CN102593118A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN102593118A CN102593118A CN2011103626884A CN201110362688A CN102593118A CN 102593118 A CN102593118 A CN 102593118A CN 2011103626884 A CN2011103626884 A CN 2011103626884A CN 201110362688 A CN201110362688 A CN 201110362688A CN 102593118 A CN102593118 A CN 102593118A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 259
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 18
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 41
- 239000012535 impurity Substances 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 15
- 238000000059 patterning Methods 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 291
- 238000005516 engineering process Methods 0.000 description 18
- 239000007789 gas Substances 0.000 description 17
- 238000013459 approach Methods 0.000 description 16
- 229910005883 NiSi Inorganic materials 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 14
- 239000001301 oxygen Substances 0.000 description 14
- 229910052760 oxygen Inorganic materials 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- 238000005755 formation reaction Methods 0.000 description 13
- 230000003647 oxidation Effects 0.000 description 13
- 238000007254 oxidation reaction Methods 0.000 description 13
- 238000010276 construction Methods 0.000 description 10
- 230000012447 hatching Effects 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000012299 nitrogen atmosphere Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 206010010144 Completed suicide Diseases 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007850 degeneration Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 229960002163 hydrogen peroxide Drugs 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910000673 Indium arsenide Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- -1 can in vacuum Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 2
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 2
- 239000005052 trichlorosilane Substances 0.000 description 2
- 229910005793 GeO 2 Inorganic materials 0.000 description 1
- 229910004143 HfON Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910004116 SrO 2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7848—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being located in the source/drain region, e.g. SiGe source and drain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/78654—Monocrystalline silicon transistors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011000812A JP5431372B2 (ja) | 2011-01-05 | 2011-01-05 | 半導体装置およびその製造方法 |
JP2011-000812 | 2011-01-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102593118A true CN102593118A (zh) | 2012-07-18 |
CN102593118B CN102593118B (zh) | 2014-12-10 |
Family
ID=46379991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110362688.4A Active CN102593118B (zh) | 2011-01-05 | 2011-11-16 | 半导体器件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8766236B2 (zh) |
JP (1) | JP5431372B2 (zh) |
KR (1) | KR101324380B1 (zh) |
CN (1) | CN102593118B (zh) |
TW (1) | TWI441339B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104934478A (zh) * | 2014-03-22 | 2015-09-23 | 阿尔特拉公司 | 高性能的鳍式场效应晶体管 |
CN106486482A (zh) * | 2015-08-24 | 2017-03-08 | 意法半导体公司 | 拉伸性硅和压缩性硅锗的共整合 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9136383B2 (en) | 2012-08-09 | 2015-09-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contact structure of semiconductor device |
EP2704199B1 (en) | 2012-09-03 | 2020-01-01 | IMEC vzw | Method of manufacturing a semiconductor device |
JP6088999B2 (ja) * | 2013-05-02 | 2017-03-01 | 富士フイルム株式会社 | エッチング液およびエッチング液のキット、これをもちいたエッチング方法および半導体基板製品の製造方法 |
WO2014178423A1 (ja) | 2013-05-02 | 2014-11-06 | 富士フイルム株式会社 | エッチング方法、これに用いるエッチング液、ならびに半導体基板製品の製造方法 |
WO2014178422A1 (ja) * | 2013-05-02 | 2014-11-06 | 富士フイルム株式会社 | エッチング液およびエッチング液のキット、これを用いたエッチング方法および半導体基板製品の製造方法 |
US9142474B2 (en) | 2013-10-07 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Passivation structure of fin field effect transistor |
US9287262B2 (en) | 2013-10-10 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Passivated and faceted for fin field effect transistor |
US20150206965A1 (en) * | 2013-11-14 | 2015-07-23 | Altera Corporation | High performance finfet |
KR102155327B1 (ko) | 2014-07-07 | 2020-09-11 | 삼성전자주식회사 | 전계 효과 트랜지스터 및 그 제조 방법 |
US10032912B2 (en) | 2014-12-31 | 2018-07-24 | Stmicroelectronics, Inc. | Semiconductor integrated structure having an epitaxial SiGe layer extending from silicon-containing regions formed between segments of oxide regions |
US9548361B1 (en) | 2015-06-30 | 2017-01-17 | Stmicroelectronics, Inc. | Method of using a sacrificial gate structure to make a metal gate FinFET transistor |
US10340340B2 (en) * | 2016-10-20 | 2019-07-02 | International Business Machines Corporation | Multiple-threshold nanosheet transistors |
KR102446604B1 (ko) * | 2021-01-04 | 2022-09-26 | 한국과학기술원 | 스트레인드 채널 성장 구조, 및 그를 이용한 스트레인드 채널 및 소자 제조 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060009001A1 (en) * | 2004-06-10 | 2006-01-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | A Recessed Polysilicon Gate Structure for a Strained Silicon MOSFET Device |
CN1950946A (zh) * | 2004-05-05 | 2007-04-18 | 先进微装置公司 | 用于增进信道载子移动性之具有高应力衬料之基于Si-Ge的半导体装置 |
CN101432859A (zh) * | 2006-04-28 | 2009-05-13 | 先进微装置公司 | 具有埋置应变层和减少的浮体效应的soi晶体管及其形成方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100332108B1 (ko) * | 1999-06-29 | 2002-04-10 | 박종섭 | 반도체 소자의 트랜지스터 및 그 제조 방법 |
JP3782021B2 (ja) * | 2002-02-22 | 2006-06-07 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、半導体基板の製造方法 |
JP3825768B2 (ja) * | 2003-08-27 | 2006-09-27 | 株式会社東芝 | 電界効果トランジスタ |
US7018901B1 (en) * | 2004-09-29 | 2006-03-28 | Freescale Semiconductor, Inc. | Method for forming a semiconductor device having a strained channel and a heterojunction source/drain |
JP5329835B2 (ja) * | 2008-04-10 | 2013-10-30 | 株式会社東芝 | 半導体装置の製造方法 |
JP4875038B2 (ja) | 2008-09-24 | 2012-02-15 | 株式会社東芝 | 半導体装置およびその製造方法 |
-
2011
- 2011-01-05 JP JP2011000812A patent/JP5431372B2/ja active Active
- 2011-09-19 US US13/236,182 patent/US8766236B2/en active Active
- 2011-09-20 TW TW100133692A patent/TWI441339B/zh active
- 2011-11-11 KR KR1020110117356A patent/KR101324380B1/ko active IP Right Grant
- 2011-11-16 CN CN201110362688.4A patent/CN102593118B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1950946A (zh) * | 2004-05-05 | 2007-04-18 | 先进微装置公司 | 用于增进信道载子移动性之具有高应力衬料之基于Si-Ge的半导体装置 |
US20060009001A1 (en) * | 2004-06-10 | 2006-01-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | A Recessed Polysilicon Gate Structure for a Strained Silicon MOSFET Device |
CN101432859A (zh) * | 2006-04-28 | 2009-05-13 | 先进微装置公司 | 具有埋置应变层和减少的浮体效应的soi晶体管及其形成方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104934478A (zh) * | 2014-03-22 | 2015-09-23 | 阿尔特拉公司 | 高性能的鳍式场效应晶体管 |
CN106486482A (zh) * | 2015-08-24 | 2017-03-08 | 意法半导体公司 | 拉伸性硅和压缩性硅锗的共整合 |
CN106486482B (zh) * | 2015-08-24 | 2019-07-09 | 意法半导体公司 | 集成电路和制造集成电路的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2012142503A (ja) | 2012-07-26 |
CN102593118B (zh) | 2014-12-10 |
TW201251028A (en) | 2012-12-16 |
US8766236B2 (en) | 2014-07-01 |
TWI441339B (zh) | 2014-06-11 |
US20120168830A1 (en) | 2012-07-05 |
JP5431372B2 (ja) | 2014-03-05 |
KR20120079800A (ko) | 2012-07-13 |
KR101324380B1 (ko) | 2013-11-01 |
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