CN102531370A - Device and method for removing edge defects of glass plate - Google Patents
Device and method for removing edge defects of glass plate Download PDFInfo
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- CN102531370A CN102531370A CN2010106074532A CN201010607453A CN102531370A CN 102531370 A CN102531370 A CN 102531370A CN 2010106074532 A CN2010106074532 A CN 2010106074532A CN 201010607453 A CN201010607453 A CN 201010607453A CN 102531370 A CN102531370 A CN 102531370A
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- 239000011521 glass Substances 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000007547 defect Effects 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims description 87
- 230000037361 pathway Effects 0.000 claims description 17
- 239000000112 cooling gas Substances 0.000 claims description 9
- 230000002950 deficient Effects 0.000 claims description 9
- 238000007373 indentation Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000003760 hair shine Effects 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- 238000003776 cleavage reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 230000009184 walking Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000006063 cullet Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229940098458 powder spray Drugs 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a device and a method for removing edge defects of a glass plate, wherein the device comprises: a carrier, a laser output unit, a light path guiding unit and a control unit. The carrying platform is used for carrying the glass plate. The laser output unit is used for outputting a laser beam. The light path guiding unit is used for guiding the laser light to be a laser beam to irradiate one end face of the edge of the glass plate. The control unit is electrically coupled with the laser output unit and the light path guiding unit and used for controlling the triggering time of the laser beam and the energy density of the laser beam and controlling the irradiation path and the moving speed of the laser beam, and a layer of glass chips is generated on the end surface of the glass plate by splitting due to the high temperature gradient difference between the irradiation and non-irradiation of the laser beam so as to form a smooth surface.
Description
Technical field
The present invention relates to a kind of devices and methods therefor that removes glass board material edge tiny flaw, particularly relate to a kind of high-temperature gradient difference of utilizing irradiating laser light and produce into the devices and methods therefor of cleavage effect at the glass board material end face.
Background technology
At present when processed glass sheet material; Like the glass substrate of processed and applied at the LCD panel; After glass substrate is through flywheel knife cutting, sliver (breaking), have the tiny crack (micro-crack) that the cutting splitting process produces at section, this tiny crack can cause the reduction of strength of glass.Its improvement method has and utilizes mechanical edging (grinding) more consuming time relatively, and the speed of its processing is about 10～80mm/s.Another kind improves the tiny crack method; Such as TaiWan, China I317667 patent announcement, be used in glass substrate end face long side direction 70 degree with interior, thickness of slab direction 70 degree with interior laser light irradiation glass substrate end face, be 0.1～200mm/s with respect to glass substrate speed; Simultaneously with cooling gas to laser light irradiation portion; Blow, make heating and melten glass end face and tiny crack thereof, make the end face of smoothing glass substrate.
Summary of the invention
The object of the present invention is to provide a kind of device and method that removes the glass board material edge defect, to address the above problem.
For reaching above-mentioned purpose, the present invention discloses a kind of device that removes the glass board material edge defect, and its structure comprises: a microscope carrier in order to bearing glass sheet material.One in order to export the laser output unit of a laser beam.One light path guidance unit is disposed on the light path of laser beam, becomes a laser beam and shines the end face in the glass board material edge in order to guided laser light, and this glass board material comprises flaky materials such as glass substrate or eyeglass.An and control unit; Electric property coupling laser output unit and light path guidance unit; Laser beam in order to control laser output unit triggers time-histories and energy density, with exposure pathways and the translational speed of control light path guidance unit to laser beam, to go out one deck glass swarf in the end face splitting; To reach the defective that removes the glass board material edge, can form the end face of shiny surface in addition.
The present invention also discloses a kind of method that removes the glass board material edge defect, and its step comprises: with a laser beam irradiation in a glass board material end face; And the exposure pathways of controlling this laser beam; Make this laser beam cover this glass board material end face in regular turn; This glass board material end face is because of the irradiation of this laser beam and the high thermograde between the irradiation is poor; Go out one deck glass swarf and produce splitting, to reach the defective that removes the glass board material edge at this end face.
Description of drawings
Fig. 1 is system's block schematic diagram of the embodiment of the device that removes glass board material edge tiny flaw of the present invention;
Fig. 2 is the flow chart of steps that removes the method for glass board material edge tiny flaw of the present invention;
Fig. 3 is the schematic perspective view of exposure pathways first embodiment of Fig. 1;
Fig. 4 is the schematic perspective view of exposure pathways second embodiment of Fig. 1;
Fig. 5 adds a wind pushing nozzle so that the schematic perspective view of glass board material cooling gas embodiment to be provided for the present invention; And
Fig. 6 adds a wind pushing nozzle so that the schematic perspective view of glass board material end face cooling gas embodiment to be provided for the present invention.
The main element nomenclature
10 glass board materials
11 end faces
12 minor faces
13 long limits
14 indentations
20 microscope carriers
30 laser output units
31 laser beams
40 light path guidance units
41 laser beams
50 control units
51 telecommunication signals
60 wind pushing nozzles
The d spot diameter
The g cooling gas
S glass swarf
The t exposure pathways
T1, t2, t3, t4 path
T5, t6, t7, t8 path
The p spacing
Step S10, step S20 method steps
Embodiment
Study when beginning carrying out the present invention, the defective on the glass board material end face is placed glass powder earlier, utilizes laser light to shine in the glass board material end face again; Can the glass powder spray be held when shining, or utilize laser light to shine earlier, place glass powder again in the glass board material end face because of laser light; All can't remove the defective at glass board material edge; A kind of in addition method becomes the condition of high temperature for utilizing laser light to shine in the glass board material end face, flatten with external force again, because of when laser light irradiation when the glass board material end face removes laser light; Energy after the irradiate light reduces rapidly, still can't flatten and the defective at glass board material edge is removed.Now as follows with Success in Experiment explanation of the present invention.
The present invention utilizes laser beam irradiation in the glass board material end face, and is poor to produce high thermograde, and then produces cleavage effect at end face, to reach the defective that removes the glass board material edge, can make end face form shiny surface in addition.
Now conjunction with figs. specifies all embodiment of the present invention as follows.
As shown in Figure 1, the device that removes glass board material 10 edge tiny flaws of present embodiment comprises: a microscope carrier 20, may command x; Y, the motion of z direction of principal axis is with bearing glass sheet material 10; Its glass board material 10 can be fixed on the microscope carrier 20, and the end face 11 of desire processing toward the outer side.One laser output unit 30 is to export a laser beam 31.One light path guidance unit 40; This light path guidance unit 40 can be the one scan device; Be disposed on the light path of laser beam 31; Can use the optical module (not shown) in this light path guidance unit 40, laser beam 31 guidings are laser beam 41, laser beam 41 shines on an end face 11 at these glass board material 10 edges again.One control unit 50; Electric property coupling laser output unit 30 and light path guidance unit 40; By triggering time-histories and the energy density of control unit 50 output telecommunication signals 51 with this laser beam 31 of controlling this laser output unit 30, the output telecommunication signal 51 of control unit 50 is the exposure pathways t and the translational speed of this laser beam of reinventing 41 of this light path guidance unit 40 of may command also.Through the irradiation of laser beam 41, can produce splitting at this end face 11 and go out one deck glass swarf s (as shown in Figure 5), to reach the defective that removes the glass board material edge, can make this end face 11 form a shiny surface in addition.
As shown in Figure 2, in the present embodiment, the step that removes the method for glass board material 10 edge tiny flaws comprises: step S10, shine in a glass board material 10 end faces 11 with a laser beam 41.And step S20; Control the exposure pathways t of this laser beam 41; Make this laser beam 41 cover in regular turn these glass board material 10 end faces 11 (or cover want the splitting process zone starting point to terminal); These glass board material 10 end faces 11 are because of the irradiation of this laser beam 41 and the high thermograde between the irradiation is poor, go out one deck glass swarf s (as shown in Figure 5) and produce splittings at this end face 11, make this end face 11 form smooth machined surface.And its splitting direction is the direction along the exposure pathways t of this laser beam 41.
Again please with reference to Fig. 3, and simultaneously with reference to shown in Figure 1, in the foregoing description; One microscope carrier 20, may command x, y; Z direction of principal axis motion, a minor face 12 that makes the exposure pathways t of this laser beam 41 comprise with this glass board material 10 end faces 11 forms a plurality of parallel lines, keeps a spacing p between each parallel lines; And the tendency of its exposure pathways t is in regular turn: after triggering these laser beam 31 irradiations, utilize this light path guidance unit 40 to make the path t1 of parallel this minor face 12 of these laser beam 41 walkings; Stop the irradiation of this laser beam 31 again, and the irradiation position of this laser beam 41 is moved according to path t2; Trigger the irradiation of this laser beam 31 once more, and move, stop irradiation again and move according to path t4 according to path t3, and repeat this irradiation and move mode cover whole end face 11 zones (or cover want splitting starting point to terminal).
Please with reference to Fig. 4; And simultaneously with reference to shown in Figure 1; In the foregoing description, the exposure pathways t of this laser beam 41 comprises a plurality of parallel lines of long limit 13 formation with this glass board material 10 end faces 11, keeps a spacing p between each parallel lines; And the tendency of its exposure pathways t is in regular turn: after triggering these laser beam 31 irradiations, utilize this light path guidance unit 40 to make this reinvent the path t5 on parallel this length limit 13 of laser beam 41 walkings; Make this laser beam 31 stop irradiation again, and the irradiation position of this laser beam 41 is moved according to path t6; Trigger the irradiation of this laser beam 31 once more, and move, stop irradiation again and move, and repeat this irradiation and move mode is covered whole end face 11 zones according to path t8 according to path t7.
In above-mentioned enforcement, the output wavelength of this laser output unit 30 this laser beam 31 of exporting is preferably between 3 to the 12um wave bands, or better wavelength is between 9 to the 12um wave bands.
In the above-mentioned enforcement, the irradiation energy of control laser beam 41, this layer glass swarf thickness that its splitting is gone out can be between between the 1um to 1mm.
In the above-mentioned enforcement, this laser beam 41 with respect to the speed of these glass board material 10 end faces 11 greater than 500mm/s.
In the above-mentioned enforcement; The spacing p of the laser beam 41 exposure pathways t of glass board material 10 end faces 11 is: (spot diameter d/25)≤spacing p≤spot diameter d; Wherein, Spot diameter d reinvents spot diameter size after the focusing of laser beam 41 for this, and this focusings afterwards spot diameter d is reduced to the 1/e of high part with energy distribution
2The time width, e is the truth of a matter of natural logarithm function.And the energy density of this laser beam 41 is between 1 * 10
4To 1 * 10
6W/cm
2Between.
Please consult Fig. 5 and shown in Figure 6 again; In the present embodiment with the device of preceding taking off embodiment or execute that to make the step major part identical; But more include a wind pushing nozzle 60 is set; This wind pushing nozzle 60 can be reinvented laser beam 41 postradiation this end face 11 zone output cooling gas g to this glass board material 10 or to this, and it is poor to be used for more improving this thermograde, and then promotes cleave velocity.
What deserves to be mentioned is that like Fig. 2, shown in Figure 5, before administration step S10, these glass board material 10 end faces 11 can be carved an indentation 14 in advance,, also can carve a starting point and a terminal point simultaneously in advance certainly as the beginning or end of splitting.And these indentation 14 mechanical type cutters capable of using or laser beam and be carved into.
Characteristics of the present invention are; The present invention utilizes laser beam in the irradiation of glass board material end face, forms high-temperature gradient behind the heat of glass board material absorption laser beam, and expanding with heat and contract with cold of generation forms a thermal stresses; Make glass board material end face splitting one deck cullet; Eliminate the tiny crack on the glass board material edge surface thus, make glass board material end face smooth, can the lifting glass stress intensity.
In sum, the above only notebook invention be not the scope that is used for limiting patent working of the present invention for presenting the embodiment or the embodiment of the technique means that adopted of dealing with problems.Be that claim context all and of the present invention conforms to, or, be all claim of the present invention and contain according to equal variation and modification that claim of the present invention is done.
Claims (19)
1. device that removes the glass board material edge defect comprises:
Microscope carrier is in order to carry this glass board material;
The laser output unit is in order to export a laser beam;
The light path guidance unit is disposed on the light path of this laser beam, is that a laser beam shines the end face in this glass board material edge in order to guide this laser beam; And
Control unit; This laser output unit of electric property coupling and this light path guidance unit; This laser beam in order to control this laser output unit triggers time-histories and energy density; With the exposure pathways and the translational speed of this laser beam of controlling this light path guidance unit, produce splitting at this end face and go out one deck glass swarf, to reach the defective that removes the glass board material edge.
2. remove the device of glass board material edge defect according to claim 1, wherein the output wavelength of this this laser beam of laser output unit output is 3 to 12um wave bands.
3. remove the device of glass board material edge defect according to claim 1, the irradiation energy of this control laser beam makes this layer glass swarf thickness that wherein this splitting goes out between 1um to 1mm.
4. remove the device of glass board material edge defect according to claim 1, wherein this light path guidance unit is the one scan device.
5. remove the device of glass board material edge defect according to claim 1; Microscope carrier may command x wherein, y, the motion of z direction of principal axis; The minor face or the long limit that make the exposure pathways of this laser beam comprise with this end face form a plurality of parallel lines, have a spacing between each parallel lines.
6. remove the device of glass board material edge defect according to claim 1, also comprise wind pushing nozzle, this wind pushing nozzle can be to this glass board material output cooling gas.
7. remove the device of glass board material edge defect according to claim 1, also comprise a wind pushing nozzle, this wind pushing nozzle can be reinvented the zone output cooling gas behind the laser beam irradiation to this of this end face of this glass board material.
8. method that removes the glass board material edge defect, its step comprises:
With a laser beam irradiation in a glass board material end face; And
Control the exposure pathways of this laser beam; Make this laser beam cover this glass board material end face in regular turn; This glass board material end face is because of the irradiation of this laser beam and the high thermograde between the irradiation is poor; Go out one deck glass swarf and produce splitting, to reach the defective that removes the glass board material edge at this end face.
9. like the said method that removes the glass board material edge defect of claim 8, it bestows a cooling gas in this glass board material, and is poor to improve this thermograde.
10. like the said method that removes the glass board material edge defect of claim 8, wherein the area synchronized of this glass board material end face behind this laser light irradiation bestowed a cooling gas, and be poor to carry this high-temperature gradient.
11. like the said method that removes glass board material edge tiny flaw of claim 8, the irradiation energy of control laser beam makes this layer glass swarf that wherein splitting goes out between 1um to 1mm.
12. like the said method that removes the glass board material edge defect of claim 8, wherein implementing this laser beam irradiation before a glass board material end face step, this glass board material end face can be carved an indentation in advance, as the beginning or end of splitting.
13. like the said method that removes the glass board material edge defect of claim 12, wherein this indentation is carved into mechanical type cutter or laser beam.
14. like the said method that removes the glass board material edge defect of claim 8, wherein the output wavelength of this laser beam is 3 to 12um wave bands.
15. like the said method that removes glass board material edge tiny flaw of claim 8, wherein this laser beam with respect to the speed of this glass board material end face greater than 500mm/s.
16. like the said method that removes the glass board material edge defect of claim 8; Wherein the spacing in this laser light irradiation path of this glass board material end face≤(d/25) and>=d; D reinvents spot diameter size after the focusing of laser beam for this, and energy distribution is reduced to the 1/e of high part
2The time width, e is the truth of a matter that natural logarithm is contained number.
17. like the said method that removes the glass board material edge defect of claim 8, wherein the energy density of this laser beam is between 1 * 10
4To 1 * 10
6W/cm
2
18., in a glass board material end face, reaching the tiny flaw that removes the glass board material edge, and make this end face form a shiny surface through laser beam irradiation like the said method that removes the glass board material edge defect of claim 8.
19. remove the device of glass board material edge defect according to claim 1; The microscope carrier of bearing glass sheet material wherein; May command x, y, the motion of z direction of principal axis; The minor face or the long limit that make the exposure pathways of this laser beam comprise with this end face form a plurality of parallel lines, have a spacing between each parallel lines.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099144580 | 2010-12-17 | ||
| TW99144580A TWI400137B (en) | 2010-12-17 | 2010-12-17 | Device for removing defects on edges of glass sheets and method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102531370A true CN102531370A (en) | 2012-07-04 |
| CN102531370B CN102531370B (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010607453.2A Active CN102531370B (en) | 2010-12-17 | 2010-12-27 | Device and method for removing edge defects of glass plate |
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| CN (1) | CN102531370B (en) |
| TW (1) | TWI400137B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6638514B2 (en) | 2015-03-31 | 2020-01-29 | 日本電気硝子株式会社 | Cutting method for brittle substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101505908A (en) * | 2006-08-24 | 2009-08-12 | 康宁股份有限公司 | Laser separation of thin laminated glass substrates for flexible display applications |
| TW201021950A (en) * | 2008-12-04 | 2010-06-16 | Ind Tech Res Inst | A laser processing apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI277612B (en) * | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
| TWI221102B (en) * | 2002-08-30 | 2004-09-21 | Sumitomo Heavy Industries | Laser material processing method and processing device |
| JP5011048B2 (en) * | 2007-09-27 | 2012-08-29 | 三星ダイヤモンド工業株式会社 | Processing method of brittle material substrate |
| JP4790735B2 (en) * | 2008-01-08 | 2011-10-12 | 長野県 | Laser processing apparatus and laser processing method |
-
2010
- 2010-12-17 TW TW99144580A patent/TWI400137B/en active
- 2010-12-27 CN CN201010607453.2A patent/CN102531370B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101505908A (en) * | 2006-08-24 | 2009-08-12 | 康宁股份有限公司 | Laser separation of thin laminated glass substrates for flexible display applications |
| TW201021950A (en) * | 2008-12-04 | 2010-06-16 | Ind Tech Res Inst | A laser processing apparatus |
Non-Patent Citations (1)
| Title |
|---|
| 殷苏民，张雷洪，许仁军，张凌峰，葛涛: "激光热应力切割玻璃实验与分析", 《中国工程科学》 * |
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| Publication number | Publication date |
|---|---|
| TW201226093A (en) | 2012-07-01 |
| CN102531370B (en) | 2014-12-10 |
| TWI400137B (en) | 2013-07-01 |
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