CN101674718A - Radiation device - Google Patents
Radiation device Download PDFInfo
- Publication number
- CN101674718A CN101674718A CN200810304472.0A CN200810304472A CN101674718A CN 101674718 A CN101674718 A CN 101674718A CN 200810304472 A CN200810304472 A CN 200810304472A CN 101674718 A CN101674718 A CN 101674718A
- Authority
- CN
- China
- Prior art keywords
- heat abstractor
- identification piece
- base plate
- radiating
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title abstract 9
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000000047 product Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a radiation device used for radiating an electronic element and comprising a radiator. The radiator comprises a bottom surface, a bottom plate, a plurality of radiation fins and an identification piece, wherein the bottom plate contacts the electronic element; the radiation fins are extended from the top surface of the bottom plate; a buckling part is arranged between twoadjacent radiation fins; and the identification piece is borne on the top surface of the radiation fins and buckled on the buckling parts of the radiation fins. Compared with the prior art, the radiation device is firmly mounted and conveniently dismounted by correspondingly clamping the identification piece on the radiation fins of the radiator, which have a buckling part structure; and meanwhile, the identification piece is mounted on the radiator so that product information, such as a trademark, a name, and the like, can be directly displayed in an attractive shape.
Description
Technical field
The present invention relates to a kind of heat abstractor, refer in particular to a kind of heat abstractor that is used for cooling electronic component.
Background technology
When moving, can produce a large amount of heats such as computer cpu, north bridge chips, the contour electronic components of high power of video card, if these heats can not be left effectively, to directly cause temperature sharply to rise, and badly influence the normal operation of electronic devices and components.For this reason, needing to add a heat abstractor comes these electronic devices and components are dispelled the heat.
Traditional heat abstractor is usually by spraying or paste brand, trade mark or the other guide that mode such as a simple and easy label identifies this heat abstractor.Though this form of identification is simple, if when being used for middle and high shelves product, form is too simple, may not satisfy client's needs.Simultaneously, the label that posts also comes off easily and causes losing.
Summary of the invention
In view of this, be necessary to provide a kind of independently heat abstractor of identification piece that has.
A kind of heat abstractor, be used for electronic element radiating, it comprises a radiator, this radiator comprises base plate that a bottom surface contacts with described electronic component and the some radiating fins that extend from the end face of this base plate, two radiating fins of being separated by are provided with snapping portion, and an identification piece is undertaken on the described radiating fin end face and is interlocked with the snapping portion of described radiating fin.
Compared with prior art, heat abstractor of the present invention is placed in described radiator with an identification piece correspondence to have on the radiating fin of snapping bilge construction, and convenient disassembly is installed firmly.Simultaneously, identification piece is placed on the described radiator, can intuitively shows product informations such as trade mark, title, form is attractive in appearance.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
Description of drawings
Fig. 1 is the three-dimensional combination figure of the heat abstractor of one embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Embodiment
See also Fig. 1, the heat abstractor of one embodiment of the present invention is used to be installed on heat-generating electronic elements such as CPU (central processing unit), the VRM (central processing unit voltage adjusting assembly) and to it and dispels the heat.This heat abstractor comprises that a radiator 10 and is placed in the identification piece 20 on the described radiator 10.
Please consult Fig. 2 simultaneously, above-mentioned radiator 10 is integrally formed by thermal conductivity good metal material such as aluminium, copper etc., comprises that a base plate 12 reaches by these base plate 12 extended some radiating fins 14.Described base plate 12 is roughly rectangular, and its bottom surface contacts with described electronic component.12 liang of diagonal angles of described base plate vertically outwards protrude out a bar shaped installation portion 16 respectively at relative short edge one side.The central authorities of each installation portion 16 all form a circular through hole 160, are used to install and fix described radiator 10.Described radiating fin 14 is extended upward by the end face of described base plate 12, and these radiating fins 14 are provided with along the horizontal space of this base plate 12.Described radiating fin 14 comprises respectively near some first radiating fins 141 of base plate 12 both sides and is positioned at some second radiating fins 142 of base plate 12 central authorities.The height of described second radiating fin 142 is progressively successively decreased by the mediad both sides of base plate 12, makes the end face of these second radiating fins 142 be arch on the whole.Be positioned at the height of the height of outermost second radiating fin 142 less than first radiating fin 141 that is adjacent.The top of described two first radiating fins 141 adjacent with described second radiating fin 142 is provided with snapping portion, is used for the described identification piece 20 of holding.In the present embodiment, the bar shaped clasp 140 that described snapping portion protrudes out respectively inwardly for the tip edge along these 2 first radiating fins 141.Simultaneously, in other embodiments, described clasp 140 is not limited to be formed at the top of described radiating fin 14, and it can be formed at other positions of radiating fin 14, and two clasps 140 also can be on the contrary to setting.
Consult Fig. 1 to Fig. 2 again, above-mentioned identification piece 20 is a rectangle elastic metallic lamellar body.Slightly upwards arching upward in the middle part of described identification piece 20, makes this identification piece 20 have certain radian on the whole, places on the end face of described second radiating fin 142 with the correspondence lid.Described identification piece 20 is formed with clasp 140 on the span on the longitudinally and described radiator 10 the spacing of 2 first radiating fins 141 is corresponding consistent.The two opposite sides edge tail of this identification piece 20 is bent upwards respectively and extends a button limit 22, with two clasps, the 140 corresponding blockings of first radiating fin 141 of described radiator 10.Simultaneously, in other embodiments, described button limit 22 is not limited to be extended upward by the side end of identification piece 22, also can extend by other positions of identification piece 22, as extending downwards, as long as described button limit 22 can the corresponding matching blocking with described 140 near terminal, close identification piece 22 middle parts or by identification piece 22 bottom surfaces.When using heat abstractor of the present invention, by modes such as punching presses, can on described identification piece 20, be formed with raise up, to the sign of forms such as lower recess or hollow out, show information such as trade mark, title with correspondence.When described identification piece 20 is installed, only need earlier button limit 22 correspondences of these identification piece 20 1 ends to be placed in the lower surface of the clasp 140 on the described radiator 10, press down the other end of identification piece 20 again, make identification piece 20 generation strains and another is detained the lower surface of another clasp 140 of limit 22 tight fasteners on radiator 10.At this moment, described identification piece 20 second radiating fin 142 that is undertaken in described radiator 10 is on the end face of arch.When dismantling this identification piece 20, only need the above-mentioned flow process of reverse operating to get final product.
In sum, heat abstractor of the present invention is placed in described radiator 10 with an identification piece 20 correspondences to have on the radiating fin 14 of clasp 140 structures, and convenient disassembly is installed firmly.Simultaneously, identification piece 20 is placed on the described radiator 10, can intuitively shows product informations such as trade mark, title, form is attractive in appearance.
Claims (10)
1. heat abstractor, be used for electronic element radiating, it comprises a radiator, this radiator comprises base plate that a bottom surface contacts with described electronic component and the some radiating fins that extend from the end face of this base plate, it is characterized in that: two radiating fins of being separated by are provided with snapping portion, and an identification piece is undertaken on the described radiating fin end face and is interlocked with the snapping portion of described radiating fin.
2. heat abstractor as claimed in claim 1 is characterized in that: the clasp of described snapping portion for being extended in opposite directions by the top of described two radiating fins, described identification piece two ends upwards are bent to form the button limit that is snapped in described clasp below.
3. heat abstractor as claimed in claim 2 is characterized in that: described two clasps are elongated, inwardly extended relatively by the top of described two radiating fins respectively.
4. according to claim 2 or 3 described heat abstractors, it is characterized in that: described base plate is a rectangle plate body, described radiating fin is provided with along the horizontal space of this base plate, and it comprises some first radiating fins that lay respectively at the base plate both sides and some second radiating fins that are positioned at base plate central authorities.
5. heat abstractor according to claim 4 is characterized in that: described two clasps are formed on 2 first radiating fins adjacent with described second radiating fin.
6. heat abstractor according to claim 4 is characterized in that: the height of described second radiating fin is progressively successively decreased by the mediad both sides of base plate, makes the end face of these second radiating fins be arch on the whole.
7. heat abstractor according to claim 4 is characterized in that: the corresponding lid of described identification piece places on described second radiating fin.
8. heat abstractor according to claim 4 is characterized in that: be positioned at the height of the height of outermost second radiating fin less than first radiating fin that is adjacent.
9. according to each described heat abstractor in the claim 1 to 7, it is characterized in that: described identification piece is a rectangle lamellar body.
10. heat abstractor according to claim 9 is characterized in that: upwards arching upward in this identification piece middle part, makes this identification piece have certain radian on the whole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810304472.0A CN101674718A (en) | 2008-09-11 | 2008-09-11 | Radiation device |
| US12/399,030 US20100059203A1 (en) | 2008-09-11 | 2009-03-06 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810304472.0A CN101674718A (en) | 2008-09-11 | 2008-09-11 | Radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101674718A true CN101674718A (en) | 2010-03-17 |
Family
ID=41798200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810304472.0A Pending CN101674718A (en) | 2008-09-11 | 2008-09-11 | Radiation device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100059203A1 (en) |
| CN (1) | CN101674718A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9508653B2 (en) * | 2013-09-18 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Die-tracing in integrated circuit manufacturing and packaging |
| KR20180055635A (en) | 2016-11-14 | 2018-05-25 | 삼성전자주식회사 | Semiconductor module |
| CN107507813A (en) * | 2017-10-10 | 2017-12-22 | 北京比特大陆科技有限公司 | Fin, chip and circuit board |
| US11923264B2 (en) | 2019-09-20 | 2024-03-05 | Samsung Electronics Co., Ltd. | Semiconductor apparatus for discharging heat |
| DE102021116133A1 (en) * | 2021-06-22 | 2022-12-22 | Vacon Oy | heatsink cooling arrangement |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2293487B (en) * | 1994-09-21 | 1998-08-12 | Hewlett Packard Co | Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package |
| US5677829A (en) * | 1995-06-07 | 1997-10-14 | Thermalloy, Inc. | Fan attachment clip for heat sink |
| US5584339A (en) * | 1995-09-08 | 1996-12-17 | Hong; Chen F. | Heat sink assembly for the central processor of computer |
| US5864464A (en) * | 1997-06-09 | 1999-01-26 | Lin; Alex | Heat sink for integrated circuit |
| TW438215U (en) * | 1998-02-10 | 2001-05-28 | D Link Corp | Heat sinks in an electronic production |
| TW479935U (en) * | 2000-06-02 | 2002-03-11 | Yau-Huei Lai | Fastening apparatus of heat dissipation fan |
| US6295202B1 (en) * | 2000-06-29 | 2001-09-25 | Hewlett-Packard Company | Heatsink for actively cooled daughterboard system |
| US6415852B1 (en) * | 2001-01-11 | 2002-07-09 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
| US7339792B2 (en) * | 2005-12-14 | 2008-03-04 | Evga Corporation | Graphics card apparatus with improved heat dissipating assemblies |
| US7515420B2 (en) * | 2007-03-27 | 2009-04-07 | Adc Telecommunications, Inc. | Apparatus for transferring heat between two corner surfaces |
| TWM327156U (en) * | 2007-08-06 | 2008-02-11 | Chin-Fu Horng | Graphite heat dissipation device and clamping rack for clamping graphite heat dissipation fin module |
| CN101936465B (en) * | 2009-07-01 | 2013-07-03 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
-
2008
- 2008-09-11 CN CN200810304472.0A patent/CN101674718A/en active Pending
-
2009
- 2009-03-06 US US12/399,030 patent/US20100059203A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20100059203A1 (en) | 2010-03-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100317 |