CN102676999A - Evaporation source and deposition apparatus - Google Patents
Evaporation source and deposition apparatus Download PDFInfo
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- CN102676999A CN102676999A CN201210058800XA CN201210058800A CN102676999A CN 102676999 A CN102676999 A CN 102676999A CN 201210058800X A CN201210058800X A CN 201210058800XA CN 201210058800 A CN201210058800 A CN 201210058800A CN 102676999 A CN102676999 A CN 102676999A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an evaporation source and a deposition apparatus, aiming to block radiant heat of a crucible and generate no block at nozzles. The evaporation source (1) is provided with a nozzle (12), a reflector (6) and a cover member (8). The nozzle (12) is arranged to heat a deposition material (M) to protrude a vapored crucible (5). A substrate (2) is sprayed with vapored deposition material (M). The reflector (6) is provided with a plurality of metal plates (15) arranged in parallel and a metal plate (15) closest to the substrate (2) is arranged at a position closer to the substrate (2) than a nozzle front end (13) of the nozzle (12) is. The cover member (8) is integrated with part of the metal plates (15) forming the reflector (6) to block the gap between the nozzle (12) and the reflector (6).
Description
Technical field
The deposition material vapor deposition that the present invention relates to be used to make regulation is by evaporation source on the vapor deposition body and evaporation coating device.
Background technology
The device that constitutes as on the object of regulation, forming vapor-deposited film has OLED display, organic EL illumination etc.Wherein OLED display is used always does not need low consumption electric power backlight, the image display device of light and thin.As its structure, the vapor-deposited film that on the glass substrate of the transparency, forms regulation is as thin film layer.As this thin film layer, have organic EL thin film layer such as luminescent layer, input horizon, transfer layer, form the electrode layer etc. of metal wiring in addition.
Each layer mainly uses vacuum vapour deposition in the formation of substrate.Vacuum vapour deposition is keeping 10
-3～10
-5Configuration is used to emit the evaporation source of the molecule of deposition material in the chamber of the high vacuum state of Pa.Evaporation source is made up of the crucible of enclosing deposition material and well heater section member (ヒ one タ section portion material).By well heater crucible is carried out heat, make deposition material evaporation or distillation (below be called evaporation), emit the molecule of deposition material towards the outside from being located at nozzle on the crucible.Placement substrate and closely be fitted in the deposition mask (metal mask) on this substrate in chamber makes deposition material vapor deposition from the crucible evaporation to substrate.On deposition mask, form the peristome of predetermined pattern, on substrate, form the thin film layer of predetermined pattern thus.
Deposition material becomes solid state at normal temperatures basically, under high vacuum, receives heat in crucible inside and evaporates.For this reason, from the spray nozzle part generation radiation of evaporation source, become the reason of the temperature rising that is configured in interior substrate of this chamber and deposition mask.Substrate is a glass raw material, and deposition mask is generally the raw material metal of low bulk.As these starting material, use Invar alloy material, super Invar alloy material, 42-alloy etc.In addition, be that the manufacturer of target is also increasing with televisor production, move towards the trend that substrate size increases now, the substrate that 1 limit surpasses 1.0m, 1.5m also begins to be used.For this reason, the cooperation deviation of deposition mask and substrate constantly increases.
The pattern that is formed on the thin film layer on the substrate requires very high precision in the occasion that each illuminant colour is separately applied thin film layer.For this reason, must strictly harmonize in advance between substrate and the deposition mask (location) and closely fit, and keep and the adjustment precision to carry out vapor deposition.At this moment, if the thermal expansion through photothermal effect generation substrate and deposition mask is poor, then between the pattern of substrate and deposition mask, produce size deviation.Particularly, then produce big position deviation, can not carry out correct pattern and form if radiogenic heat makes both become high temperature.
For this problem, the technology that disposes heat insulating component (radiation prevention body) on crucible top is disclosed in patent documentation 1.In this technology, be provided with on crucible top and be used to prevent that the photothermy of crucible from stoping body in the radiation of substrate.On crucible, be provided for penetrating the tuck of deposition material, around this tuck, dispose radiation and stop body.In addition, be attached to radiation for fear of vaporized deposition material and stop body, radiation prevention body is set at the height identical or than its low position with the emitting side peristome of tuck.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2004-214185 communique
The exiting side peristome of the tuck of patent documentation 1 stops body more outstanding than radiation, or constitutes by the mode of the position that is in equal height.For this reason, the front end position of tuck stops body to expose towards substrate and deposition mask from radiation.Tuck descends so produce temperature towards thermal radiation on every side.
Tuck becomes the path of passing through of vaporized deposition material, if high temperature does not then have special problem, but along with the temperature below the certain temperature descends, the deposition material of inner face that is attached to the hole of tuck is separated out.Then, the deposition material of having separated out at the inner face in hole gradually grows up, and is inaccessible near the front end in the hole of tuck the most at last, produces and stops up.If produce obstruction at tuck, then can not proceed the vapor deposition operation, must remove the vacuum state of vacuum chamber, keep in repair.
In addition, because crucible becomes the very high temperature state, so, in order to make photothermal effect not have influence on substrate, deposition mask, must make radiation stop body to have high heat insulating function.Usually form the radiation that is called as reverberator and stop body, this radiation stops body to constitute through the speculum that leaves, range upon range of a plurality of two sides are minute surface, but in the occasion with a formation, the thickness of the sheet material of must the increase coefficient of thermal expansion low material.Therefore, stop the thickness of the integral body of body to be difficult to attenuate as radiation.
In method in the past, tuck stops body more outstanding than radiation, and therefore, the length of tuck must be configured than radiation and stop the thickness of body bigger.For this reason, it is longer to become the length overall of the tuck that passes through the path of vaporized deposition material.For this reason, long tuck, the heat radiation that peripherad radiation produced is many more, is easy to generate separating out of deposition material in the inside in hole, produces at tuck (near the particularly zone the leading section) easily and stops up.
Summary of the invention
Therefore, the objective of the invention is to cut off the radiogenic heat of crucible, and do not produce obstruction at nozzle.
In order to solve above problem; The 1st evaporation source of the present invention is characterised in that: have ejection section, insulating unit and anti-plating unit; This ejection section is located at deposition material is heated and makes on the evaporation element of its evaporation, towards being sprayed vaporized above-mentioned deposition material by the vapor deposition body; This insulating unit has a plurality of metal sheets of configuration side by side, the most approaching above-mentioned metal sheet by the vapor deposition body in this metal sheet is arranged on more approaching more above-mentioned by the position of vapor deposition body than the front end face of above-mentioned ejection section; A part of being somebody's turn to do in a plurality of metal sheets of preventing the plating unit and constituting above-mentioned insulating unit constitutes integratedly, with obturation between above-mentioned ejection section and the above-mentioned insulating unit.
According to this evaporation source, the front end face of ejection section is positioned at outermost layer than insulating unit more near the internal layer side.Like this, can be in the inner high-temperature area configurations ejection section of insulating unit, can the length of ejection section be configured shorter, so, do not produce obstruction in ejection section.Inaccessible from the vaporized deposition material of ejection section by anti-plating unit, so, can not be attached on the insulating unit yet.And, because anti-plating unit becomes the condition of high temperature under the effect of the heat of insulating unit, so deposition material can not separated out on anti-plating unit and solidified.
In addition, the 2nd evaporation source has such characteristic on the basis of the 1st evaporation source: above-mentioned anti-plating unit uses a metal sheet in a plurality of metal sheets that constitute above-mentioned insulating unit to constitute.
According to this evaporation source, owing to use the metal sheet identical as anti-plating unit with the metal sheet of insulating unit, so, can the heat that insulating unit has be delivered to expeditiously anti-plating unit.And, need not prepare special-purpose metal sheet, so formation becomes simple for anti-plating unit.
In addition, the 3rd evaporation source has such characteristic on the basis of the 2nd evaporation source: above-mentioned anti-plating unit constitutes such concavity, and this concavity is that the port area of above-mentioned evaporation element side is the narrowest, and port area is broadened by the vapor deposition side towards above-mentioned gradually.
According to this evaporation source, anti-plating unit becomes the concavity of that kind that port area broadens gradually.The deposition material diffusion of spraying from ejection section and dispersing is not so through enlarging the unitary port area of anti-plating, anti-plating unit can limit the direction of dispersing of deposition material.
In addition, the 4th evaporation source has such characteristic on the basis of the 3rd evaporation source: make that the front end face of above-mentioned ejection section is more outstanding than the position of the unitary base end side of above-mentioned anti-plating.
According to this evaporation source, because the front end face of ejection section is outstanding from anti-plating unit, so the deposition material that ejection section has been sprayed can not be attached to the unitary inboard of anti-plating.
In addition, the 5th evaporation source has such characteristic on the basis of the 3rd evaporation source: make the unitary side foremost of above-mentioned anti-plating the position than the housing unit of accommodating above-mentioned insulating unit with above-mentioned more outstanding by vapor deposition body face in opposite directions.
According to this evaporation source, make the unitary front of anti-plating more outstanding than the substrate forward surface of housing unit, be attached to housing unit thereby can suppress deposition material.
In addition, the 6th evaporation source has such characteristic on the basis of the 2nd evaporation source: constitute the unitary metal sheet of above-mentioned anti-plating and use following metal sheet to constitute: constitute in the metal sheet of above-mentioned insulating unit, have above-mentioned deposition material not solidified temperature and a metal sheet with wherein minimum temperature.
According to this evaporation source, the unitary metal sheet of anti-plating selects to have the not metal sheet of solidified heat of deposition material, thereby can avoid the obstruction of ejection section.And through selecting to have the metal sheet of the minimum temperature in the deposition material metal sheet that solidified is not warm, the anti-plating unit that is exposed to space outerpace can not have high superfluously temperature.
In addition, the 7th evaporation source has such characteristic on the basis of the 2nd evaporation source: the front end face of above-mentioned ejection section is in has a not position of the metal sheet of solidified temperature of above-mentioned deposition material in a plurality of metal sheets that constitute above-mentioned insulating unit.
According to this evaporation source, the length overall of ejection section is restricted to is in the not length of that kind under the such temperature regime of solidified of deposition material, thus the obstruction that does not produce ejection section.And, constitute ejection section through allowing up to ground, this position, can make the deposition material of injection have the directive property of regulation.
In addition, evaporation coating device of the present invention becomes the evaporation coating device that disposes any evaporation source in the 1st～the 7th.Evaporation source of the present invention can be suitable in the evaporation coating device when organic El devices such as manufacturing OLED display, organic EL illumination.
The present invention more leans on the evaporation element side with the insulating unit that the front end face of ejection section is arranged on than the heat of cutting off evaporation element, so, can with the ejection section configured in one piece under the condition of high temperature, can shorten the length of ejection section.Like this, can cut off radiogenic heat, and can not produce obstruction in ejection section.In addition, be used for ejection section and the inaccessible anti-plating unit of evaporation element owing to be provided with, so, can on insulating unit, not adhere to deposition material, anti-plating unit becomes the condition of high temperature, so deposition material can not solidify on anti-plating unit yet.
Description of drawings
Fig. 1 is the figure of the formation of expression evaporation source.
Fig. 2 makes the figure of deposition material from evaporation source vapor deposition towards the side.
Fig. 3 is the sectional view of evaporation source.
Fig. 4 is used as the metal sheet of reverberator for explanation the figure of one example of cover member.
Fig. 5 is used as the metal sheet of reverberator for explanation another routine figure of cover member.
Fig. 6 for explanation through welding the figure will cover the example that member engages with reverberator.
The figure of the formation of the evaporation source when Fig. 7 will cover member and constitute funnel-form for expression.
Fig. 8 is for making the figure of deposition material vapor deposition towards the top from evaporation source.
Fig. 9 is the figure of an example of explanation vacuum deposition apparatus.
Figure 10 is the pie graph that is provided with the system of a plurality of vacuum evaporation chambers.
The explanation of Reference numeral
1 evaporation source, 2 substrates, 3 deposition masks, 5 crucibles, 6 reverberators, 6E reflector opening portion; 7 housings, 7E shell nozzle portion, 8 cover members, 11 well heaters, 12 nozzles, 13 spray nozzle front end faces; 15 metal sheets, 16 nozzles expose the hole, 30 vacuum deposition apparatus, 40 systems, M deposition material
Embodiment
Below, with reference to description of drawings embodiment of the present invention.Fig. 1 is the sketch chart of expression evaporation source 1 of the present invention, and Fig. 2 representes to use evaporation source 1 to carry out an example of the occasion of vapor deposition.The Z direction of Fig. 1 and arrow shown in Figure 2 is a gravity direction, and X and Y two directions form the horizontal plane direction.And, though below explanation in the occasion that constitutes the organic thin film layer of vapor deposition regulation on the substrate of OLED display, be not limited to this.For example, also can make vapor depositions such as metal film layer, inorganic thin film layer.In addition, can not be OLED display also, but vapor deposition constitute the organic thin film layer of organic EL illumination.
As shown in Figure 2, evaporation source 1 becomes and is used to make the device of deposition material M vapor deposition on substrate 2.Substrate 2 for be used to make deposition material M vapor deposition by the vapor deposition body, deposition mask (metal mask) closely is fitted in carries out vapor deposition on the substrate.On deposition mask 3, form the mask pattern 3A that stipulates, make deposition material M vapor deposition on substrate 2 through mask pattern 3A as connecting the zone.In the occasion of the organic thin film layer that constitutes OLED display, the material of luminescent layer, input horizon, transfer layer etc. becomes deposition material M, and in the occasion of the electrode layer that forms metal wiring, this material becomes deposition material M.
Must on substrate 2, carry out correct pattern forms.For this reason, strictly harmonize between substrate 2 and the deposition mask 3.Substrate 2 is a glass raw material, and deposition mask 3 is raw material metal (for example, nickel system alloy (Invar alloy) etc.).Therefore, raw material metal is that the coefficient of thermal expansion of deposition mask 3 is that the coefficient of thermal expansion of substrate 2 is low than glass raw material.Like this, as at substrate 2, deposition mask 3 effect high temperature, then between substrate 2 and deposition mask 3, produce position deviation based on the difference of coefficient of thermal expansion.
As shown in Figure 1, evaporation source 1 roughly is made up of crucible 5, reverberator 6, housing 7 and cover member 8.Crucible 5 is the evaporation element of case shape, is provided with deposition material M in inside.This deposition material M is in following inside that is pre-charged with crucible 5 such as solid states.Periphery at crucible 5 is provided with the well heater 11 as the heating unit that is used for crucible 5 is heated.Heat effect by this well heater 11 makes crucible 5 become the condition of high temperature, inner deposition material M evaporation.
In this figure, crucible 5 is made up of 4 faces (top 5A, following 5B, the 1st side 5C, the 2nd side 5D).In addition, wherein, well heater 11 is installed on top 5A and the following 5B.Certainly, also can on the face well heater 11 be installed arbitrarily.On the 1st side 5C, nozzle 12 is arranged in 1 row by the Y direction.The ejection section of nozzle 12 for being used to spray deposition material M, cardinal extremity is towards crucible 5 openings, and vaporized deposition material M sprays from front end face (spray nozzle front end face 13).On nozzle 12, form communicating pores, this communicating pores applies directive property to the deposition material M that is sprayed.Therefore, make nozzle 12 have the length that applies the directive property degree.
Reverberator 6 (6A～, surround the configuration of crucible 5 ground 6D) for being used to cut off the photothermal insulating unit of crucible 5 (well heater 11).Reverberator 6 is made up of a plurality of metal sheets 15, and each metal sheet 15 is to be raw-material metallic substance with stainless steel, molybdenum, tungsten etc.In addition, mirror ultrafinish is implemented on the surface of each metal sheet 15, reduces radiant ratio, thereby reduces the photothermal energy of emitting towards outside.
Reverberator 6 becomes and is spaced from each other the formation that predetermined distance disposes a plurality of metal sheets 15 side by side, and becoming the multilayer laminated has metal sheet 15 and spatial structure.For this reason, though constitute with thin-walled, become big as reverberator 6 integral thickness as the monomer of metal sheet 15.Reverberator 6 surrounds the configuration peripherally of crucible 5, and the reverberator 6 at the position corresponding with each face 5A～5D of crucible 5 is 6A～6D.In the example of Fig. 1, reverberator 6A～6D individually is provided with respectively, also can be respectively with each metal sheet 15 of a formation reverberator 6A～6D.Wherein, on reverberator 6C, form tiny peristome (6E of reflector opening portion) bandedly.The 6E of this reflector opening portion is formed on by 1 row and is arranged in the position that the nozzle 12 on the crucible 5 exposes.
As shown in Figure 3, cover member 8 is anti-plating member, between this inaccessible nozzle 12 (spray nozzle front end face 13) of anti-plating member and the reverberator 6, so that the non-cohesive mode on reverberator 6 of deposition material M of having sprayed from nozzle 12 is provided with.Cover member 8 can be located on the housing 7 with installing and removing, through pulling down, can carry out the maintenance of housing 7 and cover member 8.And reverberator 6 also can be located on the housing 7 with installing and removing, pulls down reverberator 6, can keep in repair.
As the formation of the face 7C side of housing 7, the zone of reverberator 6C becomes by predetermined distance makes the range upon range of structure of a plurality of metal sheet 15, and the position of cover member 8 becomes the structure that is provided with a metal sheet 15.Therefore, as if being that benchmark is watched housing 7 with substrate 2, the thickness that then covers member 8 is thinner than the thickness of reverberator 6C.
For the high heat that does not make crucible 5 acts directly on cover member 8, cover member 8 is provided with crucible 5 non-contactly.On the other hand, make the spray nozzle front end face 13 of nozzle 12 outstanding to the space outerpace (space that substrate 2 is faced) of cover member 8.For this reason, the base end side at cover member 8 is provided for making nozzle 12 outstanding nozzles to expose hole 16 by the mode that on the Y direction, is arranged in 1 row.In the example of Fig. 1 and Fig. 3, the base end side formation bottom surface at cover member 8 is provided with nozzle in this bottom surface and exposes hole 16.Like this, can expose hole 16 from each nozzle makes nozzle 12 outstanding towards outside space.Nozzle exposes hole 16 and has the diameter bigger slightly than nozzle 12, makes cover member 8 and nozzle 12 be contactless state, and makes cover member 8 as much as possible little with the gap of nozzle 12.
In the present invention, the outermost metal sheet 15 of the reverberator 6C metal sheet 15 of substrate 2 (near) more disposes near the mode of substrate 2 by the spray nozzle front end face 13 than nozzle 12.In other words, spray nozzle front end face 13 more constitutes near the mode of internal layer side with the outermost metal sheet 15 that is positioned at than reverberator 6.Reverberator 6C becomes metal sheet 15 and spatial multiwalled lit-par-lit structure, and every at a distance from 1 layer, heat stream descends down.Like this, even the temperature of crucible 5 is a very high temperature, this heat is not delivered to the outermost layer of reverberator 6C basically yet.Therefore, in reverberator 6C, the layer of crucible 5 (near) is classified to rise temperature from outermost layer (near substrate 2 layer) towards innermost layer.
Here, the inner face in the hole of nozzle 12 becomes the path of passing through of deposition material M.If nozzle 12 becomes low-temperature condition, then cooled off and separated out attached to the deposition material M of the inner face in hole.Then, separate out and the deposition material M that solidified gradually grows up, like this,, finally cause spray nozzle clogging nozzle 12 obturations.Like this, can not continue substrate 2 is carried out the vapor deposition operation, need to remove vacuum state and keep in repair.
As above-mentioned; The temperature classification ground of reverberator 6C changes, and at different levelsly emits the energy that is directly proportional with each 4 powers of temperature through radiation, for example in the identical occasion of condition of surface; Be the identical occasion of radiant ratio, emitting energy and can drop to 1 of (progression+1) branch towards the outside of crucible 5.For this reason, can alleviate of the influence of outermost radiating state to crucible 5.Utilize this temperature classification this situation that descends, if with the thermal conduction of the reverberator of n level to covering member 8, then can prevent nozzle 12 coolings, can not separate out and solidify attached to the deposition material M of the inner face in hole.Like this, can avoid the generation of spray nozzle clogging.
In addition, nozzle 12 does not receive the influence of the thickness of reverberator 6C.Promptly; As long as the spray nozzle front end face 13 of nozzle 12 is positioned at outermost metal sheet 15 than reverberator 6C more near the internal layer side, for this reason, in order to improve heat insulating function; Even the thickness that makes reverberator 6C is thickening terrifically, the length overall of the nozzle 12 also not pattern of wants must be bigger.Like this, can the length overall of nozzle 12 be configured shortlyer, can suppress from the heat radiation of nozzle 12.
At this moment, at least one metal sheet 15 in the reverberator 6 is positioned at than spray nozzle front end face 13 more near substrate 2 one sides.Like this, metal sheet 15 is positioned on the injection direction of deposition material M, for this reason, exists deposition material M attached to the problem on the reverberator 6.If deposition material M is attached on the metal sheet 15, then heat insulating function descends, and becomes and can not radiogenic heat be cut off.Therefore, the cover member 8 that plates member as anti-is set between nozzle 12 and reverberator 6.Like this, 8 pairs of reverberators 6 of cover member are protected, and for this reason, deposition material M can be attached on the reverberator 6.Cover member 8 is to be provided with in order on reverberator 6, not adhere to deposition material M strictly speaking, does not have heat insulating function.Therefore, even deposition material M does not exert an influence to heat insulating function attached on the anti-plating member yet.
In addition, cover member 8 uses the metal sheet 15 among the reverberator 6C to constitute.That is, make a metal sheet 15 in a plurality of metal sheets 15 have both functions of cover member 8 and reverberator 6, in other words, the metal sheet 15 that constitutes the part of reverberator 6 constitutes with cover member 8 integratedly.As above-mentioned, metal sheet 15 receives heat effect by means of heat insulating function, and temperature is in differences at different levels, but each metal sheet 15 is kept the condition of high temperature.
In addition, the port area of base end side of cover member 8 is the narrowest, towards front enlarged openings area gradually.For this reason, the metal sheet 15 that has reverberator 6C and both functions of cover member 8 forms shape by the circumference at the 7E of shell nozzle portion towards the mode of substrate.In addition, form from the conical surface 8T of front end towards crucible 5.
The deposition material M that has sprayed from spray nozzle front end face 13 disperses diffusely.Spray nozzle front end face 13 is if be benchmark with the face 7C of housing 7, the position that then is located at recessed, and cover member 8 is on the direction of dispersing.Therefore, form, make cover member 8 not limit the direction of dispersing of deposition material M through mode by the port area that enlarges cover member 8 from base end side towards front gradually.Like this, can make the desired scope of deposition material M vapor deposition, and can avoid unwanted deposition material M attached on the cover member 8 at substrate 2.
This aspect if make the angle of inclination of the conical surface 8T that covers member 8 bigger than the diffusion angle of the deposition material M that is sprayed, then can avoid deposition material M attached on the cover member 8.But, in this occasion, exist the port area of the 7E of shell nozzle portion of housing 7 to become big, make space outerpace produce the problem that unnecessary temperature rises.Therefore,, make that not externally the space produces unnecessary temperature rising, and the direction of dispersing of deposition material M is not limited through the angle of inclination of the conical surface that makes cover member 8 parallel with the diffusion angle of deposition material M (or parallel substantially angle).
In addition, cover member 8 constitutes with the metal sheet 15 of the reverberator 6 of the condition of high temperature integratedly, becomes contactless state with housing 7.Housing 7 exposes to the open air externally in the space, keeps the normal temperature state ideally.For this reason, if housing 7 contacts with cover member 8, the dissipation of heat that then offers cover member 8 is to housing 7, and the temperature of housing 7 rises, and the temperature of cover member 8 descends.Like this, existence is separated out and the solidified problem attached to the deposition material M on the cover member 8.For this reason, be contactless state, can avoid the dispersion of heat and the temperature of the cover member 8 that causes descends through making cover member 8 and housing 7.
It is more outstanding that the spray nozzle front end face 13 of nozzle 12 exposes hole 16 than the nozzle of base end side that is located at cover member 8.Like this, the deposition material M that has sprayed from spray nozzle front end face 13 can be from the inboard (private side of housing 7) of cover member 8 around going into attached on the reverberator 6.
In addition, make the position of the front of covering member 8 more outstanding towards substrate 2 than the face 7C (towards the face of substrate 2) of housing 7.The deposition material M that sprays from nozzle 12 has directive property, and the deposition material M after the injection adheres to towards housing 7 hardly, but the deposition material M that also has a denier is attached to the problem on the housing 7.Therefore, outstanding through the position that makes the front of covering member 8, housing 7 is blocked by cover member 8, so the problem of adhering to disappears.
In addition, as above-mentioned, cover member 8 uses a formation in each metal sheet 15 of reverberator 6C, also arbitrarily metal sheet 15 as covering member 8.Fig. 4 as cover member 8, also can use outermost metal sheet 15 from the 2nd layer of outermost layer as Fig. 5.But outermost metal sheet 15 becomes lowest temperature, and the metal sheet 15 of innermost layer becomes the highest temperature.Therefore, select best metal sheet 15 from each metal sheet 15, as cover member 8.
As cover member 8, is to maintain the condition of high temperature in order cover member 8 with the metal sheet of reverberator 6C 15, does not make the deposition material M curing of having adhered to.Therefore, as long as make cover member 8 have the not temperature of solidified minimum of deposition material M, this above temperature need be provided.On the contrary, if make cover member 8 have unnecessary high temperature, then unnecessary heat is provided to space outerpace.Reverberator 6C is classified to the temperature that descends from innermost layer towards outermost layer, so, use to be in to have the not metal sheet 15 of the layer of solidified temperature that kind of deposition material M.Like this, can prevent separating out of deposition material M, and not make space outerpace produce unwanted temperature rising.
Deposition material M separates out and the solidified temperature is different because of the difference of the kind of deposition material M.Therefore, can be according to the kind that is filled in the deposition material M in the crucible 5, selecting not from a plurality of metal sheets 15, the heat of the temperature of solidified minimum supplies to the metal sheet 15 that covers member 8.Like this, can select corresponding best metal sheet 15 with deposition material M.
In addition, nozzle 12 can by to have deposition material M not the length of the position of the metal sheet 15 of solidified temperature constitute.For fear of unwanted heat radiation, the length of best nozzle 12 is configured shorter, but for the deposition material that sprays is applied directive property, makes it have length to a certain degree.If be in deposition material M not under the solidified temperature regime, then allow to be configured nozzle 12 longer.Like this, can apply enough directive property to the deposition material M that sprays from nozzle 12, and can not produce obstruction at nozzle 12.
One of utilizing in the metal sheet 15 that constitutes reverberators 6 of above-mentioned cover member 8 also can such preparation and reverberator 6 different metallic plates 21 as shown in Figure 6, through with 15 welding of metal sheet arbitrarily in the metal sheet 15 of this metal sheet 21 and reverberator 6 and integrated.Like this, can transfer heat to incorporate metal sheet 21 from the metal sheet 15 of reverberator 6 and form the condition of high temperature.
In addition, also can that kind as shown in Figure 7 will cover member 8 and constitute funnel-form.Mode by nozzle 12 being inserted among funnelform fore-end (the indeclinable part of the port area) 8A constitutes, and keeps contactless state between fore-end 8A and the nozzle 12, and make its near.Like this, between reverberator 6C and the nozzle 12 very near.Constitute according to this, can make the port area of the 6E of reflector opening portion narrow, can make photothermal influence is irreducible minimum.And, through cover member 8 (the indeclinable part of port area) is set along nozzle 12, can be inaccessible and reverberator 6C between.
At this moment, spray nozzle front end face 13 is positioned at from the fore-end 8A of funnelform cover member 8 to position that the part of conical surface 8T shifts.Like this, the port area that can make the 6E of reflector opening portion is an inferior limit, and can be inaccessible and reverberator 6C between.
In the example of Fig. 1, from evaporation source 1 towards the side (horizontal plane direction) sprayed deposition material M, also can that kind as shown in Figure 8 make nozzle 12 constitute evaporation source 1 towards ground, top.At this moment, substrate 2 and deposition mask 3 are configured in the top of evaporation source 1, from evaporation source 1 towards the top (vertical direction) spray deposition material M.
Fig. 9 representes to have an example of the vacuum deposition apparatus 30 of evaporation source 1.Vacuum deposition apparatus 30 constitutes the chamber (vacuum evaporation chamber) of regulation, and the internal space vacuumizes through vacuum pump 31 (being VP in the drawings) becomes vacuum state.Substrate 2 and deposition mask 3 are carried by the state that erects in vertical direction, stop at the prescribed position of vacuum deposition apparatus 30.Evaporation source 1 carries regularly on transfer table 32, and transfer table 32 moves along the rail 33 on the wall that is located at vacuum deposition apparatus 30.As driver element ball-screw 34 is set, rail 33 is gone up in vertical direction (Z direction) extended, transfer table 32 moves in vertical direction.Therefore, the evaporation source 1 that carries on transfer table 32 also moves in vertical direction.
One example of the system 40 that Figure 10 representes to be made up of a plurality of vacuum deposition apparatus 30.In this system 40, have substrate running gear 41～43, relaying chamber 44～47 and vacuum evaporation chamber (vacuum deposition apparatus) 48～59.Each vacuum evaporation chamber 48～59 is the different deposition material M of vapor deposition on substrate 2 respectively.For example, by the different deposition material M of following mode difference vapor deposition, promptly; If input horizon, if then vapor deposition hole injection layer, electron injecting layer are transfer layer; If then vapor deposition hole transporting layer, electron supplying layer are luminescent layer, the then luminescent layer of vapor deposition R (redness), G (green), such 3 looks of B (blueness); If electrode layer, then vapor deposition anode layer and cathode layer.
In the example of Figure 10, station of 3 vacuum evaporation chamber 48～51,52～55,56～59 such 4 formations, becoming, totally 3 grades station constitutes.Substrate running gear 41 makes substrate move to each chamber of the 1st grade station, and substrate running gear 42 makes substrate move to each chamber of the 2nd grade station, and substrate running gear 43 makes substrate move to each chamber of the station of 3rd level.The relaying place of the station that relaying chamber 44～47 is set to be used to make substrate transfer to next stage.
In the occasion of OLED display, constitute at a plurality of organic thin film layers of substrate 2 laminated, so, through constructing the such system 40 of Figure 10, can on substrate 2, stack gradually organic thin film layer.
Claims (8)
1. evaporation source, it has ejection section, insulating unit and anti-plating unit,
This ejection section is located at deposition material is heated and makes on the evaporation element of its evaporation, towards being sprayed vaporized above-mentioned deposition material by the vapor deposition body;
This insulating unit has a plurality of metal sheets of configuration side by side, the most approaching above-mentioned metal sheet by the vapor deposition body in this metal sheet is arranged on more approaching more above-mentioned by the position of vapor deposition body than the front end face of above-mentioned ejection section;
A part of being somebody's turn to do in a plurality of metal sheets of preventing the plating unit and constituting above-mentioned insulating unit constitutes integratedly, with obturation between above-mentioned ejection section and the above-mentioned insulating unit.
2. evaporation source according to claim 1 is characterized in that:
Above-mentioned anti-plating unit uses a metal sheet in a plurality of metal sheets that constitute above-mentioned insulating unit to constitute.
3. evaporation source according to claim 2 is characterized in that:
Above-mentioned anti-plating unit constitutes such concavity, and this concavity is that the port area of above-mentioned evaporation element side is the narrowest, and port area is broadened by the vapor deposition side towards above-mentioned gradually.
4. evaporation source according to claim 3 is characterized in that:
Make that the front end face of above-mentioned ejection section is more outstanding than the position of the unitary base end side of above-mentioned anti-plating.
5. evaporation source according to claim 3 is characterized in that:
Make the unitary side foremost of above-mentioned anti-plating the position than the housing unit of accommodating above-mentioned insulating unit with above-mentioned more outstanding by vapor deposition body face in opposite directions.
6. evaporation source according to claim 2 is characterized in that:
Constituting the unitary metal sheet of above-mentioned anti-plating uses following metal sheet to constitute: constitute in the metal sheet of above-mentioned insulating unit, have above-mentioned deposition material not solidified temperature and a metal sheet with wherein minimum temperature.
7. evaporation source according to claim 2 is characterized in that:
The front end face of above-mentioned ejection section is in has a not position of the metal sheet of solidified temperature of above-mentioned deposition material in a plurality of metal sheets that constitute above-mentioned insulating unit.
8. evaporation coating device, it is characterized in that: this evaporation coating device disposes any one described evaporation source in the claim 1～7.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-049869 | 2011-03-08 | ||
| JP2011049869A JP5492120B2 (en) | 2011-03-08 | 2011-03-08 | Evaporation source and vapor deposition equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102676999A true CN102676999A (en) | 2012-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210058800XA Pending CN102676999A (en) | 2011-03-08 | 2012-03-08 | Evaporation source and deposition apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5492120B2 (en) |
| KR (1) | KR101373782B1 (en) |
| CN (1) | CN102676999A (en) |
| TW (1) | TW201241207A (en) |
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| CN103710667A (en) * | 2012-09-28 | 2014-04-09 | 株式会社日立高新技术 | Evaporation source, vacuum deposition apparatus, and method of manufacturing organic el display device |
| CN105296934A (en) * | 2015-11-09 | 2016-02-03 | 合肥欣奕华智能机器有限公司 | Linear evaporation source and evaporation plating device |
| WO2016023280A1 (en) * | 2014-08-14 | 2016-02-18 | 京东方科技集团股份有限公司 | Vapour deposition wire source |
| TWI553145B (en) * | 2015-11-16 | 2016-10-11 | 財團法人金屬工業研究發展中心 | A continuous plating apparatus of chemical vapor deposition system |
| CN107164733A (en) * | 2016-03-07 | 2017-09-15 | 三星显示有限公司 | Film forming device and the method that display device is manufactured using it |
| CN104561903B (en) * | 2013-10-24 | 2019-01-15 | 日立造船株式会社 | Vacuum deposition apparatus menifold |
| CN110573647A (en) * | 2017-04-26 | 2019-12-13 | 株式会社爱发科 | Evaporation source and film forming apparatus |
| CN112011762A (en) * | 2020-07-28 | 2020-12-01 | 云谷（固安）科技有限公司 | Evaporation plating device |
| CN112593191A (en) * | 2020-12-08 | 2021-04-02 | 江苏集萃有机光电技术研究所有限公司 | Evaporation boat |
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| KR102124588B1 (en) * | 2012-10-22 | 2020-06-22 | 삼성디스플레이 주식회사 | Linear evaporation source and vacuum deposition apparatus and having the same |
| KR102182114B1 (en) * | 2013-12-16 | 2020-11-24 | 삼성디스플레이 주식회사 | Evaporation apparatus |
| KR101599505B1 (en) * | 2014-01-07 | 2016-03-03 | 주식회사 선익시스템 | Evaporation source for deposition apparatus |
| KR101599509B1 (en) * | 2015-03-18 | 2016-03-03 | 주식회사 선익시스템 | Evaporation source |
| SG10201510101XA (en) | 2015-12-09 | 2017-07-28 | Au Optronics Corp | Evaporation apparatus and evaporation method |
| WO2020251696A1 (en) | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
| US11732345B2 (en) | 2020-06-04 | 2023-08-22 | Applied Materials, Inc. | Vapor deposition apparatus and method for coating a substrate in a vacuum chamber |
| KR102454832B1 (en) * | 2020-10-08 | 2022-10-17 | 엘지전자 주식회사 | Linear Deposition Source |
| KR102528282B1 (en) * | 2021-05-13 | 2023-05-03 | (주)데포랩 | Evaporating source |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201241207A (en) | 2012-10-16 |
| JP2012184486A (en) | 2012-09-27 |
| KR20120102504A (en) | 2012-09-18 |
| KR101373782B1 (en) | 2014-03-13 |
| JP5492120B2 (en) | 2014-05-14 |
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Application publication date: 20120919 |