CN102668730B - Transparent flexible printed wiring board and process for producing same - Google Patents

Transparent flexible printed wiring board and process for producing same Download PDF

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Publication number
CN102668730B
CN102668730B CN201180004732.2A CN201180004732A CN102668730B CN 102668730 B CN102668730 B CN 102668730B CN 201180004732 A CN201180004732 A CN 201180004732A CN 102668730 B CN102668730 B CN 102668730B
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China
Prior art keywords
transparent
insulating film
ink
nesa coating
transparent insulating
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CN201180004732.2A
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CN102668730A (en
Inventor
尾崎和行
岩瀬雅之
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Nippon Mektron KK
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Nippon Mektron KK
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

Provided is a transparent flexible printed wiring board which includes a transparent film and a transparent electroconductive film and which has excellent adhesion between the films and excellent flexibility and heat resistance. A transparent polyimide film (1) having a dimensional change through a burning step of within +-0.2% is prepared. The transparent polyimide film (1) is printed with an ITO ink containing fine ITO particles and a binder by ink-jet printing in a given pattern arrangement. Thereafter, this ITO ink is burned at 230-300 C to thereby form a transparent electroconductive film (2) having a binder content of 5-10 wt.%.

Description

Transparent flexible printed wiring board and manufacture method thereof
Technical field
The present invention relates to a kind of transparent flexible printed wiring board and manufacture method thereof, be specifically related to a kind of transparent flexible printed wiring board and the manufacture method thereof with thermal endurance.
Background technology
As the transparent wiring plate such as touch panel, glass substrate is used to be up to the present known.This transparent wiring plate is formed to make to form ITO(indium tin oxide on the glass substrate) film, then process this ito film, to form the nesa coating (tracing cloth line pattern) with desired pattern by etching.Owing to employing glass substrate, therefore this transparent wiring plate has heavier and frangible problem, and price is high.
In addition, owing to being applied to Electronic Paper etc., recently a kind of transparent wiring plate of light weight with resistance to impact is needed.
Therefore, known one uses the hyaline membrane be made up of PETG (PET) or PEN (PEN) as the transparent wiring plate of substrate.
This transparent wiring plate is produced in the following ways.First, ito film is formed by carrying out sputtering on the hyaline membrane be made up of PET or PEN.Subsequently, perform exposure technology, developing process etc., to form the resist layer with predetermined pattern in ito film.Then, etch ito film when this resist layer is used as mask, to form the nesa coating with desired pattern on hyaline membrane.
But above transparent wiring plate has following problem: its thermal endurance is not enough to the printed wiring board being used as installation component.
Normal PET has the heat resisting temperature of about 130 DEG C, and even heat-resisting PET has the heat resisting temperature of about 150 DEG C.Thus, use the transparent wiring plate of PET not to be suitable for need heat treatment (such as, reflux technique or the ACF(anisotropic conductive film) Joining Technology stood under high temperature) product (touch panel, Electronic Paper, LED illumination, EL illumination etc.).
In addition, the ito film that transparent PET film is formed not yet flexible and with the adhesiveness of hyaline membrane in successfully obtain sufficient characteristic, with as the flexible printing wiring board had needed for bending resistance (see non-patent literature 1).
On the other hand, PEN has relatively high heat resisting temperature (about 180 DEG C), thus can stand as the use low temperature reflux technique of special solder or the technique of low temperature ACF Joining Technology.But, PEN and special solder price high, and need special manufacturing facility, thus the problem causing production cost to improve.
In addition, when performing etch process to form tracing cloth line pattern, materials'use efficiency is lower, and this is owing to arranging many materials, in addition, generates great amount of carbon dioxide (CO 2).Therefore, needing this process reform is environmentally friendly technique.
Prior art document
Non-patent literature
[non-patent literature 1]
“Performance of flexible polymeric light-emitting diodes under bending conditions”, APPLIED PHYSICS LETTERS Vol. 82, No. 19 (12 May, 2003)。
Summary of the invention
The problem to be solved in the present invention
The object of the present invention is to provide a kind of transparent flexible printed wiring board with excellent heat resistance.
The means of dealing with problems
According to a first aspect of the invention, providing a kind of method for the manufacture of transparent flexible printed wiring board, comprising: prepare transparent insulating film, the size changing rate be associated with the thermal process at 230 to 300 DEG C of described transparent insulating film is not more than ± and 0.2%; Utilize ink ejecting method, print ITO ink with the form of predetermined pattern on transparent insulating film, described ITO ink comprises ITO particulate and adhesive; And cure described ITO ink, thus form the nesa coating that binder ratio is 5 to 10 wt%.
According to a second aspect of the invention, providing a kind of method for the manufacture of transparent flexible printed wiring board, comprising: prepare transparent insulating film, the size changing rate be associated with the thermal process at 230 to 300 DEG C of described transparent insulating film is not more than ± and 0.2%; Utilize method for printing screen or ink ejecting method, on transparent insulating film, print PEDOT ink with the form of predetermined pattern; Make described PEDOT ink dry, thus form nesa coating; And utilize printing technology, form heat-resisting transparent insulation diaphragm, to apply nesa coating at least partially.
According to a third aspect of the invention we, providing a kind of transparent flexible printed wiring board, comprising: transparent insulating film, the size changing rate be associated with the thermal process at 230 to 300 DEG C of described transparent insulating film is not more than ± and 0.2%; And obtain and the nesa coating formed on described transparent insulating film by curing ITO ink, and binder ratio is the nesa coating of 5 to 10 wt%.
According to a forth aspect of the invention, providing a kind of transparent flexible printed wiring board, comprising: transparent insulating film, the size changing rate be associated with the thermal process at 230 to 300 DEG C of described transparent insulating film is not more than ± and 0.2%; Obtain and the nesa coating formed on described transparent insulating film by making PEDOT ink dry; And heat resistant transparent insulating protective film, be formed to apply described nesa coating.
Beneficial effect of the present invention
Transparent insulating film is used as substrate by the present invention, and the size changing rate be associated with the thermal process at 230 to 300 DEG C of this transparent insulating film is not more than ± and 0.2%.Thus, when utilizing baking process to form nesa coating, can prevent from breaking in nesa coating, or preventing nesa coating from transparent insulating film layering.Thus, High-quality transparent flexible printing wiring board can be obtained.
In addition, because the transparent insulating film restraining oneself the baking process at high temperature performed in long-time section is used as substrate by High-quality transparent flexible printing wiring board according to the present invention, therefore this transparent flexible printed wiring board has the thermal endurance to the thermal process at high temperature performed in short time period (such as, reflux technique and ACF Joining Technology).
In addition, make the ITO ink film (nesa coating) cured comprise the adhesive that ratio is 5 to 10 wt%, thus in flexible, conductivity and adhering any between hyaline membrane substrate and nesa coating, there is fabulous characteristic.
Accompanying drawing explanation
Fig. 1 (a) 1(b) be the cross sectional view of transparent flexible printed wiring board according to example 1 and modified example thereof respectively.
Fig. 2 is the cross sectional view of the transparent flexible printed wiring board according to example 2.
Fig. 3 is the cross sectional view of the transparent flexible printed wiring board according to example 3.
Fig. 4 is the cross sectional view of the transparent flexible printed wiring board according to example 4.
Embodiment
In the present invention, the insulation transparent film with thermal endurance is used as the substrate of transparent flexible printed wiring board.Then, use the printing technology of such as injection method or method for printing screen and so on, on hyaline membrane, printing can form the ink of a type of nesa coating.As this ink, not only can use ITO ink, and the ink be made up of organic conductive polymer can be used, such as PEDOT(polyethylene dioxythiophene) ink.Subsequently, ink is cured or drying, to form the nesa coating with predetermined pattern.
First, the hyaline membrane resistance to thermal level that should meet will be described.Here, thermal endurance meets predetermined machinery and optical characteristics after referring to and at high temperature performing thermal process.This thermal process comprises printer's ink baking process (such as, 230 to 300 DEG C, one hour), reflux technique when assembly is arranged on transparent flexible printed wiring board (such as, in atmosphere, 260 DEG C, short time period [about seconds or tens of seconds]) etc.
The example of the optical characteristics needed for hyaline membrane comprises: light transmission does not significantly reduce, and does not occur painted (yellowing).
Meanwhile, the example of the mechanical property needed for hyaline membrane comprises the size changing rate be associated with thermal process.Here, size changing rate represents that hyaline membrane is heated to predetermined temperature and is follow-uply cooled to extensibility in the technique of room temperature or shrinkage gradually in thermal process (ink cures (drying) technique, reflux technique etc.).
Size changing rate is defined by following formula:
(L 1-L 2)/L 1×100 [%]
Here, L 1represent the size under the maximum temperature of hyaline membrane in thermal process, L 2represent hyaline membrane size at room temperature.
Size changing rate is particular importance when guaranteeing the quality of transparent flexible printed wiring board.In the present invention, employ following hyaline membrane: its size changing rate is not more than predetermined value, until temperature is back to room temperature from the temperature baking process.This is due to when larger size changing rate, there is great chance and breaks in nesa coating and layering between nesa coating and hyaline membrane.The main cause that nesa coating occurs in this damage is: in any one situation using ITO ink or PEDOT ink, the productive rate of the nesa coating obtained by curing (drying) technique is little of being not more than 25 wt%, and when curing (drying), the large change of volume occurs.
Therefore, the size changing rate that the hyaline membrane demand fulfillment of substrate is predetermined is used as, to guarantee the quality of transparent flexible printed wiring board.
Particularly, when the ITO ink comprising ITO particulate and adhesive is used as the material of nesa coating, the size changing rate be associated with baking process (230 to 300 DEG C, a hour) needs to be not more than ± and 0.2%.
Even if it should be noted that when use PEDOT ink, also desired size rate of change be not more than ± 0.2%.This is that the baking temperature after ink print is 100 to 150 DEG C, low compared with the stoving temperature of ITO ink due to when using PEDOT ink to form organic nesa coating.But, as when ITO ink, when size changing rate is large, break or layering in formed nesa coating.
Next, by black for description required to form the characteristic of nesa coating.
The organic nesa coating obtained by making the dryings such as PEDOT ink comprises large amount of organic matter, and has the good adhesion with hyaline membrane, and has sufficient flexibility.
When ITO ink, need the ratio of the adhesive adjusted in ITO ink, to guarantee flexibility and the adhesiveness with hyaline membrane.Thus, make trace adhesive after curing ink, keep existence, not bring ITO into perfect crystal state.But, should binder ratio be reduced, to improve the conductivity of nesa coating.Correspondingly, preferably, adhesiveness ratio is adjusted when considering the conductivity of nesa coating, adhesiveness and flexibility.
Particularly, when using ITO ink, from the viewpoint of the flexibility of the nesa coating after curing, adhesiveness and conductivity, expect that the binder ratio after curing is from 5 wt% to being not more than 10 wt%.
Binder ratio after curing is defined by following formula:
W b/W ITO×100 [%]
Here, W brepresent the weight of the adhesive after curing, W iTOrepresent the weight of the ITO ink (nesa coating) after curing.
In addition, when utilizing ink ejecting method to print, ITO ink and PEDOT ink all need to have the viscosity in preset range and surface tension, so that the fuzzy and uneven thickness of the ink printed by suppressing.
Particularly, under room temperature (23 DEG C), the viscosity of ink needs to be in the scope of 2 to 20 mPaS.
Under room temperature (23 DEG C), the surface tension of ink needs to be in the scope of 20 to 40 mN/m.In addition, be desirably in room temperature (23 DEG C) lower surface tension force and be in the scope of 25 to 35 mN/m, to suppress the fuzzy of the ink on hyaline membrane immediately after the printing.
In addition, the hyaline membrane of the appropriate surface tension had for suppressing the fuzzy of ink and uneven thickness after the printing must also be used.
The example of measurable parameter (according to surface state and the temperature of hyaline membrane, substitution table surface tension) comprises the contact angle between hyaline membrane and drippage liquid thereon.Particularly, expect to use following hyaline membrane: under room temperature (23 DEG C), this hyaline membrane is in the scope of 60 to 80 ° with the contact angle of drippage water droplet thereon.
By the way; as described in the example mentioned below, where necessary, transparent flexible printed wiring board according to the present invention can comprise high temperature insulation diaphragm; this high temperature insulation diaphragm is formed to apply part or all of nesa coating, to protect nesa coating.When using organic nesa coating of PEDOT ink, in order to oxidation anti-when thermal process, insulating protective film is provided to be necessary.
The material require of insulating protective film has the transparency and thermal endurance.For thermal endurance, this material require has and is being not less than in short time period (about several seconds to tens seconds) thermal endurance of thermal process performed at 260 DEG C, to restrain oneself the reflux technique formed after insulating protective film.
As the material of insulating protective film, need to use the solvent neither corroding and do not dissolve nesa coating.From the efficient viewpoint using material and Simplified flowsheet, expect to utilize printing technology to form insulating protective film.
Below, will describe according to four examples of the present invention.Example 1 utilizes ink ejecting method to print the example of ITO ink.Example 2 and 3 utilizes method for printing screen and ink ejecting method to print the example of PEDOT ink respectively.Example 4 is to form the example of two layers of nesa coating via insulating protective film.
Example 1
In example 1, by transparent polyimide film (70 μm of thickness) as substrate, and utilize ink ejecting method, with the form of predetermined pattern, ITO ink is applied in transparent polyimide film.Here, the Neopulim(LH-3430 that will be manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC.) as transparent polyimide film.When curing gradually chilling temperature (in this example, 230 DEG C) be confirmed to be with the size changing rate (that is, the size changing rate be associated with baking process) of transparent polyimide film in the technique being back to room temperature be not more than ± 0.2%.
Employ the ITO ink of general type, this ITO ink comprises organic bond and has dispersion ITO particulate in a solvent.
Next, by a kind of method for the manufacture of the transparent flexible printed wiring board according to this example of description.
(1) after optimizing ink-jet condition (viscosity and the surface tension of ITO ink are set in aforementioned range), ink ejecting method is utilized, with the form of predetermined pattern printing ITO ink in transparent polyimide film 1.In addition, preferably, first transparent polyimide film 1 is heated to 40 to 60 DEG C before printing.This can prevent ink droplet from soaking after falling on film and scattering.
(2) subsequently, make to utilize ink droplet and the sample drying of printing reaches 30 minutes at 120 DEG C, with in ITO ink under low boiling evaporating solvent.
(3) after this, at 230 DEG C, perform baking process in atmosphere reach one hour, to cure printed ITO ink, to form the nesa coating 2(ITO film with predetermined pattern).Confirm that the ratio of the adhesive residue in nesa coating 2 is in the scope of 5 to 10 wt%.
It should be noted that the atmosphere in baking process is nitrogen or reducing gas.As reducing gas, the gas obtained by hydrogen being added into nitrogen with about several percentage can be used, or the gas obtained by introducing formic acid (HCOOH) under a reduced pressure can be used.Based on the conductivity needed for nesa coating and facility cost etc. between relation select in baking process atmosphere.That is, the conductivity of the nesa coating formed improves in the following order: air, nitrogen and reducing gas.Facility cost also improves by this order.Therefore, preferably, atmosphere is selected according to object.
Fig. 1 (a) shows the transparent flexible printed wiring board 100 produced by above-mentioned technique.
It should be noted that as in the transparent flexible printed wiring board 100A shown in Fig. 1 (b), the transparent insulation diaphragm 3 of coating nesa coating 2 can be formed.Such as, insulating protective film 3 can be formed by printing transparent resist.With transparent polyimide film 1 and nesa coating 2 similar, insulating protective film 3 needs the thermal endurance had the thermal process (reflux technique etc.) that transparent flexible printed wiring board will stand.
The transparent flexible printed wiring board 100 according to this example is have evaluated in light transmission, resistance (conductivity), adhesiveness, flexibility and thermal endurance.Table 1 shows assessment result.
[table 1]
Table 1
From the assessment result shown in table 1, nesa coating 2 strong adhesion obtained by sintering ITO ink to transparent polyimide film 1, and has flexibility.In addition, even after film has stood normal reflow technique (peak temperature is 270 DEG C) three times, characteristic still remains unchanged, and therefore, confirms this film and has sufficient thermal endurance.
In addition, confirm also in light transmission and resistance, to illustrate favourable characteristic.
It should be noted that to compare, using following transparent polyimide film to produce transparent flexible printed wiring board: the size changing rate be associated with the baking process at 230 DEG C of this transparent polyimide film is greater than 0.2%.Here, the Neopulim(LH-3430 manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC. is employed).With apply under condition identical above and cured ITO ink, then, confirm to break in nesa coating, in addition, in nesa coating, found partial hierarchical.As described thus, the quality of size changing rate on transparent flexible printed wiring board of hyaline membrane has large impact.
Example 2
In example 2, use method for printing screen, as in example 1, with the form of predetermined pattern, PEDOT ink is applied in same substrate (transparent polyimide film 1).Employ can commercially PEDOT ink.
Next, by a kind of method for the manufacture of the transparent flexible printed wiring board according to this example of description.
(1) after optimizing printing flat board and printing condition, utilize method for printing screen, in transparent polyimide film 1, print PEDOT ink with the form of predetermined pattern.
(2) subsequently, make to utilize ink droplet at 130 DEG C and the sample drying of printing reaches 30 minutes, to form nesa coating 4(PEDOT film).
(3) after this, as can be seen from Fig. 2, the transparent insulation diaphragm 5(thickness using printing technology to be formed for the protection of nesa coating 4 is about 10 μm), to apply nesa coating 4(except the 4a of terminal part).In order to prevent nesa coating 4 to be oxidized when thermal process, provide insulating protective film 5, wherein, nesa coating 4 obtains Organic Conductive Films by making PEDOT ink dry.
In addition, with transparent polyimide film 1 and nesa coating 4 similar, insulating protective film 5 also needs to have the thermal endurance to the thermal process (reflux technique etc.) that transparent flexible printed wiring board will stand.As the transparent resist of material being used as insulating protective film 5, can by removing pigment in the resist of pigment easily obtain transparent and heat-resisting resist from can commercially comprise.
(4) then, utilize ink ejecting method, the terminal part 4a in nesa coating 4 prints silver nanoparticle ink, terminal part 4a is used for dividing with outside being connected.It should be noted that ink is not limited to silver nanoparticle ink, but other conductive ink of such as gold nano ink and so on can also be used.
(5) subsequently, as shown in Figure 2, at 130 DEG C, perform baking process reach 30 minutes, to solidify printed silver nanoparticle ink, to form terminal protecting film 6.Terminal protecting film 6 has the film thickness of about 1 μm.
The transparent flexible printed wiring board 200 shown in Fig. 2 is obtained by above-mentioned technique.
Transparent flexible printed wiring board 200 is have evaluated in light transmission, resistance (conductivity), adhesiveness, flexibility and thermal endurance.Table 2 shows assessment result.
[table 2]
Table 2
From the assessment result shown in table 2, the strong transparent polyimide film 1 that adheres to of nesa coating semi-finals obtained by making PEDOT ink dry, and there is flexibility.In addition, even after film has stood normal reflow technique (peak temperature is 270 DEG C) three times, characteristic is almost constant, therefore, confirms this film and has sufficient thermal endurance.
In addition, confirm also in light transmission and resistance, to illustrate favourable characteristic.
In addition, although found minor alteration (be not more than ± 10%) in resistance, confirmed not change in electrical resistance after initial back technique.According to this point, although assuming that cause the minor alteration of resistance due to the oxidation of the superficial layer of nesa coating 4, the oxide layer that superficial layer is formed also serves as diaphragm in subsequent reflow process, thus prevents further deterioration.
Example 3
In example 3, use ink ejecting method, as in example 1, with the form of predetermined pattern, PEDOT ink is applied in same substrate (transparent polyimide film 1).Employ can commercially PEDOT ink.
Next, by a kind of method for the manufacture of the transparent flexible printed wiring board according to this example of description.
(1) after optimizing ink-jet condition (viscosity and the surface tension of PEDOT ink are set in aforementioned range), ink ejecting method is utilized, with the form of predetermined pattern printing PEDOT ink in transparent polyimide film 1.In addition, preferably, first transparent polyimide film 1 is heated to 50 to 60 DEG C before printing.This can prevent ink droplet fuzzy and scatter after falling on film.
(2) subsequently, make to utilize ink droplet at 130 DEG C and the sample drying of printing reaches 30 minutes, to form nesa coating 7(PEDOT film).
(3) after this, as seen from Figure 3, the transparent insulation diaphragm 8(thickness using printing technology to be formed for the protection of nesa coating 7 is about 10 μm), to apply nesa coating 7(except the 7a of terminal part).With transparent polyimide film 1 and nesa coating 7 similar, insulating protective film 8 also needs to have the thermal endurance to the thermal process (reflux technique etc.) that transparent flexible printed wiring board will stand.In addition, as the transparent resist of material being used as insulating protective film 8, can by removing pigment in the resist of pigment easily obtain transparent and heat-resisting resist from can commercially comprise.
(4) then, as seen from Figure 3, utilize ink ejecting method, the terminal part 7a in nesa coating 7 prints silver nanoparticle ink, terminal part 7a is used for dividing with outside being connected.It should be noted that ink is not limited to silver nanoparticle ink, but other conductive ink of such as gold nano ink and so on can also be used.
(5) subsequently, at 130 DEG C, perform baking process reach 30 minutes, and the silver nanoparticle ink printed by solidification, to form terminal protecting film 9.Terminal protecting film 9 has the film thickness of about 1 μm.
The transparent flexible printed wiring board 300 shown in Fig. 3 is obtained by above-mentioned technique.
Transparent flexible printed wiring board 300 is have evaluated in light transmission, resistance (conductivity), adhesiveness, flexibility and thermal endurance.Table 3 shows assessment result.
[table 3]
Table 3
From the assessment result shown in table 3, nesa coating 7 strong adhesion obtained by making PEDOT ink dry to transparent polyimide film 1, and has flexibility.In addition, even after film has stood normal reflow technique (peak temperature is 270 DEG C) three times, characteristic is almost constant, therefore, confirms this film and has the sufficient thermal endurance of filling.
In addition, confirm also in light transmission and resistance, to illustrate favourable characteristic.
Example 4
According to the transparent flexible printed wiring board of this example, there is multiple transparent wiring layer.That is, this transparent flexible printed wiring board has following configuration: wherein, and the predetermined portions of the nesa coating that substrate is formed utilizes the transparent cross-over connection blank area of acquisition by making PEDOT ink dry and is electrically connected to each other.
Next, by a kind of method for the manufacture of the transparent flexible printed wiring board according to this example of description.
(1) method described in example 1 is utilized to obtain transparent flexible printed wiring board 100(see Fig. 1 (a)).
(2) subsequently, use ink ejecting method, form the transparent insulation diaphragm 10 for the protection of nesa coating 2.As can be seen from Fig. 4, insulating protective film 10 has opening 10a, and a part for nesa coating 2 is exposed on the basal surface of opening 10a.In addition, with transparent polyimide film 1 and nesa coating 2 similar, insulating protective film 10 also needs to have thermal endurance.
(3) then; after optimizing ink-jet condition (viscosity and the surface tension of PEDOT ink are set in aforementioned range), as from such as in 4, utilize printing technology (such as; ink ejecting method), in opening 10a and on insulating protective film 10, print PEDOT ink.In addition, preferably, first transparent polyimide film 1 is heated to 40 to 60 DEG C before printing.This can prevent ink droplet fuzzy and scatter after falling on film.
(4) subsequently, make to utilize ink droplet and dry 30 minutes of the sample that prints at 130 DEG C, to form transparent cross-over connection blank area 11(PEDOT film).As can be seen from Fig. 4, cross-over connection blank area 11 for be connected electrically in nesa coating 2 predetermined portions between.
(5) after this, as shown in Figure 4, the transparent insulation diaphragm 12(thickness using printing technology to be formed for the protection of cross-over connection blank area 11 is about 2 μm), to apply cross-over connection blank area 11.Similar with transparent polyimide film 1, nesa coating 2 etc., insulating protective film 12 also needs to have the thermal endurance to the thermal process (reflux technique etc.) that transparent flexible printed wiring board will stand.
The transparent flexible printed wiring board 400 shown in Fig. 4 is obtained by above-mentioned technique.
Transparent flexible printed wiring board 400 is have evaluated in light transmission, resistance (conductivity), adhesiveness, flexibility and thermal endurance.Table 4 shows assessment result.
[table 4]
Table 4
From the assessment result shown in table 4, nesa coating 2 and cross-over connection blank area 11 have sufficient adhesiveness and flexibility.In addition, even after film has stood normal reflow technique (peak temperature is 270 DEG C) three times, characteristic is almost constant, therefore, confirms this film and has sufficient thermal endurance.
In addition, confirm also in light transmission and resistance, to illustrate favourable characteristic.
According to this example, the transparent flexible printed wiring board with complicated wiring pattern can be produced.
In addition, in this example, define the nesa coating 2 obtained by the ITO ink in sintering transparent polyimide film 1, but as an alternative, as described in example 2 and 3, the nesa coating obtained by making PEDOT ink dry can be formed.
The foregoing describe four examples.Although in these examples by transparent polyimide film as the transparent insulating film serving as substrate, the transparent insulating film of such as aromatic polyamides or Nanoalloy hyaline membrane and so on can also be used, as long as it meets the condition of size changing rate etc.
As mentioned above, according to the present invention, provide fabulous in a kind of adhesiveness between hyaline membrane substrate and nesa coating and there is transparent flexible printed wiring board that is flexible and thermal endurance.
In addition; according to the present invention; nesa coating and insulating protective film all utilize printing technology to be formed, thus compared with using the manufacture method of conventional etching processes, provide a kind of for the manufacture of not wasting material and having the method for the transparent flexible printed wiring board of more subenvironment load.
Although those skilled in the art can expect additional effect of the present invention or multiple amendment based on above description, the invention is not restricted to each example above-mentioned.The constitution element of different example can be combined in due course.Do not depart from accessory rights requirement and equivalent replace in the concept idea of the present invention that draws of the content that limits and main points scope in, multiple interpolation, amendment and part can be carried out and delete.
The description of reference marker
1: transparent polyimide film
2,4,7: nesa coating
4a, 7a: terminal part
3,5,8,10,12: insulating protective film
6,9: terminal protecting film
10a: opening
11: cross-over connection blank area
100,100A, 200,300,400: transparent flexible printed wiring board.

Claims (11)

1., for the manufacture of a method for transparent flexible printed wiring board, comprising:
Prepare transparent insulating film, the size changing rate be associated with the thermal process at 230 to 300 DEG C of described transparent insulating film is not more than ± and 0.2%;
Utilize ink ejecting method, print ITO ink with the form of predetermined pattern on described transparent insulating film, described ITO ink comprises ITO particulate and adhesive;
Cure described ITO ink, thus form the nesa coating that binder ratio is 5 to 10 wt%;
After the described nesa coating of formation, utilize printing technology, form heat resistant transparent first insulating protective film with opening, the predetermined portions of described nesa coating is exposed on the basal surface of described opening;
PEDOT ink is printed in described opening and on the first insulating protective film;
Make described PEDOT ink dry, thus form transparent cross-over connection blank area; And
Utilize printing technology, form heat resistant transparent second insulating protective film, to apply cross-over connection blank area.
2. the method for the manufacture of transparent flexible printed wiring board according to claim 1, wherein, the viscosity of the ITO ink that described transparent insulating film prints and surface tension are respectively 2 to 20 mPa × S and 20 to 40 mN/m, are the value at 23 DEG C.
3. the method for the manufacture of transparent flexible printed wiring board according to claim 2, wherein, as described transparent insulating film, use following transparent insulating film: at 23 DEG C, described transparent insulating film is in the scope of 60 to 80 ° with the contact angle of the water droplet be dropped on described transparent insulating film.
4. the method for the manufacture of transparent flexible printed wiring board according to claim 1, wherein, as described transparent insulating film, use following transparent insulating film: at 23 DEG C, described transparent insulating film is in the scope of 60 to 80 ° with the contact angle of the water droplet be dropped on described transparent insulating film.
5., for the manufacture of a method for transparent flexible printed wiring board, comprising:
Prepare transparent insulating film, the size changing rate be associated with the thermal process at 230 to 300 DEG C of described transparent insulating film is not more than ± and 0.2%;
Utilize method for printing screen or ink ejecting method, on described transparent insulating film, print PEDOT ink with the form of predetermined pattern;
Make described PEDOT ink dry, thus form nesa coating;
After the described nesa coating of formation, utilize printing technology, form heat resistant transparent first insulating protective film with opening, the predetermined portions of described nesa coating is exposed on the basal surface of described opening;
PEDOT ink is printed in described opening and on the first insulating protective film;
Make described PEDOT ink dry, thus form transparent cross-over connection blank area; And
Utilize printing technology, form heat resistant transparent second insulating protective film, to apply cross-over connection blank area.
6. the method for the manufacture of transparent flexible printed wiring board according to claim 5, wherein, when utilizing described ink ejecting method to print described PEDOT ink on described transparent insulating film, the viscosity of the PEDOT ink that described transparent insulating film prints and surface tension are respectively 2 to 20 mPa × S and 20 to 40 mN/m, are the value at 23 DEG C.
7. the method for the manufacture of transparent flexible printed wiring board according to claim 6, wherein, as described transparent insulating film, use following transparent insulating film: at 23 DEG C, described transparent insulating film is in the scope of 60 to 80 ° with the contact angle of the water droplet be dropped on described transparent insulating film.
8. the method for the manufacture of transparent flexible printed wiring board according to claim 5, wherein, as described transparent insulating film, use following transparent insulating film: at 23 DEG C, described transparent insulating film is in the scope of 60 to 80 ° with the contact angle of the water droplet be dropped on described transparent insulating film.
9. the method for the manufacture of transparent flexible printed wiring board according to claim 5, comprising:
Conductive ink is printed in the terminal part of described nesa coating, and described terminal part exposes and do not applied by insulating protective film; And
Cure described conductive ink subsequently, thus form terminal protecting film.
10. a transparent flexible printed wiring board, comprising:
Transparent insulating film, the size changing rate be associated with the thermal process at 230 to 300 DEG C of described transparent insulating film is not more than ± and 0.2%;
Obtain by curing ITO ink and the nesa coating formed on described transparent insulating film, described nesa coating has the binder ratio of 5 to 10 wt%;
Heat resistant transparent first insulating protective film, is formed apply described nesa coating and have opening, and a part for described nesa coating is exposed on the basal surface of described opening;
Cross-over connection blank area, dry and formed by the PEDOT ink that makes to print in described opening and on the first insulating protective film; And
Heat resistant transparent second insulating protective film, is formed to apply described cross-over connection blank area.
11. 1 kinds of transparent flexible printed wiring boards, comprising:
Transparent insulating film, the size changing rate be associated with the thermal process at 230 to 300 DEG C of described transparent insulating film is not more than ± and 0.2%;
Obtain and the nesa coating formed on described transparent insulating film by making PEDOT ink dry;
Heat resistant transparent first insulating protective film, is formed apply described nesa coating and have opening, and a part for described nesa coating is exposed on the basal surface of described opening;
Cross-over connection blank area, dry and formed by the PEDOT ink that makes to print in described opening and on the first insulating protective film; And
Heat resistant transparent second insulating protective film, is formed to apply described cross-over connection blank area.
CN201180004732.2A 2010-05-21 2011-02-10 Transparent flexible printed wiring board and process for producing same Expired - Fee Related CN102668730B (en)

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US9029709B2 (en) 2015-05-12

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