CN102531370B - Device and method for removing edge defects of glass plate - Google Patents
Device and method for removing edge defects of glass plate Download PDFInfo
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- CN102531370B CN102531370B CN201010607453.2A CN201010607453A CN102531370B CN 102531370 B CN102531370 B CN 102531370B CN 201010607453 A CN201010607453 A CN 201010607453A CN 102531370 B CN102531370 B CN 102531370B
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- board material
- glass board
- laser beam
- face
- glass
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- 239000011521 glass Substances 0.000 title claims abstract description 99
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000007547 defect Effects 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 claims description 73
- 230000037361 pathway Effects 0.000 claims description 16
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 239000000112 cooling gas Substances 0.000 claims description 7
- 238000007373 indentation Methods 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- 238000003776 cleavage reaction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000006063 cullet Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229940098458 powder spray Drugs 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a device and a method for removing edge defects of a glass plate, wherein the device comprises: a carrier, a laser output unit, a light path guiding unit and a control unit. The carrying platform is used for carrying the glass plate. The laser output unit is used for outputting a laser beam. The light path guiding unit is used for guiding the laser light to be a laser beam to irradiate one end face of the edge of the glass plate. The control unit is electrically coupled with the laser output unit and the light path guiding unit and used for controlling the triggering time of the laser beam and the energy density of the laser beam and controlling the irradiation path and the moving speed of the laser beam, and a layer of glass chips is generated on the end surface of the glass plate by splitting due to the high temperature gradient difference between the irradiation and non-irradiation of the laser beam so as to form a smooth surface.
Description
Technical field
The present invention relates to a kind of devices and methods therefor that removes glass board material edge tiny flaw, particularly relate to a kind of high-temperature gradient that utilizes irradiating laser light poor and produce into the devices and methods therefor of cleavage effect at glass board material end face.
Background technology
At present in the time of processed glass sheet material, if processed and applied is at the glass substrate of LCD panel, at glass substrate after flywheel knife cutting, sliver (breaking), have at section the tiny crack (micro-crack) that cutting splitting process produces, this tiny crack can cause the reduction of strength of glass.Its improvement method, has utilization mechanical edging (grinding) relatively consuming time, and the speed of its processing is about 10～80mm/s.Another kind improves tiny crack method, as TaiWan, China I317667 patent discloses, to be used in glass substrate end face long side direction 70 to spend with interior, thickness of slab direction 70 and spend with interior laser light irradiation glass substrate end face, be 0.1～200mm/s with respect to glass substrate speed, simultaneously with cooling gas to laser light irradiation portion, blow, make heating and melten glass end face and tiny crack thereof, make the end face of smoothing glass substrate.
Summary of the invention
The object of the present invention is to provide a kind of device and method that removes glass board material edge defect, to address the above problem.
For reaching above-mentioned purpose, the present invention discloses a kind of device that removes glass board material edge defect, and its structure comprises: a microscope carrier in order to bearing glass sheet material.One in order to export the Laser output unit of a laser beam.One light path guidance unit, is disposed in the light path of laser beam, becomes a laser beam and irradiates the end face in glass board material edge in order to guided laser light, and this glass board material comprises the flaky material such as glass substrate or eyeglass.An and control unit, electric property coupling Laser output unit and light path guidance unit, trigger time-histories and energy density in order to the laser beam of controlling Laser output unit, with exposure pathways and the translational speed of control light path guidance unit to laser beam, to go out one deck glass swarf in end face splitting, to reach the defect that removes glass board material edge, separately can form the end face of shiny surface.
The present invention also discloses a kind of method that removes glass board material edge defect, and its step comprises: with a laser beam irradiation in a glass board material end face; And control the exposure pathways of this laser beam, make this laser beam sequentially cover this glass board material end face, the high thermograde of this glass board material end face because of the irradiation of this laser beam and between not irradiating is poor, go out one deck glass swarf and produce splitting at this end face, to reach the defect that removes glass board material edge.
Brief description of the drawings
Fig. 1 is the system block schematic diagram of the embodiment of the device that removes glass board material edge tiny flaw of the present invention;
Fig. 2 is the flow chart of steps of the method that removes glass board material edge tiny flaw of the present invention;
Fig. 3 is the schematic perspective view of exposure pathways the first embodiment of Fig. 1;
Fig. 4 is the schematic perspective view of exposure pathways the second embodiment of Fig. 1;
Fig. 5 adds a wind pushing nozzle so that the schematic perspective view of glass board material cooling gas embodiment to be provided for the present invention; And
Fig. 6 adds a wind pushing nozzle so that the schematic perspective view of glass board material end face cooling gas embodiment to be provided for the present invention.
Main element nomenclature
10 glass board materials
11 end faces
12 minor faces
13 long limits
14 indentations
20 microscope carriers
30 Laser output unit
31 laser beams
40 light path guidance units
41 laser beams
50 control units
51 telecommunication signals
60 wind pushing nozzles
D spot diameter
G cooling gas
S glass swarf
T exposure pathways
T1, t2, t3, t4 path
T5, t6, t7, t8 path
P spacing
Step S10, step S20 method steps
Embodiment
Carry out the present invention study start time, the first defect placing glass powder on glass board material end face, recycling laser light is irradiated in glass board material end face, while irradiation because of laser light, glass powder spray can be held, or first utilize laser light to irradiate in glass board material end face, placing glass powder again, all cannot remove the defect at glass board material edge, another method becomes the condition of high temperature for utilizing laser light to irradiate in glass board material end face, flatten by external force again, cause is when laser light irradiation is in the time that glass board material end face removes laser light, energy after irradiate light reduces rapidly, still cannot flatten and the defect at glass board material edge is removed.Hereby Success in Experiment of the present invention is described as follows.
The present invention utilizes laser beam irradiation in glass board material end face, poor to produce high thermograde, and then produces cleavage effect at end face, to reach the defect that removes glass board material edge, separately can make end face form shiny surface.
Hereby coordinate accompanying drawing that all the present invention embodiment are described in detail as follows.
As shown in Figure 1, the device that removes glass board material 10 edge tiny flaws of the present embodiment comprises: a microscope carrier 20, can control x, y, the motion of z direction of principal axis, with bearing glass sheet material 10, its glass board material 10 can be fixed on microscope carrier 20, and the end face 11 of wish processing toward the outer side.One Laser output unit 30, to export a laser beam 31.One light path guidance unit 40, this light path guidance unit 40 can be one scan device, be disposed in the light path of laser beam 31, can apply the optical module (not shown) in this light path guidance unit 40, laser beam 31 is guided as laser beam 41, and laser beam 41 irradiates on an end face 11 at these glass board material 10 edges again.One control unit 50, electric property coupling Laser output unit 30 and light path guidance unit 40, export telecommunication signal 51 to control triggering time-histories and the energy density of this laser beam 31 of this Laser output unit 30 by control unit 50, the output telecommunication signal 51 of control unit 50 also can be controlled exposure pathways t and the translational speed of this laser beam of reinventing 41 of this light path guidance unit 40.By the irradiation of laser beam 41, can produce splitting at this end face 11 and go out one deck glass swarf s (as shown in Figure 5), to reach the defect that removes glass board material edge, separately can make this end face 11 form a shiny surface.
As shown in Figure 2, in the present embodiment, the step that removes the method for glass board material 10 edge tiny flaws comprises: step S10, irradiates in glass board material 10 end faces 11 with a laser beam 41.And step S20, control the exposure pathways t of this laser beam 41, make this laser beam 41 sequentially cover these glass board material 10 end faces 11 (or cover want splitting process zone starting point to terminal), the high thermograde of these glass board material 10 end faces 11 because of the irradiation of this laser beam 41 and between not irradiating is poor, go out one deck glass swarf s (as shown in Figure 5) and produce splitting at this end face 11, make this end face 11 form smooth machined surface.And its splitting direction is the direction along the exposure pathways t of this laser beam 41.
Please refer to again Fig. 3, and simultaneously with reference to shown in figure 1, in above-described embodiment, a microscope carrier 20, can control x, y, z direction of principal axis motion, comprises with a minor face 12 of this glass board material 10 end faces 11 the exposure pathways t of this laser beam 41 and forms multiple parallel lines, maintains a spacing p between each parallel lines, and the tendency of its exposure pathways t is sequentially: after triggering this laser beam 31 and irradiating, utilize this light path guidance unit 40 to make the walk path t1 of parallel this minor face 12 of this laser beam 41; Stop again the irradiation of this laser beam 31, and the irradiation position of this laser beam 41 is moved according to path t2; Again trigger the irradiation of this laser beam 31, and move according to path t3, then stop irradiating and moving according to path t4, and repeat this one irradiate and move mode cover whole end face 11 regions (or cover want splitting starting point to terminal).
Please refer to Fig. 4, and simultaneously with reference to shown in figure 1, in above-described embodiment, the exposure pathways t of this laser beam 41 comprises with a long limit 13 of this glass board material 10 end faces 11 and forms multiple parallel lines, between each parallel lines, maintain a spacing p, and the tendency of its exposure pathways t is sequentially: after triggering this laser beam 31 and irradiating, utilize this light path guidance unit 40 to make this reinvent the walk path t5 on parallel this length limit 13 of laser beam 41; Make again this laser beam 31 stop irradiating, and the irradiation position of this laser beam 41 is moved according to path t6; Again trigger the irradiation of this laser beam 31, and move according to path t7, then stop irradiate and move according to path t8, and repeat this one irradiate and move mode cover whole end face 11 regions.
In above-mentioned enforcement, the output wavelength of this Laser output unit 30 this laser beam 31 of exporting is preferably between 3 to 12um wave bands, or better wavelength is between 9 to 12um wave bands.
In above-mentioned enforcement, control the irradiation energy of laser beam 41, make this layer of glass swarf thickness that its splitting goes out can be between between 1um to 1mm.
In above-mentioned enforcement, this laser beam 41 is greater than 500mm/s with respect to the speed of these glass board material 10 end faces 11.
In above-mentioned enforcement, the spacing p of the laser beam 41 exposure pathways t of glass board material 10 end faces 11 is: (spot diameter d/25)≤spacing p≤spot diameter d, wherein, spot diameter d is that this reinvents spot diameter size after the focusing of laser beam 41, and after this focusing, spot diameter d is reduced to the 1/e of high part with energy distribution
2time width, e is the truth of a matter of natural logarithm function.And the energy density of this laser beam 41 is between 1 × 10
4to 1 × 10
6w/cm
2between.
Shown in Fig. 5 and Fig. 6, in the present embodiment with front take off the device of embodiment or apply step major part identical, but more include, a wind pushing nozzle 60 is set, this wind pushing nozzle 60 can be reinvented postradiation this end face of laser beam 41 11 region output cooling gas g to this glass board material 10 or to this, poor for more improving this thermograde, and then promote cleave velocity.
It is worth mentioning that, as shown in Fig. 2, Fig. 5, before administration step S10, these glass board material 10 end faces 11 can be carved an indentation 14 in advance, as the beginning or end of splitting, certainly also can carve in advance a starting point and a terminal simultaneously.And this indentation 14 can utilize mechanical type cutter or laser beam and be carved into.
Feature of the present invention is, the present invention utilizes laser beam to irradiate at glass board material end face, after the heat of glass board material absorbing laser light, form high-temperature gradient, expanding with heat and contract with cold of producing forms a thermal stresses, make glass board material end face splitting one deck cullet, eliminate thus the tiny crack on glass board material edge surface, make glass board material end face smooth, can promote glass strain intensity.
In sum, the above only notebook invent as presenting embodiment or the embodiment of the adopted technique means of dealing with problems, be not used for limiting the scope of patent working of the present invention.Be allly to conform to the claims in the present invention context, or equal variation and the modification done according to the claims in the present invention, be all the claims in the present invention and contain.
Claims (11)
1. remove a method for glass board material edge defect, its step comprises:
With a laser beam irradiation in a glass board material end face; And
Control the exposure pathways of this laser beam, make this laser beam sequentially cover this glass board material end face, this exposure pathways forms multiple parallel lines in a minor face or a long limit of this end face, the high thermograde of this glass board material end face because of the irradiation of this laser beam and between not irradiating is poor, go out one deck glass swarf and produce splitting at this end face, and its splitting direction is along the direction of the exposure pathways of this laser beam, to reach the defect that removes glass board material edge.
2. the method that removes as claimed in claim 1 glass board material edge defect, it bestows a cooling gas in this glass board material, poor to improve this thermograde.
3. remove as claimed in claim 1 the method for glass board material edge defect, wherein the area synchronized of this glass board material end face after this laser beam irradiation bestowed a cooling gas, poor to improve this thermograde.
4. remove as claimed in claim 1 the method for glass board material edge defect, control the irradiation energy of laser beam, make this layer of glass swarf that wherein splitting goes out between 1um to 1mm.
5. remove as claimed in claim 1 the method for glass board material edge defect, wherein implementing this laser beam irradiation before a glass board material end face step, this glass board material end face can be carved an indentation in advance, as the beginning or end of splitting.
6. the method that removes as claimed in claim 5 glass board material edge defect, wherein this indentation is carved into mechanical type cutter or laser beam.
7. remove as claimed in claim 1 the method for glass board material edge defect, wherein the output wavelength of this laser beam is 3 to 12um wave bands.
8. the method that removes as claimed in claim 1 glass board material edge defect, wherein this laser beam is greater than 500mm/s with respect to the speed of this glass board material end face.
9. remove as claimed in claim 1 the method for glass board material edge defect, wherein the spacing in this laser beam irradiation path of this glass board material end face>=(d/25) and≤d, d is that this reinvents spot diameter size after the focusing of laser beam, and energy distribution is reduced to the 1/e of high part
2time width, e is the truth of a matter of natural logarithm function.
10. the method that removes as claimed in claim 1 glass board material edge defect, wherein the energy density of this laser beam is between 1 × 10
4to 1 × 10
6w/cm
2.
11. remove as claimed in claim 1 the method for glass board material edge defect, in a glass board material end face, to reach the tiny flaw that removes glass board material edge, and make this end face form a shiny surface through laser beam irradiation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099144580 | 2010-12-17 | ||
| TW99144580A TWI400137B (en) | 2010-12-17 | 2010-12-17 | Device for removing defects on edges of glass sheets and method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102531370A CN102531370A (en) | 2012-07-04 |
| CN102531370B true CN102531370B (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010607453.2A Active CN102531370B (en) | 2010-12-17 | 2010-12-27 | Device and method for removing edge defects of glass plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102531370B (en) |
| TW (1) | TWI400137B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6638514B2 (en) | 2015-03-31 | 2020-01-29 | 日本電気硝子株式会社 | Cutting method for brittle substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101505908A (en) * | 2006-08-24 | 2009-08-12 | 康宁股份有限公司 | Laser separation of thin laminated glass substrates for flexible display applications |
| TW201021950A (en) * | 2008-12-04 | 2010-06-16 | Ind Tech Res Inst | A laser processing apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI277612B (en) * | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
| TWI221102B (en) * | 2002-08-30 | 2004-09-21 | Sumitomo Heavy Industries | Laser material processing method and processing device |
| JP5011048B2 (en) * | 2007-09-27 | 2012-08-29 | 三星ダイヤモンド工業株式会社 | Processing method of brittle material substrate |
| JP4790735B2 (en) * | 2008-01-08 | 2011-10-12 | 長野県 | Laser processing apparatus and laser processing method |
-
2010
- 2010-12-17 TW TW99144580A patent/TWI400137B/en active
- 2010-12-27 CN CN201010607453.2A patent/CN102531370B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101505908A (en) * | 2006-08-24 | 2009-08-12 | 康宁股份有限公司 | Laser separation of thin laminated glass substrates for flexible display applications |
| TW201021950A (en) * | 2008-12-04 | 2010-06-16 | Ind Tech Res Inst | A laser processing apparatus |
Non-Patent Citations (1)
| Title |
|---|
| 殷苏民，张雷洪，许仁军，张凌峰，葛涛.激光热应力切割玻璃实验与分析.《中国工程科学》.2007, * |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201226093A (en) | 2012-07-01 |
| CN102531370A (en) | 2012-07-04 |
| TWI400137B (en) | 2013-07-01 |
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