CN102543912A - Radiator and manufacturing method thereof - Google Patents
Radiator and manufacturing method thereof Download PDFInfo
- Publication number
- CN102543912A CN102543912A CN2010105834232A CN201010583423A CN102543912A CN 102543912 A CN102543912 A CN 102543912A CN 2010105834232 A CN2010105834232 A CN 2010105834232A CN 201010583423 A CN201010583423 A CN 201010583423A CN 102543912 A CN102543912 A CN 102543912A
- Authority
- CN
- China
- Prior art keywords
- projection
- fin
- pedestal
- radiator
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 43
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A radiator comprises a base and a plurality of radiating fins disposed on the base. A bump is arranged either on the base or on the radiating fins, and a groove matched with the bump is arranged on the other one of the base and the radiating fins. The bump and the groove are combined in an interference fit mode so that the radiator saves cost and is environment-friendly. The invention further relates to a manufacturing method thereof.
Description
Technical field
The present invention relates to a kind of radiator, particularly a kind of Radiator and its preparation method that is used for electronic element radiating.
Background technology
Along with developing rapidly of electronic information industry; The heat that heat-generating electronic elements such as little process chip produce is more and more many; In order these heats to be distributed to ensure the normal operation of electronic component, industry can be sticked a radiator so that this heat-generating electronic elements is dispelled the heat usually on electronic component.
Existing radiator generally includes a substrate and is located at the some radiating fins on this substrate.Each radiating fin comprises that a body reaches the flanging that bends to same direction respectively from the both sides of this body.Said radiating fin vertically is arranged in order along substrate, and the end of the flanging of each radiating fin and the body of adjacent radiating fin are in contact with one another, and forms a faying face respectively in the top and the bottom of this radiator.This substrate contacts with heat-generating electronic elements; Said radiating fin is soldered on the substrate through modes such as solderings, in the soldering process, needs to add scolder and scaling powder; Particularly in the welding process of different materials; Like the welding of aluminium and copper, also need carry out nickel plating or other special processings, operation is complicacy and cost height comparatively.
Summary of the invention
In view of this, be necessary to provide a kind of have lower cost and Radiator and its preparation method easy to assembly in fact.
A kind of radiator; Comprise a pedestal and be located at the some fin on this pedestal; Said pedestal and said fin the two one of be provided with a projection, and the two another is provided with a groove that cooperates with this projection, said projection combines with the mode of said groove through interference fit.
A kind of manufacturing approach of radiator; Comprise the steps: to provide a pedestal and some fin; Said pedestal and said fin the two one of be provided with a projection; And the two another is provided with a groove corresponding with this projection, with said projection interference fit in said groove, so that said fin and pedestal combine.
Compared with prior art, combine with the mode of projection through groove between the pedestal of this radiator and the fin, make simply, and can make the two need not to be coated with scolding tin can to reach tight and firm combination, thereby practice thrift cost and environmental protection with interference fit.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of radiator in the present invention's one preferred embodiment.
Fig. 2 is the exploded view of radiator shown in Figure 1.
Fig. 3 is the three-dimensional assembly diagram of the radiator of another embodiment of the present invention.
Fig. 4 is the exploded view of radiator shown in Figure 3.
The main element symbol description
Projection 124,124a
Side 127,127a
Chamfering 128
Flanging 142
Groove 144,144a
Embodiment
Combine embodiment that the present invention is done further description with reference to the accompanying drawings.
Like Fig. 1 and shown in Figure 2, this radiator 10 comprises a pedestal 12 and is located at the some fin 14 on this pedestal 12.
This pedestal 12 is roughly rectangular plate shape, and it has a smooth lower surface 120 and a upper surface 122 relative with this lower surface 120.This lower surface 120 is used for fitting with a heat-generating electronic elements (figure does not show).The central authorities of this upper surface 122 convex with a projection 124, and this projection 124 can form through extruding or other modes, and this projection 124 extends through the relative both sides to this pedestal 12.In the present embodiment; The cross section of this projection 124 is roughly inverted isosceles trapezoid; This projection 124 comprises an end face 125 parallel with the upper surface of this pedestal 12 122 and respectively by the relative both sides of this end face 125 and the two sides 127 that slope inwardly and extend downwards, is connected through arc angling 128 between this end face 125 and the side 127.Said two sides 127 are connected between the upper surface 122 of end face 125 and this pedestal 12 of this projection 124, and are gradually-reducing shape by the end face 125 of this projection 124 to the upper surface of this pedestal 12 and extend.During practical implementation, this projection 124 also can be other shapes such as semi-cylindrical or flat column.
These fin 14 form roughly rectangular sheet by punching press, and on the upper surface 122 of being located at this pedestal 12 that is arranged parallel to each other.Each fin 14 comprise the body 140 of a rectangle and by the top of this body 140 to the vertically extending flanging 142 of the direction of another fin 14 that is adjacent.The position of the corresponding said projection 124 in the bottom of said body 140 is provided with the groove 144 that matches with the projection 124 of said pedestal 12; Said groove 144 can be through taking out tooth or other modes form; The shape of the projection 124 of the shape of said groove 144 and said pedestal 12 is complementary; The size of said groove 144 is slightly less than the size of the projection 124 of this pedestal 12, and the mode through interference fit between said groove 144 and the said projection 124 combines.
During assembling; Through external force with each fin 14 by an end of the projection 124 of this pedestal 12 promptly the side direction of this pedestal 12 intert to the projection 124 of this pedestal 12 one by one; And make back one intert the end of flanging 142 of the fin 14 to this projection 124 to be resisted against on the body 140 of last fin 14, to realize the location between adjacent two fin 14.Combine with the mode of projection 124 through groove 144 between the pedestal 12 of this radiator 10 and the fin 14, make simply, and can make the two need not to be coated with scolding tin can to reach tight and firm combination, thereby practice thrift cost and environmental protection with interference fit.Because single one by one the wearing to the projection 124 of this pedestal 12 of fin 14 of this radiator 10; Make and only need a very little contact area in the two assembling process; Can guarantee that promptly 144 of projection 124 and grooves combine closely, can prevent again simultaneously to make said fin 14 produce bigger distortion in projection 124 and groove 144 assembling process and the heat dispersion that influences this radiator 10.
Like Fig. 3 and shown in Figure 4, be the radiator 10a (adding label) in another embodiment of the present invention.The radiator 10a in the present embodiment and the difference of the radiator 10 among the last embodiment are: said projection 124a is located at the bottom of said fin 14a; Said groove 144a is located on the upper surface 122 of said pedestal 12a; Said projection 124a comprises that a bottom surface 125a parallel with the bottom of fin 14a reaches by the upwardly extending two sides 127a in the relative both sides of this bottom surface 125a; Said two sides 127 are the gradually-reducing shape extension by this bottom surface 125a to the direction of said fin 14a; During assembling, the projection 124a of said fin 14a is established card to the groove 144a of this pedestal 12a by the end of the groove 144a of this pedestal 12a is sliding one by one through external force.
Claims (10)
1. radiator; Comprise a pedestal and be located at the some fin on this pedestal; It is characterized in that: said pedestal and said fin the two one of be provided with a projection; And the two another is provided with a groove that cooperates with this projection, and said projection combines with the mode of said groove through interference fit.
2. radiator as claimed in claim 1 is characterized in that: said projection is located on the said pedestal, and said groove is located on the said fin.
3. radiator as claimed in claim 1 is characterized in that: said fin is established to this pedestal by a side of said pedestal is sliding one by one.
4. radiator as claimed in claim 2; It is characterized in that: the cross section of said projection is trapezoidal; It comprises an end face and the two sides of being extended by the direction of the said pedestal of two side direction of this end face, and said two sides are gradually-reducing shape by the end face of said projection to the direction of said pedestal and extend.
5. radiator as claimed in claim 4 is characterized in that: be connected through an arc angling between said end face and the said side.
6. radiator as claimed in claim 2 is characterized in that: said groove is located at the bottom of said fin, and the top of each fin extends to form a flanging to the direction of another fin.
7. radiator as claimed in claim 1 is characterized in that: said projection is located on the said fin, and said groove is located on the said pedestal.
8. radiator as claimed in claim 7; It is characterized in that: the cross section of said projection is trapezoidal; It comprises a bottom surface and the two sides of being extended by the direction of the said fin of two side direction of this bottom surface, and said two sides are gradually-reducing shape by the bottom surface of said projection to the direction of said fin and extend.
9. the manufacturing approach of a radiator; Comprise the steps: to provide a pedestal and some fin; Said pedestal and said fin the two one of be provided with a projection; And the two another is provided with a groove corresponding with this projection, with said projection interference fit in said groove, so that said fin and pedestal combine.
10. the manufacturing approach of radiator as claimed in claim 9 is characterized in that: when said projection is located on the pedestal, when said groove was located on the fin, said fin plugged to the projection of said pedestal through its groove one by one; When said groove is located on the pedestal, when said projection was located on the fin, the projection of said fin is sliding one by one established card extremely in the groove of said pedestal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010583423.2A CN102543912B (en) | 2010-12-10 | 2010-12-10 | Radiator and its preparation method |
| US12/979,316 US20120145374A1 (en) | 2010-12-10 | 2010-12-27 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010583423.2A CN102543912B (en) | 2010-12-10 | 2010-12-10 | Radiator and its preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102543912A true CN102543912A (en) | 2012-07-04 |
| CN102543912B CN102543912B (en) | 2015-10-21 |
Family
ID=46198137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010583423.2A Active CN102543912B (en) | 2010-12-10 | 2010-12-10 | Radiator and its preparation method |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120145374A1 (en) |
| CN (1) | CN102543912B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661488A (en) * | 2013-11-21 | 2015-05-27 | 奇鋐科技股份有限公司 | Manufacturing method for heat dissipation modules |
| CN105283033A (en) * | 2014-07-21 | 2016-01-27 | 奇鋐科技股份有限公司 | Manufacture method of heat-dissipating module |
| CN105720022A (en) * | 2014-12-04 | 2016-06-29 | 国家电网公司 | Heat radiation apparatus for extra-high voltage direct current thyristor voltage-equalizing loop |
| CN109644554A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369918B (en) * | 2012-04-03 | 2015-01-21 | 全亿大科技（佛山）有限公司 | Heat radiation device and assembling method thereof |
| CN110972444B (en) * | 2018-09-30 | 2022-09-06 | 泰科电子(上海)有限公司 | Heat sink and housing assembly |
| CN110972443B (en) * | 2018-09-30 | 2023-09-15 | 泰科电子(上海)有限公司 | Heat dissipating device and housing assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070169918A1 (en) * | 2006-01-20 | 2007-07-26 | Hua-Shou Kuo | Combination cooler module |
| US20090084529A1 (en) * | 2007-09-30 | 2009-04-02 | Tsung-Hsien Huang | Cooler module |
| US20090242168A1 (en) * | 2008-03-27 | 2009-10-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly and method for manufacturing the same |
-
2010
- 2010-12-10 CN CN201010583423.2A patent/CN102543912B/en active Active
- 2010-12-27 US US12/979,316 patent/US20120145374A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070169918A1 (en) * | 2006-01-20 | 2007-07-26 | Hua-Shou Kuo | Combination cooler module |
| US20090084529A1 (en) * | 2007-09-30 | 2009-04-02 | Tsung-Hsien Huang | Cooler module |
| US20090242168A1 (en) * | 2008-03-27 | 2009-10-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly and method for manufacturing the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661488A (en) * | 2013-11-21 | 2015-05-27 | 奇鋐科技股份有限公司 | Manufacturing method for heat dissipation modules |
| CN104661488B (en) * | 2013-11-21 | 2018-03-09 | 奇鋐科技股份有限公司 | The manufacture method of radiating module |
| CN105283033A (en) * | 2014-07-21 | 2016-01-27 | 奇鋐科技股份有限公司 | Manufacture method of heat-dissipating module |
| CN105720022A (en) * | 2014-12-04 | 2016-06-29 | 国家电网公司 | Heat radiation apparatus for extra-high voltage direct current thyristor voltage-equalizing loop |
| CN109644554A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120145374A1 (en) | 2012-06-14 |
| CN102543912B (en) | 2015-10-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170420 Address after: Guangdong, Chancheng Province West Industrial Zone, 35 North Road, Warburg, No. Patentee after: Quanyida Technology (Foshan) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Foxconn Precision Industry Co., Ltd. Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. |
|
| TR01 | Transfer of patent right |