CN102668250B - Anisotropic conducting film and method for producing same - Google Patents

Anisotropic conducting film and method for producing same Download PDF

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Publication number
CN102668250B
CN102668250B CN201080054185.4A CN201080054185A CN102668250B CN 102668250 B CN102668250 B CN 102668250B CN 201080054185 A CN201080054185 A CN 201080054185A CN 102668250 B CN102668250 B CN 102668250B
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resin
conductive film
anisotropic conductive
resin molding
resin bed
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CN201080054185.4A
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CN102668250A (en
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深谷达朗
松岛隆行
山本润
相崎亮太
工藤克哉
古田和隆
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Dexerials Corp
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Dexerials Corp
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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Abstract

Electronic components of different sizes are simultaneously mounted with high precision. The disclosed film has a two-layer configuration of a first resin layer (11) having a tack strength of at least 200 kPa, and a second resin layer (12) containing conductive particles. By means of electronic components being installed in the first resin layer (11), use on an IC, FPC, and SMD becomes possible, and simultaneous mounting becomes possible.

Description

Anisotropic conductive film and manufacture method thereof
Technical field
The present invention relates to the dispersed anisotropic conductive film of a kind of electroconductive particle and manufacture method thereof.
The application, based on the Japanese patent application No. Patent 2009-225771 of Japan's application on September 30th, 2009, requires priority, by referring to this application, quotes in this application.
Background technology
Up to now, when making IC (Integrated Circuit: integrated circuit) and other electronic unit engage with glass substrate, IC is installed on the glass substrate (COG:Chip on Glass), other electronic unit is arranged on flexible printed board (FPC:Flexible Printed Circuits).
Such as, liquid-crystal apparatus is as shown in Figure 6 such, is mounted on FPC102, is mounted in the SMD (Surface Mount Device) 101 of capacitor etc. by IC103 on glass substrate 104.In addition, FPC102 is connected by FOG (Film on Glass) ACF (Anisotropic Conductive Film) 105 with glass substrate 104, and IC103 is connected by COG ACF106 with glass substrate 104.
But, utilize welding in the method for loading of SMD101, because reflow process is necessary, so the high heat of SMD101.In addition, in order to the joint of SMD101, it is required that double-side type FPC102 becomes, and increases cost.In addition, along with the high refinement of liquid-crystal apparatus in recent years, the quantity of required SMD101 increases, and increases based on FPC102 area, and liquid-crystal apparatus becomes large.
So liquid-crystal apparatus is as shown in Figure 7 such, attempt using SMD ACF207 SMD201 to be arranged on (for example, referring to patent documentation 1) on glass substrate 204.Thus, above-mentioned reflow process can be omitted.In addition, by being arranged on by SMD201 on glass substrate 205, FPC202 can be made miniaturized, meanwhile, cheap one side FPC202 can be used.
Patent documentation 1: JP 2006-245554 publication.
But, in the liquid-crystal apparatus shown in Fig. 7, due to varying in size of the electronic units such as SMD201, FPC202 and IC203, so when carrying them, need SMD ACF207, FOG ACF205 and COG ACF206 respectively.In addition, in the lift-launch of SMD201, required other lift-launch temporarily (temporarily pasting), can need considerable workload.
In addition, although also can consider to use identical ACF to install SMD, FPC and IC simultaneously, the ACF characteristic needed for SMD, FPC and IC is different, so be difficult to unify accurately to install these electronic units.Such as, when the small-sized SMD of such as capacitor etc. being mounted in COG ACF (adhesion strength: 5 ~ 80kPa) and being upper temporarily, as shown in Figure 8, the dislocation of SMD can be there is.
Summary of the invention
The present invention is the invention proposed in view of so existing truth, its object is to, provides a kind of anisotropic conductive film and manufacture method thereof of installing the electronic unit varied in size accurately simultaneously.
The present inventors repeat the result of various research, find by the adhesion strength (Tackiness: adherence) of regulation as one of the ability keeping surface mounting assembly, use 2 layers of ACF constructed, SMD can be made temporarily to be equipped on glass substrate at a high speed, SMD and IC is installed simultaneously.
That is, relate to anisotropic conductive film of the present invention, it is characterized in that: stacked have the 1st resin bed of more than 200kPa adhesion strength and the 2nd resin bed containing electroconductive particle.
In addition, relate to the manufacture method of anisotropic conductive film of the present invention, it is characterized in that: manufacture following anisotropic conductive film, namely stacked have the 1st resin bed of more than 200kPa adhesion strength and the 2nd resin bed containing electroconductive particle, be used in and carry multiple electronic unit by surface mounting apparatus is interim on the 1st resin bed, and installed by thermo-compressed in the installation of above-mentioned electronic unit and other electronic unit simultaneously.
According to the present invention, high adhesion strength can be utilized, at a high speed interim lift-launch such as small-sized SMD, in addition, due to 2 layers of structure can be utilized to make the particle seizure property in such as COG improve, so fine pitch can be corresponded to, can the electronic unit varied in size be installed accurately simultaneously.
Accompanying drawing explanation
Fig. 1 is the sectional view representing the anisotropic conductive film relating to an embodiment of the present invention;
Fig. 2 is the figure of an example of the object form schematically representing anisotropic conductive film;
Fig. 3 is the figure of the installation method for illustration of the electronic unit employing the anisotropic conductive film relating to present embodiment;
Fig. 4 is the schematic diagram of photo when using the anisotropic conductive film of sample 4 temporarily to carry small-sized SMD;
Fig. 5 is the schematic diagram of photo when using the anisotropic conductive film of sample 7 temporarily to carry small-sized SMD;
Fig. 6 is the figure of the installation method for illustration of existing electronic unit;
Fig. 7 is the figure of the installation method for illustration of existing electronic unit;
Fig. 8 is the schematic diagram of photo when using existing anisotropic conductive film temporarily to carry small-sized SMD.
Embodiment
< anisotropic conductive film >
Fig. 1 is the sectional view representing the anisotropic conductive film relating to an embodiment of the present invention.This anisotropic conductive film 10 is stacked has the 1st resin bed 11 of more than 200kPa adhesion strength and the 2nd resin bed 12 containing electroconductive particle.When using this anisotropic conductive film 10 that electronic unit is arranged on glass substrate, becoming the 1st resin bed 11 with electronic component side, mode that glass substrate side becomes the 2nd resin bed 12 adhered.Particularly, relate to the anisotropic conductive film 10 of present embodiment for utilizing surface mounting apparatus multiple electronic unit of interim lift-launch on the 1st resin bed 11, and utilize thermo-compressed, mounting electronic parts and other electronic unit simultaneously.As surface mounting apparatus, such as, can use the surface mounting apparatus that can temporarily carry at a high speed with 1.0 ~ 0.1 seconds/chip degree.In addition, as using surface mounting apparatus to carry out the interim electronic unit carried, as long as the SMD (Surface Mount Device) of surface mounting apparatus can be applicable to, be then not particularly limited, but such as SMD during manufacture liquid crystal indicator, can capacitor be listed.
Be more than 200kPa by the adhesion strength of the 1st resin bed 11 relating to the anisotropic conductive film of present embodiment, dislocation during the small-sized SMD of interim mounting condenser at a high speed etc. can be prevented such as, small-sized SMD can be installed accurately.The scope of adhesion strength is preferably 200 ~ 600kPa, is more preferably 200 ~ 250kPa.Within the scope of this, enough confining forces can be obtained in the high speed of electronic unit is carried temporarily, in addition, film shape can be maintained.In addition, the implication of adhesion strength is that the mensuration probe controlled by adhesion test machine (TACKINESS TESTER) is pressed on determinand, pulls open the maximum of the adhesion strength in process.
1st resin bed 11 is that the 2nd resin bed 12 is the conductive layers containing conducting particles not containing the insulating barrier of electroconductive particle, 2 layers of structure of the anisotropic conductive film relating to present embodiment preferably stacked 1st resin bed 11 and the 2nd resin bed.Thus, such as when by IC (Integrated Circuit) install on the glass substrate (COG:Chip on Glass), 1st resin bed 11 flows because of the pressing force of the projection of IC, becomes the state not hindering the electrode on glass substrate to contact with electroconductive particle.On the other hand, because the 2nd resin bed 12 comprises electroconductive particle to high-density, so be limited based on the flowing of the pressing force of the projection of IC, catch electroconductive particle with high catch rate.In addition, the implication of the catch rate of electroconductive particle is electronic unit engages the quantity of the electroconductive particle of the per unit area of the terminal (projection) of front and back ratio with substrate.In addition, from the viewpoint of particle capturing efficiency, the lowest melt viscosity of best 2nd resin bed 12 is higher than the lowest melt viscosity of the 1st resin bed 11.Particularly, the lowest melt viscosity forming the resin of the 2nd resin bed 12 is preferably 100 ~ 100000Pas, and the lowest melt viscosity forming the resin of the 1st resin bed 11 is preferably 10 ~ 10000Pas.For lowest melt viscosity, sample can be seated in rotary viscosimeter by ormal weight, while measure with the programming rate rising edge of regulation.
As the electroconductive particle used in anisotropic conductive film 10, be not particularly limited, the metallics such as such as nickel, gold, copper, gold-plated etc. to resin particle after particle, subtend resin particle gold-plated after the outermost layer of particle implement the particle etc. that insulation covers.
In addition, anisotropic conductive film 10 viscosity is at normal temperatures preferably 10 ~ 1000kPas, is more preferably 10 ~ 500kPas.Viscosity based on anisotropic conductive film 10 is the scope of 10 ~ 1000kPas, when anisotropic conductive film 10 is formed the roll coil of strip of band shape described later, can prevent so-called extruding, and in addition, can maintain the adhesion strength of regulation.
As long as the composition of the 1st resin bed 11 and the 2nd resin bed 12 does not hinder above-mentioned feature, be then not particularly limited, but preferably form resin, liquid epoxy resin, potentiality curing agent and silane coupling agent containing film.
Film forms resin and is equivalent to the high molecular weight resin that mean molecule quantity is more than 10000, from the viewpoint of film formative, and the preferably mean molecule quantity of about 10000 ~ 80000.Form resin as film, the various resins such as epoxy resin, denaturation loop epoxy resins, denaturation loop epoxy resins, urethane resin, phenoxy resin can be used, wherein form the viewpoint such as state, connection reliability from film, preferably use phenoxy resin.
As liquid epoxy resin, as long as there is mobility under normal temperature, be then not particularly limited, can all use commercially available epoxy resin.As this epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolak type epoxy, bisphenol-type epoxy resin, stilbene type epoxy resin, triphenol methane type epoxy resin, phenol aralkyl-type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmenthane type epoxy resin etc. can be used particularly.They both can be used alone, also two or more use capable of being combined.
As potentiality curing agent, the various curing agent such as heat-curing type, UV curing type can be used.Potentiality curing agent does not react usually, and by certain Triggered Activity, starts reaction.Triggering has heat, light, pressurization etc., can carry out choice for use according to purposes.There is the method by generating spike (cation or anion) based on the dissociation reaction etc. of heating in the activation method of thermal activities type potentiality curing agent, near room temperature stable dispersion to epoxy resin and at high temperature mix with epoxy resin dissolve and start after melting out the curing agent of molecular sieve enclosing type under starting the method for curing reaction, high temperature curing reaction method, melt out curing etc. based on microcapsules.As thermal activities type potentiality curing agent, have imidazoles, hydrazides class, boron trifluoride-amine complex, sulphur aluminium salt, amine imines, polyamine salt, dicyandiamide etc. or its sex change thing, they can use separately or as mixture of more than two kinds.Wherein, in the present embodiment, microcapsule-type imidazoles potentiality curing agent is preferably used.
As silane coupling agent, epoxies, Ammonia, mercaptosulfides class, ureide derivative etc. can be used.Wherein, in the present embodiment, preferably epoxies silane coupling agent is used.Thus, the cementability at the interface of organic material and inorganic material can be made to improve.
In addition, as other interpolation constituent, preferably containing inorganic filler.By containing inorganic filler, in the mobility of the 1st resin bed 11 and the 2nd resin bed 12, produce difference during crimping, particle catch rate can be made to improve.As inorganic filler, silicon, mica, titanium oxide, calcium carbonate, magnesium oxide etc. can be used, the kind of inorganic filler without particular limitation of.
Fig. 2 is the figure of an example of the object form schematically showing anisotropic conductive film 10.This anisotropic conductive film 10, for stack gradually the 1st resin bed 11 and the 2nd resin bed 12 in peeling base 13, is shaped to band shape.The anisotropic conductive film winding layer of this band shape is stacked in the reeling end 22 be held in the 1st and the 2nd flange 21, becomes outer circumferential side to make peeling base 13.As peeling base 13, be not particularly limited, PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene) etc. can be used.In addition, also can be configured to, on the 2nd resin bed 12, there is transparent coverlay.In addition, anisotropic conductive film 10 is not limited to be with roll-shape, may also be elongate in shape.
As shown in Figure 2, when being provided as the band Wound product batching anisotropic conductive film 10, based on the scope of viscosity as 10 ~ 1000kPas of setting anisotropic conductive film 10, the distortion of anisotropic conductive film 10 can be prevented, maintaining the size of regulation.In addition, anisotropic conductive film 10 be the situation of stacked more than 2 of elongate in shape too, can prevent distortion, maintain regulation size.
In addition, when the roll coil of strip that reels uses anisotropic conductive film 10, larger than the adhesion strength of the 2nd resin bed 12 by the adhesion strength of the 1st resin bed 11, first can peel off the 2nd resin bed from peeling base 13, prevent obstruction.
The manufacture method > of < anisotropic conductive film
Below, the manufacture method of above-mentioned anisotropic conductive film is described.The manufacture method of the anisotropic conductive film in present embodiment is at the 1st resin molding containing formation on the 2nd resin molding of electroconductive particle with the adhesion strength of more than 200kPa.Here, also Pasting the 1st resin molding and the 2nd resin molding.Also can after formation one side resin molding, dry (recoat) the opposing party resin of coating.In addition, the 1st resin molding and the 2nd resin molding form the 1st resin bed 11 and the 2nd resin bed 12 respectively.
The manufacture method of pasting the 1st resin molding and the 2nd resin molding has: generate the operation with the 1st resin molding of more than 200kPa adhesion strength; Generate the operation of the 2nd resin molding containing electroconductive particle; With the operation of stickup the 1st resin molding and the 2nd resin molding.In the operation of generation the 1st resin molding, make film form resin, liquid epoxy resin, potentiality curing agent and silane coupling agent and dissolve in a solvent.As solvent, toluene, ethyl acetate etc. or its mixed solvent can be used.The 1st resin molding generation solution coat dissolving obtained, in peeling sheet, makes solvent evaporates, thus obtains the 1st resin molding.
Equally, in the operation of generation the 2nd resin molding, make electroconductive particle, film form resin, liquid epoxy resin, potentiality curing agent and silane coupling agent and dissolve in a solvent.As solvent, toluene, ethyl acetate etc. or its mixed solvent can be used.The 2nd resin molding generation solution coat dissolving obtained, in peeling sheet, makes solvent evaporates, thus obtains the 2nd resin molding.
Then, in the operation of stickup the 1st resin molding and the 2nd resin molding, peel off the peeling sheet of the 2nd resin molding, be pasted onto on the 1st resin molding.
By so pasting the 1st resin molding and the 2nd resin molding, the anisotropic conductive film 10 stacking gradually the 1st resin bed 11 and the 2nd resin bed 12 in peeling base 13 can be obtained.In addition, after formation one side resin molding, when making the resin-coated drying of the opposing party (recoat) manufacture, as long as such as make the 1st resin molding drying generate afterwards, by the 2nd resin molding generation solution coat on the 1st resin molding.
< employs the installation > of the electronic unit of anisotropic conductive film
Below, the installation method of the electronic unit employing anisotropic conductive film is described.The anisotropic conductive film relating to present embodiment due to adhesion strength high, even if so carry small-sized SMD, the also raw dislocation of difficult labour temporarily at a high speed.In addition, because be 2 layers of structure, so particle seizure property is good, the IC of fine pitch can be installed.That is, according to the anisotropic conductive film relating to present embodiment, can unify the different electronic unit such as size, kind is installed.
Fig. 3 is the figure of the installation method for illustration of the electronic unit employing the anisotropic conductive film relating to present embodiment.In the liquid-crystal apparatus shown in this Fig. 3, SMD31, FPC32 and IC33 are connected on the electrode of glass substrate by anisotropic conductive film 10.SMD31 is capacitor, and when seated, use surface mounting apparatus to be mounted at a high speed the 1st resin bed side of anisotropic conductive film 10, in addition, FPC32 and IC33 is configured in other installation region of the 1st resin bed temporarily.Afterwards, such as, use thermocompression head, unified these electronic units of thermo-compressed, thus SMD31, FPC32 and IC33 are electrically connected on the electrode of glass substrate.
Namely, comprising in the installation region of electrode on the glass substrate configures anisotropic conductive film 10 by entire surface, the electronic unit (SMD31, FPC32 and IC33) of the electrode position configuration different installation in this anisotropic conductive film 10, such as, thermocompression head is used to make these electronic units unify thermo-compressed, thus use compared with the situation of welding with existing, the intermittent time (tact time) can be made to increase substantially.
By like this, the joint of SMD is become ACF from existing scolding tin, can install at a high speed.In addition, compared with welding, can reduce bonding area, meanwhile, dislocation when can prevent SMD from temporarily carrying, so can shorten SMD spacing, carries small-sized SMD, can realize high refinement.
Embodiment
The following describes embodiments of the invention.First, by the mixing ratio shown in table 1, phenoxy resin, liquid epoxy resin, potentiality curing agent, silane coupling agent, silicon particle and electroconductive particle is made to be dissolved in toluene, this lysate is coated on stripping film, form the dry thickness of regulation, after oven dried, make Resin A ~ G.
In table 1, ' PKHH ' is the phenoxy resin of phenoxy group associating (Off ェ ノ キ シ ア ソ シ エ イ Star) society.In addition, ' EP828 ' is the bisphenol A-type liquid epoxy resin of Japanese epoxy field (ジ ャ パ Application エ Port キ シ レ Application ジ) Co., Ltd..In addition, ' HX3941 ' is the microcapsule-type imidazoles potentiality curing agent of Asahi Chemical Industry's chemistry (ケ ミ カ Le) Co., Ltd..In addition, ' A-187 ' is the epoxies silane coupling agent of モ メ Application テ ィ Block パ Off ォ マ Application ス マ テ リ ア Le ズ ジ ャ パ Application contract commercial firm.In addition, ' RY200 ' is the hydrophobicity silicon particle of Japanese ア エ ロ ジ Le Co., Ltd..In addition, ' Ni/Au electroplates acryl resin particle ' is the electroconductive particle of Sekisui Chemical Co., Ltd.In addition, each mixing ratio in table 1 represents Quality Mgmt Dept.
［ table 1 ］
Resin A B C D E F G
PKHH 40 30 25 20 20 20 30
EP828 10 20 25 30 30 30 20
HX3941 35 35 35 35 35 35 30
A-187 2 2 5 5 5 5 2
アエロジルRY200 0 0 0 0 8 8 8
Ni/Au electroplates acryl resin particle (φ 4 μm) 0 0 0 0 0 30 30
Then, the sample 1 ~ 7 of anisotropic conductive film is made of the Resin A ~ G shown in table 1.
［ sample 1 ］
Make the anisotropic conductive film of the 1 layer of structure be made up of the resin F of thickness 25 μm.
［ sample 2 ］
Make the anisotropic conductive film of the 1 layer of structure be made up of the resin G of thickness 25 μm.
［ sample 3 ］
Paste the 1st resin molding be made up of the Resin A of thickness 15 μm and the 2nd resin molding be made up of the resin G of thickness 10 μm, make the anisotropic conductive film of 2 layers of structure.In addition, when using this anisotropic conductive film to be installed on the glass substrate by electronic unit, become the 1st resin molding with electronic component side, the mode that glass substrate side becomes the 2nd resin molding is adhered.
［ sample 4 ］
Paste the 1st resin molding be made up of the resin B of thickness 15 μm and the 2nd resin molding be made up of the resin G of thickness 10 μm, make the anisotropic conductive film of 2 layers of structure.In addition, when using this anisotropic conductive film to be installed on the glass substrate by electronic unit, the same with sample 3, become the 1st resin molding with electronic component side, the mode that glass substrate side becomes the 2nd resin molding is adhered.
［ sample 5 ］
Paste the 1st resin molding be made up of the resin C of thickness 15 μm and the 2nd resin molding be made up of the resin G of thickness 10 μm, make the anisotropic conductive film of 2 layers of structure.In addition, when using this anisotropic conductive film to be installed on the glass substrate by electronic unit, the same with sample 3, become the 1st resin molding with electronic component side, the mode that glass substrate side becomes the 2nd resin molding is adhered.
［ sample 6 ］
Paste the 1st resin molding be made up of the resin D of thickness 15 μm and the 2nd resin molding be made up of the resin G of thickness 10 μm, make the anisotropic conductive film of 2 layers of structure.In addition, when using this anisotropic conductive film to be installed on the glass substrate by electronic unit, the same with sample 3, become the 1st resin molding with electronic component side, the mode that glass substrate side becomes the 2nd resin molding is adhered.
［ sample 7 ］
Paste the 1st resin molding be made up of the resin E of thickness 15 μm and the 2nd resin molding be made up of the resin G of thickness 10 μm, make the anisotropic conductive film of 2 layers of structure.In addition, when using this anisotropic conductive film to be installed on the glass substrate by electronic unit, the same with sample 3, become the 1st resin molding with electronic component side, the mode that glass substrate side becomes the 2nd resin molding is adhered.
The various result of the tests of sample 1 ~ 7 shown in table 2.Adhesion strength, temporarily lift-launch property, insulating properties, particle catch property, connect impedance, adhesive strength, viscosity and flanging each test carry out as follows.In addition, sample 1 ~ 4 is equivalent to comparative example or reference example, and sample 5 ~ 7 is equivalent to embodiment.
［ adhesion strength ］
Use adhesion testing machine ((strain) レ ス カ TACII), under the ambiance of 22 DEG C, with probe diameter 5mm (stainless steel minute surface, cylindric), compressive load 196kgf, compress speed 30mm/min, the condition determination of peeling rate 5mm/min carries out, and peak strength is set to the adhesion strength (kPa) of each sample.Here, the adhesion strength of each sample represents the adhesion strength of the film of electro part carrying side.
［ temporarily lift-launch property ］
Use surface mounting apparatus (ヤ マ Ha (Yamaha) engine (strain) society YV100II), in each sample on the glass substrate (コ-ニ Application グ (strain) 1737F processed) that 0.7mm is thick, carry 10 SMD ((strain) Murata Manufacturing Co. Ltd. system 1005 capacitor, overall dimension: L1.0mm × W0.5m × H0.4m) with the element gap of 0.3mm temporarily.The situation being provided with the dislocation of SMD for ×, if the situation of dislocation-free is Ο.
［ insulating properties ］
Thermo-compressed IC in each sample on the glass substrate (コ-ニ Application グ (strain) 1737F processed) of 0.7mm thickness (between projection spacing: 12.5 μm), obtains connector.To glass substrate adjacent liner between apply the voltage of 30V, measure insulation impedance, if insulation impedance is 1.0 × 10 -6below Ω is short circuit.If the situation of short circuit is ×, if the situation of not short circuit is Ο.
［ particle seizure ］
Particle after the quantity (on average) of the electroconductive particle existed under each projection when counting temporary fixed IC and thermo-compressed catches number (on average), obtains capturing efficiency by following formula.If the situation that capturing efficiency is more than 20% is Ο, if the situation less than 20% be ×.
Capturing efficiency (%)=(population captured after thermo-compressed)/(population existed under projection time temporary fixed) × 100
［ connection impedance ］
Thermo-compressed IC in each sample on the glass substrate (コ-ニ Application グ (strain) 1737F processed) of 0.7mm thickness (between projection spacing: 12.5 μm), obtains connector.Afterwards, to measure between the projection of IC and the liner of glass substrate initial is connected impedance (Ω).If the situation connecting impedance ratio 5 Ω little is Ο, the situation of 5 more than Ω is ×.
［ adhesive strength ］
Thermo-compressed IC in each sample on the glass substrate (コ-ニ Application グ (strain) 1737F processed) of 0.7mm thickness (between projection spacing: 12.5 μm), obtains connector.Afterwards, by peel strength when to peel off this connector along 90 DEG C of directions with hot strength 50cm/min for initial bond strenght (N/cm).If the situation that adhesive strength is less than 3N/cm is ×, the situation of more than 3N/cm is Ο.
［ viscosity ］
Applied stress control type galvanometer (Haake society RS150), measures the MV minium viscosity (kPas) of each sample.As circular cone, use the circular cone of diameter 8mm, angle 2 degree, measurement range is 30 DEG C ~ 250 DEG C.In addition, the resin molding of electro part carrying side and the resin molding of glass substrate side measure too.
［ with or without extruding ］
Each sample is cut into 2.0mm, with 0.2N/mm 2tension winding on the roll coil of strip of core diameter 2.54mm, profile 100mm, at room temperature place 1 day.By visual inspection, if be Ο without situation about extruding, have situation about extruding for ×.
［ table 2 ］
In addition, Fig. 4 represents the anisotropic conductive film using sample 4, state diagram during the small-sized SMD of interim lift-launch.In addition, Fig. 5 represents the anisotropic conductive film using sample 7, state diagram during the small-sized SMD of interim lift-launch.This is the same with the condition of above-mentioned ' temporarily lift-launch property ', uses surface mounting apparatus, sample carries 2 row, 10 SMD ((strain) Murata Manufacturing Co. Ltd. system 1005 capacitor) with the element gap of 0.3mm temporarily.
Comparison diagram 4 and Fig. 5 known, use sample 7 than use sample 4 can keep accurately at a high speed interim carry time the position of capacitor.This is because the resin molding E of the lift-launch side of sample 7 contains the liquid epoxy resin more than the resin molding B of the lift-launch side of sample 4, there is high adhesion strength.
In addition, from the various result of the tests shown in table 2,1st resin bed of electro part carrying side has the adhesion strength of more than 200kPa, and the 2nd resin bed of glass substrate side contains electroconductive particle, also can be used in the lift-launch of any one of IC, FPC and SMD thus.Such as, sample 5 ~ sample 7 has 2 layers of structure, and has the adhesion strength of more than 200kPa, so can at a high speed interim mounting condenser, in addition, can install with the electronic unit such as IC, FPC simultaneously.
In addition, although sample 1 has the adhesion strength of more than 200kPa, owing to being only the individual layer of resin molding F, so can not get good insulating properties and particle seizure property.In addition, sample 2 does not have the adhesion strength only corresponding to interim lift-launch at a high speed, in addition, is also only the individual layer of resin molding G, so can not get good insulating properties, particle seizure property and adhesive strength, is unsuitable for the installation of any one of IC, FPC and SMD yet.In addition, although sample 3,4 has 2 layers of structure, its adhesion strength is identical with existing ACF level, is not only to correspond to interim level of carrying at a high speed, is unsuitable for the installation of SMD.
In addition, the viscosity based on anisotropic conductive film is 10 ~ 1000kPas, can maintain film shape, prevents extruding when being wound on the roll coil of strip.Such as, sample 6 is identical relative to the mixing ratio of phenoxy resin with liquid epoxy resin in sample 7, but because the viscosity of sample 6 is too low, so when being wound on the roll coil of strip, can extrude.On the other hand, sample 7 owing to having suitable viscosity, so extruding when being wound on the roll coil of strip can be prevented.
In addition, from the mixing ratio of each resin shown in table 1, in the 1st resin bed of electro part carrying side, mixing ratio relative phenoxy resin 100 Quality Mgmt Dept of liquid epoxy resin is 100 ~ 150 Quality Mgmt Dept, thus the adhesion strength that can maintain.Such as, the resin molding C ~ F of the lift-launch side use of sample 1,5 ~ 7 is scopes of above-mentioned mixing ratio, so can obtain the adhesion strength of more than 200kPa.
In addition, by adding silicon particle to resin, can prevent viscosity when adhesion strength is increased from declining, maintaining film shape.Such as, the film E of the film D of the lift-launch side of comparative sample 6 and the lift-launch side of sample 7 is known, and the resin molding E containing silicon particle, while maintenance adhesion strength, can prevent the viscosity caused because of the increase of liquid epoxy resin amount from declining.
Symbol description
10 anisotropic conductive film
11 the 1st resin beds
12 the 2nd resin beds
13 peeling base
21 flanges (flange)
22 winders
31 SMD
32 FPC
33 IC
101 SMD
102 FPC
103 IC
104 glass substrates
105 FOG ACF
106 COG AFC
201 SMD
202 FPC
203 IC
204 glass substrates
205 FOG ACF
206 COG ACF
207 SMD ACF.

Claims (6)

1. an anisotropic conductive film, is characterized in that,
Stacked have the 1st resin bed of the adhesion strength of more than 203kPa and the 2nd resin bed containing electroconductive particle,
Be used in and carry multiple electronic unit by surface mounting apparatus is interim on above-mentioned 1st resin bed, and installed by thermo-compressed in the installation of above-mentioned electronic unit and other electronic unit simultaneously.
2. anisotropic conductive film according to claim 1, is characterized in that,
Viscosity under normal temperature is 10 ~ 1000kPas.
3. anisotropic conductive film according to claim 2, is characterized in that,
Above-mentioned 1st resin bed and above-mentioned 2nd resin bed contain: film forms resin, liquid epoxy resin and potentiality curing agent.
4. anisotropic conductive film according to claim 3, is characterized in that,
Above-mentioned 2nd resin bed contains inorganic filler.
5. anisotropic conductive film according to claim 4, is characterized in that,
Above-mentioned 1st resin bed contains inorganic filler.
6. a manufacture method, manufactures the anisotropic conductive film described in the claims 1, it is characterized in that,
Have:
Generate the operation with the 1st resin molding of the adhesion strength of more than 203kPa;
Generate the operation of the 2nd resin molding containing electroconductive particle; And
Paste the operation of above-mentioned 1st resin molding and above-mentioned 2nd resin molding.
CN201080054185.4A 2009-09-30 2010-09-29 Anisotropic conducting film and method for producing same Expired - Fee Related CN102668250B (en)

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JP6428325B2 (en) * 2014-02-04 2018-11-28 デクセリアルズ株式会社 Anisotropic conductive film and manufacturing method thereof
JP2015149126A (en) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 Anisotropic conductive film and method for manufacturing the same
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