CN102612276A - Manufacturing process for pores of multilayer HDI (high density interconnector) circuit board - Google Patents
Manufacturing process for pores of multilayer HDI (high density interconnector) circuit board Download PDFInfo
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- CN102612276A CN102612276A CN2012100645021A CN201210064502A CN102612276A CN 102612276 A CN102612276 A CN 102612276A CN 2012100645021 A CN2012100645021 A CN 2012100645021A CN 201210064502 A CN201210064502 A CN 201210064502A CN 102612276 A CN102612276 A CN 102612276A
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- sandblast
- pores
- wiring board
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- circuit board
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a manufacturing process for pores of a multilayer HDI (high density interconnector) circuit board. The process includes steps of firstly, manufacturing circuits on the surface of a core board; secondly, coating insulation resin; thirdly, pressing sandblast resistance dry films; fourthly, reserving sandblast windows; fifthly, creating pores through the sandblast; sixthly, removing the sandblast resistance dry films; and seventhly, plating the pores with copper to realize electrical connection among layers of the circuit board. The process breaks through the conventional carbon dioxide laser pore-forming method, by using an existing PCB (printed circuit board) processing device, namely a sandblast machine to process blind pores and electroplating the pores, the electrical connection among layers of the circuit board is realized and quality of pores is improved. By the manufacturing process, mutual connection between pores and duplicate pores and arrangement of extra welding spots on surfaces of through holes are realized, and accordingly, the wiring density of circuits on both inner layer and outer layer is further enhanced, and benefit is brought to miniaturization, high density and high reliability of the PCB.
Description
Technical field
The present invention relates to the printed-board technology field, be specifically related to have the micropore manufacture craft of the HDI printed circuit board (PCB) of multilayer.
Background technology
Develop rapidly along with electronic technology; Electronic product is tending towards microminiaturization, lighting, highly integrated gradually; The encapsulation of semiconductor device also is tending towards many pins thin spaceization, and the pcb board that this inevitable requirement is carried semiconductor device is accordingly also wanted miniaturization and and densification.Can the PCB substrate densification depend on micropore and the circuit that interlayer connects, and combine the performance of electronic product and decide, so the micropore technology of PCB industry becomes one of key technology of PCB industry.Micropore comprises through hole, buried via hole and the blind hole etc. on the printed substrate.In the industry, micropore manufacture craft commonly used generally is to adopt the hole copper facing of CO2 laser drill, realizes the interlayer electric interconnection.This technology is simple, but the micro hole of laser punching method manufacturing is drum shape, all is unfavorable for holeization, the carrying out of electroplating from aspects such as micropore clean and depositions, and holeization, electroplating process are prone to cause copper facing thin partially, and is high to terminal client continuity test mortality.
Summary of the invention
To the problems referred to above, the present invention provides a kind of post-production that is beneficial to the hole, be easy to the micropore manufacture craft that realizes that folded hole is interconnected, can effectively improve wiring board micropore quality.
The technical scheme that the present invention takes is: a kind of micropore manufacture craft of multi-layer H DI wiring board may further comprise the steps:
(1) makes circuit on the central layer surface;
(2) making even coated media layer on the central layer of circuit;
(3) press anti-sandblast dry film;
The mode of (4) adopt exposure, developing is opened the sandblast window in the circuit board;
(5) adopt sand-blasting machine that wiring board is carried out the sandblast pit;
(6) the anti-sandblast dry film on the removal wiring board;
(7) wiring board is carried out hole copper facing, realize the interlayer electric interconnection.
Adopt the existing PCB surface-treated abrasive blast equipment that is used for to make micropore in the step according to the invention (5), the utilization jet blasting forms micropore, obtains being the micropore of cone shape, is beneficial to micropore clean and deposition.
Said step (6), (7) adopt existing technology to carry out membrane removal, copper facing realization interlayer electric interconnection.
Beneficial effect of the present invention is: said technology is broken the micropore production method of the CO2 laser punching of present routine; Carry out the hole electric plating method again after adopting existing PCB surface processing equipment sand-blasting machine processing blind hole; The micro hole that is drum shape that can effectively avoid adopting the CO2 laser punching to produce is difficult for the problem of cleaning and hole plating; Realize pcb board interlayer electric interconnection, improve the micropore fabricating quality.Further, adopt technology drilling according to the invention can realize that the folded hole of micropore interconnects and through-hole surfaces is established pad again, can further improve the wiring density of ectonexine circuit, be beneficial to miniaturization, densification and the high reliability of pcb board.
Embodiment
For the ease of those skilled in the art's understanding, the present invention is done further to describe in detail below in conjunction with specific embodiment:
Micropore manufacture craft of the present invention is specific as follows:
1, the central layer surface lines is made; Adopting conventional method to produce PCB central layer surface lines in this step gets final product;
2, on step 1 basis, adopting rumble to be coated in the even coating in PCB central layer surface one deck again is the dielectric layer of main material with the resin, and the THICKNESS CONTROL of dielectric layer is at 40-80 μ m, and dielectric layer plays the effect of insulating between each layer line road flaggy.Need to adopt 100 ℃ bake out temperature baking 15 minutes after dielectric layer has applied, utilize 175 ℃ hot setting one hour after the oven dry again.Coated dielectric layer resin need satisfy wiring board to the requirement on resin chemistry, physics and the performance such as electric, and special resin should have high
TG and low dielectric constant.
3, the anti-sandblast dry film of the said pressure of step 3; This dry film mainly is made up of polyester film, polyethylene film, photoresist film, and this dry film adopts the existing sand-blasting machine that utilizes to carry out that material therefor and press mold mode get final product in the surface-treated technology;
4, the sandblast window is opened in said step 4 exposure/development, is to adopt existing technology to carry out image transfer, leaves the position and the size that need to make blind hole in the circuit board, keeps other position dry film, but obtains the sandblast window;
5, adopt the abrasive blast equipment high-speed jet in the step 5, impact the pcb board face.Sand-blasting machine is a kind of surface processing equipment, and it adopts compressed air is power, will spray the material high velocity jet to the surface of the work that needs processing to form the high velocity jet bundle, and the mechanical performance of workpiece outer surface is changed with the various requirement of the application of satisfying workpiece.Usually be applied to the surface treatment of wiring board at the circuit board industry.The micropore that is applied to wiring board of novelty of the present invention is made.During sandblast, the quicksand that the sand of ejection is provided with anti-sandblast dry film place ejection for the plate face can rebound and return, and then can etch away dielectric layer until the copper to the bottom for the windowing place; Obtain required blind hole; These holes are cone shape, and the aperture may diminish to 50 μ m, and quality is fine; Be easy to clean and deposition are carried out in the hole, also just help holeization and plating that wiring board is made the later stage.In this step, during said sand-blasting machine sandblast pit, the transfer rate of wiring board is controlled at 1.2 ± 0.2m/min; Blasting pressure is controlled at 2.5kg/cm
2The concentration of institute's sandblast (being sand water mixed proportion) is 20% ± 5.The micropore that obtains like this is after the plating of hole, and quality is very good, can effectively improve the thin partially problem that influences conducting of micropore copper facing that traditional handicraft is processed.
6, through behind the sandblast pit, by the method for routine this hole is carried out the holeization, electroplated, make micropore metalization, a laminate of wiring board has just been processed like this, repeats other level again and makes, and last pressing promptly becomes the multilayer circuit board finished product.In addition, after step 6 obtained small blind hole, needs employing concentration was that the NaOH solution of 8-12% is removed the PCB surface dry film.
The foregoing description is merely preferred implementation of the present invention, and in addition, the present invention can also have other implementations.That is to say that under the prerequisite that does not break away from the present invention's design, any conspicuous replacement all should fall into protection scope of the present invention.
Claims (5)
1. the micropore manufacture craft of a multi-layer H DI wiring board may further comprise the steps:
(1) makes circuit on the central layer surface;
(2) making even coated media layer on the central layer of circuit;
(3) press anti-sandblast dry film;
The mode of (4) adopt exposure, developing is opened the sandblast window in the circuit board;
(5) adopt sand-blasting machine that wiring board is carried out the sandblast pit;
(6) the anti-sandblast dry film on the removal wiring board;
(7) wiring board is carried out hole copper facing, realize the interlayer electric interconnection.
2. the micropore manufacture craft of multi-layer H DI wiring board according to claim 1 is characterized in that: dielectric layer described in the step (2) is the resin bed of 40-80 μ m thickness.
3. the micropore manufacture craft of multi-layer H DI wiring board according to claim 1 is characterized in that: after having applied dielectric layer in the step (2), to its oven dry and curing.
4. the micropore manufacture craft of multi-layer H DI wiring board according to claim 1 is characterized in that: the dry film of anti-sandblast dry film described in the step (3) for being made up of polyester film, polyethylene film, photoresist film.
5. the micropore manufacture craft of multi-layer H DI wiring board according to claim 1 is characterized in that: the parameter of sand-blasting machine sandblast pit is controlled to be described in the step (5): wiring board transfer rate, 1.2 ± 0.2m/min; Blasting pressure, 2.5kg/cm
2Sandblast concentration, 20% ± 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100645021A CN102612276A (en) | 2012-03-13 | 2012-03-13 | Manufacturing process for pores of multilayer HDI (high density interconnector) circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100645021A CN102612276A (en) | 2012-03-13 | 2012-03-13 | Manufacturing process for pores of multilayer HDI (high density interconnector) circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102612276A true CN102612276A (en) | 2012-07-25 |
Family
ID=46529327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100645021A Pending CN102612276A (en) | 2012-03-13 | 2012-03-13 | Manufacturing process for pores of multilayer HDI (high density interconnector) circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102612276A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275269A (en) * | 2018-11-16 | 2019-01-25 | 深圳市和美精艺科技有限公司 | A kind of the micropore production method and its structure of PCB substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1059066A (en) * | 1990-06-20 | 1992-02-26 | 纳幕尔杜邦公司 | Remove the method for resist from printed circuit board (PCB) |
| EP0793406A1 (en) * | 1996-02-29 | 1997-09-03 | Tokyo Ohka Kogyo Co., Ltd. | Process for producing multilayer wiring boards |
| JP2000269645A (en) * | 1999-03-15 | 2000-09-29 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
-
2012
- 2012-03-13 CN CN2012100645021A patent/CN102612276A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1059066A (en) * | 1990-06-20 | 1992-02-26 | 纳幕尔杜邦公司 | Remove the method for resist from printed circuit board (PCB) |
| EP0793406A1 (en) * | 1996-02-29 | 1997-09-03 | Tokyo Ohka Kogyo Co., Ltd. | Process for producing multilayer wiring boards |
| JP2000269645A (en) * | 1999-03-15 | 2000-09-29 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275269A (en) * | 2018-11-16 | 2019-01-25 | 深圳市和美精艺科技有限公司 | A kind of the micropore production method and its structure of PCB substrate |
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| C12 | Rejection of a patent application after its publication | ||
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Application publication date: 20120725 |