CN102687244A - 使用溶液法制作柔性板的方法 - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title description 12
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000000126 substance Substances 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 9
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims description 21
- 239000004642 Polyimide Substances 0.000 claims description 20
- 229920001721 polyimide Polymers 0.000 claims description 20
- 230000002209 hydrophobic effect Effects 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 13
- 239000000178 monomer Substances 0.000 claims description 10
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- 239000010431 corundum Substances 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000006355 external stress Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 239000004033 plastic Substances 0.000 description 12
- 229920003023 plastic Polymers 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 6
- 229920006254 polymer film Polymers 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 206010007247 Carbuncle Diseases 0.000 description 4
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- -1 aromatic tetracarboxylic acid Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 235000019994 cava Nutrition 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02601—Nanoparticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/36—Feeding the material on to the mould, core or other substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/22—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/08—Coating a former, core or other substrate by spraying or fluidisation, e.g. spraying powder
- B29C41/085—Coating a former, core or other substrate by spraying or fluidisation, e.g. spraying powder by rotating the former around its axis of symmetry
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/12—Spreading-out the material on a substrate, e.g. on the surface of a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/14—Dipping a core
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
- B29K2105/165—Hollow fillers, e.g. microballoons or expanded particles
- B29K2105/167—Nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
Abstract
公开了一种用于使用碳纳米管制作柔性板的方法。所述方法包括将含有碳纳米管的油墨涂覆至基板上以形成沉积层以及将聚合物溶液或单体溶液涂覆在所述沉积的碳纳米管层上以形成薄膜层。根据所述方法,旋涂的碳纳米管层涂覆有聚合物化学溶液或单体化学溶液以最小化基板与聚合物膜接触的面积并由此有利地形成无需施加任何外应力或激光而与所述基板上容易分离的柔性板。
Description
技术领域
本发明涉及一种用于制作固定在硅片或玻璃基板上的柔性板的方法。
背景技术
为了使用用于传统硅片或玻璃基板的最佳制作设备,塑料板因其柔性而应当固定在硬基板上。
主要有三种用于将这样的塑料板固定在硬玻璃基板上的方法。
参照图1,提出了一种使用单面胶带将塑料板固定在玻璃基板上的方法。塑料膜2置于玻璃基板1上,并且塑料膜2的两端用单面胶带3固定。该方法非常简单并便于使用,但具有一个缺点,由于玻璃基板1没有粘附在塑料板上,以及玻璃基板和塑料板具有不同的热膨胀系数,则在高温工艺期间,塑料板产生凹陷。
图2示出使用双面胶层4固定玻璃基板1和塑料板2的方法。该方法的优点在于,可以改善玻璃基板和柔性板之间的粘合并且可以避免由高温工艺造成的塑料膜凹陷。然而,该方法具有难于控制粘合强度的缺点。也就是说,当双面胶层粘合强度高时,在完成整个工艺之后,需要大的外应力把塑料板和基板分离,以及当双面胶层粘合强度低时,则不利地,在该工艺期间基板与塑料板分离。
参照图3,为了解决上文提到的问题,牺牲层5置于玻璃基板1和塑料板2之间并在该工艺完成之后通过激光辐射加热以将所述膜和所述基板分离。该方法的优点在于,玻璃基板和塑料板之间的粘合得到改善,并且塑料板与玻璃基板分离时的应力可以被最小化。然而,该方法的缺点是,不可以循环使用牺牲层并且由于使用激光而使制作成本增加。
如图4所示,与上文提到的工艺不同,聚合物溶液6通过例如旋涂法的方法涂覆在玻璃基板1上以形成聚合物膜,随后所述膜被加热并固化,随后被去除。该方法也具有缺点,由于玻璃基板和聚合物膜之间有极其高的粘合强度,聚合物膜不能容易地分离。
发明内容
技术问题
因此,鉴于上述问题进行本发明,本发明的一个目的是提供一种使用碳纳米管制作柔性板的方法,其中,旋涂的碳纳米管层被涂覆聚合物化学溶液或单体化学溶液以最小化基板与聚合物膜接触的面积,并由此形成无需施加任何外应力或激光就可以与所述基板容易分离的柔性板。
本发明的另一目的是提供一种这样的制作柔性板的方法:通过使用含疏水物质的油墨形成沉积层来实现如上文所述与使用含碳纳米管的油墨相同的效果。
技术方案
根据本发明,以上目的和其他目的可以通过提供一种用于使用碳纳米管制造柔性板的方法来实现,所述方法包括:将含有碳纳米管的油墨旋涂在基板上以形成沉积层;以及将聚合物溶液或单体溶液旋涂在所述沉积的碳纳米管上以形成薄膜层。
具体地,可以用于上文所述方法的化学溶液可以选自芳香族聚酰亚胺、聚苯硫醚和含氟树脂。
更具体地,所述化学溶液为聚酰亚胺(PI)或聚甲基丙烯酸甲酯(PMMA)。
上文所述的制作方法中可以使用的基板可以选自玻璃、硅片、不锈钢和刚玉。
可替换地,提供了一种用于通过重复上文所述制作方法至少一次以形成由所述沉积层和所述薄膜层组成的至少一个复合膜层来制作柔性板的方法。
所述制作方法可以使用含有疏水物质的油墨代替碳纳米管以形成沉积层。该制作方法按照与使用含有碳纳米管的油墨层实现所述沉积层的工序相同的连续工序实现。
特别地,当使用疏水物质时,优选的是,疏水物质高度疏水并具有80度或大于80度的接触角。
有益效果
本发明提供了一种用于制作柔性板的方法,通过用聚合物化学溶液或单体化学溶液涂覆旋涂的碳纳米层以最小化基板接触聚合物膜的面积,所述柔性板可以与所述基板容易地分离而无需施加任何外应力或激光。
附图说明
结合附图从下文的详细描述中可以更清楚地理解本发明的上述目的、特征和优点以及其他的目的、特征和优点,其中:
图1至图4为说明根据现有技术制作板的方法的截面图;以及
图5至图7为说明根据本发明制作板的方法的截面图。
具体实施方式
下文中,将结合附图详细描述本发明的构型和操作。
参照图5和图6,根据本发明的用于制作柔性板的方法包括:将含碳纳米管21的油墨涂覆至基板10上以形成沉积层20;以及将含聚合物或单体的化学溶液旋涂在所述沉积的碳纳米管层上以形成薄膜层30。多种涂覆方法可以应用至本发明,例如,旋涂法、狭缝涂覆法、喷涂法或浸涂法。
由于所述化学溶液渗透在旋涂的碳纳米管之间,则通过所述方法形成的柔性板可以有效减少作为薄膜层的薄膜接触玻璃基板的面积,因此实现所述薄膜层与所述玻璃基板便利分离。
用于上文所述的制作方法的化学溶液中,聚合物溶液可以选自有机物,例如聚酰亚胺(PI)、聚甲基丙烯酸甲酯(PMMA)及其组合,所述聚合物溶液以流体形式沉积并固化以获取薄膜。此外,所述聚合物溶液可以为所述有机物和少量无机物的混合物。具体而言,所述聚合物溶液可以选自芳香族聚酰亚胺、聚苯硫醚和含氟树脂及其组合。可替换地,聚合物溶液可以为通过均苯四甲酸二酐或联苯四甲酸酐缩聚获取的芳香族聚酰亚胺以及例如为二氨基二苯醚的芳香族聚酰亚胺。本文中使用的术语“聚酰亚胺(PI)树脂”指的是通过芳香族四羧酸或其衍生物与芳香族二异氰酸酯或其衍生物缩聚、随后亚胺化而制备的高度耐热树脂。聚酰亚胺(PI)树脂根据使用的单体类型而具有不同的分子结构,并因此可以显示出多种物理性质。通常,用来制备聚酰亚胺(PI)树脂的芳香族四羧酸可以为均苯四甲酸二酐(PMDA)或联苯四甲酸酐(BPDA)等,以及芳香族二胺可以为二氨基二苯醚(ODA)或对苯二胺(p-PDA)。
此外,可用于本发明的单体溶液可以为环氧化合物或UV固化(紫外固化)型单体并可以通过热处理或UV辐射而聚合。
此外,可以用于该制作方法的基板可以由对于半导体工艺有用的硬材料制成,所述硬材料选自玻璃、硅片、不锈钢和刚玉。
参照图7,该制作方法可以包括重复一系列步骤至少一次,其中所述系列步骤包括使用含碳纳米管的油墨形成沉积层并使用含聚合物或含单体的溶液形成薄膜层,从而形成具有包括多个含碳纳米管的薄膜层20a、20b和20c的多层结构的柔性板,由此实现因碳纳米管而具有高强度且可以与玻璃基板容易地分离的高强度柔性板。
下文将描述另一实施方式。制作方法可以使用含有疏水物质的油墨代替碳纳米管以实现沉积层。该制作方法是按照与使用含有碳纳米管的油墨层实现沉积层的工序相同的连续工序实现的。在该情况下,优选的是,疏水物质高度疏水并具有80度至130度的接触角。例如,所述疏水物质可以含有羟基、氨基或羧基。
如上文所述,根据本发明的制作方法能够通过使基板接触薄膜的面积最小化而形成无需施加任何外应力或激光就可以容易地与基板分离的柔性板。
尽管出于说明目的公开了本发明的优选实施方式,但本领域的技术人员将理解,在不脱离所附权利要求中所公开的本发明的范围和精神的情况下,可以进行各种改动、添加和替换。
Claims (12)
1.一种用于使用碳纳米管制作柔性板的方法,所述方法包括:
将含有碳纳米管的油墨涂覆至基板上以形成沉积层;以及
将聚合物溶液或单体溶液涂覆在所沉积的碳纳米管层上以形成薄膜层。
2.根据权利要求1所述的方法,其中,所述化学溶液选自芳香族聚酰亚胺、聚苯硫醚和含氟树脂。
3.根据权利要求1所述的方法,其中,所述化学溶液为聚酰亚胺(PI)或聚甲基丙烯酸甲酯(PMMA)。
4.根据权利要求1至3中任一项所述的方法,其中,所述基板选自玻璃、硅片、不锈钢和刚玉。
5.根据权利要求4所述的方法,其中,所述沉积层和所述薄膜层的形成过程被重复至少一次,以形成由所述沉积层和所述薄膜层组成的至少一个复合膜层,所述至少一个复合膜层构成所述柔性板。
6.一种用于制作柔性板的方法,所述方法包括:
将含有接触角大于80度的高度疏水物质的油墨涂覆至基板上以形成沉积层;以及
将含有聚合物或单体的化学溶液涂覆在所沉积的疏水物质上以形成薄膜层。
7.根据权利要求6所述的方法,其中,所述疏水物质具有80度至130度的接触角。
8.根据权利要求7所述的方法,其中,所述疏水物质含有羟基、氨基或羧基或者上述基团的组合。
9.根据权利要求7所述的方法,其中,所述化学溶液选自芳香族聚酰亚胺、聚苯硫醚和含氟树脂。
10.根据权利要求7所述的方法,其中,所述化学溶液为聚酰亚胺(PI)或聚甲基丙烯酸甲酯(PMMA)。
11.根据权利要求7至10中任一项所述的方法,其中,所述基板选自玻璃、硅片、不锈钢和刚玉。
12.根据权利要求11所述的方法,其中,所述沉积层和所述薄膜层的形成过程被重复至少一次,以形成由所述沉积层和所述薄膜层组成的至少一个复合膜层,所述至少一个复合膜层构成所述柔性板。
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KR102369298B1 (ko) | 2014-04-29 | 2022-03-03 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치 및 그 제조방법 |
CN111516279A (zh) * | 2020-04-23 | 2020-08-11 | 内蒙动力机械研究所 | 一种防热涂层片材预成型方法 |
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CN108724570A (zh) | 2018-11-02 |
US20120183699A1 (en) | 2012-07-19 |
KR20110035033A (ko) | 2011-04-06 |
JP2013506286A (ja) | 2013-02-21 |
JP5758391B2 (ja) | 2015-08-05 |
WO2011040685A1 (en) | 2011-04-07 |
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