CN102543385B - 接合线变压器 - Google Patents
接合线变压器 Download PDFInfo
- Publication number
- CN102543385B CN102543385B CN201110433085.9A CN201110433085A CN102543385B CN 102543385 B CN102543385 B CN 102543385B CN 201110433085 A CN201110433085 A CN 201110433085A CN 102543385 B CN102543385 B CN 102543385B
- Authority
- CN
- China
- Prior art keywords
- transformer
- bond wire
- line
- closing line
- secondary engagement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F19/00—Fixed transformers or mutual inductances of the signal type
- H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
- H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
- H03F1/0294—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers using vector summing of two or more constant amplitude phase-modulated signals
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/217—Class D power amplifiers; Switching amplifiers
- H03F3/2176—Class E amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4905—Shape
- H01L2224/49051—Connectors having different shapes
- H01L2224/49052—Different loop heights
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/537—A transformer being used as coupling element between two amplifying stages
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/541—Transformer coupled at the output of an amplifier
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Amplifiers (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10193629.2 | 2010-12-03 | ||
EP10193629 | 2010-12-03 | ||
EP10194851.1 | 2010-12-14 | ||
EP10194851.1A EP2461335B1 (en) | 2010-12-03 | 2010-12-14 | Bond wire transformer |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102543385A CN102543385A (zh) | 2012-07-04 |
CN102543385B true CN102543385B (zh) | 2015-04-08 |
Family
ID=44992434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110433085.9A Expired - Fee Related CN102543385B (zh) | 2010-12-03 | 2011-12-05 | 接合线变压器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9048020B2 (zh) |
EP (1) | EP2461335B1 (zh) |
CN (1) | CN102543385B (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9911838B2 (en) | 2012-10-26 | 2018-03-06 | Ixys Corporation | IGBT die structure with auxiliary P well terminal |
US8686513B1 (en) * | 2012-10-26 | 2014-04-01 | Ixys Corporation | IGBT assembly having circuitry for injecting/extracting current into/from an auxiliary P well |
US8976561B2 (en) | 2012-11-14 | 2015-03-10 | Power Integrations, Inc. | Switch mode power converters using magnetically coupled galvanically isolated lead frame communication |
US8818296B2 (en) | 2012-11-14 | 2014-08-26 | Power Integrations, Inc. | Noise cancellation for a magnetically coupled communication link utilizing a lead frame |
US9035435B2 (en) | 2012-11-14 | 2015-05-19 | Power Integrations, Inc. | Magnetically coupled galvanically isolated communication using lead frame |
EP2736166A1 (en) * | 2012-11-22 | 2014-05-28 | Nxp B.V. | Power combiner |
US9660606B2 (en) * | 2013-04-29 | 2017-05-23 | Skyworks Solutions, Inc. | Autotransformer-based impedance matching circuits and methods for radio-frequency applications |
EP2838195B1 (en) | 2013-08-14 | 2018-10-03 | Ampleon Netherlands B.V. | Combiner circuit for a class-e outphasing power amplifier |
US9337183B2 (en) * | 2013-11-01 | 2016-05-10 | Infineon Technologies Ag | Transformer input matched transistor |
EP2991085B1 (en) | 2014-08-28 | 2020-08-26 | Ampleon Netherlands B.V. | Transformer |
US9589916B2 (en) * | 2015-02-10 | 2017-03-07 | Infineon Technologies Ag | Inductively coupled transformer with tunable impedance match network |
US9628032B1 (en) * | 2015-12-11 | 2017-04-18 | Infineon Technologies Ag | RF device package with integrated hybrid coupler |
TWI690043B (zh) | 2016-02-17 | 2020-04-01 | 瑞昱半導體股份有限公司 | 積體電路裝置 |
US11127689B2 (en) | 2018-06-01 | 2021-09-21 | Qorvo Us, Inc. | Segmented shielding using wirebonds |
US11219144B2 (en) | 2018-06-28 | 2022-01-04 | Qorvo Us, Inc. | Electromagnetic shields for sub-modules |
US11114363B2 (en) | 2018-12-20 | 2021-09-07 | Qorvo Us, Inc. | Electronic package arrangements and related methods |
US11515282B2 (en) | 2019-05-21 | 2022-11-29 | Qorvo Us, Inc. | Electromagnetic shields with bonding wires for sub-modules |
CN115188559B (zh) * | 2022-09-08 | 2022-12-09 | 东南大学 | 一种基于折纸结构的mems电感 |
CN116779574B (zh) * | 2023-08-08 | 2024-04-19 | 深圳市锐骏半导体股份有限公司 | 集成采样电阻的半导体装置及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1202296A1 (en) * | 2000-10-27 | 2002-05-02 | Xerox Corporation | Out-of-plane microcoil using bonding wires and method for making |
US7714649B1 (en) * | 2008-06-02 | 2010-05-11 | Rockwell Collins, Inc. | High-efficiency linear amplifier using non linear circuits |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4686492A (en) * | 1985-03-04 | 1987-08-11 | Tektronix, Inc. | Impedance match connection using multiple layers of bond wires |
US6586309B1 (en) * | 2000-04-24 | 2003-07-01 | Chartered Semiconductor Manufacturing Ltd. | High performance RF inductors and transformers using bonding technique |
US6836183B2 (en) * | 2002-10-16 | 2004-12-28 | Icefyre Semiconductor Corporation | Chireix architecture using low impedance amplifiers |
US7002249B2 (en) * | 2002-11-12 | 2006-02-21 | Primarion, Inc. | Microelectronic component with reduced parasitic inductance and method of fabricating |
US6998952B2 (en) * | 2003-12-05 | 2006-02-14 | Freescale Semiconductor, Inc. | Inductive device including bond wires |
US7250684B2 (en) * | 2004-06-30 | 2007-07-31 | Intel Corporation | Circular wire-bond pad, package made therewith, and method of assembling same |
US7091791B1 (en) | 2004-07-23 | 2006-08-15 | Atheros Communications, Inc. | Transformer implementation using bonding wires |
US7453142B2 (en) * | 2005-12-05 | 2008-11-18 | Texas Instruments Incorporated | System and method for implementing transformer on package substrate |
WO2008123082A1 (ja) * | 2007-03-29 | 2008-10-16 | Nec Corporation | インダクタ、配線基板、および半導体装置 |
US8269555B2 (en) | 2008-05-05 | 2012-09-18 | Nxp B.V. | Efficient linear LINC power amplifier |
US8174322B2 (en) | 2010-05-04 | 2012-05-08 | Nxp B.V. | Power control of reconfigurable outphasing chireix amplifiers and methods |
US8203386B2 (en) | 2010-05-04 | 2012-06-19 | Nxp B.V. | Reconfigurable outphasing Chireix amplifiers and methods |
-
2010
- 2010-12-14 EP EP10194851.1A patent/EP2461335B1/en active Active
-
2011
- 2011-12-02 US US13/310,293 patent/US9048020B2/en active Active
- 2011-12-05 CN CN201110433085.9A patent/CN102543385B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1202296A1 (en) * | 2000-10-27 | 2002-05-02 | Xerox Corporation | Out-of-plane microcoil using bonding wires and method for making |
US7714649B1 (en) * | 2008-06-02 | 2010-05-11 | Rockwell Collins, Inc. | High-efficiency linear amplifier using non linear circuits |
Also Published As
Publication number | Publication date |
---|---|
US20120139640A1 (en) | 2012-06-07 |
US9048020B2 (en) | 2015-06-02 |
EP2461335A1 (en) | 2012-06-06 |
CN102543385A (zh) | 2012-07-04 |
EP2461335B1 (en) | 2015-09-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151111 Address after: Holland Ian Deho Finn Patentee after: Samba Holdings Netherlands Ltd. Address before: Holland Ian Deho Finn Patentee before: NXP B.V. |
|
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Nijmegen Patentee after: Ampleon Netherlands B.V. Address before: Holland Ian Deho Finn Patentee before: Samba Holdings Netherlands Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150408 Termination date: 20211205 |
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CF01 | Termination of patent right due to non-payment of annual fee |