CN102569278A - 发光装置以及照明装置 - Google Patents
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- 238000005286 illumination Methods 0.000 title abstract description 3
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000009434 installation Methods 0.000 claims description 20
- 230000004888 barrier function Effects 0.000 claims description 4
- 230000000452 restraining effect Effects 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 235000012364 Peperomia pellucida Nutrition 0.000 description 1
- 240000007711 Peperomia pellucida Species 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
一种通过着眼于减小浮游电容而能够抑制发光元件的误点灯的发光装置以及照明装置。本发明是发光装置(1),其包括:具有绝缘层的基板(2);形成在该基板(2)的表面上并具有导电性且未电性导通的多个安装焊垫(3)以及电性导通的配线图案(4);以及安装在所述安装焊垫(3)上并且电性连接于所述配线图案(4)的多个发光元件(5)。
Description
技术领域
本发明的实施方式涉及一种使用发光二极管(Light Emitting diode,LED)等的发光元件来作为光源的发光装置以及照明装置。
背景技术
近来,正逐渐使用LED来作为照明装置的光源。该光源是在基板上配设多个LED裸芯片(bare chip),将各LED芯片以接合线(bonding wire)电性连接于配线图案(pattern)并安装到基板。然后,将多个该基板装入铝等的金属制的本体内而构成LED照明装置。
此类先前的照明装置通常是由连接于交流电源的点灯装置来供给电力,以进行LED的点灯控制。而且,金属制的本体被接地而处于接地电位。
[现有技术文献]
[专利文献]
[专利文献1]日本专利特开2009-54989号公报
但是,上述先前的照明装置例如会产生误点灯的现象,即,尽管点灯装置的电源开关(单断开关)处于断开的状态,但LED仍会微弱地点亮。一般认为该现象是由于下述原因造成,即,因噪声(noise)重叠于电源线(1ine)而在LED芯片所连接的配线图案等的导体与靠近该导体的金属制的本体之间产生的浮游电容,导致有微小电流成为漏电流而流经LED芯片。
发明内容
本发明是有鉴于上述问题而完成,其目的在于提供一种通过着眼于减小浮游电容而能够抑制发光元件的误点灯的发光装置以及照明装置。
本发明的实施方式的发光装置包括:具有绝缘层的基板;以及形成在该基板的表面上并具有导电性且未电性导通的多个安装焊垫以及电性导通的配线图案。而且,发光装置包括安装在所述安装焊垫上并且电性连接于所述配线图案的多个发光元件。
本发明的实施方式的照明装置包括:处于接地电位且具有导电性的装置本体;配设在所述装置本体中的上述发光装置;以及连接于交流电源以对所述发光装置供给电力的点灯装置。
(发明的效果)
根据本发明的实施方式,可提供能够有效地活用该安装焊垫并且能够抑制发光元件的误点灯的发光装置以及照明装置。
附图说明
图1是表示本发明的实施方式的发光装置的平面图。
图2是表示对该发光装置中的一部分形成密封构件之前的状态的局部放大平面图。
图3是沿图2中的Y-Y线而示意性地表示的剖面图。
图4是表示该发光装置中的安装焊垫以及配线图案的平面图。
图5是表示该发光装置中的安装焊垫以及配线图案的局部放大平面图。
图6是表示该发光装置中的发光元件的连接状态的接线图。
图7是表示本发明的实施方式的照明装置的概略接线图。
附图标记:
1:发光装置
2:基板
3:安装焊垫
3a:切口部
4:配线图案
4a:供电部
5:发光元件(LED芯片)
6:密封构件
7:铜箔
8:抗蚀剂层
9:绝缘性粘结剂
10:接合线
20:照明装置
21:点灯装置
22:本体
A:第一层
AC:商用交流电源
B:第二层
C:第三层
Cs:浮游电容
SW:电源开关
具体实施方式
以下,参照图1至图7来说明本发明的实施方式的发光装置以及照明装置。图1至图6表示发光装置,图7表示照明装置。另外,在各图中,对于相同部分标注相同符号并省略重复说明。
如图1至图5所示,发光装置1具备基板2、形成在该基板2的表面上的安装焊垫3及配线图案4、多个发光元件5以及密封构件6。
基板2是以玻璃环氧(glass epoxy)树脂等的材料而形成为包含绝缘层的细长的长方形状。长度尺寸为约250mm~300mm,宽度尺寸为约10mm~32mm。基板2的厚度尺寸优选0.5mm以上且1.8mm以下,本实施方式中,适用约1mm的厚度尺寸。
基板2的形状并不限于长方形状。可适用正方形状或圆形状的基板。而且,对于基板2的材料,可适用陶瓷(ceramics)材料或其他的合成树脂材料。进而,对于基板2,可适用金属制的基板以提高各发光元件5的散热性,所述金属制的基板是将铝等的导热性良好且散热性优异的金属材料作为基底(base)板,并在该基底板的一面层叠有绝缘层。
图4以及图5表示形成在基板2的表面上的安装焊垫3及配线图案4。如图4及图5代表性地说明的,安装焊垫3以及配线图案4具有导电性,且如后所述般采用三层结构,并包含相同材料。
安装焊垫3是安装着发光元件5的部分,呈大致圆形状,且使圆周上的相向的一部分(图5上的上下)呈弧状切开而形成,在该一对切口部3a上,以空开规定的绝缘距离并延伸的方式而配置着配线图案4的供电部4a。
该安装焊垫3如图4所示,沿着基板2的长度方向而成列地形成着多个。具体而言,沿着基板2的长度方向形成两列,而在其1列中大致等间隔地配设着35个安装焊垫3。
安装焊垫3是虽具有导电性但未电性导通的、电性分离的非导通焊垫。而且,安装焊垫3的表面作为反射层来发挥功能,进而,还兼具作为散热层的功能,该散热层对从发光元件5产生的热进行散热。
如上所述,配线图案4具有连接各发光元件5的供电部4a,且以可从电源侧对各发光元件5供给电力的方式而呈细条状地构成供电路径。另外,在由安装焊垫3与配线图案4大致围成的各区域内,遍布整个面而形成有对基板2的热进行散热的铜箔7的图案。由此,能够实现基板2整体的均热化,并且能够提高散热性能。
如图3所示,所述安装焊垫3以及配线图案4为三层结构,在基板2的表面上,通过蚀刻(etching)而设有铜图案以作为第一层A。在该铜图案层之上,电镀处理有镍(Ni)以作为第二层B,而对于第三层C,电镀处理有银(Ag)。因此,第三层C即表层实施有镀银(Ag),全光线反射率高达90%。
在该电镀处理中,第二层B的镍(Ni)的膜厚优选形成为5μm以上,第三层C的银(Ag)的膜厚优选形成为1μm以上,通过采用此种膜厚尺寸,可实现均匀的膜厚形成而达成反射率的均匀化。
如图1至图3所示,在基板2的表层,除了作为发光元件5的安装区域的安装焊垫3的区域、配线图案4的供电部4a的区域及零件的安装部分以外,在大致整个面上层叠着反射率高的白色的抗蚀剂(resist)层8。
多个发光元件5包含LED裸芯片。对于LED裸芯片,例如使用发出蓝色光的LED裸芯片,以使发光部发出白色系的光。该LED裸芯片使用硅酮(silicone)树脂系的绝缘性粘结剂9而粘结在安装焊垫3上。
LED裸芯片例如为InGaN系的元件,在透光性的蓝宝石(sapphire)元件基板上层叠有发光层,发光层是依次层叠n型氮化物半导体层、InGaN发光层以及p型氮化物半导体层而形成。并且,用于使电流流经发光层的电极包含:在p型氮化物半导体层上以p型电极焊垫形成的正(plus)侧电极;以及在n型氮化物半导体层上以n型电极焊垫形成的负(minus)侧电极。这些电极通过接合线10而电性连接至配线图案4的供电部4a上。接合线10包含金(Au)的细线,并经由以金(Au)为主成分的凸块(bump)而连接,以提高安装强度和降低LED裸芯片的损伤。
多个发光元件5安装在各安装焊垫3上的大致圆形状的大致中央部,各发光元件5与各安装焊垫3是以一对一的关系而配设着。因此,发光元件5安装在沿长度方向排列的多个安装焊垫3上而形成2列发光元件列。
而且,由于配线图案4的供电部4a延伸至安装焊垫3的切口部3a,因此能够相应地缩短接合线10。
另外,供电部4a的表面的面积相对于LED裸芯片的上表面的面积而优选形成为1倍至2倍的范围。如果小于1倍,则接合线10的接合的可靠性欠缺,因此有可能会在接合时以及使用时产生问题。而且,如果超过2倍,则整体上供电部4a、进而配线图案4的面积将变大,从而如后所述般会造成发光元件5易产生误点灯的倾向。
具体而言,LED裸芯片的上表面的尺寸为0.5mm×0.3mm,面积为0.15mm2,供电部4a的面积为0.25mm2。
以此方式配设的各发光元件5例如从正侧电源经由配线图案4、一个供电部4a、接合线10而连接至发光元件5的正侧电极,并从发光元件5的负侧电极经由接合线10而连接至另一个供电部4a,以通过配线图案4来对各发光元件11进行供电。因此,安装焊垫3处于未电性连接而分离的状态。
以上述方式连接的发光元件5成为如图6所示的连接状态。即,7个电路串联连接在一起,所述电路是将2个并联连接有5个发光元件5的并联电路予以串联连接,并在该串联电路的两端连接有用于防止发光元件5的误点灯的电容器(condenser)C。而且,可将多片基板2电性地连续连接,可适当选择该基板2的适用片数。
密封构件6为透光性合成树脂制,例如为透明硅酮树脂制,且含有适量的YAG:Ce等的荧光体。密封构件6包含多个凸状荧光体层,在本实施方式中,密封构件6包含分别包覆每个发光元件5的凸状荧光体层的集合。凸状荧光体层呈山形的形状,且呈圆弧状的凸状,且以在其下缘部与邻接的凸状荧光体层相连的方式而形成。因此,密封构件6是沿所述发光元件列而形成多列即形成为2列,以包覆并密封各发光元件5及接合线10。
荧光体受到发光元件5发出的光激发,从而放射出与发光元件5发出的光色为不同色的光。在发光元件5发出蓝色光的本实施方式中,为了能够出射白色光,而对于荧光体使用黄色荧光体,该黄色荧光体放射出与蓝色光存在补色关系的黄色系的光。
密封构件6是在未硬化的状态下对应于各发光元件5、接合线10而涂布,随后进行加热硬化或放置规定时间以使其硬化而设置着。
其次,加上参照图7来说明上述发光装置1的作用。图7是表示照明装置的概略接线图。照明装置20例如为用作基础照明的形式,且具备经由电源开关SW而连接于商用交流电源AC的点灯装置21以及收容有发光装置1的本体22。点灯装置21例如是在全波整流电路的输出端子间连接平滑电容器,并在该平滑电容器上连接直流电压转换电路以及电流检测机构而构成。发光装置1从该点灯装置21经由连接器(connector)而接受直流电力的供给,以对该发光元件5进行点灯控制。本体22为铝等的具有导电性的金属制,且被接地而处于接地电位。
当对发光装置1进行通电时,由密封构件6覆盖的各发光元件5一齐发光,发光装置1被用作出射白色光的面状光源。在该发光中,发光元件5放射出的光中的朝向基板2侧的光主要被安装焊垫3的表层而反射向光的利用方向。而且,安装焊垫3作为对各发光元件5发出的热进行扩散的散热片(heat spreader)而发挥功能,以促进散热。
此时,由于发光元件5被安装在安装焊垫3的大致圆形状的大致中央部,因此可将安装焊垫3的中央部作为发光中心而有效地将光予以反射。除此以外,可使未用于反射的安装焊垫3的区域减少到最小限度,从而可减少安装焊垫3的无用区域。
然而,如果连接各发光元件5的配线图案4与本体22之间处于靠近的情况,则有可能产生浮游电容Cs。关于浮游电容,处于接地电位的本体22将形成一个电极,且配线图案4主要形成另一个电极,两电极间将经由介电体而静电耦合。此时,浮游电容的大小与电极的面积成比例,但如上所述,该安装焊垫3是虽具有导电性但未电性导通的、电性分离的非导通焊垫。
因此,该安装焊垫3不会形成另一个电极,因此能够减少另一个电极的面积,从而能够减小浮游电容Cs。
因而,在断开电源开关SW的状态下,即使有噪声重叠于电源线,也能够使微小电流作为漏电流而流经发光元件5受到抑制,结果可避免发光元件5的误点灯。
而且,可考虑将接合线10连接于安装发光元件5的安装焊垫3,使安装焊垫3电性导通而兼用作配线图案4。但是,此时,如果为了提高发光元件5的反光效果或散热效果而增大安装焊垫3的面积,则会与此相伴地有助于浮游电容Cs变大,从而可能会因噪声导致漏电流流经发光元件5而造成发光元件5的误点灯。
在本实施方式中,安装焊垫3为未电性导通的非导通焊垫,因此即使增大安装焊垫3的面积也不会有助于浮游电容Cs变大,因此不仅可有效地活用安装焊垫3来提高发光元件5的反光效果或散热效果,而且可抑制微小电流作为漏电流而流经发光元件5,从而能够抑制发光元件5的误点灯。
除此以外,通过图6所示的电容器C,还能够进一步提高抑制发光元件5的误点灯的效果。
如上所述,根据本实施方式,能够有效地活用安装焊垫3,并且能够减小浮游电容Cs而抑制发光元件5的误点灯。
本发明并不限定于上述实施方式的结构,在不脱离发明的主旨的范围内可进行各种变形。例如,作为照明装置,可适用于在室内或室外使用的照明器具、显示器(display)装置等。
Claims (3)
1.一种发光装置,其特征在于包括:
具有绝缘层的基板;
形成在该基板的表面上并具有导电性且未电性导通的多个安装焊垫以及电性导通的配线图案;以及
安装在所述安装焊垫上并且电性连接于所述配线图案的多个发光元件。
2.根据权利要求1所述的发光装置,其特征在于,
所述安装焊垫呈在表面形成反射层的圆形状,所述发光元件安装在该圆形状的中央部。
3.一种照明装置,其特征在于包括:
处于接地电位且具有导电性的装置本体;
配设在所述装置本体中的所述权利要求1或2所述的发光装置;以及
连接于交流电源以对所述发光装置供给电力的点灯装置。
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US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
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US20070176198A1 (en) * | 2006-02-02 | 2007-08-02 | Samsung Electro-Mechanics Co., Ltd. | Chip on board package and manufacturing method thereof |
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US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
CN1816918A (zh) * | 2003-06-30 | 2006-08-09 | 皇家飞利浦电子股份有限公司 | 发光二极管热管理*** |
US20070176198A1 (en) * | 2006-02-02 | 2007-08-02 | Samsung Electro-Mechanics Co., Ltd. | Chip on board package and manufacturing method thereof |
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