CN102622122B - 触摸屏 - Google Patents
触摸屏 Download PDFInfo
- Publication number
- CN102622122B CN102622122B CN201110431993.4A CN201110431993A CN102622122B CN 102622122 B CN102622122 B CN 102622122B CN 201110431993 A CN201110431993 A CN 201110431993A CN 102622122 B CN102622122 B CN 102622122B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- electrode
- screen
- touch
- dielectric film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008878 coupling Effects 0.000 claims abstract description 16
- 238000010168 coupling process Methods 0.000 claims abstract description 16
- 238000005859 coupling reaction Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 5
- 238000000926 separation method Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 19
- 230000004075 alteration Effects 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
- G06F3/03547—Touch pads, in which fingers can move on a surface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0405—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
- H01L21/0425—Making electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0405—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
- H01L21/0425—Making electrodes
- H01L21/044—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Position Input By Displaying (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008111414A JP2009265748A (ja) | 2008-04-22 | 2008-04-22 | タッチパネル付き表示装置 |
JP2008-111414 | 2008-04-22 | ||
CNA2009101351447A CN101566750A (zh) | 2008-04-22 | 2009-04-22 | 带触摸屏的显示装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2009101351447A Division CN101566750A (zh) | 2008-04-22 | 2009-04-22 | 带触摸屏的显示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102622122A CN102622122A (zh) | 2012-08-01 |
CN102622122B true CN102622122B (zh) | 2015-11-18 |
Family
ID=40849226
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110431993.4A Active CN102622122B (zh) | 2008-04-22 | 2009-04-22 | 触摸屏 |
CNA2009101351447A Pending CN101566750A (zh) | 2008-04-22 | 2009-04-22 | 带触摸屏的显示装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2009101351447A Pending CN101566750A (zh) | 2008-04-22 | 2009-04-22 | 带触摸屏的显示装置 |
Country Status (6)
Country | Link |
---|---|
US (8) | US8436830B2 (zh) |
EP (2) | EP2112574A1 (zh) |
JP (1) | JP2009265748A (zh) |
KR (1) | KR101050900B1 (zh) |
CN (2) | CN102622122B (zh) |
TW (1) | TWI388896B (zh) |
Families Citing this family (97)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101382651B (zh) * | 2007-09-07 | 2011-12-14 | 群康科技(深圳)有限公司 | 触控式电润湿显示装置、触控式电路基板及其制造方法 |
JP2009265748A (ja) | 2008-04-22 | 2009-11-12 | Hitachi Displays Ltd | タッチパネル付き表示装置 |
JP5178379B2 (ja) * | 2008-07-31 | 2013-04-10 | 株式会社ジャパンディスプレイイースト | 表示装置 |
JP5423004B2 (ja) * | 2009-01-08 | 2014-02-19 | 東レ株式会社 | ネガ型感光性樹脂組成物およびそれを用いたタッチパネル用材料 |
CN101893977B (zh) * | 2009-05-19 | 2012-07-25 | 北京京东方光电科技有限公司 | 触摸屏、彩膜基板及其制造方法 |
JP5278759B2 (ja) * | 2009-05-28 | 2013-09-04 | 凸版印刷株式会社 | 静電容量型入力装置 |
CN102023733B (zh) * | 2009-09-11 | 2012-11-14 | 北京京东方光电科技有限公司 | 触摸屏、彩膜基板及其制造方法 |
KR101611906B1 (ko) * | 2009-10-27 | 2016-04-14 | 엘지디스플레이 주식회사 | 터치 패널을 갖는 입체 영상 액정 표시 장치 및 이의 제조 방법 |
KR20110052241A (ko) * | 2009-11-12 | 2011-05-18 | 엘지디스플레이 주식회사 | 터치 패널 일체형 입체 영상 표시 장치 및 이의 제조 방법 |
KR101322981B1 (ko) | 2009-12-01 | 2013-10-29 | 엘지디스플레이 주식회사 | 터치 소자를 구비한 표시장치 |
KR101649228B1 (ko) * | 2009-12-02 | 2016-08-19 | 엘지디스플레이 주식회사 | 터치패널 일체형 액정 표시 장치 |
TWI408441B (zh) * | 2009-12-09 | 2013-09-11 | Au Optronics Corp | 觸控顯示面板以及觸控基板 |
KR101351415B1 (ko) * | 2009-12-09 | 2014-01-16 | 엘지디스플레이 주식회사 | 터치 패널 및 터치 패널 일체형 액정 표시 장치 |
US8970509B2 (en) | 2009-12-09 | 2015-03-03 | Lg Display Co., Ltd. | Touch panel and liquid crystal display device including the same |
KR101320074B1 (ko) * | 2009-12-10 | 2013-10-18 | 엘지디스플레이 주식회사 | 정전용량 방식 터치 스크린 패널 |
US8493349B2 (en) * | 2009-12-10 | 2013-07-23 | Lg Display Co., Ltd. | Touch screen panel |
TWI417600B (zh) * | 2009-12-11 | 2013-12-01 | Century Display Shenzhen Co | 觸控面板的製作方法以及母板 |
CN102713799B (zh) * | 2009-12-28 | 2015-11-25 | 京瓷株式会社 | 输入装置、以及具备其的显示装置 |
KR101821429B1 (ko) * | 2009-12-29 | 2018-01-23 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 금속화된 광 방향 전환 특징부를 갖는 조명 장치 |
KR101093326B1 (ko) * | 2010-02-18 | 2011-12-14 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 및 그 제작방법 |
KR101049006B1 (ko) | 2010-02-22 | 2011-07-12 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 및 그 제조방법 |
CN102667694B (zh) * | 2010-02-24 | 2015-06-17 | 京瓷株式会社 | 输入装置、显示装置及便携终端 |
KR101073215B1 (ko) * | 2010-03-05 | 2011-10-12 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 일체형 평판표시장치 |
KR101082219B1 (ko) | 2010-03-16 | 2011-11-09 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 일체형 평판표시장치 |
KR101040846B1 (ko) | 2010-03-16 | 2011-06-14 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 및 그 제조방법 |
TWI412970B (zh) * | 2010-03-30 | 2013-10-21 | Chunghwa Picture Tubes Ltd | 觸控輸入裝置 |
KR101073147B1 (ko) * | 2010-04-05 | 2011-10-12 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 일체형 평판표시장치 및 그 제조방법 |
JP5454314B2 (ja) * | 2010-04-06 | 2014-03-26 | セイコーエプソン株式会社 | 表示装置、および電子機器 |
KR101693698B1 (ko) * | 2010-04-28 | 2017-01-09 | (주)멜파스 | 접촉 감지 패널 및 접촉 감지 장치 |
KR101048918B1 (ko) * | 2010-04-28 | 2011-07-12 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 및 이를 구비한 영상표시장치 |
CN102236482B (zh) * | 2010-05-04 | 2013-11-06 | 宸鸿光电科技股份有限公司 | 电容式触控结构及其制造方法以及触控设备 |
EP2593852B1 (en) * | 2010-07-14 | 2020-12-16 | LG Innotek Co., Ltd. | Touch panel and method for manufacturing the same |
CN102375643B (zh) * | 2010-08-20 | 2014-02-26 | 上海立体数码科技发展有限公司 | 具有视差栅栏功能的电阻式触摸屏、显示装置及制备方法 |
JP2012068287A (ja) * | 2010-09-21 | 2012-04-05 | Toppan Printing Co Ltd | カラーフィルタ基板及びその製造方法 |
KR101323004B1 (ko) * | 2010-10-01 | 2013-10-29 | 엘지디스플레이 주식회사 | 정전용량 방식 터치 스크린 패널 |
JP5659684B2 (ja) * | 2010-10-18 | 2015-01-28 | 凸版印刷株式会社 | タッチパネル基板及びその製造方法 |
KR101339669B1 (ko) * | 2010-10-26 | 2013-12-11 | 삼성디스플레이 주식회사 | 터치 스크린 패널 |
KR101779594B1 (ko) * | 2010-10-26 | 2017-09-19 | 엘지디스플레이 주식회사 | 터치 스크린 패널과 이의 제조방법 |
EP2638453A4 (en) * | 2010-11-09 | 2015-11-25 | Tpk Touch Solutions Inc | TOUCH SCREEN DEVICE |
KR101397250B1 (ko) * | 2010-12-30 | 2014-05-20 | 하이디스 테크놀로지 주식회사 | 정전 용량 터치 패널 및 그 제조 방법 |
CN102622114B (zh) * | 2011-01-28 | 2015-03-25 | 华映科技(集团)股份有限公司 | 一种触控面板的感应装置 |
CN102654797A (zh) * | 2011-03-02 | 2012-09-05 | 东莞万士达液晶显示器有限公司 | 触控面板 |
KR101908492B1 (ko) | 2011-04-12 | 2018-10-17 | 엘지디스플레이 주식회사 | 터치 패널 일체형 표시 장치 |
CN102736763A (zh) * | 2011-04-14 | 2012-10-17 | 联咏科技股份有限公司 | 触控传感装置 |
US20120274602A1 (en) * | 2011-04-29 | 2012-11-01 | Qualcomm Mems Technologies, Inc. | Wiring and periphery for integrated capacitive touch devices |
KR101191949B1 (ko) * | 2011-06-20 | 2012-10-17 | 박준영 | 정전용량 터치 패널의 제조 방법 및 이에 의해 제조되는 터치 패널 |
CN102929454A (zh) * | 2011-08-12 | 2013-02-13 | 宸鸿科技(厦门)有限公司 | 电容式触控面板及降低其金属导体可见度的方法 |
TW201317852A (zh) * | 2011-10-27 | 2013-05-01 | Hannstar Display Corp | 觸控感測裝置及其製造方法 |
JP5939766B2 (ja) * | 2011-11-04 | 2016-06-22 | 株式会社ジャパンディスプレイ | タッチパネル |
KR101357585B1 (ko) * | 2011-12-08 | 2014-02-11 | 엘지이노텍 주식회사 | 터치패널의 전극 패턴 및 그 제조 방법 |
KR102134490B1 (ko) | 2012-01-12 | 2020-07-16 | 시냅틱스 인코포레이티드 | 단일층 용량성 이미징 센서들 |
JP2013196531A (ja) * | 2012-03-22 | 2013-09-30 | Japan Display Inc | タッチパネルおよびタッチパネル付き表示装置 |
JP5509473B2 (ja) * | 2012-04-27 | 2014-06-04 | 株式会社ジャパンディスプレイ | タッチパネル |
KR102017155B1 (ko) * | 2012-11-01 | 2019-09-03 | 삼성디스플레이 주식회사 | 터치스크린 패널 및 그의 제조방법 |
KR102052165B1 (ko) * | 2012-11-30 | 2019-12-05 | 삼성디스플레이 주식회사 | 터치스크린 패널의 제조방법 |
KR101426303B1 (ko) * | 2013-02-20 | 2014-08-05 | 주식회사 하이딥 | 터치 센서 패널 |
KR101469653B1 (ko) * | 2013-02-28 | 2014-12-05 | 이성규 | 터치 스크린 패널 및 그 제조방법 |
CN103345317B (zh) * | 2013-03-25 | 2014-10-29 | 深圳欧菲光科技股份有限公司 | 触摸屏 |
JP2014219963A (ja) * | 2013-04-12 | 2014-11-20 | 信越ポリマー株式会社 | センサーシート作製用シート及びその製造方法、タッチパッド用センサーシート及びその製造方法 |
TWI484382B (zh) * | 2013-04-17 | 2015-05-11 | E Ink Holdings Inc | 觸控面板 |
KR101478043B1 (ko) * | 2013-04-24 | 2015-01-02 | 일진디스플레이(주) | 터치 패널 및 그 제조 방법 |
JP2014219816A (ja) * | 2013-05-08 | 2014-11-20 | 株式会社ジャパンディスプレイ | タッチパネル付き表示装置 |
US9552089B2 (en) | 2013-08-07 | 2017-01-24 | Synaptics Incorporated | Capacitive sensing using a matrix electrode pattern |
US20150091842A1 (en) | 2013-09-30 | 2015-04-02 | Synaptics Incorporated | Matrix sensor for image touch sensing |
US10042489B2 (en) | 2013-09-30 | 2018-08-07 | Synaptics Incorporated | Matrix sensor for image touch sensing |
US9298325B2 (en) | 2013-09-30 | 2016-03-29 | Synaptics Incorporated | Processing system for a capacitive sensing device |
US9459367B2 (en) | 2013-10-02 | 2016-10-04 | Synaptics Incorporated | Capacitive sensor driving technique that enables hybrid sensing or equalization |
US9274662B2 (en) | 2013-10-18 | 2016-03-01 | Synaptics Incorporated | Sensor matrix pad for performing multiple capacitive sensing techniques |
US9081457B2 (en) | 2013-10-30 | 2015-07-14 | Synaptics Incorporated | Single-layer muti-touch capacitive imaging sensor |
US10804897B2 (en) * | 2014-01-10 | 2020-10-13 | Touchplus Information Corp. | Touch-sensitive keypad control device |
TWI616805B (zh) * | 2014-01-10 | 2018-03-01 | 新益先創科技股份有限公司 | 遠端控制裝置 |
US20150206493A1 (en) * | 2014-01-21 | 2015-07-23 | Apple Inc. | Devices and methods for reducing or eliminating mura artifact |
JP2015153297A (ja) | 2014-02-18 | 2015-08-24 | Nltテクノロジー株式会社 | タッチセンサー基板、画像表示装置、およびタッチセンサー基板の製造方法 |
US9798429B2 (en) | 2014-02-28 | 2017-10-24 | Synaptics Incorporated | Guard electrodes in a sensing stack |
US10133421B2 (en) | 2014-04-02 | 2018-11-20 | Synaptics Incorporated | Display stackups for matrix sensor |
KR101450248B1 (ko) * | 2014-04-16 | 2014-10-15 | 에스맥 (주) | 전기적 특성이 향상된 터치 스크린 패널 |
US9927832B2 (en) | 2014-04-25 | 2018-03-27 | Synaptics Incorporated | Input device having a reduced border region |
US9690397B2 (en) | 2014-05-20 | 2017-06-27 | Synaptics Incorporated | System and method for detecting an active pen with a matrix sensor |
TWI502445B (zh) * | 2014-06-11 | 2015-10-01 | Innolux Corp | 觸控顯示裝置及觸控基板 |
CN104317470B (zh) * | 2014-11-14 | 2017-06-13 | 深圳市华星光电技术有限公司 | 互电容式ogs触摸面板及其制造方法 |
CN104461142B (zh) * | 2014-12-10 | 2017-06-30 | 京东方科技集团股份有限公司 | 触控显示基板及其制备方法、触控显示装置 |
US10175827B2 (en) | 2014-12-23 | 2019-01-08 | Synaptics Incorporated | Detecting an active pen using a capacitive sensing device |
US10990148B2 (en) | 2015-01-05 | 2021-04-27 | Synaptics Incorporated | Central receiver for performing capacitive sensing |
CN104679343B (zh) * | 2015-03-26 | 2017-07-28 | 京东方科技集团股份有限公司 | 一种触控显示装置、触摸面板、导电搭桥方法及搭桥结构 |
US9939972B2 (en) | 2015-04-06 | 2018-04-10 | Synaptics Incorporated | Matrix sensor with via routing |
US9720541B2 (en) | 2015-06-30 | 2017-08-01 | Synaptics Incorporated | Arrangement of sensor pads and display driver pads for input device |
US10095948B2 (en) | 2015-06-30 | 2018-10-09 | Synaptics Incorporated | Modulation scheme for fingerprint sensing |
US9715304B2 (en) | 2015-06-30 | 2017-07-25 | Synaptics Incorporated | Regular via pattern for sensor-based input device |
CN205028263U (zh) | 2015-09-07 | 2016-02-10 | 辛纳普蒂克斯公司 | 一种电容传感器 |
KR102510915B1 (ko) | 2015-09-16 | 2023-03-17 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
US10037112B2 (en) | 2015-09-30 | 2018-07-31 | Synaptics Incorporated | Sensing an active device'S transmission using timing interleaved with display updates |
CN105448933B (zh) * | 2015-11-24 | 2018-10-30 | 深圳市华星光电技术有限公司 | 用于液晶面板中的阵列基板及其制作方法 |
US10067587B2 (en) | 2015-12-29 | 2018-09-04 | Synaptics Incorporated | Routing conductors in an integrated display device and sensing device |
CN106933400B (zh) | 2015-12-31 | 2021-10-29 | 辛纳普蒂克斯公司 | 单层传感器图案和感测方法 |
KR102374561B1 (ko) * | 2017-06-19 | 2022-03-15 | 삼성디스플레이 주식회사 | 표시 장치 및 입력감지부재 |
KR20210005437A (ko) * | 2019-07-05 | 2021-01-14 | 삼성디스플레이 주식회사 | 센서 모듈 및 이를 포함하는 표시 장치 |
CN110658951B (zh) * | 2019-09-25 | 2023-09-26 | 京东方科技集团股份有限公司 | 一种触控基板及其制作方法、触控显示装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58166437A (ja) * | 1982-03-26 | 1983-10-01 | Fujitsu Ltd | 指タツチ式座標検出パネルの製造方法 |
CN101131492A (zh) * | 2007-10-10 | 2008-02-27 | 友达光电股份有限公司 | 触控面板及其制作方法 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1112405A (en) * | 1963-11-01 | 1968-05-08 | Texas Instruments Ltd | Formation of small dimensioned apertures using photographic masking and etching techniques |
JPS54103694A (en) | 1978-02-01 | 1979-08-15 | Seiko Epson Corp | Production of transparent conductive film patterns of liquid crystal panel |
US4639720A (en) * | 1981-01-12 | 1987-01-27 | Harris Corporation | Electronic sketch pad |
JPS609021A (ja) * | 1983-06-27 | 1985-01-18 | シャープ株式会社 | マトリツクス型タツチキ−入力装置 |
US5403435A (en) * | 1992-01-23 | 1995-04-04 | Micron Technology, Inc. | Process for selectively etching integrated circuit devices having deep trenches or troughs or elevated features with re-entrant profiles |
EP0574213B1 (en) * | 1992-06-08 | 1999-03-24 | Synaptics, Inc. | Object position detector |
US5952998A (en) * | 1997-01-15 | 1999-09-14 | Compaq Computer Corporation | Transparent touchpad with flat panel display for personal computers |
US6177968B1 (en) * | 1997-09-01 | 2001-01-23 | Canon Kabushiki Kaisha | Optical modulation device with pixels each having series connected electrode structure |
JP3624703B2 (ja) * | 1998-07-28 | 2005-03-02 | セイコーエプソン株式会社 | 電気光学装置及びそれを用いた投射型表示装置 |
US6642984B1 (en) * | 1998-12-08 | 2003-11-04 | Fujitsu Display Technologies Corporation | Liquid crystal display apparatus having wide transparent electrode and stripe electrodes |
US6174801B1 (en) * | 1999-03-05 | 2001-01-16 | Taiwan Semiconductor Manufacturing Company | E-beam direct writing to pattern step profiles of dielectric layers applied to fill poly via with poly line, contact with metal line, and metal via with metal line |
US7223643B2 (en) * | 2000-08-11 | 2007-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
JP2002313121A (ja) * | 2001-04-16 | 2002-10-25 | Nitto Denko Corp | タッチパネル付照明装置及び反射型液晶表示装置 |
US6970160B2 (en) * | 2002-12-19 | 2005-11-29 | 3M Innovative Properties Company | Lattice touch-sensing system |
JP4118708B2 (ja) | 2003-02-28 | 2008-07-16 | アルプス電気株式会社 | フレキシブルセンサおよびそれを用いた入力装置並びにフレキシブルセンサの製造方法 |
JP3972846B2 (ja) * | 2003-03-25 | 2007-09-05 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
WO2004112448A2 (en) * | 2003-06-13 | 2004-12-23 | Semtech Corporation | Sensor for capacitive touch pad pointing device |
TWI269213B (en) | 2004-01-07 | 2006-12-21 | Elan Microelectronics Corp | A capacitor type touch pad using thin film and the process thereof |
TWI247184B (en) * | 2004-04-16 | 2006-01-11 | Toppoly Optoelectronics Corp | Method for manufacturing LCD device with integrated touch panel |
US20070229470A1 (en) | 2006-03-31 | 2007-10-04 | Warren Snyder | Capacitive touch sense device having polygonal shaped sensor elements |
TWI322374B (en) | 2006-04-14 | 2010-03-21 | Ritdisplay Corp | Light transmission touch panel and manufacturing method thereof |
TWI313431B (en) | 2006-04-14 | 2009-08-11 | Ritdisplay Corporatio | Transparent touch panel |
US8059015B2 (en) * | 2006-05-25 | 2011-11-15 | Cypress Semiconductor Corporation | Capacitance sensing matrix for keyboard architecture |
JP2008065748A (ja) * | 2006-09-11 | 2008-03-21 | Sharp Corp | タッチパネル及びタッチパネルを用いた表示装置 |
US7920129B2 (en) * | 2007-01-03 | 2011-04-05 | Apple Inc. | Double-sided touch-sensitive panel with shield and drive combined layer |
KR101481682B1 (ko) * | 2007-04-09 | 2015-01-12 | 삼성디스플레이 주식회사 | 터치스크린 표시장치 |
TW200842681A (en) * | 2007-04-27 | 2008-11-01 | Tpk Touch Solutions Inc | Touch pattern structure of a capacitive touch panel |
US20080309633A1 (en) | 2007-06-13 | 2008-12-18 | Apple Inc. | Touch-sensitive display |
JP4506785B2 (ja) * | 2007-06-14 | 2010-07-21 | エプソンイメージングデバイス株式会社 | 静電容量型入力装置 |
JP4945345B2 (ja) | 2007-07-03 | 2012-06-06 | 株式会社 日立ディスプレイズ | タッチパネル付き表示装置 |
JP4582169B2 (ja) * | 2008-03-26 | 2010-11-17 | ソニー株式会社 | 静電容量型入力装置、入力機能付き表示装置および電子機器 |
JP2009265748A (ja) * | 2008-04-22 | 2009-11-12 | Hitachi Displays Ltd | タッチパネル付き表示装置 |
JP5178379B2 (ja) * | 2008-07-31 | 2013-04-10 | 株式会社ジャパンディスプレイイースト | 表示装置 |
US7982723B2 (en) | 2008-09-18 | 2011-07-19 | Stmicroelectronics Asia Pacific Pte. Ltd. | Multiple touch location in a three dimensional touch screen sensor |
JP5113773B2 (ja) * | 2009-01-20 | 2013-01-09 | 株式会社ジャパンディスプレイイースト | 表示装置 |
US7995041B2 (en) * | 2009-02-02 | 2011-08-09 | Apple Inc. | Integrated touch screen |
-
2008
- 2008-04-22 JP JP2008111414A patent/JP2009265748A/ja active Pending
-
2009
- 2009-04-21 TW TW98113171A patent/TWI388896B/zh active
- 2009-04-21 KR KR20090034581A patent/KR101050900B1/ko active IP Right Grant
- 2009-04-22 CN CN201110431993.4A patent/CN102622122B/zh active Active
- 2009-04-22 EP EP20090005638 patent/EP2112574A1/en not_active Ceased
- 2009-04-22 EP EP18150053.9A patent/EP3333686A1/en not_active Ceased
- 2009-04-22 CN CNA2009101351447A patent/CN101566750A/zh active Pending
- 2009-04-22 US US12/427,878 patent/US8436830B2/en active Active
-
2013
- 2013-03-13 US US13/798,372 patent/US8643627B2/en active Active
-
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- 2014-01-28 US US14/166,054 patent/US8941616B2/en active Active
-
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- 2015-01-07 US US14/591,440 patent/US9292147B2/en active Active
-
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- 2016-01-28 US US15/008,933 patent/US9952710B2/en active Active
-
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- 2018-03-12 US US15/917,916 patent/US10168828B2/en active Active
- 2018-11-26 US US16/199,428 patent/US10719166B2/en active Active
-
2020
- 2020-06-18 US US16/904,950 patent/US20200319745A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58166437A (ja) * | 1982-03-26 | 1983-10-01 | Fujitsu Ltd | 指タツチ式座標検出パネルの製造方法 |
CN101131492A (zh) * | 2007-10-10 | 2008-02-27 | 友达光电股份有限公司 | 触控面板及其制作方法 |
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CN101566750A (zh) | 2009-10-28 |
US20190095038A1 (en) | 2019-03-28 |
EP2112574A1 (en) | 2009-10-28 |
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US20160162109A1 (en) | 2016-06-09 |
US20130194233A1 (en) | 2013-08-01 |
KR20090111783A (ko) | 2009-10-27 |
EP3333686A1 (en) | 2018-06-13 |
TWI388896B (zh) | 2013-03-11 |
US8643627B2 (en) | 2014-02-04 |
US20150122771A1 (en) | 2015-05-07 |
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