CN102601711B - Board grinding device - Google Patents
Board grinding device Download PDFInfo
- Publication number
- CN102601711B CN102601711B CN201210075020.6A CN201210075020A CN102601711B CN 102601711 B CN102601711 B CN 102601711B CN 201210075020 A CN201210075020 A CN 201210075020A CN 102601711 B CN102601711 B CN 102601711B
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- CN
- China
- Prior art keywords
- polishing head
- plate body
- lapping
- permanent magnet
- lapping tape
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A board grinding device comprises a lifting platform, a grinding module and a pressurizing module. The grinding module is opposite to a bearing portion of the lifting platform and comprises a grinding belt and a driving component which is connected with the grinding belt to drive the grinding belt to rotate. The pressurizing module comprises a pressurizing head and a pressure adjusting component, the pressurizing head is suitable for moving to contact with the back of partial grinding belt between the lifting platform and the pressurizing head, the pressure adjusting component is connected with the pressurizing head and suitable for moving the pressurizing head, and the pressure adjusting component comprises a cavity, an electromagnetic coil, a permanent magnet and a connector. The permanent magnet is movably arranged between the electromagnetic coil and the top side of the cavity, the electromagnetic coil is fixed to the cavity and positioned between the pressurizing head and the permanent magnet, and the connector is connected between the permanent magnet and the pressurizing head. Grinding thickness can be precisely controlled by means of the board grinding device. The invention further provides another board grinding device, which can reduce maintenance cost.
Description
Technical field
The invention relates to a kind of lapping device, and relate to especially a kind of plate body lapping device.
Background technology
Along with the progress of plane Display Technique, various two-d display panels have been widely used in electronic product common in daily life, as TV, computer, mobile phone, Satellite Navigation Set etc.
Making in the process of two-d display panel, need to the surface of two-d display panel be ground and be cleaned, and existing lapping device as shown in Figure 1.Existing lapping device 100 comprises that actuator 110 moves left and right to order about mobile platform 120 along continuous straight runs D1, and mobile platform 120 is provided with abrasive cloth 130.In addition, lapping device 100 more comprises cylinder 140 and grinding head 150, and grinding head 150 is in order to adsorb two-d display panel 50, and cylinder 140 connects grinding head 150, with order about grinding head 150 vertically D2 move up and down.When to grind step time, cylinder 140 orders about grinding head 150 and moves down, so that two-d display panel 50 contacts abrasive cloth 130, moves left and right, so that the surface of two-d display panel 50 is ground and actuator 110 orders about mobile platform 120.
In prior art, in the time grinding cylinder 140 on boost unstablely, and easily produce the situation of gas leakage, cause grinding clean deleterious.In addition, grinding thickness is difficult for precisely controlling, and easily occurs the situation of surperficial scratch or damage two-d display panel 50.
Summary of the invention
In view of this, the invention provides a kind of plate body lapping device, precisely to control grinding thickness.
The present invention separately provides a kind of plate body lapping device, to reduce maintenance cost.
For reach above-mentioned advantage at least one of them, the present invention proposes a kind of plate body lapping device, comprises hoistable platform, grinding module and compression module.Hoistable platform has supporting part, and grinding module is relative with supporting part, and grinding module comprises lapping tape and driven unit.Lapping tape has relative abradant surface and the back side, and driven unit connects lapping tape, rotates to order about lapping tape.Compression module comprises polishing head and pressure adjustment assembly.Polishing head is suitable for the mobile and contact back side to the part lapping tape between hoistable platform and polishing head, and pressure is adjusted assembly and connected polishing head, and is suitable for mobile polishing head and puts on to adjust polishing head the pressure of lapping tape.Pressure is adjusted assembly and is comprised cavity, solenoid, permanent magnet and connector, and cavity has the top side away from polishing head, and permanent magnet is arranged between solenoid and top side movably, and forms blanket gas secret room between permanent magnet and top side.Solenoid is fixed on cavity, and between polishing head and permanent magnet, and connector is connected in permanent magnet and polishing head.
In one embodiment of this invention, above-mentioned plate body lapping device more comprises the pressure detection module that is disposed at supporting part, and pressure adjustment assembly more comprises the control module that is electrically connected to pressure detection module and solenoid.
In one embodiment of this invention, above-mentioned abradant surface is matsurface.
In one embodiment of this invention, above-mentioned compression module more comprises multiple balls, be arranged in polishing head, and polishing head comprises that contact-making surface is for contacting lapping tape, contact-making surface is provided with multiple holes, and it is outer with contact lapping tape that ball stretches out contact-making surface via hole respectively.
In one embodiment of this invention, above-mentioned polishing head comprises that contact-making surface is for contacting lapping tape, and contact-making surface is provided with multiple fluid holes, and lapping tape is provided with multiple perforations, and perforation extends to the back side from abradant surface.
In one embodiment of this invention, above-mentioned driven unit comprises roller set.
In one embodiment of this invention, above-mentioned supporting part comprises the first loading end and the second loading end that is positioned at the first loading end edge, and the distance between the first loading end and polishing head is different from the distance between the second loading end and polishing head.
In one embodiment of this invention, above-mentioned hoistable platform comprises platform body and driving element.Platform body has supporting part, and driving element connecting platform body, to order about platform body towards approaching or moving away from the direction of grinding module.
For reach above-mentioned advantage at least one of them, the present invention separately proposes a kind of plate body lapping device, it comprises hoistable platform, grinding module and compression module.Hoistable platform has supporting part, and grinding module is relative with supporting part.Grinding module comprises lapping tape and driven unit.Lapping tape has relative abradant surface and the back side.Driven unit connects lapping tape, rotates to order about lapping tape.Compression module comprises polishing head, multiple ball and pressure adjustment assembly.Polishing head is suitable for mobile and contacts to the back side of the part lapping tape between hoistable platform and polishing head.Ball is arranged in polishing head, and polishing head comprises that contact-making surface is for contacting lapping tape, and contact-making surface is provided with multiple holes, and it is outer with contact lapping tape that ball stretches out contact-making surface via hole respectively.Pressure is adjusted assembly and is connected polishing head, and is suitable for mobile polishing head and puts on the pressure of lapping tape to adjust polishing head.
In the plate body lapping device of one embodiment of the invention, plate body is arranged on hoistable platform, and by compression module, lapping tape is forced into plate body, and so that plate body is ground, and such mode contributes to precisely to control grinding thickness.In addition, in the plate body lapping device of another embodiment of the present invention, because being provided with ball in polishing head with the frictional force between minimizing lapping tape and polishing head, thus can extend the service life of lapping tape, to reduce maintenance cost.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Brief description of the drawings
Fig. 1 is the schematic diagram of existing a kind of lapping device.
Fig. 2 is the schematic diagram of a kind of plate body lapping device of one embodiment of the invention.
Fig. 3 is the schematic diagram of the contact-making surface of the polishing head of Fig. 2.
Fig. 4 is the schematic diagram of the abradant surface of the lapping tape of Fig. 2.
Fig. 5 is the schematic top plan view of the supporting part of another embodiment of the present invention and the plate body that carries thereof.
Fig. 6 is the generalized section along the I-I line of Fig. 5.
Detailed description of the invention
Technological means and effect of taking for reaching predetermined goal of the invention for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to detailed description of the invention, structure, feature and effect of the plate body lapping device proposing according to the present invention, be described in detail as follows.
Fig. 2 is the schematic diagram of a kind of plate body lapping device of one embodiment of the invention.Please refer to Fig. 2, the plate body lapping device 200 of the present embodiment comprises hoistable platform 210, grinding module 220 and compression module 230, and wherein hoistable platform 210 has supporting part 211 with carrying plate body 60, and grinding module 220 is relative with supporting part 211.This hoistable platform 210 for example comprises platform body 212 and driving element 213.Above-mentioned supporting part 211 belongs to platform body 212, and driving element 213 connecting platform bodies 212.Driving element 213 is for example motor, and it moves to approach or away from grinding module 220 along direction D3 in order to order about platform body 212.Plate body 60 is for example the elements such as display floater, glass substrate, but is not limited to this.
Grinding module 220 comprises lapping tape 221 and driven unit 222.Lapping tape 221 has relative abradant surface 223 and the back side 224, and abradant surface 223 is for example matsurface, and the part abradant surface 223 of position between supporting part 211 and compression module 230 is in the face of supporting part 211.Driven unit 222 connects lapping tape 221, rotates to order about lapping tape 221.The driven unit 222 of the present embodiment for example comprises roller set 222, and roller set 222 can drive lapping tape 221 to rotate while rotating.
Compression module 230 comprises polishing head 231 and pressure adjustment assembly 232.Polishing head 231 is suitable for mobile and contacts to the back side 224 of the part lapping tape 221 between hoistable platform 211 and polishing head 231, and pressure is adjusted assembly 232 and connected polishing head 231, and be suitable for mobile polishing head 231 and put on the pressure of lapping tape 221 to adjust polishing head 231.
In the present embodiment, in the time will grinding plate body 60, drive lapping tape 221 to rotate by driven unit 222, and order about platform body 212 by driving element 213 and move towards the direction that approaches grinding module 220 along direction B3, make plate body 60 contact the abradant surface 223 of lapping tape 221 or keep suitable spacing with the abradant surface 223 of lapping tape 221.Then, adjust assembly 232 by pressure and make polishing head 231 bring pressure to bear on lapping tape 221, so that lapping tape 221 grinds the surface of plate body 60.
Be different from prior art, the plate body lapping device 200 of the present embodiment is to carry plate body 60 by hoistable platform 210 in design, and by compression module 230, lapping tape 221 is forced into plate body 60 so that plate body 60 is ground.The driving element 213 of hoistable platform 210 can accurately be controlled the height that platform body 212 rises, and contributes to precisely to control grinding thickness.In addition,, in order more precisely to control grinding thickness, the driving element 213 of hoistable platform 210 can coordinate in order to the height sensor (not shown) of sensing plate body 60 positions controls the height that platform body 212 rises.
In order more precisely and stably to control the pressure that puts on lapping tape 221, the selected pressure of the present embodiment is adjusted assembly 232 and is for example comprised cavity 233, solenoid 234, permanent magnet 235 and connector 236.Cavity 233 has the top side 237 away from polishing head 231, and permanent magnet 235 is arranged between solenoid 234 and top side 237 movably, and forms blanket gas secret room S between permanent magnet 235 and top side 237.Air pressure in this blanket gas secret room S is for example capable of regulating.Solenoid 234 is fixed on cavity 233, and between polishing head 231 and permanent magnet 235, and connector 236 is for example through solenoid 234 and is connected in permanent magnet 235 and polishing head 231.
Pass into the sense of current and the power of solenoid 234 by control, make to produce repulsive force between solenoid 234 and permanent magnet 235, and this repulsive force just can support permanent magnet 235, connector 236 and polishing head 231.And, can order about permanent magnet 235 and move down by controlling air pressure in blanket gas secret room S, and drive connector 236 and polishing head 231 to move, use the pressure of adjusting polishing head 231 and put on lapping tape 221.Be different from prior art, the selected pressure adjustment assembly 232 of the present embodiment can adopt the mode of the mixed pressure cylinder of magnetic force to order about polishing head 231 and move, so can comparatively precisely and stably control polishing head 231 and put on the pressure of lapping tape 221, to avoid the situation of the not good or damage plate body 60 of grinding effect.
It should be noted that, the present invention does not limit the type of drive of pressure adjustment assembly 232.In another embodiment, also can superly order about permanent magnet 235 apart from power and move by what produce between solenoid 234 and permanent magnet 235, connector 236 with polishing head 231 along with permanent magnet 235 moves.In more detail, the sense of current that can be only passes into solenoid 234 by control with the strong and weak direction of adjusting the magnetic force that solenoid 234 produces with strong and weak, so that produce suitable attraction or repulsive force between solenoid 234 and permanent magnet 235, thereby control the moving direction of permanent magnet 235, be applied to the pressure of lapping tape 221 to adjust polishing head 231.In other embodiments, also can select other pressure adjustment assembly to replace above-mentioned pressure adjustment assembly 232.
In addition, plate body lapping device 200 can further comprise the pressure detection module 240 that is disposed at supporting part 211, and pressure adjustment assembly 230 more comprises the control module (not shown) that is electrically connected to pressure detection module 240 and solenoid 234.Pressure detection module 240 for example comprises multiple pressure detection devices 242, it is in order to pressure sensor, and control module can be controlled power and the direction of the electric current that passes into solenoid 234 or adjust the air pressure in blanket gas secret room S according to the sensing result of pressure detection module 240, put on the pressure of lapping tape 221 more accurately and stably to control polishing head 231.
Fig. 3 is the schematic diagram of the contact-making surface of the polishing head of Fig. 2.Please refer to Fig. 2 and Fig. 3, in order to lower the frictional force between the contact-making surface 239 of polishing head 231 and lapping tape 221 that it contacts, compression module 230 can more comprise the multiple balls 251 that are arranged in polishing head 231, and on the contact-making surface 239 of polishing head 231, can be provided with multiple holes 252, it is outer with contact lapping tape 221 that these balls 251 stretch out contact-making surface 239 via hole 252 respectively.So, can reduce the resistance that lapping tape 221 rotates the service life that promotes lapping tape 221, and then reduce the maintenance cost of plate body lapping device 200.
Fig. 4 is the schematic diagram of the abradant surface of the lapping tape of Fig. 2.Please refer to Fig. 2 to Fig. 4, in order to promote the effect of clean plate body 60, can make cleaning solution (as water) flow to the abradant surface 223 of lapping tape 221 via polishing head 231.Particularly, the contact-making surface 239 of polishing head 231 can be provided with multiple fluid holes 253, and other surface (as the surface relative with contact-making surface 239) of polishing head 231 is for example provided with liquid inlet, for injecting cleaning solution.In addition, lapping tape 221 is provided with multiple perforations 225, and perforation 225 extends to the back side 224 from abradant surface 223, and the cleaning solution so flowing out from fluid hole 253 can flow between abradant surface 223 and plate body 60 via perforation 225.
Fig. 5 is the schematic top plan view of the supporting part of another embodiment of the present invention and the plate body that carries thereof, and Fig. 6 is the generalized section along the I-I line of Fig. 5.Please refer to Fig. 5 and Fig. 6, in the non-all thick embodiment of plate body, the loading end of supporting part can be designed to match with the shape of plate body.For instance, when supporting part 211a is when carrying plate body 60a (as display floater), because plate body 60a comprises substrate 61 and substrate 62, and substrate 61 protrudes from outside substrate 62, for the part that protrudes from substrate 62 of bearing substrate 61, supporting part 211a can be designed to include the first loading end 214 and the second loading end 215 that is positioned at the first loading end 214 edges.Distance between polishing head 231 shown in the first loading end 215 and Fig. 2 is different from the distance between the second loading end 215 and polishing head 231.The first loading end 215 is in order to bearing substrate 62, and the second loading end 215 is for example higher than the first loading end 214, with the part that protrudes from substrate 62 of bearing substrate 61, so can avoid plate body 60a to be under pressure time, produce crooked situation, so the surface 63 of grinding base plate 61 equably.
In sum, in plate body lapping device of the present invention, plate body is arranged on hoistable platform, and by compression module, lapping tape is forced into plate body, so that plate body is ground.Because the driving element of hoistable platform can accurately be controlled the height that platform body rises, this contributes to precisely to control grinding thickness.In addition, in the plate body lapping device of an embodiment, because being provided with ball in polishing head with the frictional force between minimizing lapping tape and polishing head, thus can extend the service life of lapping tape, to reduce the maintenance cost of plate body lapping device.In addition, be different from the mode that prior art is used merely air cylinder driven, adjusting assembly at pressure comprises in the embodiment of cavity, solenoid, permanent magnet and connector, can adopt the mode of the mixed pressure cylinder of magnetic force to drive polishing head, so can more precisely and stably control polishing head and put on the pressure of lapping tape.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (8)
1. a plate body lapping device, is characterized in that, comprising:
One hoistable platform, has a supporting part;
One grinding module, relative with this supporting part, this grinding module comprises:
One lapping tape, has a relative abradant surface and a back side; And
One driven unit, connects this lapping tape, rotates to order about this lapping tape; And a compression module, comprising:
One polishing head, is suitable for moving and extremely this back side of this lapping tape of part between this hoistable platform and this polishing head of contact; And
One pressure is adjusted assembly, connect this polishing head, and be suitable for mobile this polishing head and put on to adjust this polishing head the pressure of this lapping tape, this pressure is adjusted assembly and is comprised a cavity, one solenoid, one permanent magnet and a connection piece, this cavity has a top side away from this polishing head, this permanent magnet is arranged between this solenoid and this top side movably, and between this permanent magnet and this top side, form a blanket gas secret room, this solenoid is fixed on this cavity, and between this polishing head and this permanent magnet, and this connector is connected in this permanent magnet and this polishing head.
2. plate body lapping device as claimed in claim 1, is characterized in that, more comprises a pressure detection module, is disposed at this supporting part, and this pressure adjustment assembly more comprises a control module, is electrically connected to this pressure detection module and this solenoid.
3. plate body lapping device as claimed in claim 1, is characterized in that, this abradant surface is a matsurface.
4. plate body lapping device as claimed in claim 1, it is characterized in that, this compression module more comprises multiple balls, be arranged in this polishing head, and this polishing head comprises that a contact-making surface is for contacting this lapping tape, this contact-making surface is provided with multiple holes, and it is outer to contact this lapping tape that those balls stretch out this contact-making surface via those holes respectively.
5. plate body lapping device as claimed in claim 1, is characterized in that, this polishing head comprises that a contact-making surface is for contacting this lapping tape, and this contact-making surface is provided with multiple fluid holes, and this lapping tape is provided with multiple perforations, and those perforations extend to this back side from this abradant surface.
6. plate body lapping device as claimed in claim 1, is characterized in that, this driven unit comprises a roller set.
7. plate body lapping device as claimed in claim 1, it is characterized in that, this supporting part comprises one first loading end and one second loading end that is positioned at this first loading end edge, and the distance between this first loading end and this polishing head is different from the distance between this second loading end and this polishing head.
8. plate body lapping device as claimed in claim 1, is characterized in that, this hoistable platform comprises:
One platform body, has this supporting part; And
One driving element, connects this platform body, to order about this platform body towards approaching or moving away from the direction of this grinding module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210075020.6A CN102601711B (en) | 2012-03-20 | 2012-03-20 | Board grinding device |
| TW101110386A TWI500477B (en) | 2012-03-20 | 2012-03-26 | Grinding apparatus for plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210075020.6A CN102601711B (en) | 2012-03-20 | 2012-03-20 | Board grinding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102601711A CN102601711A (en) | 2012-07-25 |
| CN102601711B true CN102601711B (en) | 2014-10-08 |
Family
ID=46519680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210075020.6A Expired - Fee Related CN102601711B (en) | 2012-03-20 | 2012-03-20 | Board grinding device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102601711B (en) |
| TW (1) | TWI500477B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012109071A1 (en) * | 2012-09-26 | 2014-03-27 | Contitech Elastomer-Beschichtungen Gmbh | Grinding process for printing plates in flexo or high pressure area |
| CN103612182A (en) * | 2013-11-27 | 2014-03-05 | 苏州道众机械制造有限公司 | Flat belt grinder |
| CN105058206A (en) * | 2015-08-07 | 2015-11-18 | 河南鸿昌电子有限公司 | Crystal particle grinding machine |
| CN105033821B (en) * | 2015-08-14 | 2017-08-04 | 广州数控设备有限公司 | Position and pressure compensator, method and the sander using the device |
| CN105150055B (en) * | 2015-08-27 | 2017-10-10 | 哈尔滨商业大学 | A kind of robot belt grinding machine for large flat class workpiece |
| US11491606B2 (en) * | 2015-10-21 | 2022-11-08 | ST Engineering Aerospace Ltd. | Grinding module, a grinding machine and a method for grinding |
| CN105598795B (en) * | 2016-01-29 | 2019-07-26 | 湖州展邦实业有限公司 | A kind of floor sanding device of improvement |
| CN106078469B (en) * | 2016-08-01 | 2018-07-27 | 蓝思科技（长沙）有限公司 | A kind of polishing process and its device of the 3D cambered surfaces of ceramic member |
| DE102016214568A1 (en) * | 2016-08-05 | 2018-02-08 | Weeke Bohrsysteme Gmbh | Processing device and processing method |
| CN108015674B (en) * | 2016-11-04 | 2020-03-31 | 合肥京东方显示技术有限公司 | Grinding device |
| CN110788710B (en) * | 2019-10-16 | 2021-02-19 | 中国电子科技集团公司第十一研究所 | Tellurium-zinc-cadmium crystal surface grinding and polishing device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2033320U (en) * | 1988-03-05 | 1989-03-01 | 重庆大学 | Revolving-stage type plane sandbag grinder with press-grind plate structure |
| US5957763A (en) * | 1997-09-19 | 1999-09-28 | Speedfam Corporation | Polishing apparatus with support columns supporting multiple platform members |
| JP2004276175A (en) * | 2003-03-17 | 2004-10-07 | Hitachi High-Tech Electronics Engineering Co Ltd | Polishing apparatus and method for manufacturing magnetic disk using the same |
| WO2006112531A1 (en) * | 2005-04-19 | 2006-10-26 | Nihon Micro Coating Co., Ltd. | Device for and method of polishing peripheral edge of semiconductor wafer |
| CN101784369A (en) * | 2007-08-16 | 2010-07-21 | 株式会社荏原制作所 | Polishing device |
| CN102152206A (en) * | 2010-01-15 | 2011-08-17 | 株式会社荏原制作所 | Polishing apparatus, polishing method and pressing member for pressing a polishing tool |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001225253A (en) * | 2000-02-16 | 2001-08-21 | Fukuoka Prefecture | Belt sander |
| JP5555865B2 (en) * | 2010-02-05 | 2014-07-23 | 株式会社ブイ・テクノロジー | Polishing equipment |
-
2012
- 2012-03-20 CN CN201210075020.6A patent/CN102601711B/en not_active Expired - Fee Related
- 2012-03-26 TW TW101110386A patent/TWI500477B/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2033320U (en) * | 1988-03-05 | 1989-03-01 | 重庆大学 | Revolving-stage type plane sandbag grinder with press-grind plate structure |
| US5957763A (en) * | 1997-09-19 | 1999-09-28 | Speedfam Corporation | Polishing apparatus with support columns supporting multiple platform members |
| JP2004276175A (en) * | 2003-03-17 | 2004-10-07 | Hitachi High-Tech Electronics Engineering Co Ltd | Polishing apparatus and method for manufacturing magnetic disk using the same |
| WO2006112531A1 (en) * | 2005-04-19 | 2006-10-26 | Nihon Micro Coating Co., Ltd. | Device for and method of polishing peripheral edge of semiconductor wafer |
| CN101784369A (en) * | 2007-08-16 | 2010-07-21 | 株式会社荏原制作所 | Polishing device |
| CN102152206A (en) * | 2010-01-15 | 2011-08-17 | 株式会社荏原制作所 | Polishing apparatus, polishing method and pressing member for pressing a polishing tool |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201338920A (en) | 2013-10-01 |
| CN102601711A (en) | 2012-07-25 |
| TWI500477B (en) | 2015-09-21 |
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