CN102626896A - Silicon chip polishing method for cutting polishing cloth of fixed plate edge - Google Patents
Silicon chip polishing method for cutting polishing cloth of fixed plate edge Download PDFInfo
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- CN102626896A CN102626896A CN2012101223794A CN201210122379A CN102626896A CN 102626896 A CN102626896 A CN 102626896A CN 2012101223794 A CN2012101223794 A CN 2012101223794A CN 201210122379 A CN201210122379 A CN 201210122379A CN 102626896 A CN102626896 A CN 102626896A
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- polishing
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- fixed plate
- polishing cloth
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Abstract
The invention relates to a silicon chip polishing method for cutting polishing cloth of a fixed plate edge, which includes the following steps: cutting the polishing cloth according to a silicon chip edge sinking condition so as to enable the diameter of the polishing cloth to be smaller than that of a polishing fixed plate; sticking the polishing cloth onto the polishing fixed plate so as to enable the circle center of the polishing cloth to be aligned to that of the polishing fixed plate; and placing a silicon chip to conduct polishing. By means of the polishing method, the polishing cloth of the fixed plate edge is cut off, and a flat edge of the silicon chip is arranged outside the fixed plate and does not contact with the polishing cloth, therefore effects on the fixed plate of a polishing machine of changes of environment temperature, water temperature and the like are relieved, and an edge sinking problem at the flat edge position of the silicon chip is solved.
Description
Technical field
The present invention relates to the silicon wafer polishing technical field, particularly relate to the silicon chip polishing method that a kind of price fixing edge polishing cloth cuts cloth.
Background technology
Polishing pad is a critical component of carrying polishing fluid, and it is used for the abrasion particle of polishing fluid is sent into the sheet sub-surface and removed byproduct, and the acquisition of planarization is because those higher parts contact polishing pads and being removed on the circular wafer.The mechanical performance of polishing pad plays an important role to polishing velocity and final flatness like elasticity and modulus of shearing, compressibility and roughness.The hardness of polishing pad has tangible influence to polishing uniformity; Hard packing can obtain interior uniformity (WID) of mould and bigger complanation distance preferably; Cushion can improve uniformity (WIW) in the sheet, for obtaining good WID and WIW, soft, the hard packing of use capable of being combined; Between disk and fixture thereof, add one deck elasticity notacoria (backing film), can satisfy rigidity and flexible double requirements.Polishing pad is often for containing the polyester fiber felt of polyurethanes.After polishing pad uses " glazing " gradually, removal speed is descended, can recover the matsurface of polishing pad, improve the ability that it holds slurry, thereby make removal speed kept and prolong the life-span of polishing pad with the method for finishing.Thereby thereby to improve polishing pad, prolong its service life to reduce processing loss be one of main challenge of CMP technology.
Summary of the invention
Technical problem to be solved by this invention provides a kind of collapse price fixing edge polishing cloth on limit of place, the flat limit of silicon chip of can avoiding and cuts the silicon chip polishing method of cloth.
The technical solution adopted for the present invention to solve the technical problems is: provide a kind of price fixing edge polishing cloth to cut the silicon chip polishing method of cloth, may further comprise the steps:
(1) extracts polishing cloth according to the limit situation of collapsing of the silicon chip after the equipment polishing, make the diameter of polishing cloth less than the diameter of polishing price fixing;
(2) said polishing cloth is attached on the polishing price fixing, makes the center of circle of polishing cloth aim at the center of circle of polishing price fixing;
(3) place silicon chip, silicon chip is polished.
The diameter of said polishing cloth is than the little 2-10cm of diameter of polishing price fixing.
Beneficial effect
Owing to adopted above-mentioned technical scheme, the present invention compared with prior art has following advantage and good effect: the present invention slices off price fixing edge polishing cloth; Make the flat limit of silicon chip not contact the polishing mode of polishing cloth in the price fixing outside; Alleviate the influence that variations such as environment temperature, water temperature bring the polishing machine price fixing, solve the flat limit of silicon chip and locate to collapse the limit problem, improve silicon chip geometric parameter level; Sharpest edges of the present invention are; Can collapsing according to silicon chip, the limit situation is random adjusts the width that cuts cloth, and simple to operation, and any cost useless increases.
Description of drawings
Fig. 1 is that the present invention processes the simulation sketch map.
The specific embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in the restriction scope of the present invention.Should be understood that in addition those skilled in the art can do various changes or modification to the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Embodiment of the present invention relates to the silicon chip polishing method that a kind of price fixing edge polishing cloth cuts cloth; This method is through simple process polishing cloth edge; Change the finished edge surface state; Make silicon chip in polishing process, not contact the polishing cloth edge and change the whole silicon chip surface quality of silicon chip, thereby thoroughly solve the collapse phenomenon on limit of silicon chip edge, specifically may further comprise the steps:
(1) extracts polishing cloth 2 according to the limit situation of collapsing of the silicon chip after the equipment polishing, make the diameter of polishing cloth 2 less than the diameter of polishing price fixing 1; Can adopt big compasses that polishing cloth 2 is extracted, the diameter of polishing cloth 2 preferably can be than the little 2-10cm of diameter of polishing price fixing 1.
(2) said polishing cloth 2 is attached on the polishing price fixing 1, makes the center of circle of polishing cloth 2 aim at the center of circle of polishing price fixing 1;
(3) place silicon chip 3, silicon chip is polished, be about to silicon chip 3 and be positioned on the ceramic disk 4, and adopt 5 pairs of silicon chips 3 of rubbing head to polish, the processing simulation drawing of having placed behind the silicon chip 3 is as shown in Figure 1.
Be not difficult to find that the present invention slices off price fixing edge polishing cloth, make the flat limit of silicon chip not contact the polishing mode of polishing cloth in the price fixing outside; Alleviate the influence that variations such as environment temperature, water temperature bring the polishing machine price fixing, solve the flat limit of silicon chip and locate to collapse the limit problem, improve silicon chip geometric parameter level; Sharpest edges of the present invention are; Can collapsing according to silicon chip, the limit situation is random adjusts the width that cuts cloth, and simple to operation, and any cost useless increases.
Claims (2)
1. a price fixing edge polishing cloth cuts the silicon chip polishing method of cloth, it is characterized in that, may further comprise the steps:
(1) extracts polishing cloth according to the limit situation of collapsing of the silicon chip after the equipment polishing, make the diameter of polishing cloth less than the diameter of polishing price fixing;
(2) said polishing cloth is attached on the polishing price fixing, makes the center of circle of polishing cloth aim at the center of circle of polishing price fixing;
(3) place silicon chip, silicon chip is polished.
2. price fixing edge polishing cloth according to claim 1 cuts the silicon chip polishing method of cloth, it is characterized in that, the diameter of said polishing cloth is than the little 2-10cm of diameter of polishing price fixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101223794A CN102626896A (en) | 2012-04-24 | 2012-04-24 | Silicon chip polishing method for cutting polishing cloth of fixed plate edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101223794A CN102626896A (en) | 2012-04-24 | 2012-04-24 | Silicon chip polishing method for cutting polishing cloth of fixed plate edge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102626896A true CN102626896A (en) | 2012-08-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101223794A Pending CN102626896A (en) | 2012-04-24 | 2012-04-24 | Silicon chip polishing method for cutting polishing cloth of fixed plate edge |
Country Status (1)
| Country | Link |
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| CN (1) | CN102626896A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106670944A (en) * | 2016-12-31 | 2017-05-17 | 上海合晶硅材料有限公司 | Silicon wafer polishing method |
| CN109623628A (en) * | 2018-12-12 | 2019-04-16 | 大连理工大学 | Inhibit the method for edge effect in a kind of mechanical lapping or polishing process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000015556A (en) * | 1998-06-30 | 2000-01-18 | Mitsubishi Materials Silicon Corp | Regenerating method of polishing cloth |
| CN2452681Y (en) * | 2000-12-13 | 2001-10-10 | 陈显达 | Emery combination structure for emergy grinder |
| JP3326443B2 (en) * | 1993-08-10 | 2002-09-24 | 株式会社ニコン | Wafer polishing method and apparatus therefor |
| US6561876B1 (en) * | 1999-06-28 | 2003-05-13 | Kabushiki Kaisha Toshiba | CMP method and semiconductor manufacturing apparatus |
| CN102089121A (en) * | 2008-07-31 | 2011-06-08 | 信越半导体股份有限公司 | Wafer polishing method and double side polishing apparatus |
-
2012
- 2012-04-24 CN CN2012101223794A patent/CN102626896A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3326443B2 (en) * | 1993-08-10 | 2002-09-24 | 株式会社ニコン | Wafer polishing method and apparatus therefor |
| JP2000015556A (en) * | 1998-06-30 | 2000-01-18 | Mitsubishi Materials Silicon Corp | Regenerating method of polishing cloth |
| US6561876B1 (en) * | 1999-06-28 | 2003-05-13 | Kabushiki Kaisha Toshiba | CMP method and semiconductor manufacturing apparatus |
| CN2452681Y (en) * | 2000-12-13 | 2001-10-10 | 陈显达 | Emery combination structure for emergy grinder |
| CN102089121A (en) * | 2008-07-31 | 2011-06-08 | 信越半导体股份有限公司 | Wafer polishing method and double side polishing apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106670944A (en) * | 2016-12-31 | 2017-05-17 | 上海合晶硅材料有限公司 | Silicon wafer polishing method |
| CN109623628A (en) * | 2018-12-12 | 2019-04-16 | 大连理工大学 | Inhibit the method for edge effect in a kind of mechanical lapping or polishing process |
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Application publication date: 20120808 |