CN102682875A - Transparent conductive structure for touch panel and manufacturing method thereof - Google Patents
Transparent conductive structure for touch panel and manufacturing method thereof Download PDFInfo
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- CN102682875A CN102682875A CN201110062482XA CN201110062482A CN102682875A CN 102682875 A CN102682875 A CN 102682875A CN 201110062482X A CN201110062482X A CN 201110062482XA CN 201110062482 A CN201110062482 A CN 201110062482A CN 102682875 A CN102682875 A CN 102682875A
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Abstract
The invention discloses a transparent conductive structure for a touch panel and a manufacturing method of the transparent conductive structure. The transparent conductive structure for the touch panel comprises a base plate unit, a first covered unit, a transparent conductive unit and a second covered unit. The base plate unit is provided with at least one transparent base plate. The first covered unit is provided with at least one first covered layer which is formed on the upper surface of the at least one transparent base plate. The transparent conductive unit is provided with at least one transparent conductive layer which is formed on the upper surface of the at least one first covered layer, and the at least one transparent conductive layer is provided with multiple conductive circuits which are arranged as a special circuit pattern. The second covered unit is provided with a second covered layer which is formed on the upper surface of the at least one transparent conductive layer, and the top end of the at least one second covered layer is provided with a touch surface which is used for being touched by outer matters. The at least one second covered layer is formed by mixing silicon oxide, aluminum oxide, lithium oxide and polytetrafluoroethylene.
Description
Technical field
The present invention relates to a kind of transparent conducting structures and preparation method thereof, refer to a kind of transparent conducting structures that is applied to contact panel and preparation method thereof especially.
Background technology
Touch technology now is because of needing additional configuration mouse, button or directionkeys, thus extensively apply to the mode of various electronic installation as its input, to reach the lightening trend of product.In other words; Rise along with Internet appliance product; Contact panel (touch panel) replaces the old mode of linking up with keyboard, mouse and information products gradually; The contact panel technology provides the interface of a cover hommization, when making general user's operating computer or electronic product, can become more direct, simple, lively, interesting.And the range of application of contact panel is wide; Comprise that portable communication and information products (like personal digital assistant PDA etc.), finance/commerce are with system, medical hospital registration system, supervisory control system, information guiding and browsing system; And assisted teaching system etc.; Because its operation is simple and easy, thereby increased the convenience that the consumer uses.
Generally speaking, contact panel is classified according to the sensing principle and can roughly be divided into resistance-type, condenser type, piezoelectric type, infrared ray and ultrasonic waves formula.Wherein capacitance type touch-control panel is to be coated with the transparent conductive material film as the face inside conductor at glass surface; Cooperate the integrated circuit (IC) on glass plain conductor transmission signals all around to outside soft board or the hardboard again, said structure is referred to as touch sensor (touch sensor).If further attach the over cap of the external circuit board and the top again, then its completion article then are called contact panel.Glass surface can form uniform electric field during use, as user during with finger tip touch-control glass surface, because of the static reaction produces changes in capacitance, then can locate the coordinate of input point position according to this variation between finger and electric field.
See also shown in Figure 1; Known technology discloses a kind of transparent conducting structures that is applied to contact panel, and it comprises: a pet substrate 1a, forms in conducting wire 3a on hard coat 2a on the upper surface of pet substrate 1a, a plurality of lower surface that forms in pet substrate 1a, and one covers above-mentioned a plurality of conducting wire 3a to protect the protective layer 4a of above-mentioned a plurality of conducting wire 3a.Yet; Because above-mentioned a plurality of conducting wire 3a are apart from the still excessive reason of upper surface 20a (this is used to operate the surface of the required contact of contact panel for the user) of hard coat 2a, so above-mentioned a plurality of conducting wire 3a must use electrical conductivity (conduction scope) less than 0.3 the ohm-sq ((ohm-sq rice (Ω/m of Ω/)
2)) ultralow electric conducting material reach the requirement of induction.
Summary of the invention
The object of the present invention is to provide a kind of transparent conducting structures and preparation method thereof, it can be applicable to contact panel, and does not need as prior art, to use ultralow electric conducting material to make the conducting wire.
The embodiment of the invention provides a kind of transparent conducting structures that is applied to contact panel, and it comprises: a base board unit, one first lining unit, an electrically conducting transparent unit and one second lining unit.Wherein, base board unit has at least one transparency carrier.The first lining unit has at least one first coating that forms in the upper surface of above-mentioned at least one transparency carrier.The electrically conducting transparent unit has at least one transparency conducting layer that forms in the upper surface of above-mentioned at least one first coating; Wherein above-mentioned at least one transparency conducting layer has a plurality of conducting wires, and above-mentioned a plurality of conducting wire by layout arrangement to form a specific circuit pattern.The second lining unit has at least one second coating that forms in the upper surface of above-mentioned at least one transparency conducting layer; The top of wherein above-mentioned at least one second coating have one be used to provide foreign object (for example user's finger or any pointer or the like) touching the touching surface, and above-mentioned at least one second coating can by silica, aluminium oxide, lithia and Teflon (Teflon) mix each other form.
The embodiment of the invention provides a kind of manufacture method that is applied to the transparent conducting structures of contact panel, and it comprises: at first, a base board unit is provided, it has at least one transparency carrier; Then, in the upper surface of above-mentioned at least one transparency carrier at least one first coating that is shaped; Then, in the upper surface of above-mentioned at least one first coating at least one transparency conducting layer that is shaped with a plurality of conducting wires, wherein above-mentioned a plurality of conducting wires by layout arrangement to form a specific circuit pattern; At last; In the upper surface of above-mentioned at least one transparency conducting layer at least one second coating that is shaped; The top of wherein above-mentioned at least one second coating has one and is used to provide the touching of foreign object touching surperficial, and above-mentioned at least one second coating can be mixed institute with Teflon and formed by silica, aluminium oxide, lithia each other.
In sum; Transparent conducting structures that the embodiment of the invention provided and preparation method thereof can be through the design of " distance of the further above-mentioned touching surface that is used to provide the foreign object touching and above-mentioned specific circuit pattern "; So that transparent conducting structures of the present invention and preparation method thereof can need not use ultralow electric conducting material to make under the situation of above-mentioned a plurality of conducting wires, can obtain the conduction scope and can be applied to contact panel between the circuit pattern between 0.8 to 3 ohm-sq.Moreover above-mentioned at least one second coating can be mixed each other with Teflon by silica, aluminium oxide, lithia and form the hard protective layer of a tool high abrasion and low frictional factor.
For enabling further to understand characteristic of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provides reference and explanation, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the side-looking generalized section of known application in the transparent conducting structures of contact panel;
Fig. 2 is the flow chart of the manufacture method of first embodiment of the invention;
Fig. 2 A is the side-looking generalized section that first embodiment of the invention has been passed through step S100 to S102 manufacturing process;
Fig. 2 B is the side-looking generalized section that first embodiment of the invention has been passed through step S104 manufacturing process;
Fig. 2 C is the side-looking generalized section that first embodiment of the invention has been passed through step S106 manufacturing process;
Fig. 3 is the schematic top plan view of layout type of a plurality of conducting wires of first embodiment of the invention;
Fig. 4 is the side-looking generalized section of second embodiment of the invention;
Fig. 5 is the side-looking generalized section of third embodiment of the invention; And
Fig. 6 is the side-looking generalized section of fourth embodiment of the invention.
Wherein, description of reference numerals is following:
Embodiment
(first embodiment)
See also Fig. 2, Fig. 2 A to Fig. 2 C, and shown in Figure 3; By knowing among the above-mentioned figure; First embodiment of the invention provides a kind of manufacture method that is applied to the transparent conducting structures of contact panel, and it comprises following several steps (in Fig. 2, from step S100 to shown in the step S106) at least:
Step S100 is: at first, please cooperate shown in Fig. 2 and Fig. 2 A, a base board unit 1 is provided, it has at least one transparency carrier 10.For instance; Above-mentioned at least one transparency carrier 10 can be polyethylene terephthalate (polyethylene Terephthalate, PET), Merlon (Poly Carbonate, PC), polyethylene (polyethylene; PE), polyvinyl chloride (Poly Vinyl Chloride; PVC), polypropylene (Poly Propylene, PP), polystyrene (Poly Styrene, PS) or polymethyl methacrylate (Polymethylmethacrylate; PMMA) one of them in, and the thickness of above-mentioned at least one transparency carrier 10 haply can be between 50 μ m to 125 μ m.In other words, the designer can adopt material different to make above-mentioned at least one transparency carrier 10 according to different design requirements.Yet the above-mentioned listed relevant material of processing transparency carrier 10 just is used for for example, and it is not that any material (for example plastics, glass etc.) that can be made into transparency carrier 10 all can be applicable among the present invention in order to qualification the present invention.
Step S102 is: please cooperate shown in Fig. 2 and Fig. 2 A, in the upper surface of above-mentioned at least one transparency carrier 10 at least one first coating 20 that is shaped.For instance, above-mentioned at least one first coating 20 can be one by the made hard coating of hard material.In other words; According to different design requirements; The designer can adopt different hard materials to make above-mentioned at least one first coating 20, and when for example the employed hard material of designer was the ultraviolet light photopolymerization material, this hard coating can be a ultraviolet light photopolymerization coating.Yet the above-mentioned listed relevant material of processing first coating 20 just is used for for example, and it is not that any material that can be made into first coating 20 all can be applicable among the present invention in order to qualification the present invention.
Step S104 is: please cooperate shown in Fig. 2 and Fig. 2 B; In the upper surface of above-mentioned at least one first coating 20 at least one transparency conducting layer 30 that is shaped with a plurality of conducting wires 300, wherein above-mentioned a plurality of conducting wires 300 by layout arrangement to form a specific circuit pattern P.For instance, electrically conducting transparent unit 3 can be a tin indium oxide (ITO) conductive layer, and above-mentioned a plurality of conducting wire 300 forms in the upper surface of above-mentioned at least one transparency conducting layer 30.According to different design requirement, each conducting wire 300 can be one by the made silver-colored circuit of ag material, by the made aluminum steel road of aluminum, by the made copper wire of copper product or by the made any conducting wire of any electric conducting material.Above-mentioned a plurality of conducting wire 300 can make that the conduction scope (electrical conductivity) of above-mentioned specific circuit pattern P haply can be between 0.8 to 3 ohm-sq (ohm-sq rice (Ω/m under the situation that need not use ultralow electric conducting material to make
2)) between.In other words, the designer can be according to the circuit pattern P and the required conduction scope of institute's specific planning, to make a plurality of conducting wires 300 in the upper surface of above-mentioned at least one transparency conducting layer 30.
Moreover; Please cooperate Fig. 2 B and shown in Figure 3; Above-mentioned a plurality of conducting wire 300 can be divided into a plurality of X axis track circuit 300X toward horizontal expansions with a plurality of toward vertical (this is vertically with above-mentioned laterally mutual vertical haply) extension and respectively with above-mentioned a plurality of X axis track circuit 300X mutually insulateds and orthogonal haply Y axial track circuit 300Y; The thickness H of each conducting wire 300 (shown in Fig. 2 B) can be between
to
; The width W 1 of each X axis track circuit 300X can be between
to
; Distance B 1 between per two X axis track circuit 300X can be between 10 μ m to 20 μ m; The width W 2 of each Y axial track circuit 300Y can be between
to
, and the distance B 2 between per two Y axial track circuit 300Y can be between 5 μ m to 15 μ m.Yet defining of above-mentioned relevant a plurality of conducting wires 300 just is used for for example, and it is not in order to limit the present invention.
Step S106 is: please cooperate shown in Fig. 2 and Fig. 2 C; In the upper surface of above-mentioned at least one transparency conducting layer 30 at least one second coating 40 that is shaped, the top of wherein above-mentioned at least one second coating 40 have one be used to provide foreign object (for example user's finger F or any pointer or the like) touching touching surface 400.For instance, because above-mentioned a plurality of conducting wire 300 forms in the upper surface of above-mentioned at least one transparency conducting layer 30, so above-mentioned a plurality of conducting wire 300 is covered by above-mentioned at least one second coating 40.In addition, above-mentioned at least one second coating 40 can be one by the made hard protective layer of hard material, for example: above-mentioned at least one second coating 40 at least can be by silica (silicon dioxide (SiO for example
2)), aluminium oxide (alundum (Al (Al for example
2O
3)), lithia and Teflon mix each other form; Wherein silica account for the percentage by weight of second coating 40 can be between 60%～95%; Aluminium oxide accounts for the percentage by weight of second coating 40 can be between 20%～25%; Lithia accounts for the percentage by weight of second coating 40 can be between 5%～10%, and Teflon account for the percentage by weight of second coating 40 can be between 5%～10%.
Please again with reference to figure 2C and shown in Figure 3; Manufacturing process through above-mentioned steps S100 to S106; First embodiment of the invention provides a kind of transparent conducting structures that is applied to contact panel, and it comprises: a base board unit 1, one first lining unit 2, an electrically conducting transparent unit 3 and one second lining unit 4.Wherein, base board unit 1 has at least one transparency carrier 10.The first lining unit 2 has at least one first coating 20 that forms in the upper surface of above-mentioned at least one transparency carrier 10.Electrically conducting transparent unit 3 has at least one transparency conducting layer 30 that forms in the upper surface of above-mentioned at least one first coating 20; Wherein above-mentioned at least one transparency conducting layer 30 has a plurality of conducting wires 300, and above-mentioned a plurality of conducting wire 300 by layout arrangement to form a specific circuit pattern P.The second lining unit 4 has at least one second coating 40 that forms in the upper surface of above-mentioned at least one transparency conducting layer 30; The top of wherein above-mentioned at least one second coating 40 have one be used to provide foreign object (for example user's finger F or any pointer or the like) touching touching surface 400, and above-mentioned at least one second coating 40 at least can by silica, aluminium oxide, lithia and Teflon mix each other form.
For instance; Above-mentioned at least one transparency carrier 10 can be one of them among polyethylene terephthalate, Merlon, polyethylene, polyvinyl chloride, polypropylene, polystyrene or the polymethyl methacrylate, and the thickness of above-mentioned at least one transparency carrier 10 can be between 50 μ m to 125 μ m.Above-mentioned at least one first coating 20 can be a hard coating, and this hard coating can be a ultraviolet light photopolymerization coating.Each conducting wire 300 can be a silver medal circuit, an aluminum steel road, a copper wire or any conducting wire, and the conduction scope of above-mentioned specific circuit pattern P can be between 0.8 to 3 ohm-sq.
Moreover; Above-mentioned a plurality of conducting wire 300 (as shown in Figure 3) can be divided into a plurality of X axis track circuit 300X toward horizontal expansions and a plurality of past longitudinal extensions and respectively with above-mentioned a plurality of X axis track circuit 300X mutually insulateds and orthogonal Y axial track circuit 300Y; The thickness H of each conducting wire 300 can be between
to
; The width W 1 of each X axis track circuit 300X can be between
to
; Distance B 1 between per two X axis track circuit 300X can be between 10 μ m to 20 μ m; The width W 2 of each Y axial track circuit 300Y can be between
to
, and the distance B 2 between per two Y axial track circuit 300Y can be between 5 μ m to 15 μ m.In addition, above-mentioned a plurality of conducting wires 300 form in the upper surface of above-mentioned at least one transparency conducting layer 30, and above-mentioned a plurality of conducting wire 300 is covered by above-mentioned at least one second coating 40.Above-mentioned at least one second coating 40 can be one by the made hard protective layer of hard material.
(second embodiment)
See also shown in Figure 4ly, second embodiment of the invention provides a kind of transparent conducting structures that is applied to contact panel, and it comprises: a base board unit 1, one first lining unit 2, an electrically conducting transparent unit 3 and one second lining unit 4.Comparison by Fig. 4 and Fig. 2 C can know that second embodiment and maximum different being of first embodiment: in a second embodiment, above-mentioned a plurality of conducting wires 300 are embedded in the inside of above-mentioned at least one transparency conducting layer 30, to form a plurality of embedded conducting wires.For instance, the upper surface of each conducting wire 300 expose and can with the flush of above-mentioned at least one transparency conducting layer 30 so that the upper surface of each conducting wire 300 is covered by above-mentioned at least one second coating 40.In other words; The designer can be according to the circuit pattern P and the required conduction scope of institute's specific planning, (to be embedded in above-mentioned at least one transparency conducting layer 30 in for example coming through the mode of the above-mentioned a plurality of conducting wires 300 of roll extrusion) being embedded in a plurality of conducting wires 300 in above-mentioned at least one transparency conducting layer 30.
(the 3rd embodiment)
See also shown in Figure 5ly, third embodiment of the invention provides a kind of transparent conducting structures that is applied to contact panel, and it comprises: a base board unit 1, one first lining unit 2, an electrically conducting transparent unit 3 and one second lining unit 4.Comparison by Fig. 5 and Fig. 2 C can be known; The 3rd embodiment and maximum different being of first embodiment: in the 3rd embodiment; Above-mentioned a plurality of conducting wire 300 forms in the lower surface of above-mentioned at least one transparency conducting layer 30 and is embedded in above-mentioned at least one first coating layer 20, to form a plurality of embedded conducting wires.In other words; The designer can be according to the circuit pattern P and the required conduction scope of institute's specific planning; With with being embedded in above-mentioned at least one first coating 20 (for example the mode through the above-mentioned at least one transparency conducting layer 30 of roll extrusion, with interior) in a plurality of conducting wires 300 with being embedded in above-mentioned at least one first coating 20 in above-mentioned a plurality of conducting wires 300.
(the 4th embodiment)
See also shown in Figure 6ly, fourth embodiment of the invention provides a kind of transparent conducting structures that is applied to contact panel, and it comprises: a base board unit 1, one first lining unit 2, an electrically conducting transparent unit 3 and one second lining unit 4.Comparison by Fig. 6 and Fig. 2 C can be known; The 4th embodiment and maximum different being of first embodiment: in the 4th embodiment; Above-mentioned at least one transparency conducting layer 30 has the two-layer at least nesa coating (30A, 30B) that is stacked each other on together, and above-mentioned a plurality of conducting wire 300 forms between the above-mentioned two-layer at least nesa coating (30A, 30B).For instance, above-mentioned a plurality of conducting wire 300 be embedded in can be simultaneously wherein in the nesa coating 30A (also being first nesa coating) and contact an other nesa coating 30B (also being second nesa coating that forms on first nesa coating).In other words; The designer can be according to the circuit pattern P and the required conduction scope of institute's specific planning; With with being embedded between the above-mentioned two-layer at least nesa coating (30A, 30B) (for example the mode through the above-mentioned at least one transparency conducting layer 30 of roll extrusion, with being embedded between the above-mentioned two-layer at least nesa coating (30A, 30B) in above-mentioned a plurality of conducting wires 300) in a plurality of conducting wires 300.
(the possible effect of embodiment)
Transparent conducting structures that the embodiment of the invention provided and preparation method thereof can be through the design of " distance of the further above-mentioned touching surface that is used to provide the foreign object touching and above-mentioned specific circuit pattern "; So that transparent conducting structures of the present invention and preparation method thereof can need not use ultralow electric conducting material to make under the situation of above-mentioned a plurality of conducting wires, can obtain the conduction scope and can be applied to contact panel between the circuit pattern between 0.8 to 3 ohm-sq.Moreover above-mentioned at least one second coating can be mixed each other with Teflon by silica, aluminium oxide, lithia and form the hard protective layer of a tool high abrasion and low frictional factor.
Yet the above is merely embodiments of the invention, can not with the restriction scope of the invention.Be that all equalizations of doing according to claim of the present invention change and modification, will do not lose main idea of the present invention place, also do not break away from the spirit and scope of the present invention, the former capital should be regarded as further enforcement situation of the present invention.
Claims (10)
1. a transparent conducting structures that is applied to contact panel is characterized in that, comprising:
One base board unit, it has at least one transparency carrier;
One first lining unit, it has at least one first coating that forms in the upper surface of above-mentioned at least one transparency carrier;
One electrically conducting transparent unit; It has at least one transparency conducting layer that forms in the upper surface of above-mentioned at least one first coating; Wherein above-mentioned at least one transparency conducting layer has a plurality of conducting wires, and above-mentioned a plurality of conducting wire by layout arrangement to form a specific circuit pattern; And
One second lining unit; It has at least one second coating that forms in the upper surface of above-mentioned at least one transparency conducting layer; The top of wherein above-mentioned at least one second coating has one and is used to provide the touching of foreign object touching surperficial, and above-mentioned at least one second coating is mixed institute each other with Teflon and formed by silica, aluminium oxide, lithia.
2. the transparent conducting structures that is applied to contact panel as claimed in claim 1; It is characterized in that above-mentioned at least one transparency carrier is polyethylene terephthalate, Merlon, polyethylene, polyvinyl chloride, polypropylene, polystyrene or polymethyl methacrylate.
3. the transparent conducting structures that is applied to contact panel as claimed in claim 1 is characterized in that, above-mentioned at least one first coating is a hard coating, and this hard coating is a ultraviolet light photopolymerization coating; Each conducting wire is a silver medal circuit, an aluminum steel road or a copper wire, and the conduction scope of above-mentioned specific circuit pattern is between 0.8 to 3 ohm-sq; Above-mentioned at least one second coating is one by the made hard protective layer of hard material.
4. the transparent conducting structures that is applied to contact panel as claimed in claim 1; It is characterized in that; Above-mentioned a plurality of conducting wire be divided into a plurality of X axis track circuits toward horizontal expansions and a plurality of past longitudinal extensions and respectively with above-mentioned a plurality of X axis track circuit mutually insulateds and orthogonal Y axial track circuit; The thickness of each conducting wire is between
to
; The width of each X axis track circuit is between
to
; Distance between per two X axis track circuits is between 10 μ m to 20 μ m; The width of each Y axial track circuit is between
to
, and the distance between per two Y axial track circuits is between 5 μ m to 15 μ m.
5. the transparent conducting structures that is applied to contact panel as claimed in claim 1 is characterized in that above-mentioned a plurality of conducting wires form in the upper surface of above-mentioned at least one transparency conducting layer, and above-mentioned a plurality of conducting wire is covered by above-mentioned at least one second coating.
6. the transparent conducting structures that is applied to contact panel as claimed in claim 1 is characterized in that above-mentioned a plurality of conducting wires are embedded in the inside of above-mentioned at least one transparency conducting layer, and above-mentioned a plurality of conducting wire is covered by above-mentioned at least one second coating.
7. the transparent conducting structures that is applied to contact panel as claimed in claim 1 is characterized in that, above-mentioned a plurality of conducting wires form in the lower surface of above-mentioned at least one transparency conducting layer and are embedded in above-mentioned at least one first coating layer.
8. the transparent conducting structures that is applied to contact panel as claimed in claim 1; It is characterized in that; Above-mentioned at least one transparency conducting layer has the two-layer at least nesa coating that is stacked each other on together, and above-mentioned a plurality of conducting wire forms between the above-mentioned two-layer at least nesa coating.
9. the transparent conducting structures that is applied to contact panel as claimed in claim 8 is characterized in that, above-mentioned a plurality of conducting wires are embedded in wherein in the nesa coating and contact an other nesa coating simultaneously.
10. a manufacture method that is applied to the transparent conducting structures of contact panel is characterized in that, comprising:
One base board unit is provided, and it has at least one transparency carrier;
In the upper surface of above-mentioned at least one transparency carrier at least one first coating that is shaped;
In the upper surface of above-mentioned at least one first coating at least one transparency conducting layer that is shaped with a plurality of conducting wires, wherein above-mentioned a plurality of conducting wires by layout arrangement to form a specific circuit pattern; And
In the upper surface of above-mentioned at least one transparency conducting layer at least one second coating that is shaped; The top of wherein above-mentioned at least one second coating has one and is used to provide the touching of foreign object touching surperficial, and above-mentioned at least one second coating is mixed institute each other with Teflon and formed by silica, aluminium oxide, lithia.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110062482XA CN102682875A (en) | 2011-03-16 | 2011-03-16 | Transparent conductive structure for touch panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110062482XA CN102682875A (en) | 2011-03-16 | 2011-03-16 | Transparent conductive structure for touch panel and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102682875A true CN102682875A (en) | 2012-09-19 |
Family
ID=46814652
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| CN201110062482XA Pending CN102682875A (en) | 2011-03-16 | 2011-03-16 | Transparent conductive structure for touch panel and manufacturing method thereof |
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| CN106470530A (en) * | 2015-08-21 | 2017-03-01 | 柯尼卡美能达株式会社 | Feature thread pattern, the base material with nesa coating and its manufacture method |
| CN108156763A (en) * | 2016-12-05 | 2018-06-12 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and preparation method thereof |
| CN109219236A (en) * | 2017-06-30 | 2019-01-15 | 宏启胜精密电子(秦皇岛)有限公司 | Transparent flexible circuit board and preparation method thereof |
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Application publication date: 20120919 |