CN102625625B - Novel fixing device and assembling method for high-power radio frequency power amplifiers - Google Patents
Novel fixing device and assembling method for high-power radio frequency power amplifiers Download PDFInfo
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- CN102625625B CN102625625B CN201210094679.6A CN201210094679A CN102625625B CN 102625625 B CN102625625 B CN 102625625B CN 201210094679 A CN201210094679 A CN 201210094679A CN 102625625 B CN102625625 B CN 102625625B
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Abstract
The invention discloses a novel fixing device and an assembling method for high-power radio frequency power amplifiers. The fixing device comprises a radiating base, a PCB (printed circuit board) board and a U-shaped piece. The PCB board is arranged tightly on the upper surface layer of the radiating base and provided with a center hole and a pair of fixing holes for connecting, a group of welding pads are arranged along the surrounding edge of the center hole; the central part of the U-shaped piece is an arc-shaped groove body, the upper two sides extend outward to form lugs respectively, each lug is provided with a fixing hole and is connected with the PCB board through an adjusting protection retaining part and a screw which penetrates through the fixing hole;a high-power radio frequency power amplifier is pressed on the radiating base by the central arc-shaped groove body of the U-shaped piece through downward pressure; and the U-shaped piece, the PCB board and the radiating base are connected by the screws or bolts which penetrate through the fixing holes on the lugs. By the assembling method, the high-power radio frequency power amplifiers can be assembled with low cost, good grounding and radiating of the radio frequency amplifiers can be guaranteed, performance consistency of the high-power radio frequency power amplifiers is improved, and production and assembly of the high-power radio frequency power amplifiers are facilitated.
Description
Technical field
The present invention relates to communication equipment field, in particular, relate to a kind of communication equipment radio-frequency power amplifier erecting device and utilize it to realize the method for installing.
Background technology
Radio-frequency power amplifier is the important component part of various transmitting set, in emission system, radio-frequency power amplifier power output can greatly to hundreds of watts.So the impedance ground of radio-frequency power amplifier and radiating effect determine reliability and the cost of whole amplifier operation, and it is installed and fixing means is just extremely crucial.
Special power amplifier module selected by radio-frequency power amplifier, earthing effect and heat dispersion are all secure, but cost is higher, and each special-purpose radio-frequency power amplifier module all needs specific mounting structure to coordinate, and brings larger restriction to the overall construction design of equipment.The general radio frequency amplifier tube that use cost is lower carrys out designed for greater reliability amplifier, has important using value.
Usually ready-made power amplifier module is all power amplifier manufacturers design and manufactures, and be directly radio-frequency power amplifier is welded on one piece of heat dispersion substrate, heat dispersion substrate is internally connected with power amplifier.When mounted, radiating copper sheet directly contacts with the ground connection Copper Foil of pcb board, has lower impedance ground, adds the soft cushioning of heat conduction to improve the heat dispersion of power amplifier between radiating copper sheet and heat dissipation base.This mode is that power amplifier module is special, and device purchase cost is higher, and structural design is subject to the restriction of power amplifier module shape, dumb.
Summary of the invention
The object of this invention is to provide a kind of fixture of radio-frequency power amplifier, it is utilized fixedly to lay radio-frequency power amplifier, the installation method of the radio-frequency power amplifier of low cost not only can be provided, and radio-frequency power amplifier ground connection and heat radiation can be guaranteed well, improve consistency of performance, and be convenient to produce assembling.
For achieving the above object, the present invention adopts following technical scheme:
A kind of novel high-power radio-frequency power amplifier fixture, it comprises:
One heat dissipation base, its upper surface is a flat face or has groove;
One pcb board, tightly be overlying on the upper epidermis of heat dissipation base, this pcb board has and can be positioned at mesopore wherein for radio-frequency power amplifier, the shape of this mesopore is mated mutually with the packaging appearance structure of radio-frequency power amplifier, surrounding edge along this mesopore is furnished with an assembly welding dish, this assembly welding dish comprises a pair input, output pin pad and a pair ground pad, pcb board also offers a pair connection fixing hole, a pair described ground pad is used for the connection for radio-frequency power amplifier ground pin, described input, output pin pad is used for for radio-frequency power amplifier input, the connection of output pin,
One shape of reverse omega sheet, it is made up of elastic metallic material, and middle part is arc groove body, and upper both sides are outward extended with end ear respectively, each end ear is offered fixing hole by regulating protection retention means to realize being connected with pcb board through the screw and of its fixing hole; High-power RF power amplifier is pressed on heat dissipation base downwards by the middle part arc groove body of this shape of reverse omega sheet;
By the connection realizing shape of reverse omega sheet, pcb board and heat dissipation base three through the screw of fixing hole or bolt on end ear.
By the connection realizing shape of reverse omega sheet, pcb board and heat dissipation base three through the screw of fixing hole or bolt on end ear.
In described radio-frequency power amplifier fixture, the straight area in arc groove face of the middle part body of this shape of reverse omega sheet is not less than the upper surface of installed radio-frequency power amplifier encapsulation; Described adjustment protection retention means presses down limit height for adjusting shape of reverse omega sheet, and the gross thickness of this adjustment protection retention means is: (limiting altitude that shape of reverse omega sheet presses down+radio-frequency power amplifier thickness-pcb board thickness) ± 5mm.
The adjustment protection retention means of described radio-frequency power amplifier fixture is one group of annular elastomeric pad mutually piling up conjunction.
Another object of the present invention is to provide a kind of installation method of radio-frequency power amplifier of low cost.
For achieving the above object, the present invention adopts following technical scheme:
Utilize aforesaid fixture to realize a method for radio-frequency power amplifier installation, its method step is as follows:
1) the heat dissipation base upper surface adopted is plane or has a groove, this groove can hold radio-frequency power amplifier body crouch into;
2) first pcb board is fixed on heat dissipation base, if adopt upper surface to open reeded heat dissipation base, then the mesopore of pcb board will be made to offer position corresponding with the groove on heat dissipation base;
3) position of radio-frequency power amplifier welding in the mesopore then radio-frequency power amplifier being placed in pcb board is welded, if adopt upper surface to open reeded heat dissipation base, then directly radio-frequency power amplifier is lying into wherein and welds;
4) again shape of reverse omega sheet is placed on radio-frequency power amplifier, by the through hole on the end ear of shape of reverse omega sheet both sides just to connection through hole corresponding on pcb board, adjustment protection retention means is placed between holes, tightens through after shape of reverse omega sheet, adjustment protection retention means, pcb board and heat dissipation base successively with screw;
5) input of radio-frequency power amplifier, output pin are correctly welded on the input of pcb board, output pin pad;
6) interim dismounting shape of reverse omega sheet, the sidewall ground pad solder correct corresponding to PCB by the both sides ground pin of radio-frequency power amplifier, and again shape of reverse omega sheet is installed.
In the method step 4 that described radio-frequency power amplifier is installed; protection retention means is regulated to adopt one group of annular elastomeric pad; first calculate required protection pad annular elastomeric pad quantity of putting between holes in advance, the annular elastomeric pad of number of matches is overlayed between holes.
The installation of high-power RF power amplifier is the difficult problem that cost and performance are difficult to balance, the invention provides a kind of can good earth and fixture and the installation method of heat radiation can be taken into account for a long time.
Advantage of the present invention is:
1) cost is lower, and the cost price of the radio-frequency power amplifier that the present invention is packaged together heat radiation and ground connection is below the half of other encapsulation radio-frequency power amplifiers;
2) structure is simple, is easy to produce;
3) install simply, be easy to operation;
4) radio-frequency power amplifier is made to be pressed on heat dissipation base, and because the thickness of pad is through survey calculation, radio-frequency power amplifier can be protected well, radio-frequency power amplifier can not be damaged because pressure is excessive, make radio-frequency power amplifier obtain the life-span and greatly strengthen;
5), while ensure that good heat radiating, due to reasonable installation steps cleverly, be subject to distortional stress hardly after making radio-frequency power amplifier pin be welded to PCB, serviceability is more stable;
6) pad of ground pin is welded on the sidewall of PCB, this ground pin directly and the innovation welding method of PCB sidewall ground pad solder, strengthen the heat-sinking capability of radio-frequency power amplifier, and impedance ground is little, and avoid conventional contact ground connection because contact-making surface oxidation the imperfect earth phenomenon that causes, ensure that permanent good ground connection.
Accompanying drawing explanation
Fig. 1 is existing radio-frequency power amplifier structural representation.
Fig. 2 is radio-frequency power amplifier fixture one example structure schematic diagram of the present invention.
Fig. 3 be embodiment illustrated in fig. 2 in pcb board structural representation (overlooking).
Fig. 4 is vertical view embodiment illustrated in fig. 2.
Fig. 5 be embodiment illustrated in fig. 2 in fixed cell device (shape of reverse omega sheet) structural representation (overlooking).
Below in conjunction with drawings and the specific embodiments the present invention done and further illustrate in detail.
Embodiment
Shown in Fig. 1 is the structural representation of existing radio-frequency power amplifier 2, and it comprises radio-frequency power amplifier body and input, output pin pin two 1,22 and the ground pin 23,24 at middle part.
Fig. 2 shows the structure of an embodiment of radio-frequency power amplifier fixture of the present invention, also gives radio-frequency power amplifier and be placed on corresponding position signal on pcb board in figure.In this embodiment; radio-frequency power amplifier fixture forms primarily of heat dissipation base 6, pcb board 3 and fixed cell device 1, and fixed cell device 1 realizes being connected with pcb board 1 by least one pair of adjusting bolt group (often group regulates protection retention means 4 by a bolt 5 with a group).The input of radio-frequency power amplifier tube 2, output pin are welded on the input of pcb board 3, o pads respectively, what number in the figure 24 indicated is the ground pin of radio-frequency power amplifier tube 2, and a pair ground pin of radio-frequency power amplifier tube 2 is welded on the ground pad of pcb board 3 sidewall respectively.
See Fig. 2, in this embodiment, the upper surface of heat dissipation base 6 can be a flat face, or have can hold radio-frequency power amplifier body crouch into groove; The bottom of heat dissipation base 6 can adopt existing radiator structure form.
See Fig. 2 to Fig. 4, pcb board 3 in this embodiment is tightly overlying on the upper epidermis of heat dissipation base 6, this pcb board 3 has and can be positioned at mesopore 37 wherein for radio-frequency power amplifier, the shape of this mesopore is mated mutually with the packaging appearance structure of radio-frequency power amplifier tube, surrounding edge along this mesopore is furnished with an assembly welding dish, this assembly welding dish comprises a pair input, output pin pad 31,32 and a pair ground pad 33,34, described a pair ground pad 33,34 is arranged on the sidewall of pcb board, pcb board also offers a pair connection fixing hole 35,36.
Described fixed cell device is for radio-frequency power amplifier tube is fixed on heat dissipation base.See Fig. 1 and Fig. 5; in this embodiment; fixed cell device is a shape of reverse omega sheet 1; it is arc groove body 13 in the middle part of it; the end ear 12 of both sides has fixing hole 11; shown in Figure 1 during installation, regulate protection retention means 4 this shape of reverse omega sheet and pcb board to be realized being connected by a bolt 5 with one group, radio-frequency power amplifier 2 can be against on heat dissipation base 6 downwards by the middle part arc groove body 13 of this shape of reverse omega sheet.The middle part straight area of arc groove dignity of this shape of reverse omega sheet is not less than the upper surface of installed radio-frequency power amplifier encapsulation.This shape of reverse omega sheet should be made up of elastic metallic material; Described adjustment protection retention means presses down limit height for adjusting shape of reverse omega sheet, its preferred mode is that the annular elastomeric pad 4(that conjunction is piled up in employing one group mutually can be soft rubber material), this group pad pile close after gross thickness should meet and be: (limiting altitude that shape of reverse omega sheet presses down+radio-frequency power amplifier thickness-pcb board thickness) ± 5mm; Like this, according to the actual requirements and the thickness of selected monolithic annular elastomeric pad, the number of use one group of pad can be calculated in advance, with best protection radio-frequency power amplifier.
The concrete steps utilizing the fixture of above-described embodiment to realize radio-frequency power amplifier installation method are:
1) the heat dissipation base upper surface adopted is plane or has a groove, this groove can hold radio-frequency power amplifier body crouch into;
2) first pcb board is fixed on heat dissipation base, if adopt upper surface to open reeded heat dissipation base, then the mesopore of pcb board will be made to offer position corresponding with the groove on heat dissipation base; Pcb board is fixed on after on heat dissipation base, by radio-frequency power amplifier put correctly on the radio-frequency power amplifier welding position of pcb board, shape of reverse omega sheet recess is placed on radio-frequency power amplifier upward, the fixing hole (through hole) of two ends end ear is just to fixing hole (through hole) corresponding on pcb board, and between hole, stack protection pad, tighten through after shape of reverse omega sheet, protection pad, pcb board and heat dissipation base successively with screw;
3) position then radio-frequency power amplifier being placed in the mesopore internal power amplifier tube welding of pcb board is welded, if adopt upper surface to open reeded heat dissipation base, then directly radio-frequency power amplifier is lying into wherein and welds;
4) again shape of reverse omega sheet is placed on radio-frequency power amplifier, by the through hole on the end ear of shape of reverse omega sheet both sides just to connection through hole corresponding on pcb board, required protection pad quantity of putting between this holes of budget, this group protection pad is overlayed between holes, tightens through after shape of reverse omega sheet, one group of protection pad, pcb board and heat dissipation base successively with screw;
5) input of radio-frequency power amplifier, output pin are correctly welded on the input of pcb board, output pin pad;
6) interim dismounting shape of reverse omega sheet, the sidewall ground pad solder correct corresponding to PCB by the both sides ground pin of radio-frequency power amplifier, and again shape of reverse omega sheet is installed.
The technical scheme feature of the present embodiment is that cost is lower, and structure is simple, is easy to produce; Install simple, be easy to operation; Power amplifier tube is pressed on heat dissipation base, and because the thickness of overall pad is through survey calculation, power amplifier tube can be protected well, power amplifier tube can not be damaged because pressure is excessive.While ensure that good heat radiating, due to reasonable installation steps cleverly, after making power amplifier tube pin be welded to PCB, be subject to distortional stress hardly.And the most outstanding innovative point of this programme is the sidewall weld of ground pin: the pad of ground pin is welded on the sidewall of PCB.This ground pin directly and the innovation welding method of PCB sidewall ground pad solder, strengthen the heat-sinking capability of power amplifier tube, and impedance ground is little, and avoid conventional contact ground connection because contact-making surface oxidation the imperfect earth phenomenon that causes, ensure that permanent good ground connection.
Claims (5)
1. a novel high-power radio-frequency power amplifier fixture, comprising:
One heat dissipation base, its upper surface is a flat face or has groove;
One pcb board, tightly be overlying on the upper epidermis of heat dissipation base, this pcb board has and can be positioned at mesopore wherein for radio-frequency power amplifier, the shape of this mesopore is mated mutually with the packaging appearance structure of radio-frequency power amplifier, surrounding edge along this mesopore is furnished with an assembly welding dish, this assembly welding dish comprises a pair input, output pin pad and a pair ground pad, pcb board also offers a pair connection fixing hole, a pair described ground pad is used for the connection for radio-frequency power amplifier ground pin, described input, output pin pad is used for for radio-frequency power amplifier input, the connection of output pin,
Characterized by further comprising:
One shape of reverse omega sheet, it is made up of elastic metallic material, middle part is arc groove body, upper both sides are outward extended with end ear respectively, each end ear is offered fixing hole by regulating protection retention means to realize being connected with pcb board through the screw and of its fixing hole, described adjustment protects retention means to be press down for adjusting shape of reverse omega sheet the annular elastomeric pad that a group of limit height piles up conjunction mutually; High-power RF power amplifier is pressed on heat dissipation base downwards by the middle part arc groove body of this shape of reverse omega sheet;
By the connection realizing shape of reverse omega sheet, pcb board and heat dissipation base three through the screw of fixing hole or bolt on end ear; The pad of ground pin is welded in by installation steps on the sidewall of PCB mesopore, these installation steps are: first by shape of reverse omega sheet and after regulating protection retention means, pcb board and heat dissipation base mutually to tighten, the input of radio-frequency power amplifier, output pin are correctly welded on the input of pcb board, output pin pad; Then remove shape of reverse omega sheet, the sidewall ground pad solder correct corresponding to PCB by the both sides ground pin of radio-frequency power amplifier temporarily, and again shape of reverse omega sheet is installed.
2. radio-frequency power amplifier fixture according to claim 1, is characterized in that: the straight area in arc groove face of the middle part body of this shape of reverse omega sheet is not less than the upper surface of installed radio-frequency power amplifier encapsulation.
3. radio-frequency power amplifier fixture according to claim 1, is characterized in that: the described gross thickness of protection retention means that regulates is: (limiting altitude that shape of reverse omega sheet presses down+radio-frequency power amplifier thickness-pcb board thickness) ± 5mm.
4. utilize the fixture described in claim 1 to realize a method for radio-frequency power amplifier installation, it is characterized in that method step is as follows:
1) the heat dissipation base upper surface adopted is plane or has a groove, this groove can hold radio-frequency power amplifier body crouch into;
2) first pcb board is fixed on heat dissipation base, if adopt upper surface to open reeded heat dissipation base, then the mesopore of pcb board will be made to offer position corresponding with the groove on heat dissipation base;
3) position of radio-frequency power amplifier welding in the mesopore then radio-frequency power amplifier being placed in pcb board is welded, if adopt upper surface to open reeded heat dissipation base, then directly radio-frequency power amplifier is lying into wherein and welds;
4) again shape of reverse omega sheet is placed on radio-frequency power amplifier, by the through hole on the end ear of shape of reverse omega sheet both sides just to connection through hole corresponding on pcb board, adjustment protection retention means is placed between holes, tightens through after shape of reverse omega sheet, adjustment protection retention means, pcb board and heat dissipation base successively with screw;
5) input of radio-frequency power amplifier, output pin are correctly welded on the input of pcb board, output pin pad;
6) interim dismounting shape of reverse omega sheet, the sidewall ground pad solder correct corresponding to PCB by the both sides ground pin of radio-frequency power amplifier, and again shape of reverse omega sheet is installed.
5. the method realizing radio-frequency power amplifier and install according to claim 4; it is characterized in that: in step 4); described adjustment protection retention means adopts one group of annular elastomeric pad; first calculate required protection pad annular elastomeric pad quantity of putting between holes in advance, the annular elastomeric pad of number of matches is overlayed between holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210094679.6A CN102625625B (en) | 2012-04-01 | 2012-04-01 | Novel fixing device and assembling method for high-power radio frequency power amplifiers |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210094679.6A CN102625625B (en) | 2012-04-01 | 2012-04-01 | Novel fixing device and assembling method for high-power radio frequency power amplifiers |
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| Publication Number | Publication Date |
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| CN102625625A CN102625625A (en) | 2012-08-01 |
| CN102625625B true CN102625625B (en) | 2015-03-11 |
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| CN201210094679.6A Active CN102625625B (en) | 2012-04-01 | 2012-04-01 | Novel fixing device and assembling method for high-power radio frequency power amplifiers |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2014023030A1 (en) * | 2012-08-10 | 2014-02-13 | 海能达通信股份有限公司 | Electronic device |
| CN108566169A (en) * | 2018-06-13 | 2018-09-21 | 刁川川 | A kind of radio-frequency power amplifier that supporting multimode multi-frequency, assemble method, chip and communication terminal |
| CN114916130A (en) * | 2021-02-08 | 2022-08-16 | 广汽埃安新能源汽车有限公司 | Driving circuit board suitable for HPD packaging IGBT module |
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| JPH09232487A (en) * | 1996-02-21 | 1997-09-05 | Meidensha Corp | Fixing structure of circuit element |
| CN201182049Y (en) * | 2008-04-23 | 2009-01-14 | 杭州华三通信技术有限公司 | Single plate and electronic equipment with the same |
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| CN101808494A (en) * | 2010-03-26 | 2010-08-18 | 海能达通信股份有限公司 | Radio frequency high-power heat pipe radiator |
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| US5910025A (en) * | 1997-10-31 | 1999-06-08 | Ericsson, Inc. | Edge interface electrical connectors |
| JP2008258016A (en) * | 2007-04-05 | 2008-10-23 | Smk Corp | Solder connection structure of terminal for electronic component with printed wiring board |
| CN201298960Y (en) * | 2008-12-15 | 2009-08-26 | 浙江哈勃电子科技有限公司 | PCB board convenient for welding |
| JP5024314B2 (en) * | 2009-03-05 | 2012-09-12 | 株式会社富士通ゼネラル | Semiconductor device heat dissipation structure and electronic device including the same |
| CN201418208Y (en) * | 2009-03-17 | 2010-03-03 | 艾默生网络能源有限公司 | Printed circuit board adopting direct interconnection between daughter board and mother board |
| CN202067973U (en) * | 2011-01-14 | 2011-12-07 | 仕昌电子(深圳)有限公司 | Minisize HDMI connector |
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2012
- 2012-04-01 CN CN201210094679.6A patent/CN102625625B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232487A (en) * | 1996-02-21 | 1997-09-05 | Meidensha Corp | Fixing structure of circuit element |
| CN101803184A (en) * | 2007-09-21 | 2010-08-11 | 日本电气株式会社 | High output power amplifier, wireless transmitter, wireless transmitting and receiving device, and high output power amplifier mounting method |
| CN201182049Y (en) * | 2008-04-23 | 2009-01-14 | 杭州华三通信技术有限公司 | Single plate and electronic equipment with the same |
| CN101808494A (en) * | 2010-03-26 | 2010-08-18 | 海能达通信股份有限公司 | Radio frequency high-power heat pipe radiator |
| CN201700111U (en) * | 2010-04-02 | 2011-01-05 | 海能达通信股份有限公司 | Power amplifier fixing device and communication device |
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