal golden tunicle.
For electrolysis hard gold plating solution of the present invention,, can suppress it and formed the plating tunicle beyond hope plating position of plating material through control current density.
The concentration of the organic oxidizing agent that is cooperated in the electrolysis hard gold plating solution of the present invention is 0.1～20g/L, is preferably 0.5～5g/L, is preferably 1～3g/L especially.When the not enough 0.1g/L of the concentration of organic oxygenant, the inhibition effect that the gold in the low current density areas is separated out is little.Even the concentration of organic oxidizing agent surpasses 20g/L, the inhibition effect that the gold in the low current density areas is separated out also can not change and be high.
In electrolysis hard gold plating solution of the present invention, be combined with carboxylic acid or hydroxycarboxylic acid or their salt.They play a role as complexing agent.As carboxylic acid or hydroxycarboxylic acid or their salt, can enumerate: formic acid, oxyacetic acid, lactic acid, hydroxy-benzoic acid, oxalic acid, propanedioic acid, succsinic acid, oxysuccinic acid, tartrate, phthalic acid, diglycollic acid, Hydrocerol A and their salt.Be preferably an alkali metal salts such as sodium salt, sylvite as salt; Alkali earth metal salts such as calcium salt; The salt of ammonia, amine etc.They can cooperate separately, also can cooperate more than 2 kinds.
The concentration of the complexing agent of electrolysis hard gold plating solution of the present invention is 1～100g/L, is preferably 5～600g/L.When the not enough 1g/L of the concentration of complexing agent, from being easy to get in the golden tunicle by the inorganic impurity of plating material stripping.When inorganic impurity gets in the golden tunicle, the golden purity drop of golden tunicle.Consequently, golden tunicle outward appearance is worsened, the contact resistance of contact component is increased, solidity to corrosion is worsened.Even the concentration of complexing agent surpasses 100g/L, because the effect that can not get matching with it is therefore uneconomical.
In electrolysis hard gold plating solution of the present invention, be combined with water miscible cobalt salt or water miscible nickel salt.As cobalt salt, can enumerate: rose vitriol, Xiao Suangu, NSC 51149, cobaltous dihydroxycarbonate.As nickel salt, can enumerate: single nickel salt, nickel sulfamic acid, sulfurous acid nickel, nickelous chloride.They can cooperate separately, also can cooperate more than 2 kinds.
The cobalt salt of electrolysis hard gold plating solution of the present invention or the concentration of nickel salt are 0.01～10g/L, are preferably 0.1～1.0g/L.When the not enough 0.01g/L of the concentration of cobalt salt or nickel salt, the hardness step-down of golden tunicle.Even the concentration of cobalt salt or nickel salt surpasses 10g/L, because the effect that can not get matching with it is therefore uneconomical.Through cooperating cobalt salt or nickel salt with above-mentioned concentration, the hardness of golden tunicle reaches 150～200HV.In addition, what is called is matched with cobalt salt or nickel salt water-soluble of electrolysis hard of the present invention gold plating solution, and being meant can be with above-mentioned concentration the water-soluble of degree that be dissolved in the water.
In electrolysis hard gold plating solution of the present invention, be combined with the organic acid conducting salt.As the organic acid conducting salt, can enumerate: potassium formiate, Tripotassium Citrate, potassiumphosphate, saltpetre, potassium succinate.They can cooperate separately, also can cooperate more than 2 kinds.
The concentration of the organic acid conducting salt of electrolysis hard gold plating solution of the present invention is 10～200g/L, is preferably 50～100g/L.If the not enough 10g/L of the concentration of organic acid conducting salt, then the outward appearance of golden tunicle worsens, and can not obtain normal golden tunicle.Even the concentration of organic acid conducting salt surpasses 200g/L, because the effect that can not get matching with it is therefore uneconomical.
In electrolysis hard gold plating solution of the present invention, be combined with nitrogenous 5-membered heterocycles compound.Nitrogenous 5-membered heterocycles compound plays a role as the organic crystal regulator.The inventor thinks that nitrogenous 5-membered heterocycles compound is through being adsorbed in gold tricyanide ion or the gold ion after electrical double layer is adsorbed in deallocation seat (cryanide ion) in the bath or carrying out complexing, and the crystal growth of control gold forms fine and close golden tunicle.In addition, the nitrogenous 5-membered heterocycles compound that uses in the present invention can not get in the golden tunicle.Therefore, the golden purity of golden tunicle is high.
As nitrogenous 5-membered heterocycles compound; Can enumerate: imidazoles, glyoxal ethyline, pyrazoles, 3; 5-dimethyl pyrazole, 2-tetrahydroglyoxaline, 2-Pyrrolidone, NSC 9226,5,5-T10, wallantoin, succimide, DL-Pyrrolidonecarboxylic acid and their salt.
In electrolysis hard gold plating solution of the present invention, nitrogenous 5-membered heterocycles compound concentrations is 1～50g/L, is preferably 5～20g/L, is preferably 8～12g/L especially.When the not enough 1g/L of nitrogenous 5-membered heterocycles compound concentrations, the crystallization regulating effect diminishes, and can not get fine and close golden tunicle.Even nitrogenous 5-membered heterocycles compound concentrations surpasses 50g/L, because the effect that can not get matching with it is therefore uneconomical.
Electrolysis hard of the present invention gold plating solution can be that 3.0～7.0 scope is used at pH, is that 4.0～5.0 scope is used at pH preferably.When pH was lower than 4.0, cathode efficiency reduced, and was difficult to obtain the golden tunicle of regulation thickness.And when pH was higher than 5.0, the outward appearance of golden tunicle took on a red color, and was difficult to obtain normal golden tunicle.In addition, as the regulator of pH, can give an example: sodium hydroxide, Pottasium Hydroxide, volatile caustic, dilute sulphuric acid.
In electrolysis hard of the present invention gold plating solution, can be in the scope that does not hinder effect of the present invention matched with other substances.
Use the method for plating of electrolysis hard gold plating solution of the present invention, can implement with present known method for plating.In addition, also can carry out plating through following local plating method, that is, with platinum system nozzle as anode, will be by plating material as negative electrode, from platinum system nozzle to by plating material spraying plating electrolysis hard gold of the present invention plating solution.
Embodiment
Device formation and the evaluation method used in the test are following.
Prepare the copper coin of 32mm * 150mm * 0.2mm.Use the nickel sulfamic acid plating solution on this copper coin, to form the nickel flashing of 2 μ m thickness, with it as sample.The overlapping mask plate that fixedly has the Zylox system of the foursquare peristome of 10mm * 10mm on this sample.
Use pump that plating solution is delivered to the plating solution jet orifice, from the peristome injection plating solution of this plating solution jet orifice to mask plate.Thus, sample is implemented local plating.At the plating solution jet orifice diameter being installed is the platinum nozzle of 5mm, and with this nozzle as anode.
The mensuration of the thickness of gold tunicle is used the system fluorescent X-ray elcometer SEA5120 of SII society.
Through the nitric acid aeration test method of being put down in writing in the JIS standard (JIS H8620 10.5), carry out having or not on the golden tunicle evaluation that produces pin hole as one of porosity test.The porosity test is the size to the pin hole of plating layer, the test that quantity is estimated.In the nitric acid aeration test, in container bottom, add magnetic making sheet in the moisture eliminator of nitric acid and upload and put sample, about 23 ℃ of held 1 hour.The nitric acid vapor that in moisture eliminator, produces makes the nickel flashing corrosion through pin hole.When the nickel flashing of substrate receives when corroding, on golden tunicle, will present spot.For the generation state of this spot, contrast to estimate with the erosion resistance grading standard chart of regulation in the corrosion resistant test method (JISH850211.5) of the plating of JIS standard.
(embodiment 1)
Potassium auric cyanide: 5g/L (as Au)
Tripotassium Citrate: 70g/L
Hydrocerol A: 50g/L
Potassium formiate: 20g/L
Rose vitriol: 0.96g/L
2-nitrobenzene-sulfonic acid: 2g/L
Imidazoles: 10g/L
According to said ratio plating solution is regulated.It is 4.2 that this plating solution is adjusted to pH, according to 55 ℃ of liquid temperature, current density 40A/dm
2Condition, the mode that becomes 0.05 μ m with golden film thickness is implemented local plating to sample.The tone of the golden tunicle that on sample, forms is lemon yellow, and outward appearance is even, is good surface appearance.Solidity to corrosion is estimated, and erosion resistance is rated 9.5-5, and total corroded area rate is greater than 0.02 and is below 0.05%.
(embodiment 2～5), (comparative example 1,2)
Proportioning according to expression in the table 1 prepares plating solution, likewise sample is implemented local plating with embodiment 1.The tone of the golden tunicle that on sample, forms is lemon yellow, and outward appearance is even, is good surface appearance.The result that solidity to corrosion is estimated representes in table 2.
[table 1]
[table 2]
| The erosion resistance grading | Total corroded area rate % | |
| Embodiment 1 | 9.5-5 | Greater than 0.02 and be below 0.05% |
| Embodiment 2 | 9.3-3 | Greater than 0.05 and be below 0.07% |
| Embodiment 3 | 9.5-6 | Greater than 0.02 and be below 0.05% |
| Embodiment 4 | 9.5-3 | Greater than 0.02 and be below 0.05% |
| Embodiment 5 | 9.3-6 | Greater than 0.05 and be below 0.07% |
| Comparative example 1 | 4-1 | Greater than 2.50 and be below 5.00% |
| Comparative example 2 | 4-4 | Greater than 2.50 and be below 5.00% |
Embodiment 1～5 compares with comparative example 1,2, and corrosion is suppressed significantly.
Know that from above electrolysis hard gold plating solution of the present invention even the thickness of golden tunicle is below the 0.1 μ m, also can form the golden tunicle of the few densification of pin hole.Consequently, by the corrosion resistance excellent of plating material.
Claims (4)
1. an electrolysis hard gold plating solution is characterized in that, contains:
Gold tricyanide and gold tricyanide salt at least a;
Water soluble cobaltous salt or water soluble nickel salt;
The organic acid conducting salt;
The aromatic sulfonic acid compound;
Be selected from 1 in group that constitutes by carboxylic acid, hydroxycarboxylic acid and their salt or the combination more than 2 kind;
Nitrogenous 5-membered heterocycles compound.
2. the described electrolysis hard of claim 1 gold plating solution, wherein, the said nitrogenous 5-membered heterocycles compound concentrations in the said electrolysis hard gold plating solution is 1～50g/L.
3. the described electrolysis hard of claim 1 gold plating solution, wherein, the pH of plating solution is in 3～7 scope.
4. method for plating, through with the spraying plating of the described electrolysis hard gold of claim 1 plating solution at the position of the hope plating of sample, form golden tunicle at the position of hoping plating.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009279409A JP2011122192A (en) | 2009-12-09 | 2009-12-09 | Electrolytic hard gold plating liquid and plating method using the same |
| JP2009-279409 | 2009-12-09 | ||
| PCT/JP2010/071304 WO2011070933A1 (en) | 2009-12-09 | 2010-11-30 | Electrolytic hard gold plating solution and plating method using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102695819A true CN102695819A (en) | 2012-09-26 |
Family
ID=44145478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800528667A Pending CN102695819A (en) | 2009-12-09 | 2010-11-30 | Electrolytic hard gold plating solution and plating method using same |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP2511400A4 (en) |
| JP (1) | JP2011122192A (en) |
| KR (1) | KR20120120134A (en) |
| CN (1) | CN102695819A (en) |
| SG (1) | SG181529A1 (en) |
| TW (1) | TW201137184A (en) |
| WO (1) | WO2011070933A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542818A (en) * | 2024-01-10 | 2024-02-09 | 深圳市联合蓝海应用材料科技股份有限公司 | Gold-silver alloy bump and preparation method and application thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5025815B1 (en) * | 2011-08-10 | 2012-09-12 | 小島化学薬品株式会社 | Hard gold plating solution |
| JP5758361B2 (en) * | 2012-08-31 | 2015-08-05 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Non-cyanide gold-palladium alloy plating solution and plating method |
| JP5152943B1 (en) * | 2012-09-19 | 2013-02-27 | 小島化学薬品株式会社 | Method for producing low free cyanogen gold salt |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86100895A (en) * | 1985-01-18 | 1986-07-16 | 恩格尔哈德公司 | Gold electroplating bath |
| CN1357060A (en) * | 1999-06-17 | 2002-07-03 | 德古萨电解技术有限公司 | Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor |
| US20040249177A1 (en) * | 2003-06-04 | 2004-12-09 | Shipley Company, L.L.C. | Leveler compounds |
| CN1561407A (en) * | 2001-08-24 | 2005-01-05 | 法国梅塔勒科技公司 | Electrolyte tank for electrochemical deposition of gold and its alloys |
| CN101550571A (en) * | 2008-03-31 | 2009-10-07 | 恩伊凯慕凯特股份有限公司 | Electroplating solution containing gold for partly electroplating |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2355581C3 (en) * | 1973-11-07 | 1979-07-12 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Galvanic bright gold bath with high deposition rate |
| JPS637390A (en) * | 1986-06-26 | 1988-01-13 | Nippon Engeruharudo Kk | Gold-cobalt alloy plating liquid |
| JP4320606B2 (en) * | 2004-03-15 | 2009-08-26 | 上村工業株式会社 | Gold plating bath |
| SG127854A1 (en) * | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
| JP5559455B2 (en) * | 2007-06-29 | 2014-07-23 | 日本高純度化学株式会社 | Electrolytic gold plating solution and gold film obtained using the same |
| JP2009165730A (en) | 2008-01-18 | 2009-07-30 | Kozo Motoki | Cleaning brush |
| JP5216633B2 (en) * | 2008-03-19 | 2013-06-19 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Method for suppressing background plating |
| KR101079554B1 (en) * | 2008-06-11 | 2011-11-04 | 니혼 고쥰도가가쿠 가부시키가이샤 | Electrolytic gold plating solution and gold film obtained using same |
-
2009
- 2009-12-09 JP JP2009279409A patent/JP2011122192A/en not_active Ceased
-
2010
- 2010-11-30 SG SG2012041463A patent/SG181529A1/en unknown
- 2010-11-30 EP EP10835855.7A patent/EP2511400A4/en not_active Withdrawn
- 2010-11-30 CN CN2010800528667A patent/CN102695819A/en active Pending
- 2010-11-30 KR KR1020127012784A patent/KR20120120134A/en not_active Application Discontinuation
- 2010-11-30 WO PCT/JP2010/071304 patent/WO2011070933A1/en active Application Filing
- 2010-12-08 TW TW099142808A patent/TW201137184A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86100895A (en) * | 1985-01-18 | 1986-07-16 | 恩格尔哈德公司 | Gold electroplating bath |
| CN1357060A (en) * | 1999-06-17 | 2002-07-03 | 德古萨电解技术有限公司 | Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor |
| CN1205360C (en) * | 1999-06-17 | 2005-06-08 | 德古萨电解技术有限公司 | Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor |
| CN1561407A (en) * | 2001-08-24 | 2005-01-05 | 法国梅塔勒科技公司 | Electrolyte tank for electrochemical deposition of gold and its alloys |
| US20040249177A1 (en) * | 2003-06-04 | 2004-12-09 | Shipley Company, L.L.C. | Leveler compounds |
| CN101550571A (en) * | 2008-03-31 | 2009-10-07 | 恩伊凯慕凯特股份有限公司 | Electroplating solution containing gold for partly electroplating |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542818A (en) * | 2024-01-10 | 2024-02-09 | 深圳市联合蓝海应用材料科技股份有限公司 | Gold-silver alloy bump and preparation method and application thereof |
| CN117542818B (en) * | 2024-01-10 | 2024-04-05 | 深圳市联合蓝海应用材料科技股份有限公司 | Gold-silver alloy bump and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201137184A (en) | 2011-11-01 |
| EP2511400A4 (en) | 2013-07-24 |
| WO2011070933A1 (en) | 2011-06-16 |
| JP2011122192A (en) | 2011-06-23 |
| KR20120120134A (en) | 2012-11-01 |
| EP2511400A1 (en) | 2012-10-17 |
| SG181529A1 (en) | 2012-07-30 |
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Application publication date: 20120926 |