CN102560184B - 无铅易切削高导电率的钙铜材料 - Google Patents
无铅易切削高导电率的钙铜材料 Download PDFInfo
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CN 201210014212 CN102560184B (zh) | 2012-01-17 | 2012-01-17 | 无铅易切削高导电率的钙铜材料 |
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CN102560184A CN102560184A (zh) | 2012-07-11 |
CN102560184B true CN102560184B (zh) | 2013-09-18 |
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Families Citing this family (3)
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CN105821235B (zh) * | 2016-03-24 | 2017-08-22 | 湖南银联湘北铜业有限公司 | 用于紫杂铜脱氧精炼的中间合金、应用及制备方法 |
CN106191510A (zh) * | 2016-06-30 | 2016-12-07 | 宁波兴敖达金属新材料有限公司 | 无铅易切削高导电率的钙碲青铜材料 |
CN112662910B (zh) * | 2020-12-17 | 2022-03-25 | 中南大学 | 一种高导电高强铜铬钙合金及其制备方法 |
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CN101487090A (zh) * | 2008-01-17 | 2009-07-22 | 济源优克电子材料有限公司 | 一种铜键合丝及其制备方法 |
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JPS6120693A (ja) * | 1984-07-06 | 1986-01-29 | Toshiba Corp | ボンデイングワイヤ− |
JPH06184672A (ja) * | 1992-12-18 | 1994-07-05 | Mitsubishi Materials Corp | 給水給湯用耐孔食性銅合金配管 |
JPH0828384B2 (ja) * | 1993-07-15 | 1996-03-21 | 株式会社東芝 | ボンディングワイヤ |
JPH07166276A (ja) * | 1993-12-15 | 1995-06-27 | Mitsubishi Materials Corp | 耐蟻の巣状腐食性に優れた銅合金およびこの銅合金からなる熱交換器用配管 |
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CN101487090A (zh) * | 2008-01-17 | 2009-07-22 | 济源优克电子材料有限公司 | 一种铜键合丝及其制备方法 |
Non-Patent Citations (4)
Title |
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JP昭61-20693A 1986.01.29 |
JP特开平6-168976A 1994.06.14 |
JP特开平6-184672A 1994.07.05 |
JP特开平7-166276A 1995.06.27 |
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Inventor after: Feng Bin Inventor after: Zhang Jianwei Inventor after: Huang Min Inventor before: Peng Feng Inventor before: Xia Baoping Inventor before: Liu Jianping Inventor before: Feng Bin Inventor before: Zhang Lu |
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Effective date of registration: 20171115 Address after: Lin Shan Zhen Feng Qi Road Yuyao City, Zhejiang province 315400 Ningbo City No. 26 Patentee after: Ningbo Xing'aodao Metal New Material Co., Ltd. Address before: 315174, 557 Feng Feng Road, Gaoqiao village, Gaoqiao Town, Ningbo, Zhejiang, Yinzhou District Co-patentee before: Ningbo Xing'aodao Metal New Material Co., Ltd. Patentee before: Ningbo Aoda Copper Products Co., Ltd. |