CN115421259A

CN115421259A - Optical module

Info

Publication number: CN115421259A
Application number: CN202211173753.3A
Authority: CN
Inventors: 孙雨舟; 陈龙; 于登群; 李伟龙
Original assignee: Innolight Technology Suzhou Ltd
Current assignee: Innolight Technology Suzhou Ltd
Priority date: 2017-07-19
Filing date: 2017-07-19
Publication date: 2022-12-02
Anticipated expiration: 2037-07-19
Also published as: CN116449510A; CN109283632B; CN115421258A; CN115421258B; CN115421259B; CN109283632A

Abstract

The invention relates to an optical module, wherein one end of the optical module is provided with an optical interface, the other end of the optical module is provided with an electrical interface, the optical module comprises a shell, a heat sink arranged in the shell, a light emitting end, a PCB and an optical system, the optical system guides light emitted by the light emitting end to the optical interface, one end of the PCB is fixed on the heat sink, the light emitting end is packaged on the heat sink and is electrically connected with the PCB, and the optical system, the light emitting end and the PCB are sequentially arranged in the connecting line direction of the optical interface and the electrical interface. The circuit board is fixed on the heat sink, so that the connection is convenient, the assembly tolerance is reduced, and the optimal photoelectric signal conversion and transmission scheme is obtained.

Description

Optical module

The application is a divisional application of a Chinese invention patent application with the application number of 2017105907964, namely an invention name of an optical module, which is applied by the applicant on 7/19/2017.

Technical Field

The invention relates to the technical field of optical communication, in particular to an optical module.

Background

With the development of society, the data volume is larger and larger. The optical communication module is required to have faster transmission rate and lower cost. The existing 3G can not meet the numerous and complicated requirements of users and markets, and TD-LTE (Time Division-long term Evolution, long term Evolution of TD-SCDMA) is produced as a technology of 3G moving toward 4G. Because of the shortage of optical fiber resources, high new laying cost and long base station distribution distance at present, the demand of small pluggable (SFP +) packaged optical modules is gradually increased.

Generally, in an optical module structure, an electrical signal enters the PCBA from a gold finger and then is output to an opto-chip, which converts the electrical signal into an optical signal, which is output to an optical port via an optical system. Both the optical port and the electrical port (gold finger) are fixed relative to the module housing. The PCBA is generally rigid, the optical system is also rigid, and there are dimensional tolerances for all devices.

At present, most of optical module packaging technologies use a Flexible Printed Circuit (FPC) to absorb assembly tolerance, but the FPC and the PCBA welding point introduce large electrical signal attenuation, and the FPC and the PCBA welding point can only be applied to a transmission rate of less than 10G.

Higher transmission rate, optical module product design for long distance transmission requires less high speed electrical signal attenuation. Meanwhile, the assembly requirements of the module are required to be met, the gold finger, PCBA, the photoelectric chip, the free space optical path component and the optical port are required to be assembled together, and how to design the gold finger, the PCBA, the photoelectric chip, the free space optical path component and the optical port integrally to obtain the optimal photoelectric signal conversion transmission scheme becomes a problem to be solved by the current system.

Disclosure of Invention

Accordingly, an object of the present invention is to provide an optical module capable of realizing high-speed signal transmission.

An optical module, the one end of optical module has optical interface, and the other end has the electrical interface, the optical module includes the casing, sets up heat sink, light emission end, PCB board, the optical system in the casing, optical system will the light that light emission end sent arrives optical interface, wherein, the one end of PCB board is fixed in heat sink, light emission end encapsulation is in on the heat sink, light emission end with PCB board electricity is connected, optical system, light emission end with PCB board sets gradually in optical interface and electrical interface line direction.

As a further improvement of the embodiment of the present invention, an end of the PCB board adjacent to the electrical interface is configured as the electrical interface.

As a further improvement of the embodiment of the present invention, the light emitting end is disposed at an end face of an end of the PCB board far from the electrical interface.

As a further improvement of the embodiment of the invention, the light emitting end comprises a laser, and one end of the PCB is electrically connected with the laser through a gold wire.

As a further improvement of the embodiment of the present invention, there is no overlapping area between the vertical projection of the optical system on the housing and the vertical projection of the PCB on the housing.

As a further improvement of the embodiment of the present invention, the optical system is disposed on the heat sink.

As a further improvement of the embodiment of the present invention, the heat sink includes a first heat sink and a second heat sink, the optical system is disposed on the first heat sink, one end of the PCB board is fixed on the second heat sink, and the light emitting end is packaged on the second heat sink.

As a further improvement of the embodiment of the present invention, the heat sink and the housing are formed as an integral structure.

As a further improvement of the embodiment of the present invention, the driver of the light emitting end is packaged on a PCB board, and the light emitting end and the driver are located on the same side of the PCB board.

As a further improvement of the embodiment of the present invention, the light emitting end includes a laser, and the laser is packaged on the heat sink.

As a further improvement of the embodiment of the present invention, the optical module includes a light receiving end that converts a received optical signal into an electrical signal, the optical interface includes a transmitting end optical interface and a receiving end optical interface, light emitted by the light transmitting end is guided to the transmitting end optical interface through the optical system, and an optical signal received by the receiving end optical interface is conducted to the light receiving end through the optical system.

As a further improvement of the embodiment of the present invention, the optical module further includes an assembly tolerance absorption component, the assembly tolerance absorption component guides light emitted from the light emitting end to a central position of the optical interface or to an external connector connected to the optical module after passing through the optical system, or the assembly tolerance absorption component guides light emitted from the light emitting end to the optical system.

As a further improvement of the embodiment of the present invention, the assembly tolerance absorbing assembly includes an optical element disposed between the optical system and the optical interface or between the optical system and the light emitting end, the optical element being for effecting optical path docking between the optical system and the optical interface or optical path docking between the optical system and the light emitting end.

As a further improvement of the embodiments of the present invention, the optical interface includes a transmitting-end optical interface and a receiving-end optical interface; the optical elements include a transmitting end optical element and a receiving end optical element, which adjust the optical path so that the light entering the transmitting end optical interface is located at the center of the transmitting end optical interface.

As a further improvement of the embodiment of the present invention, the transmitting-side optical element and the receiving-side optical element include elements capable of transmitting light and changing the propagation direction of the light, such as a lens, a plate glass, or a mirror.

As a further improvement of the embodiment of the present invention, the optical element includes an optical fiber that realizes optical path connection.

As a further improvement of the embodiment of the present invention, the PCB is configured as a hard board.

As a further improvement of the embodiment of the present invention, the light emitting end includes a laser, and a spacer is disposed between the laser and the heat sink.

As a further improvement of the embodiment of the invention, no soft board is welded between the light emitting end and the PCB.

The optical module is characterized in that one end of the optical module is provided with an optical interface, the other end of the optical module is provided with an electrical interface, the optical module comprises a shell, a heat sink arranged in the shell, a plurality of lasers, a PCB and an optical system, the optical system guides the optical combination wave emitted by the lasers to the optical interface, the PCB is constructed into a hard board, the other end of the PCB is constructed into the electrical interface, one end of the PCB is fixed on the heat sink, the heat sink extends out of one end of the PCB, and the lasers are electrically connected with the PCB.

As a further improvement of the embodiment of the present invention, the laser is disposed adjacent to one end of the PCB board.

As a further improvement of the embodiment of the present invention, the other end of the PCB board is close to the edge of the case.

As a further improvement of the embodiment of the present invention, the optical system and the laser are both provided to the heat sink.

As a further improvement of the embodiment of the invention, the laser is packaged on the heat sink, and the projection of the laser and the PCB on the surface of the heat sink has no overlap.

As a further improvement of the embodiments of the present invention, the area of the heat sink is larger than the sum of the optical system and the laser area.

As a further improvement of the embodiment of the present invention, the heat sink includes a first heat sink and a second heat sink, the optical system is disposed on the first heat sink, one end of the PCB board is fixed on the second heat sink, and the laser is packaged on the second heat sink.

As a further improvement of the embodiment of the present invention, the optical module further includes an assembly tolerance absorption component, the assembly tolerance absorption component guides light emitted by the laser to the optical interface or to an external connector connected to the optical module after passing through the optical system, or the assembly tolerance absorption component guides light emitted by the laser to the optical system.

As a further refinement of an embodiment of the invention, the assembly tolerance absorbing assembly is at least partially disposed on the heat sink.

As a further improvement of the embodiment of the present invention, the assembly tolerance absorbing assembly includes an optical element for enabling optical path interfacing between the optical system and the laser, wherein at least a portion of the optical element is disposed on the heat sink.

As a further improvement of the embodiment of the present invention, there is no overlapping area between a vertical projection of the assembly tolerance absorbing assembly on the housing and a vertical projection of the PCB board on the housing.

As a further improvement of an embodiment of the present invention, the assembly tolerance absorbing assembly includes at least one emission-end optical fiber through which light emitted from the laser is guided to the optical system.

As a further improvement of the embodiment of the present invention, the first heat sink and the second heat sink are both provided with optical fiber fixing elements, and the emission end optical fiber is fixed by the optical fiber fixing elements.

As a further improvement of the embodiment of the present invention, the optical system includes a wavelength division multiplexer fixed on the heat sink, and the wavelength division multiplexer guides light emitted from the laser to the optical interface through the emission-end optical fiber.

As a further improvement of the embodiment of the present invention, the optical module further includes a driver, and the driver is connected to the laser by a gold wire.

As a further improvement of the embodiment of the present invention, a spacer is disposed between the laser and the heat sink.

As a further improvement of the embodiment of the invention, a soft board is not welded between the laser and the PCB.

An optical module is characterized by comprising a shell, a heat sink arranged in the shell, a light emitting end, a PCB (printed circuit board), wherein one end of the optical module is provided with an optical interface, the other end of the optical module is provided with an electrical interface, a laser, the PCB and an optical system are all fixed on the heat sink, the PCB is constructed into a hard board, the laser is electrically connected with the PCB, the optical interface is fixedly arranged relative to the shell, and the heat sink is fixedly arranged relative to the shell; the optical module further comprises an assembly tolerance absorption assembly, and the assembly tolerance absorption assembly guides light emitted by the laser to the central position of the optical interface or an external connector connected with the optical module after passing through the optical system.

As a further improvement of the embodiment of the present invention, the optical module includes an optical system that guides light emitted from the light emitting end to the optical interface, and the assembly tolerance absorbing member is disposed between the optical system and the optical interface, or the assembly tolerance absorbing member is disposed between the optical system and the light emitting end.

As a further improvement of the embodiment of the present invention, the assembly tolerance absorbing member is an optical fiber for optical path connection.

As a further improvement of the embodiment of the present invention, the light emitting end includes a laser and a spacer block, and the spacer block is disposed between the laser and the heat sink.

As a further improvement of the embodiment of the present invention, the optical system includes a wavelength division multiplexer for guiding the optical combining wave emitted by the laser to the optical interface.

As a further improvement of the embodiment of the present invention, the optical module includes a light receiving end, the optical interface includes a transmitting end optical interface and a receiving end optical interface, light emitted by the laser is guided to the transmitting end optical interface through the optical system, and an optical signal received by the receiving end optical interface is guided to the light receiving end through the optical system.

As a further improvement of the embodiment of the present invention, the optical module includes a transmitting end optical element and a receiving end optical element, the optical interface includes a transmitting end optical interface and a receiving end optical interface, and the optical path is adjusted by the transmitting end optical element and the receiving end optical element, so that the light passing through the transmitting end optical interface and the receiving end optical interface is located at the center of the transmitting end optical interface.

As a further improvement of the embodiment of the present invention, the optical system is disposed on the first heat sink, the optical receiving end includes a PD chip, the laser and the PD chip of the optical receiving end are both packaged on the second heat sink, and the driver of the laser is packaged on the PCB; the assembly tolerance absorption assembly is arranged between the optical system and the PD chip of the laser/light receiving end.

As a further improvement of the embodiment of the present invention, the assembly tolerance absorption assembly includes at least one transmitting end optical fiber and at least one receiving end optical fiber, and optical path connection is performed through the optical fibers to guide light emitted by the laser to the optical system, or guide light received by the optical system to the light receiving end; the transmitting end optical fiber is fixed on the heat sink.

As a further improvement of the embodiments of the present invention, the optical interface includes a transmitting end optical interface and a receiving end optical interface; the optical system comprises an emission light path and a receiving light path, the emission light path comprises a wavelength division multiplexer, the receiving light path comprises the wavelength division multiplexer and a reflector, and an optical signal emitted by the laser can be transmitted to the emission end optical interface under the guiding action of the lens component and the wavelength division multiplexer.

As a further improvement of an embodiment of the present invention, the assembly tolerance absorbing assembly includes an adapter port fixed on the heat sink and located between the optical system and the optical interface, and at least one optical fiber optically connecting the adapter port and the optical interface, the optical fiber guiding light emitted from the optical system to the optical interface.

As a further improvement of the embodiment of the present invention, the adapter interface includes a transmitting adapter interface corresponding to the light emitting end and a receiving adapter interface corresponding to the light receiving end; the optical fiber comprises a first optical fiber connected between the transmitting end optical interface and the transmitting adapter interface and a second optical fiber connected between the receiving end optical interface and the receiving adapter interface.

As a further improvement of the embodiment of the present invention, the light emitting end and the PCB are electrically connected by a gold wire.

As a further improvement of the embodiment of the present invention, there is no overlapping area between the vertical projection of the light emitting end on the housing and the vertical projection of the PCB board on the housing.

As a further improvement of the embodiment of the present invention, the heat sink is formed as an integral structure with the housing.

As a further improvement of the embodiment of the present invention, an end of the PCB board opposite to the electrical interface is fixed on the heat sink.

As a further improvement of the embodiment of the present invention, there is no overlapping area between the light emitting end and the projection of the PCB on the housing perpendicular to the surface of the PCB.

Compared with the prior art, the invention has the beneficial effects that: according to the technical scheme provided by the invention, the circuit board is fixed on the heat sink, so that the connection is convenient, and meanwhile, the assembly tolerance is reduced, so that the scheme of optimal photoelectric signal conversion and transmission is obtained.

Drawings

FIG. 1 is a perspective view of a light module in a preferred first embodiment of the present invention;

FIG. 2 is a top view of the light module of FIG. 1;

FIG. 3 isbase:Sub>A cross-sectional view of the light module of FIG. 2 taken along line A-A;

FIG. 4 is an exploded perspective view of the light module of FIG. 1;

FIG. 5 is a perspective view of a light module in a second preferred embodiment of the present invention;

FIG. 6 is a top view of the light module of FIG. 5;

FIG. 7 is a perspective view of a light module in a preferred third embodiment of the present invention;

FIG. 8 is an exploded perspective view of the light module of FIG. 7;

FIG. 9 is a front view of a light module in a preferred fourth embodiment of the present invention;

FIG. 10 is a top view of the light module of FIG. 9;

fig. 11 is an enlarged view of a portion a of the light module in fig. 10;

FIG. 12 is a schematic perspective view of a light module in a fifth preferred embodiment of the present invention;

FIG. 13 is an exploded perspective view of the light module of FIG. 12;

FIG. 14 is a front view of the light module of FIG. 12;

fig. 15 is a sectional view taken along line B-B in fig. 14.

Detailed Description

The present invention will be described in detail below with reference to specific embodiments shown in the accompanying drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.

As shown in fig. 1 to 4, in an embodiment of the present invention, an optical module 100 includes a housing 10 (only a lower housing is illustrated here), a heat sink 20 disposed in the housing 10, a laser 31 disposed on the heat sink 20, and a PCB 40 partially disposed on the heat sink 20, where one end of the optical module 100 has an optical interface and the other end has an electrical interface, and the optical interface includes an emitting-end optical interface 51 and a receiving-end optical interface 52. The PCB 40 is a hard board, one end of the PCB 40 is fixed on the heat sink 20 and electrically connected to the laser 31, and the other end of the PCB 40 is an electrical interface 43 of the optical module. Here, the other end of the PCB 40 is provided with a gold finger, and the gold finger serves as an electrical interface of the optical module.

The optical module 100 further includes an optical system 60 disposed in the housing and located between the laser 31 and the optical interface, and preferably, the optical system 60 is at least partially disposed on the heat sink 20, that is, the optical system 60 may be partially disposed on the heat sink 20 or may be entirely disposed on the heat sink 20, and the heat sink 20 and the housing may be configured as an integrally molded structure. The driver 35 of the laser 31 is packaged on the PCB 40, the laser 31 can be directly packaged on the heat sink 20 or packaged on a pad of the heat sink 20, a high-speed electrical signal is output from the driver 35 to the PCB 40, and then is output to the laser 31 through a gold wire connection for a very short distance, and the optical system 60 guides light emitted by the laser 31 to an optical interface. That is, the laser 31 is optically coupled with the emission-side optical interface 51 as an emission side. The optical signal received by the receiving-end optical interface 52 is transmitted to the optical receiving end via the optical system 60, and the optical receiving end converts the received optical signal into an electrical signal. That is, the optical receiving end is optically coupled to the receiving end optical interface 52 while being electrically connected to the PCB board. In the whole high-speed link, no flexible board is welded, so that the signal loss caused by welding points is reduced, and the laser 31 is close enough to the PCB 40 to ensure the optimal electrical performance. Moreover, all the elements are fixed with the heat sink 20 by taking the heat sink 20 as a reference, the assembly tolerance is small, the heat can be dissipated through the heat sink 20, and the heat dissipation performance is reliable and good.

Specifically, the optical system 60 is disposed at one side of the laser 31, and the optical system 60 includes a lens assembly and a wavelength division multiplexer, where the lens assembly includes at least one lens, and the lens assembly can process, such as focus or collimate, the light emitted from the laser 31, so as to adjust the propagation direction of the emergent light of the laser 31; the wavelength division multiplexer can combine a plurality of split beams into a single beam, so that the optical signal emitted from the laser 31 can be conducted to the transmitting-end optical interface 51 through the guiding action of the lens assembly and the wavelength division multiplexer. The PCB 40 is horizontally disposed inside the housing 10 of the optical module 100, and the light receiving end may be directly packaged on the heat sink 20 or packaged on a pad of the heat sink. Wherein the laser 31 includes a VCSEL (vertical cavity surface emitting laser) chip, the light receiving end includes a PD (photo diode) chip, and light transmitted from the receiving end optical interface 52 reaches the PD chip 32 after passing through the wavelength division multiplexer and the reflection prism 32. The VCSEL chip is soldered directly to the heat sink 20, connected to the PCB 40 through Jin Xiandian, and electrically connected to the driver 35 packaged on the PCB 40. The PD chip 32 is also soldered directly to the heat sink 20. Of course, the laser 31 may also be another type of laser chip, and similarly, the light receiving end may also be a PIN chip, an ADP chip, or another detector chip. In addition, the optical interface may be configured as one interface, and the transmitting end optical interface and the receiving end optical interface may also be configured as only one or two-in-one arrangement, that is, the optical module includes a transmitting and receiving end optical interface, and the transmitting and receiving end optical interface may be a transmitting end optical interface and/or a receiving end optical interface, or an optical transceiving integrated optical interface.

Further, in the present embodiment, the optical interface is fixed with respect to the housing 10, the heat sink 20 is also fixed with respect to the housing 10, and in order to absorb an assembly tolerance between the optical interface and a corresponding laser and/or optical receiver (here, a photodetector), the optical module 100 further includes an assembly tolerance absorption component for ensuring that light emitted by the laser can be received by an external element connected to the optical module 100, and light emitted by the external element connected to the optical module 100 can be well transmitted to the optical receiver. That is, the assembly tolerance absorption assembly can guide light emitted from the laser 31 to the center position of the optical interface or to an external connector connected to the optical module after passing through the optical system 60, or the assembly tolerance absorption assembly can guide light emitted from the laser 31 to the optical system 60. The center position of the optical interface is near the approximate center position, which is the position where the external connector receives the optical signal after the external connector is mated with the optical module 100, and is also the position where the external connector transmits the optical signal. External connectors include fiber optic plugs, switch interfaces, and the like.

Specifically, an assembly tolerance absorbing assembly is disposed at the optical interface, and the assembly tolerance absorbing assembly includes an optical element disposed between the optical system 60 and the optical interface for enabling optical path interfacing between the optical system 60 and the optical interface. The optical elements include a transmitting end optical element 71 and a receiving end optical element 72, the

optical elements

71 and 72 may be lenses, flat glass, or mirrors, etc. which can transmit light and change the propagation direction of light, and the light path is adjusted by these

optical elements

71 and 72, so that the light entering the transmitting end optical interface 51 is located at the center of the transmitting end optical interface, and the light entering the optical module 100 from the receiving end optical interface 52 can reach the optical receiver well. Of course, an optical element may be disposed between the optical system 60 and the laser 31 for interfacing the optical path between the optical system 60 and the laser 31.

The present embodiment also discloses an assembling method of the optical module 100, which includes the following steps: packaging the optical system 60, the laser 31 and the PD chip of the light receiving end on the heat sink 20; fixing one end of the PCB 40 to the heat sink 20; fixing the heat sink 20 in the housing 10; an optical element 71 is provided between the optical system 60 and the optical interface, and the optical element 71 is adjusted so that the optical path center of the optical interface corresponds to the optical path of the laser 31 and the PD chip 32 of the light receiving end.

Referring to fig. 5 to 6, a second embodiment of the present invention is shown, in which the optical module 200 also includes a housing 210, heat sinks 221/222 disposed in the housing, a laser 231 disposed on the heat sink, and a PCB 240 partially disposed on the heat sink. The optical module 200 has an optical interface at one end and an electrical interface at the other end, the optical interface including a transmitting end optical interface 251 and a receiving end optical interface 252. The PCB 240 is constructed as a hard board, one end of the PCB 240 is fixed on the heat sink and electrically connected to the laser 231, and the other end of the PCB 240 is constructed as an electrical interface 243 of the optical module, on which a gold finger is provided for external plug connection.

In this embodiment, the heat sink includes a first heat sink 221 and a second heat sink 222, the optical system 260 of the optical module is disposed on the first heat sink 221, the laser 231 and the PD chip 232 of the optical receiving end are packaged on the second heat sink 222, and the driver 235 of the laser 231 is packaged on the PCB 240. The optical interface in this embodiment is fixedly disposed relative to the housing 210, and the first and

second heat sinks

221, 222 are also fixed relative to the housing 210. In order to be able to absorb assembly tolerances between the optical interface and its corresponding laser and/or optical receiver, an assembly tolerance absorbing component of the optical module 200 is arranged between the optical system 260 and the laser 231/PD chip 232 of the optical receiving end. Specifically, the assembly tolerance absorbing assembly includes at least one transmitting end optical fiber 271 and at least one receiving end optical fiber 272, and the first heat sink 221 and the second heat sink 222 are both provided with optical fiber fixing elements, and both ends of the optical fiber are fixed by the optical fiber fixing elements. The light emitted from the laser 231 is guided to the optical system 260 or the light received by the optical system 260 is guided to the light receiving end by optical fiber. Because the optical fiber is flexible, tolerances can be absorbed by the optical fiber. In this embodiment, the number of optical fibers is related to the structure and transmission rate of the optical module, and if the optical interface of the optical module is set as a single optical interface, only one corresponding optical fiber may be set; when the transmission rate of the optical module is required to be high, the optical module can be configured with a plurality of lasers, and the number of the optical fibers is consistent with that of the lasers. Tolerance is absorbed by arranging a flexible and deformable optical fiber so that the optical path center of the optical interface corresponds to the optical paths of the laser 231 at the light emitting end and the PD chip 232 at the light receiving end.

The present embodiment also discloses an assembling method of the optical module 200, which includes the following steps: encapsulating the optical system 260 on the first heat sink 221; packaging the laser 231 and the PD chip 232 of the optical receiving end on the second heat sink 222; fixing one end of the PCB board 240 on the second heat sink 222; securing both the first 221 and second 222 heat sinks within the housing 210; an optical fiber is connected between the optical system 260 and the laser 231 and/or the PD chip 232 at the light receiving end.

Referring to fig. 7 to 8, a third embodiment of the present invention is shown, in this embodiment, an optical module 300 also includes a housing 310, a heat sink 320 disposed in the housing 310, a laser 331 disposed on the heat sink 320, and a PCB 340 partially disposed on the heat sink, one end of the optical module 330 has an optical interface, and the other end has an electrical interface, where the optical interface includes a transmitting end optical interface 351 and a receiving end optical interface 352. The PCB 340 is a hard board, one end of the PCB 340 is fixed on the heat sink 320 and electrically connected to the laser 331, and the other end of the PCB 340 is an electrical interface 343 of the optical module.

The optical system of the optical module is arranged 360 on the heat sink 320, the driver 335 of the laser 331 is packaged on the PCB 340, the laser 331 is packaged on the heat sink 320, and the PD chip of the optical receiving end is also packaged on the heat sink 320. The optical system 360 includes a transmitting optical path including a wavelength division multiplexer and a receiving optical path including a wavelength division multiplexer and a mirror. In this embodiment, the optical interface is fixed relative to the housing 310, and the heat sink 320 is also fixed relative to the housing 310, and in order to absorb the assembly tolerance between the optical interface and its corresponding transmitting end and receiving end, the assembly tolerance absorbing assembly of the optical module is disposed between the optical system 360 and the optical interface. Specifically, the assembly tolerance absorption assembly includes an adapter 370 and at least one optical fiber connecting the adapter 370 and the optical interface. An adapter 370 is secured to the heat sink 320, wherein the adapter 370 includes a transmit adapter corresponding to a light transmitting end and a receive adapter corresponding to a light receiving end. Thus, there are also two optical fibers, a first optical fiber 371 connected between the transmitting side optical interface 351 and the transmitting adapter, and a second optical fiber 372 connected between the receiving side optical interface 352 and the receiving adapter. Carry out the light path through optic fibre and connect, simple structure, if set up an optical interface, then only need set up an optic fibre and can satisfy the demand, it is with low costs.

The embodiment also discloses an assembling method of the optical module, which comprises the following steps: encapsulating the optical system 360, the laser 331 and the PD chip of the optical receiving end on the heat sink 320; securing the adapter 370 to the heat sink 320; fixing one end of PCB board 340 on heat sink 320; securing heat sink 320 within housing 310; an optical fiber is connected between the adapter 370 and the optical interface, and the optical path center of the optical interface corresponds to the optical paths of the transmitting end and the receiving end through the optical fiber.

Referring to fig. 9 to 11, a fourth embodiment of the present invention is shown, in which an optical module 400 also includes a housing 410, a heat sink 420 disposed in the housing 410, a laser 431 disposed on the heat sink 420, and a PCB 440 partially disposed on the heat sink. One end of the optical module is provided with an optical interface, and the other end of the optical module is provided with an electrical interface. The optical interfaces include a transmitting side optical interface 451 and a receiving side optical interface 452. Wherein the PCB 440 is constructed as a hard board, one end of the PCB 440 is fixed on the heat sink 420 and electrically connected to the laser 431, and the other end of the PCB 440 is constructed as an electrical interface 443 of the optical module. The optical system 460 of the optical module is disposed on the heat sink 420, the laser 431 and the driver 435 of the laser 431 are both packaged on the heat sink 420, and the PD chip of the optical receiver is also packaged on the heat sink 420. The present embodiment is different from the first embodiment in that the driver 435 of the laser 431 is also disposed on the heat sink 420 and connected to the laser 431 by gold wires, and the driver 435 is also located at the edge of the PCB 440 and connected to the PCB 440 by the gold wires as well. The arrangement of other components is substantially the same as that of the first embodiment, and will not be described again.

Referring to fig. 12 to 15, in a fifth embodiment of the present invention, an optical module 500 includes a housing 510 and a PCB 540 disposed in the housing, wherein an accommodating space is disposed in the housing 510, and the PCB 540 is disposed in the accommodating space. The PCB 540 may be clamped to the housing 510, and of course, the PCB 540 may be fixed to the housing 510 by screws, or may be fixed to the heat sink at one end and then fixed to the housing by the heat sink as in the previous embodiments, or may be connected by other methods. The PCB 540 may be entirely accommodated in the accommodating space, or may be partially accommodated in the accommodating space. One end of the optical module is provided with an optical interface, the other end of the optical module is provided with an electrical interface, and one end of the PCB 540 far away from the optical interface is constructed into the electrical interface 543 of the optical module.

In addition, the optical module 500 further includes an assembly tolerance absorbing assembly attached to the housing, which in this embodiment is configured as an adapter 570. The adapter 570 is provided separately from the housing 510, and at least a part of the adapter 570 is accommodated in the accommodating space. The optical module further comprises an optical assembly 560 disposed on the PCB, the optical assembly 560 having

optical interfaces

551 and 552 coupled with an adapter 570, and a gap S between the adapter 570 and the housing 10 is adjustable. Optical assembly 560 may be integrally formed on a PCB, detachably mounted on the PCB, or integrally formed on a heat sink, i.e., the optical system, optical interface, and circuit board are all fixed to the heat sink. Wherein the optical assembly 560 is electrically connected to the PCB board.

In this embodiment, the adapter 570 is separated from the housing 510, and the gap 22 between the adapter 570 and the housing 510 is adjustable, so that the problem that the optical path center of the adapter 570 does not correspond to the optical component 560 due to the manufacturing tolerance of the adapter 570 and/or the housing 510 is avoided, the manufacturing tolerance of the adapter 570 and/or the housing 510 is converted into the position tolerance of the adapter 570, the adapter 570 can move relative to the housing 510 according to the position of the optical component 560, and the optical component 560 and the adapter 570 of the optical module 500 are very easy to insert and pull out and convenient to assemble.

When the optical assembly 560 is plugged into the adapter 570, the plugging between the optical assembly 560 and the adapter 570 may be artificially controlled. Of course, a positioning fixture may be additionally used to position the optical assembly 560 to fit with the adapter 570.

Further, the light assembly 560 is configured to include a light receiving end, a light emitting end, and an optical system. Of course, the optical assembly 560 may also be configured to include a transceiver chip that integrates light reception and light emission.

In this embodiment, the optical interfaces of the optical component 560 are two, one of which is the light emitting interface 551, and the other of which is the light receiving interface 552. Of course, both interfaces may also be provided as light emitting interfaces or light receiving interfaces.

The end face of the adapter 570 parallel to the plugging direction of the

optical interfaces

551, 552 has an adjustment gap S with the housing 510. Thus, when the adapter 570 is assembled, the adapter 570 can be moved in a plurality of directions up, down, left, and right, respectively, according to the position of the optical assembly 560.

In this embodiment, the adapter 570 and the housing 510 are fixed by dispensing. Of course, other means of attachment are possible, such as a threaded attachment between the adapter 570 and the housing 510.

The embodiment also discloses an assembling method of the optical module, which comprises the following steps: mounting the optical assembly 560 and the PCB board to the housing 510; mating the adapter 570 with the

optical interfaces

551, 552 of the optical assembly 560; the adapter 570 is secured to the housing 510. When the adapter 570 is secured to the housing 510, the adapter 570 is preferably secured to the housing 510 using glue. Of course, other means of attachment are possible, such as a threaded attachment between the adapter 570 and the housing 510. When a screw-fastening is used, a gasket (not shown) of a corresponding thickness may be placed in the gap S between the adapter 570 and the housing 510 as needed.

In other embodiments, the interfaces of the optical assembly are provided as one, and correspondingly, the adapter and the mating interface of the optical assembly are also provided as one, that is, the interfaces are provided as an optical transceiver interface. Of course, the interface may be provided as only the light emitting interface, or as only the light receiving interface.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.

Claims

1. An optical module is characterized in that one end of the optical module is provided with an optical interface, the other end of the optical module is provided with an electrical interface, the optical module comprises a shell, a heat sink arranged in the shell, a light emitting end, a PCB and an optical system, the optical system guides light emitted by the light emitting end to the optical interface, one end of the PCB is fixed on the heat sink, the light emitting end is packaged on the heat sink and is electrically connected with the PCB, and the optical system, the light emitting end and the PCB are sequentially arranged in the connecting line direction of the optical interface and the electrical interface.

2. The optical module of claim 1, wherein an end of the PCB board adjacent to the electrical interface is configured as the electrical interface.

3. The optical module of claim 1, wherein the light emitting end is disposed at an end surface of an end of the PCB board away from the electrical interface.

4. The optical module of claim 3, wherein the light emitting end comprises a laser, and one end of the PCB is electrically connected to the laser through a gold wire.

5. The optical module of claim 1, wherein there is no overlap area between a vertical projection of the optical system on the housing and a vertical projection of the PCB board on the housing.

6. The light module of claim 1, wherein the optical system is disposed on the heat sink.

7. The optical module of claim 6, wherein the heat sink comprises a first heat sink and a second heat sink, the optical system is disposed on the first heat sink, one end of the PCB is fixed on the second heat sink, and the light emitting end is packaged on the second heat sink.

8. The optical module of claim 1, wherein the heat sink is integrally formed with the housing.

9. The optical module of claim 1, wherein the driver of the light emitting end is packaged on a PCB board, and the light emitting end and the driver are located on the same side of the PCB board.

10. The light module of claim 9, wherein the light emitting end comprises a laser, the laser being packaged on the heat sink.

11. The optical module according to claim 1, wherein the optical module includes a light receiving end that converts a received optical signal into an electrical signal, the optical interface includes a transmitting end optical interface and a receiving end optical interface, light emitted from the light transmitting end is guided to the transmitting end optical interface through the optical system, and an optical signal received by the receiving end optical interface is conducted to the light receiving end through the optical system.

12. The optical module of claim 1, further comprising an assembly tolerance absorption assembly, wherein the assembly tolerance absorption assembly guides light emitted from the light emitting end to a central position of the optical interface or to an external connector connected to the optical module after passing through the optical system, or guides light emitted from the light emitting end to the optical system.

13. The optical module of claim 12, wherein the assembly tolerance absorbing assembly includes an optical element disposed between the optical system and the optical interface or between the optical system and the light emitting end, the optical element being configured to enable optical path interfacing between the optical system and the optical interface or optical path interfacing between the optical system and the light emitting end.

14. The optical module of claim 13, wherein the optical interface comprises a transmit side optical interface and a receive side optical interface; the optical elements include a transmitting end optical element and a receiving end optical element, which adjust the optical path so that the light entering the transmitting end optical interface is located at the center of the transmitting end optical interface.

15. The optical module according to claim 14, wherein the transmitting-side optical element and the receiving-side optical element include elements that are capable of transmitting light and changing the propagation direction of light, such as a lens, a plate glass, or a mirror.

16. The optical module of claim 13, wherein the optical element comprises an optical fiber that enables optical path connections.

17. The optical module of claim 1, wherein the PCB is configured as a rigid board.

18. The light module of claim 1, wherein the light emitting end comprises a laser, and a spacer is disposed between the laser and the heat sink.

19. The optical module of claim 1, wherein no solder-on-flex is provided between the light emitting end and the PCB.

20. The optical module is characterized in that one end of the optical module is provided with an optical interface, the other end of the optical module is provided with an electrical interface, the optical module comprises a shell, a heat sink arranged in the shell, a plurality of lasers, a PCB and an optical system, the optical system guides the optical combination wave emitted by the lasers to the optical interface, the PCB is constructed into a hard board, the other end of the PCB is constructed into the electrical interface, one end of the PCB is fixed on the heat sink, the heat sink extends out of one end of the PCB, and the lasers are electrically connected with the PCB.

21. The optical module of claim 20, wherein the laser is disposed proximate to an end of the PCB.

22. The optical module of claim 20, wherein the other end of the PCB board is proximate to an edge of the housing.

23. The optical module of claim 20, wherein the optical system and the laser are both disposed on the heat sink.

24. The light module of claim 23, wherein the laser is packaged on the heat sink without an overlap of the laser and a projection of the PCB board onto a surface of the heat sink.

25. The optical module of claim 23, wherein the area of the heat sink is greater than the sum of the optical system and the laser area.

26. The optical module of claim 23, wherein the heat sink comprises a first heat sink and a second heat sink, the optical system is disposed on the first heat sink, one end of the PCB board is fixed to the second heat sink, and the laser is packaged on the second heat sink.

27. The optical module of claim 23, further comprising an assembly tolerance absorption assembly that directs light from the laser through the optical system to the optical interface or to an external connector connected to the optical module, or that directs light from the laser to the optical system.

28. The light module of claim 27 wherein the assembly tolerance absorbing assembly is disposed at least partially on the heat sink.

29. The optical module of claim 28, wherein the assembly tolerance absorbing assembly includes an optical element for interfacing an optical path between the optical system and the laser, wherein at least a portion of the optical element is disposed on the heat sink.

30. The optical module of claim 27, wherein a perpendicular projection of the assembly tolerance absorbing assembly on the housing and a perpendicular projection of the PCB board on the housing do not have an overlapping area.

31. The optical module of claim 27, wherein the heat sink comprises a first heat sink and a second heat sink, the optical system is disposed on the first heat sink, one end of the PCB board is fixed on the second heat sink, and the laser is packaged on the second heat sink.

32. The optical module of claim 31, wherein the assembly tolerance absorbing assembly includes at least one emission end optical fiber through which light emitted by the laser is directed to the optical system.

33. The optical module of claim 32, wherein the first heat sink and the second heat sink are each provided with an optical fiber fixing element, and the emission end optical fiber is fixed by the optical fiber fixing element.

34. The optical module of claim 32, wherein the optical system comprises a wavelength division multiplexer affixed to the heat sink, the wavelength division multiplexer directing light emitted by the laser through the launch-end optical fiber to the optical interface.

35. The optical module of claim 20, further comprising a driver, wherein the driver is connected to the laser by gold wire.

36. The optical module of claim 20, wherein a spacer is disposed between the laser and the heat sink.

37. The optical module of claim 20, wherein no solder-flex is present between the laser and the PCB.

38. An optical module is characterized by comprising a shell, a heat sink arranged in the shell, a light emitting end, a PCB (printed circuit board), wherein one end of the optical module is provided with an optical interface, the other end of the optical module is provided with an electrical interface, a laser, the PCB and an optical system are all fixed on the heat sink, the PCB is constructed into a hard board, the laser is electrically connected with the PCB, the optical interface is fixedly arranged relative to the shell, and the heat sink is fixedly arranged relative to the shell; the optical module further comprises an assembly tolerance absorption assembly, and the assembly tolerance absorption assembly guides light emitted by the laser to the central position of the optical interface or an external connector connected with the optical module after passing through the optical system.

39. The optical module of claim 38, wherein the optical module comprises an optical system that guides light emitted from the light emitting end to the optical interface, and wherein the assembly tolerance absorbing assembly is disposed between the optical system and the optical interface, or wherein the assembly tolerance absorbing assembly is disposed between the optical system and the light emitting end.

40. The optical module of claim 39, wherein the assembly tolerance absorbing component is an optical fiber for optical path connection.

41. The optical module of claim 40, wherein the light emitting end comprises a laser and a spacer block, the spacer block being disposed between the laser and the heat sink.

42. The optical module of claim 41, wherein the optical system comprises a wavelength division multiplexer that directs the optical combination wave emitted by the laser to the optical interface.

43. The optical module as claimed in claim 42, wherein the optical module includes a light receiving end, the optical interface includes a light emitting end optical interface and a light receiving end optical interface, the light emitted from the laser is guided to the light emitting end optical interface through the optical system, and the light signal received by the light receiving end optical interface is guided to the light receiving end through the optical system.

44. The optical module of claim 39, wherein the optical module comprises a transmitting end optical element and a receiving end optical element, and the optical interface comprises a transmitting end optical interface and a receiving end optical interface, and the optical path is adjusted by the transmitting end optical element and the receiving end optical element, so that the light passing through the transmitting end optical interface and the receiving end optical interface is located at the center of the transmitting end optical interface.

45. The optical module of claim 43, wherein the optical system is disposed on a first heat sink, the light receiving end comprises a PD chip, the laser and the PD chip of the light receiving end are packaged on a second heat sink, and a driver of the laser is packaged on a PCB; the assembly tolerance absorbing assembly is arranged between the optical system and the PD chip of the laser/light receiving end.

46. The optical module of claim 42, wherein the assembly tolerance absorbing assembly comprises at least one transmitting end optical fiber and at least one receiving end optical fiber optically connected by optical fibers to guide light emitted from a laser to the optical system or guide light received by the optical system to a light receiving end; the transmitting end optical fiber is fixed on the heat sink.

47. The optical module of claim 42, wherein the optical interface comprises a transmit side optical interface and a receive side optical interface; the optical system comprises an emission light path and a receiving light path, the emission light path comprises a wavelength division multiplexer, the receiving light path comprises the wavelength division multiplexer and a reflector, and an optical signal emitted by the laser can be transmitted to the emission end optical interface under the guiding action of the lens component and the wavelength division multiplexer.

48. The optical module of claim 47 wherein the assembly tolerance absorption assembly comprises an adapter port secured to the heat sink and positioned between the optical system and the optical interface, and at least one optical fiber optically connecting the adapter port and the optical interface, the optical fiber directing light emitted by the optical system to the optical interface.

49. The optical module of claim 48, wherein the adapter interfaces comprise a transmit adapter interface corresponding to a light transmitting end and a receive adapter interface corresponding to a light receiving end; the optical fiber comprises a first optical fiber connected between the transmitting end optical interface and the transmitting adapter interface and a second optical fiber connected between the receiving end optical interface and the receiving adapter interface.

50. The optical module of claim 38, wherein the light emitting terminal is electrically connected to the PCB by gold wire.

51. The light module of claim 38, wherein a perpendicular projection of the light emitting end on the housing and a perpendicular projection of the PCB board on the housing do not have an overlapping area.

52. The optical module of claim 38, wherein the heat sink is formed as a unitary structure with the housing.

53. The optical module of claim 38, wherein an end of the PCB board opposite the electrical interface is secured to the heat sink.

54. The light module of claim 38, wherein there is no overlapping area with a projection of the light emitting end and the PCB board on the housing perpendicular to a surface of the PCB board.

55. The optical module of claim 38, wherein no solder-on-flex is present between the light emitting end and the PCB.