CN102555389A - 聚酰亚胺薄膜层合物及包含其的金属层压板 - Google Patents
聚酰亚胺薄膜层合物及包含其的金属层压板 Download PDFInfo
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- CN102555389A CN102555389A CN2010106149651A CN201010614965A CN102555389A CN 102555389 A CN102555389 A CN 102555389A CN 2010106149651 A CN2010106149651 A CN 2010106149651A CN 201010614965 A CN201010614965 A CN 201010614965A CN 102555389 A CN102555389 A CN 102555389A
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- polyimide
- heat conduction
- layer
- film layer
- polyimide layer
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Images
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Abstract
本发明提供一种聚酰亚胺薄膜层合物及包含其的金属层压板。该聚酰亚胺薄膜层合物包含第一聚酰亚胺层,其中该第一聚酰亚胺层的热传导系数为0.2-0.9W/m.K,并且绝缘破坏强度不小于3KV;第二聚酰亚胺层,形成于该第一聚酰亚胺层之上,其中该第二聚酰亚胺层的热传导系数大于1W/m.K;以及,第三聚酰亚胺层,形成于该第二聚酰亚胺层之上,其中该第三聚酰亚胺层的热传导系数为0.2-0.9W/m.K,并且绝缘破坏强度不小于3KV。
Description
【技术领域】
本发明涉及聚酰亚胺薄膜层合物及包含其的金属层压板,特别涉及一种高导热性及高耐电压性聚酰亚胺薄膜层合物及包含其的金属层压板。
【背景技术】
在电子产品朝向轻量薄型及行动化的趋势下,电子产品的构装密度越来越集成化。再加上功能的需求也越来越高,所需驱动电力功率也一直往上增加,***所产生的热量也随之直线上升,如何经由良好的散热以维持电子产品***稳定运作将成为关键。聚酰亚胺树脂因具有优异的耐热性、机械特性及电性特性,因此常被用来作为铜箔基板材料的绝缘层,为应付未来电子产品朝向微型化及高速化趋势所带来的散热问题,例如能在基板中的树脂绝缘层赋予导热的功能,可提供较佳的元件散热途径,以增加元件的可靠度及寿命。
在US2006/0127686(A1)中,公开了将导热粒子如氧化铝、氧化硅、氮化硼、氧化硼包覆的氮化铝、铝粉、二氧化硅、碳化硅、氮化铝、二氧化钛、磷化钙、或钛化钡添加至聚酰亚胺膜的结构中。该些导热粒子的添加量约占薄膜成品总重为40~85wt%,由实施例可看出所得的聚酰亚胺薄膜的热导传导系数皆小于1.0W/m.K以下。
在JP 9137060(A)中,公开了以氮化硼或氮化铝提高聚酰亚胺膜的导热性。氮化硼或氮化铝的平均粒径约介于0.1微米至10微米之间,而薄膜成品的热导传导系数约介于0.2W/m.K至0.6W/m.K之间,其热传导性并不高。
在US专利5,078,936中,公开了以碳黑增加聚酰亚胺膜的导热性/导电性的方法,但此专利仅局限于导电性的应用。
由上述专利所公开的内容可知,现有技术所采用的无机填充粒子可提高导热性,但也同时提高许多不需提高的性质如介电常数、介电损失、及薄膜硬度。尤其在高含量无机填充粒子添加时,还容易产生脆性问题,无法完成薄膜的制作;若采用高热传导性物质如碳纳米管、碳黑、碳纤维或石墨材料添加,则树脂可展现高的热传导性,但此时树脂通常已具有一定的导电能力,丧失一般高分子树脂所具有的电性绝缘特性。
【发明内容】
本发明提供一种聚酰亚胺薄膜层合物,包含:第一聚酰亚胺层,其中该第一聚酰亚胺层的热传导系数为0.2-0.9W/m.K,并且绝缘破坏强度不小于3KV;形成于该第一聚酰亚胺层之上的第二聚酰亚胺层,其中该第二聚酰亚胺层的热传导系数大于1W/m.K;以及形成于该第二聚酰亚胺层之上的第三聚酰亚胺层,其中该第三聚酰亚胺层的热传导系数为0.2-0.9W/m.K,并且绝缘破坏强度不小于3KV。
本发明亦提供一种金属层压板,包含第一金属薄膜,以及上述的聚酰亚胺薄膜层合物,其中该聚酰亚胺薄膜层合物配置于该第一金属薄膜上。
以下借助多个实施方式并结合附图,更进一步说明本发明的方法、特征及优点,但并非用来限制本发明的范围,本发明的范围应以所附的权利要求书为准。
【附图说明】
图1为本发明一实施方式所述的聚酰亚胺薄膜层合物的剖面示意图。
图2为本发明一实施方式所述的覆铜层压板的剖面示意图。
图3为本发明一实施方式所述的双面软性铜箔基板的剖面示意图。
【主要附图标记说明】
10~聚酰亚胺薄膜层合物;
12~第一聚酰亚胺层;
14~第二聚酰亚胺层;
16~第三聚酰亚胺层;
18、22~金属薄膜;
20~金属层压板;
30~双面软性铜箔基板;
T1~第一聚酰亚胺层的厚度;
T2~第二聚酰亚胺层的厚度;以及
T3~第三聚酰亚胺层的厚度。
【具体实施方式】
本发明提供一种聚酰亚胺薄膜层合物,通过多层聚酰亚胺薄膜结构设计达到具有高导热性及耐电压电性绝缘特性。
请参照图1,该聚酰亚胺薄膜层合物10包含:第一聚酰亚胺层12、配置于该第一聚酰亚胺层之上的第二聚酰亚胺层14,以及配置于该第二聚酰亚胺层之上的第三聚酰亚胺层16。该第一聚酰亚胺层12具有厚度T1、而该第二聚酰亚胺层具有厚度T2,以及该第三聚酰亚胺层具有厚度T3,其中厚度T1-T3具有以下的关系:0.5<T2/T1<10、0.5<T2/T3<10,若该第一、第二、及第三聚酰亚胺层的厚度不符合上述关系式时,则该聚酰亚胺薄膜层合物10较不易同时达到高热传导系数及电性绝缘特性的平衡,即该聚酰亚胺薄膜层合物10无法同时满足热传导系数>1.5W/m.K及击穿电压(breakdownvoltage)>3KV的特性。此外,该第一聚酰亚胺层12的厚度T1与该第三聚酰亚胺层16的厚度T3可为相同或不同。此外,该第一聚酰亚胺层的厚度T1系介于7-20μm之间,而该第三聚酰亚胺层的厚度T3系介于7-20μm之间,若第一及第三聚酰亚胺层过厚则会影响整体多层薄膜的热传导性,即无法达到热传导系数大于1.5W/m.K,而若第一及第三聚酰亚胺层过薄则会影响整体多层薄膜的绝缘性,即击穿电压会小于3KV以下。该聚酰亚胺薄膜层合物10的总厚度(T1、T2、及T3的总合)小于60μm,若总厚度过厚则该聚酰亚胺薄膜层合物10易产生脆性问题。
该第一聚酰亚胺层12系由聚酰亚胺树脂构成,可进一步包含导热粉体,其中该导热粉体的重量百分比为0.1-60wt%,以该聚酰亚胺树脂及该导热粉体的总重为基准。当导热粉体的重量百分比介于0.1-30wt%之间,所得的第一聚酰亚胺层12系具有可挠曲性;此外,当导热粉体的重量百分比介于30-60wt%之间,所得的第一聚酰亚胺层12则较不具可挠曲性。
该第一聚酰亚胺层12可由第一聚酰胺酸组合物经成膜后所得。该第一聚酰胺酸组合物可包含聚酰胺酸树脂、溶剂、及该导热粉体。该聚酰胺酸树脂可由二酐单体及二胺单体制备而得,并经酰亚胺化反应成为聚酰亚胺树脂。其中,该二酐单体可选自均苯四甲酸二酐(pyromellitic dianhydride、PMDA)、3,3′,4,4′-二苯甲酮四甲酸二酐(3,3′,4,4′-Biphenyl tetracarboylicdianhydride、s-BPDA)、1,4,5,8-亚萘四甲酸二酐(1,4,5,8-Naphthalenetetracarboxylicdianhydride、NTCDA)、3,3′,4,4′-二苯酮四甲酸二酐(3,3′,4,4′-benzophenone-tetracarboxylic dianhydride、BTDA)、4,4′-二苯醚四酸酐(4,4′-oxydiphthalic anhydride、ODPA)、对苯二酚二酞酸酐(hydroquinnone diphtalic anhydride、HQDA)、双酚A二酐(4,4′-bisphenol Adianhydride、BPADA)、2,2′-双-(3,4-二羧苯基)六氟丙烷二酐(2,2′-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride、6FDA)、1,3-二氢-1,3-二氧-5-异苯并呋喃羧酸亚苯酯(1,3-dihydro-1,3-dioxo-5-isobenzofurancarboxylic acid phenylene ester、TAHQ)、3,3′,4,4′-二苯基砜四酸二酐(3,3′,4,4′-Diphenylsulfone tetracarboxylic dianhydride、DSDA)或其混合物;而该二胺单体可选自对苯二胺(p-phenylene diamine、P-PDA)、4,4′-氧联二苯胺(4,4′-oxydianiline、4,4′-ODA)、3,4′-二胺基二苯醚(3,4′-Oxydianiline、3,4′-ODA)、3,3’-二羟基-4,4′-二氨基联苯(3,3’-dihydroxy-4,4′-diamino-biphenyl、HAB)、4,4′-二氨基二苯砜(4,4′-diaminodiphenyl sulfone、4,4’-DDS)、2,2′-双(4-氨基苯基)六氟丙烷(2,2′-bis(4-aminophenyl)hexa-fluoropropane、Bis-A-AF)、2,2-双(4-[4-氨基苯氧基]苯基)丙烷(2,2-Bis(4-[4-aminophenoxy]phenyl)propane、BAPP)、2,2-双(4-[3-氨基苯氧基]苯基)砜(2,2-Bis(4-[3-aminophenoxy]phenyl)sulfone、BAPS)、1,4-双(4-氨基苯氧基)苯(1,4-Bis(4-aminophenoxy)benzene、TPE-Q)、1,3-双(4-氨基苯氧基)苯(1,3-Bis(4-aminophenoxy)benzene、TPE-R)、1,3-双(3-氨基苯氧基)苯(1,3-Bis(3-aminophenoxy)benzene、APB)、4,4′-双(4-氨基苯氧基)联苯(4,4′-Bis(4-aminophenoxy)biphenyl、BAPB)、1,4′-双(4-氨基苯氧基)-2,5-双-叔丁基苯(1,4′-Bis(4-aminophenoxy)-2,5-di-t-butylbenzene、DTBAB)、4,4′-双(4-氨基苯氧基)二苯甲酮(4,4′-Bis(4-aminophenoxy)benzophenone、BAPK)、二氨基硅氧烷(diamino siloxane)或其混合物。该溶剂可为非质子极性有机溶剂,包括N-甲基-2-吡咯烷酮(N-methyl-2-pyrrolidone;NMP)或N,N-二甲基乙酰胺(N,N-dimethylacetamide;DMAc)、γ-丁内酯(γ-butyrolactone;GBL)等或由二甲苯(Xylene)或甲苯(Toluene)所组成的共溶剂。
此外,该导热粉体可包含氮化硼、氮化铝、三氧化二铝粉体、或其混合物,其中该导热粉体的粒径范围系介于为60nm~2.0μm之间。值得注意的是,该第一聚酰亚胺层的热传导系数为0.2-0.9W/m.K,并且绝缘破坏强度不小于3KV,以维持该聚酰亚胺薄膜层合物的耐电压电性绝缘特性。
该第二聚酰亚胺层14系由聚酰亚胺树脂、导热碳材、及导热粉体所组成,其中该导热碳材及该导热粉体的重量系介于10-50wt%之间,以该第二聚酰亚胺层的总重为基准。此外,该导热粉体与该导热碳材的重量比可介于10∶90至50∶50,为维持该聚酰亚胺薄膜层合物的导热特性,该导热粉体与该导热碳材的重量比值优选不大于1。该第二聚酰亚胺层14可由第二聚酰胺酸组合物经成膜后所得。该第二聚酰胺酸组合物包含聚酰胺酸树脂、溶剂、该导热碳材及该导热粉体。该聚酰胺酸树脂及该导热粉体与该第一聚酰亚胺层12所使用的聚酰胺酸树脂及该导热粉体具有相同的定义。该导热粉体可包含氮化硼、氮化铝、三氧化二铝粉体、或其混合物。在本发明一实施例中,该导热碳材可为气相生长碳纤维(vapor grown carbon fiber、VGCF),具有直径介于20nm-0.5μm之间,并具有长宽比(aspect ratio)大于5。该第二聚酰亚胺层的热传导系数大于1W/m.K,以维持该聚酰亚胺薄膜层合物的高导热特性。
该第三聚酰亚胺层14系由聚酰亚胺树脂构成,可进一步包含导热粉体,其中该导热粉体的重量百分比系介于0.1-60wt%,以该聚酰亚胺树脂及该导热粉体的总重为基准。当导热粉体的重量百分比介于0.1-30wt%之间,所得的第三聚酰亚胺层16系具有可挠曲性;此外,当导热粉体的重量百分比介于30-60wt%之间,所得的第三聚酰亚胺层16则较不具可挠曲性。该第一聚酰亚胺层12可由第一聚酰胺酸组合物经成膜后所得。该第一聚酰胺酸组合物包含聚酰胺酸树脂、溶剂、及该导热粉体。该聚酰胺酸树脂可由二酐单体及二胺单体制备而得,并经酰亚胺化反应成为聚酰亚胺树脂。该聚酰胺酸树脂及该导热粉体与该第一聚酰亚胺层12所使用的聚酰胺酸树脂及该导热粉体具有相同的定义。值得注意的是,该第一聚酰亚胺层的热传导系数为0.2-0.9W/m.K,并且绝缘破坏强度不小于3KV,以维持该聚酰亚胺薄膜层合物的耐电压电性绝缘特性。此外,该第一聚酰亚胺层12与该第三聚酰亚胺层16可具有相同或不同的组成。
根据本发明其他实施例,请参照图2,本发明所述的聚酰亚胺薄膜层合物10可进一步配置于金属薄膜18上,以形成金属层压板,例如覆铜层压板20。此外,请参照图3,另一金属薄膜22可配置于该金属层压板20的聚酰亚胺薄膜层合物10上,得到双面软性铜箔基板30。该金属薄膜可包含铜箔、铝箔、不锈钢箔、或镍箔。
为了让本发明的上述和其他目的、特征、和优点能更加明显易懂,下文特举多个实施例并结合附图作详细说明如下:
聚酰胺酸树脂的制备
制备例1
将0.0799摩尔(34.5568g)的2,2-双(4-[3-氨基苯氧基]苯基)砜(BAPS)及0.0799摩尔(15.98g)4,4-氧联二苯胺(4,4′-ODA)置入1000ml的四口反应瓶中,加入400ml甲基-2-吡咯烷酮与甲苯的共溶剂(N-methyl-2-pyrrolidone/Toluene=80/20),通入氮气并搅拌,使得上述二胺单体完全溶解后,于室温下加入0.1595摩尔(49.4389g)4,4′-二苯醚四酸酐(ODPA)(即,四羧酸二酐单体)(分多次加入,每次间隔30分钟),于最后一次加完后再搅拌3小时即得到热塑性聚酰胺酸溶液500g(固含量为20wt%),其中二胺单体和四羧酸二酐单体的摩尔比为1∶0.998。
制备例2
将0.0578摩尔(6.2418g)对苯二胺(P-PDA)及0.1349摩尔(26.971g)4,4-氧二苯胺(4,4′-ODA)置入1000ml的四口反应瓶中,加入425g甲基-2-吡咯烷酮与甲苯的共溶剂(N-methyl-2-pyrrolidone/Toluene=80/20),通入氮气并搅拌,使得上述二胺单体完全溶解后,于室温下加入0.1917摩尔(41.7877g)均苯四甲酸二酐(PMDA)(即,四羧酸二酐单体)(分多次加入,每次间隔30分钟),于最后一次加完再搅拌3小时即得到耐热性聚酰胺酸溶液500g(固含量为15wt%),其中二胺单体和四羧酸二酐单体的摩尔比为1∶0.995。
聚酰胺酸组合物的制备
制备例3
取8.57g氮化硼(粒径为0.5μm、型号MK-hBN-050,由Lower Friction公司制造出售),以少许N-甲基吡咯烷酮(NMP)溶剂润湿搅拌均匀,再称取100g由制备例1所得的热塑性聚酰胺酸溶液,利用均质机与氮化硼充分搅拌均匀(速度为2000rpm,时间为30min),然后再用三辊式滚轧机(three rollmill)分散,最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(1)(氮化硼的重量百分比为30wt%,以该氮化硼及聚酰胺酸组合物(1)的固体总重为基准)。所得的聚酰胺酸组合物(1)主要作为本发明所述聚酰亚胺薄膜层合物的第一及第三聚酰亚胺层。
制备例4
取5.0g氮化硼(粒径为0.5μm、型号MK-hBN-050,由Lower Friction公司制造出售),以少许N-甲基吡咯烷酮(NMP)溶剂润湿搅拌均匀,再称取100g由制备例1所得的热塑性聚酰胺酸溶液,利用均质机与氮化硼充分搅拌均匀(速度为2000rpm,时间为30min),然后再用三辊式滚轧机分散,最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(2)(氮化硼的重量百分比为20wt%,以该氮化硼及聚酰胺酸组合物(2)的固体总重为基准)。所得的聚酰胺酸组合物(2)主要作为本发明所述聚酰亚胺薄膜层合物的第一及第三聚酰亚胺层。
制备例5
取2.22g氮化硼(粒径为0.5μm、型号MK-hBN-050,由Lower Friction公司制造出售),以少许N-甲基吡咯烷酮(NMP)溶剂润湿搅拌均匀,再称取100g由制备例1所得的热塑性聚酰胺酸溶液,利用均质机与氮化硼充分搅拌均匀(速度为2000rpm,时间为30min),然后再用三辊式滚轧机分散,最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(3)(氮化硼的重量百分比为10wt%,以该氮化硼及聚酰胺酸组合物(3)的固体总重为基准)。所得的聚酰胺酸组合物(3)主要作为本发明所述聚酰亚胺薄膜层合物的第一及第三聚酰亚胺层。
制备例6
取100g由制备例1所得的热塑性聚酰胺酸溶液,利用均质机搅拌均匀(速度为2000rpm,时间为30min),最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(4)(不含氮化硼)。所得的聚酰胺酸组合物(4)主要作为本发明所述聚酰亚胺薄膜层合物的第一及第三聚酰亚胺层。
制备例7
取12.0g气相生长碳纤维(vapor grown carbon fiber,VGCF-H,日本昭河电工公司制造及出售)及3.0g氮化硼(粒径为5~6μm,型号PT180,由奇异创新公司制造及出售),以少许N-甲基吡咯烷酮(NMP)溶剂润湿搅拌均匀,再称取100g由制备例2所得的耐热性聚酰胺酸溶液,利用均质机与VGCF及氮化硼充分搅拌均匀(速度为2000rpm,时间为30min),然后再用三辊式滚轧机分散,最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(5)(气相生长碳纤维的重量百分比为40wt%、氮化硼的重量百分比为10wt%,以该气相生长碳纤维、氮化硼、及聚酰胺酸组合物(5)的固体总重为基准)。所得的聚酰胺酸组合物(5)主要作为本发明所述聚酰亚胺薄膜层合物的第二聚酰亚胺层。
制备例8
取9.0g气相生长碳纤维(vapor grown carbon fiber,VGCF-H,日本昭河电工公司制造及出售)及6.0g氮化硼(粒径为5~6μm,型号PT180,由奇异创新公司制造及出售),以少许N-甲基吡咯烷酮(NMP)溶剂润湿搅拌均匀,再称取100g由制备例2所得的耐热性聚酰胺酸溶液,利用均质机与VGCF及氮化硼充分搅拌均匀(速度为2000rpm,时间为30min),然后再用三辊式滚轧机分散,最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(6)(气相生长碳纤维的重量百分比为30wt%、氮化硼的重量百分比为20wt%,以该气相生长碳纤维、氮化硼、及聚酰胺酸组合物(6)的固体总重为基准)。所得的聚酰胺酸组合物(6)主要作为本发明所述聚酰亚胺薄膜层合物的第二聚酰亚胺层。
制备例9
取7.5g气相生长碳纤维(vapor grown carbon fiber,VGCF-H,日本昭河电工公司制造及出售)及7.5g氮化硼(粒径为5~6μm,型号PT180,由奇异创新公司制造及出售),以少许N-甲基吡咯烷酮(NMP)溶剂润湿搅拌均匀,再称取100g由制备例2所得的耐热性聚酰胺酸溶液,利用均质机与VGCF及氮化硼充分搅拌均匀(速度为2000rpm,时间为30min),然后再用三辊式滚轧机分散,最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(7)(气相生长碳纤维的重量百分比为25wt%、氮化硼的重量百分比为25wt%,以该气相生长碳纤维、氮化硼、及聚酰胺酸组合物(7)的固体总重为基准)。所得的聚酰胺酸组合物(7)主要作为本发明所述聚酰亚胺薄膜层合物的第二聚酰亚胺层。
制备例10
取100g由制备例2所得的耐热性聚酰胺酸溶液,利用均质机充分搅拌均匀(速度为2000rpm,时间为30min),最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(8)。所得的聚酰胺酸组合物(8)主要作为本发明所述聚酰亚胺薄膜层合物的第二聚酰亚胺层。
制备例11
取15.0g氮化硼(粒径为5~6μm,型号PT180,由奇异创新公司制造及出售),以少许N-甲基吡咯烷酮(NMP)溶剂润湿搅拌均匀,再称取100g由制备例2所得的耐热性聚酰胺酸溶液,利用均质机与氮化硼充分搅拌均匀(速度为2000rpm,时间为30min),然后再用三辊式滚轧机分散,最后再利用高速脱泡机脱泡,得到聚酰胺酸组合物(9)(氮化硼的重量百分比为50wt%,以该氮化硼及聚酰胺酸组合物(9)的固体总重为基准)。所得的聚酰胺酸组合物(9)主要作为本发明所述聚酰亚胺薄膜层合物的第二聚酰亚胺层。
聚酰亚胺薄膜层合物
实施例1
首先,将制备例3所得的聚酰胺酸组合物(1)利用平移式涂布机涂布于PET离型基材(厚度为100μm),经100℃烘烤干燥20min后,得到第一膜层。接着,再将制备例7所得的聚酰胺酸组合物(5)涂布于该第一膜层上,并经100℃烘烤干燥20min后,得到第二膜层。接着,再将制备例3所得的聚酰胺酸组合物(1)涂布于该第二膜层上,并经100℃烘烤干燥20min后,得到第三膜层。最后,将所得的多层膜从PET基材撕起,利用铝框将薄膜四周固定,放入高温炉氮气以350℃温度维持1小时进行聚酰亚胺树脂环化,得到聚酰亚胺薄膜层合物(1)。该聚酰亚胺薄膜层合物(1)各层的厚度及组成系如表1所示。
实施例2-10
实施例2-10分别如实施例1的相同方式进行,但以表1所示的各层组成取代实施例1的各膜层,分别得到聚酰亚胺薄膜层合物(2)-(10)。
比较实施例1
首先,将制备例6得的聚酰胺酸组合物(4)利用平移式涂布机涂布于PET离型基材(厚度为100μm),经100℃烘烤干燥20min后,得到第一膜层。接着,再将制备例10所得的聚酰胺酸组合物(8)涂布于该第一膜层上,并经100℃烘烤干燥20min后,得到第二膜层。接着,再将制备例6所得的聚酰胺酸组合物(4)涂布于该第二膜层上,并经100℃烘烤干燥20min后,得到第三膜层。最后,将所得的多层膜从PET基材撕起,利用铝框将薄膜四周固定,放入高温炉氮气以350℃温度维持1小时进行聚酰亚胺树脂环化,得到聚酰亚胺薄膜层合物(11)。该聚酰亚胺薄膜层合物(11)各层的厚度及组成系如表1所示。
比较实施例2
将制备例7得的聚酰胺酸组合物(5)利用平移式涂布机涂布于PET离型基材(厚度为100μm),经100℃烘烤干燥20min后,得到一膜层。将所得的单层膜从PET基材撕起,利用铝框将薄膜四周固定,放入高温炉氮气以350℃温度维持1小时进行聚酰亚胺树脂环化,得到聚酰亚胺薄膜(1)。该聚酰亚胺薄膜(1)的厚度及组成系如表1所示。
比较实施例3
将制备例11得的聚酰胺酸组合物(9)利用平移式涂布机涂布于PET离型基材(厚度为100μm),经100℃烘烤干燥20min后,得到一膜层。将所得的单层膜从PET基材撕起,利用铝框将薄膜四周固定,放入高温炉氮气以350℃温度维持1小时进行聚酰亚胺树脂环化,得到聚酰亚胺薄膜(2)。该聚酰亚胺薄膜(2)的厚度及组成系如表1所示。
表1
性质测试
接着,对所得的聚酰亚胺薄膜层合物(1)-(11)、聚酰亚胺薄膜(1)-(2)、及市售的聚酰亚胺薄膜(商品编号为Kapton MT、由杜邦制造及出售)进行热传导系数、击穿电压、可挠曲性、及吸水率的测量,其评估方法详述如下,而所得的聚酰亚胺薄膜材料特性结果如表(2)所示。
热导传导系数使用Hot Disk-2500测量仪依据Iso/DIS220072.2规范进行测量。
击穿电压系使用耐电压测仪Model 730-1型号依据ASTM D149规范进行测量。此外,击穿电压定义为介质能承受到某一数值的高电压而不致崩溃的能力、或将一不导电的绝缘体变成导体及产生电流所需的最低电压。
吸水率评估方式依据IPC-TM-6502.6.2进行评估,首先将聚酰亚胺薄膜裁切成10cm×10cm大小的试片,将试片放入热风烘箱内,设定温度为110℃,时间维持60分钟,取出后称其重量为W1,然后将试片在室温浸泡于去离子水中24小时,将表面擦拭干燥并清洁称重,其重量为W2,聚酰亚胺薄膜吸水率将依据下列公式计算得出
可挠性评估方式系将高导热聚酰亚胺薄膜摊平后,以180度直接对折,重复上述动作十次以上,若薄膜无断裂,则聚酰亚胺薄膜材料通过可挠性测试。
表2
本发明所述的聚酰亚胺薄膜层合物,由于其中间层为聚酰亚胺掺混高导热碳材,可大幅提高整个聚酰亚胺薄膜层合物的导热性质,并借助上下两层提供高的耐电压性质(绝缘破坏强度不小于3KV),维持整个聚酰亚胺薄膜层合物的绝缘特性。因此,该聚酰亚胺薄膜层合物兼具有高导热特性及绝缘电气特性,可提供先进构装所要求的高功能整合、薄型化及高散热***的需求。
虽然本发明已以优选实施例披露如上,然其并非用以限定本发明,任何本发明所属技术领域中的技术人员,在不脱离本发明的精神和范围内,应可作任意更改与润饰。因此,本发明的保护范围应以所附权利要求书限定的范围为准。
Claims (15)
1.一种聚酰亚胺薄膜层合物,包含:
第一聚酰亚胺层,其中该第一聚酰亚胺层的热传导系数为0.2-0.9W/m.K,并且绝缘破坏强度不小于3KV;
第二聚酰亚胺层,形成于该第一聚酰亚胺层之上,其中该第二聚酰亚胺层的热传导系数大于1W/m.K;以及
第三聚酰亚胺层,形成于该第二聚酰亚胺层之上,其中该第三聚酰亚胺层的热传导系数为0.2-0.9W/m.K,并且绝缘破坏强度不小于3KV。
2.如权利要求1所述的聚酰亚胺薄膜层合物,其中该第一聚酰亚胺层及该第三聚酰亚胺层系各自独立并且包含聚酰亚胺树脂。
3.如权利要求1所述的聚酰亚胺薄膜层合物,其中该第一聚酰亚胺层及该第三聚酰亚胺层系各自独立并且还包含导热粉体,其中该导热粉体包含氮化硼、氮化铝、三氧化二铝粉体、或其混合物。
4.如权利要求3所述的聚酰亚胺薄膜层合物,其中该导热粉体的重量百分比为0.1-60wt%,以该聚酰亚胺树脂及该导热粉体的总重为基准。
5.如权利要求1所述的聚酰亚胺薄膜层合物,其中该第二聚酰亚胺层包含聚酰亚胺树脂、导热碳材及导热粉体,其中该导热碳材包含碳纳米管、碳纤维、石墨,该导热粉体包含氮化硼、氮化铝、三氧化二铝粉体、或其混合物。
6.如权利要求5所述的聚酰亚胺薄膜层合物,其中该导热碳材及该导热粉体总重为10-50wt%,以该第二聚酰亚胺层的总重为基准。
7.如权利要求5所述的聚酰亚胺薄膜层合物,其中该导热粉体与该导热碳材的重量比为10∶90至50∶50。
8.如权利要求5所述的聚酰亚胺薄膜层合物,其中该导热碳材为气相生长碳纤维。
9.如权利要求1所述的聚酰亚胺薄膜层合物,其中该第一聚酰亚胺层具有厚度T1、该第二聚酰亚胺层具有厚度T2、以及该第三聚酰亚胺层具有厚度T3,其中0.5<T2/T1<10,且0.5<T2/T3<10。
10.如权利要求9所述的聚酰亚胺薄膜层合物,其中该第一聚酰亚胺层的厚度T1为7-20μm,而该第三聚酰亚胺层的厚度T3为7-20μm。
11.如权利要求9所述的聚酰亚胺薄膜层合物,其中该聚酰亚胺薄膜层合物的总厚度小于60μm。
12.一种金属层压板,包含:
第一金属薄膜,以及
权利要求1项中所述的聚酰亚胺薄膜层合物,配置于该第一金属薄膜上。
13.如权利要求12所述的金属层压板,进一步包含:
第二金属薄膜,配置于该聚酰亚胺薄膜层合物上。
14.如权利要求13所述的金属层压板,其中该第一金属薄膜及该第二金属薄膜系各自独立并且包含铜箔、铝箔、不锈钢箔、或镍箔。
15.如权利要求14所述的金属层压板,其中该金属层压板为双面软性铜箔基板。
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CN114679837A (zh) * | 2020-12-24 | 2022-06-28 | 广东生益科技股份有限公司 | 一种黑色无胶挠性覆铜板及其制备方法和应用 |
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