CN102513401A - Tubular target bonding method - Google Patents
Tubular target bonding method Download PDFInfo
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- CN102513401A CN102513401A CN2011104314644A CN201110431464A CN102513401A CN 102513401 A CN102513401 A CN 102513401A CN 2011104314644 A CN2011104314644 A CN 2011104314644A CN 201110431464 A CN201110431464 A CN 201110431464A CN 102513401 A CN102513401 A CN 102513401A
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Abstract
The invention relates to a tubular target bonding method for bonding a tubular target and a metal lining tube. The method makes the whole tubular target with large length be bonded with the metal lining tube in high quality; and the high quality bonding is concretely embodied in cases that the weld thickness is controlled, the weld thickness can be reduced to a common weld thickness of a planar target, even thinner, and the uniformity of the weld thickness can be maintained. The method is beneficial to the welding flux saving and target use performance improvement. The method is suitable for the production of the tubular target with certain plasticity, and the plasticity of the tubular target satisfies requirements of a cold drawing technology.
Description
Technical field
The present invention relates to a kind of adhering method that is used for the tubulose target of bonding tubulose target and metal liner.
Background technology
Sputtering target material is different by shape, can be divided into two big types of planar targets and tubulose targets (also being rotary target material or hollow columnar target).The former sputter utilization rate is about 30%, and the latter's utilization rate can be up to 80%; Because this advantage of tubulose target, it is used more and more widely, and the thing followed is that the kind of tubulose target is also more and more.Known tubulose target has metal, like Ag, Al, Ti tubulose target, also have the pottery, like AZO (zinc oxide aluminum), ITO (tin indium oxide), Si3N4 (silicon nitride) tubulose target.The metal or alloy target that some metal targets, particularly fusing point and intensity are all relatively low, easy place creep in sputter procedure influences the carrying out of sputter procedure.These metal or alloy targets need use the low-melting-point metal (scolder that just it has often been said or solder) of easy deformation to be bonded in the intensity height, to be difficult on the another kind of material of place creep, like stainless steel, Mo etc.The material that this bulk strength is high, be difficult for place creep is called backboard (backing plate) usually for planar targets; And to the tubulose target, then often be called bushing pipe or carry pipe (backing tube).Solder layer also has an important effect except playing the effect that connects target and backboard (bushing pipe) and heat-conductivity conducting.Be exactly the plastic deformation through itself, reduce the stress concentration phenomenon that the mismatch in coefficient of thermal expansion owing to target and backboard (bushing pipe) causes.Because target material surface is raise by the high-energy ion bombardment temperature, sizable stress then because of there being water-cooled but, can taking place and concentrate in backboard (bushing pipe) on target and backboard (bushing pipe) interface, can cause the target cracking when serious, come off during sputter.
Planar targets bonding simple relatively, technology are also quite ripe.And the bonding more complicated of tubulose target does not still have a kind of gratifying method so far.Disclose in the patent of the patent of japanese kokai publication hei 11-71667 patent, Chinese application number 200910166813 and U. S. application numbers 20040074770 and to have utilized heat expansion cold
The principle that contracts closely is enclosed within the target pipe on the bushing pipe, accomplishes bonding method.Some method also; Be employed in target pipe internal surface and bushing pipe outer surface and form certain wavy convex-concave engaging piece (one Chinese patent application number 200710126292); Or things such as flange (one Chinese patent application number 200580042924) are set, thereby mechanically the target pipe is fixed on the bushing pipe at the end face of target pipe and/or bushing pipe.Indispensable heat conduction, conduction, reduction stress that these methods are not all considered scolder and play a part are concentrated, thereby in actual production, seldom are applied.
And the method for employing scolder can not provide gratifying bonding quality up to now.The insider knows that the adhesive linkage of planar targets or layer can be controlled at about 0.2mm very equably, and with the bonding tubulose target of known method so far, its adhesive linkage or layer thickness are mostly about 1mm.For example people such as village will outstanding person (one Chinese patent application number 200910195883) is to target inside pipe wall and bushing pipe outer wall coated with solder, regulate the two position after heating make coating fusing, the thick approximately 1mm of the adhesive linkage of formation or layer.China's application number 200580042924 disclosed methods, its adhesive linkage or layer thickness are also near 1mm.Because a large amount of scolders that use costliness, blocked up adhesive linkage or layer cause the target production cost to increase.In addition, because whole pipe target directly is bonded on the long bushing pipe, practical operation has certain degree of difficulty, and mostly that multistage is the short pipe target of known method is bonded on the long bushing pipe so far, thereby is combined into a long tubulose target.Like this, between section and section, can leave certain slit.In addition, because be not easy to realize the centering of target pipe and bushing pipe, adhesive linkage or layer are in uneven thickness, particularly along pipe target axis direction.These all have harmful effect to sputter procedure.
Summary of the invention
The objective of the invention is to change deficiency of the prior art, and a kind of adhering method of tubulose target is provided, make tubulose target whole, that length is big to bond together in high quality with metal liner; This high-quality bonding throat depth that is embodied in can be controlled, and throat depth can be thinned to the common throat depth of planar targets even thinner, and throat depth can keep uniformity; This to practice thrift scolder, to improve the target serviceability all helpful; The present invention is applicable to the production of the tubulose target with certain plasticity, and its plasticity will satisfy the requirement of cold-drawing technology.
Technical scheme of the present invention is achieved in that
The first step: process internal diameter and thickness earlier all greater than the final target pipe that requires, its length is less than
Whole requirement; Choose internal diameter, external diameter and finally require in full accordly, but length is greater than the final metal liner that requires;
Second step: polish in target pipe and the metal liner surface to needs are bonding, sandblast, cleaning, coating film treatment;
The 3rd step: the metal liner outer surface that was processed on the surface applies one deck eutectic solder equably, and the eutectic solder coating layer thickness can not be less than the tack coat or the solder layer thickness of design;
The 4th step: the inside that is sleeved on the metal liner that is coated with eutectic solder the target pipe;
The 5th step: to being sleeved on after together metal liner and target pipe take the lead, it is compound to carry out cold-drawn;
The 6th step: the multiple tube with cold-drawn after compound is placed on and carries out soldering in the heater; The temperature of heater is set and is higher than 50-150 ℃ of eutectic solder fusing point; Be incubated 20-200 minute, until between eutectic solder and target pipe and metal liner, all form 100% firm metallurgical binding.
The suitable Au of being used for of cold-drawing recovery, Ag, Al, Cu, Ni, Sn, Zn tubular metal target described in the 5th step and be the alloy tubulose target of main component with these metals.
Described cold-drawing recovery was combined on the drawbench and carried out the 5th step, and the selection of drawing deformation amount or cold drawing die will guarantee that drawing deformation only occurs on target pipe and the scolder, and metal liner does not deform.
The 5th goes on foot in the compound process of described cold-drawn; Through selecting suitable drawing deformation amount or cold drawing die size to make metal liner between the tubulose target, produce a capillary gap that is suitable for soldering; And capillary gap uniformity, thickness are 0.1mm-3mm, fill eutectic solder in the capillary gap.
Soldering compound through the cold-drawn in the 5th step and the 6th step makes and forms a uniformity between metal liner and the tubulose target, and thickness is the solder layer of 0.1mm-3mm.
Described Au, Ag, Al, Cu, Ni, Sn, Zn tubular metal target and be to have uniformity between alloy tubulose target and the metal lining of main component with these metals, and thickness is the solder layer of 0.1mm-3mm.
The invention has the advantages that:
1, can realize the centering of target pipe and bushing pipe, adhesive linkage or layer thickness are even.
2, can improve the welding quality of target to a great extent, and practice thrift welding material.
3, effectively improve the serviceability of target, prolong the service life of target.
Description of drawings
Fig. 1 is target pipe, scolder, the metal liner relative position before cold-drawn is compound.
Fig. 2 is a material deformation sketch map in the cold-drawn recombination process.
Fig. 3 is target pipe, scolder, the metal liner relative position after cold-drawn is compound.
The specific embodiment
Embodiment 1: like Fig. 1,2, shown in 3, and a kind of adhering method of tubulose target, the step of this method is following:
The first step: process internal diameter and thickness earlier all greater than the final target pipe that requires, its length is less than final requirement; Choose internal diameter, external diameter and finally require in full accordly, but length is greater than the final metal liner that requires;
Second step: polish in target pipe and the metal liner surface to needs are bonding, sandblast, cleaning, coating film treatment;
The 3rd step: the metal liner outer surface that was processed on the surface applies one deck eutectic solder equably, and the eutectic solder coating layer thickness can not be less than the solder layer thickness of design;
The 4th step: the inside that is sleeved on the metal liner that is coated with eutectic solder the target pipe;
The 5th step: to being sleeved on after together metal liner and target pipe take the lead, it is compound to carry out cold-drawn;
The 6th step: the multiple tube with cold-drawn after compound is placed on and carries out soldering in the heater; The temperature of heater is set and is higher than 50-150 ℃ of eutectic solder fusing point; Be incubated 20-200 minute, until between eutectic solder and target pipe and metal liner, all form 100% firm metallurgical binding.
The suitable Au of being used for of cold-drawing recovery, Ag, Al, Cu, Ni, Sn, Zn tubular metal target described in the 5th step and be the alloy tubulose target of main component with these metals.
Described cold-drawing recovery was combined on the drawbench and carried out the 5th step, and the selection of drawing deformation amount or cold drawing die will guarantee that drawing deformation only occurs on target pipe and the scolder, and metal liner does not deform.
The 5th goes on foot in the compound process of described cold-drawn; Through selecting suitable drawing deformation amount or cold drawing die size to make metal liner between the tubulose target, produce a capillary gap that is suitable for soldering; And capillary gap uniformity, thickness are 0.1mm-3mm, fill eutectic solder in the capillary gap.
Soldering compound through the cold-drawn in the 5th step and the 6th step makes and forms a uniformity between metal liner and the tubulose target, and thickness is the solder layer of 0.1mm-3mm.
Described Au, Ag, Al, Cu, Ni, Sn, Zn tubular metal target and be to have uniformity between alloy tubulose target and the metal lining of main component with these metals, and thickness is the solder layer of 0.1mm-3mm.
Embodiment 2: like Fig. 1,2, shown in 3, and a kind of adhering method of tubulose target, the step of this method is following:
The first step: process internal diameter and thickness earlier all greater than the final target pipe that requires, its length is less than
Whole requirement; Choose internal diameter, external diameter and finally require in full accordly, but length is longer than the metal liner of final requirement;
Second step: polish in target pipe and the metal liner surface to needs are bonding, sandblast, cleaning, coating film treatment;
The 3rd step: the metal liner outer surface that was processed on the surface applies one deck eutectic solder equably, and the eutectic solder coating layer thickness can not be less than the solder layer thickness of design;
The 4th step: the inside that is sleeved on the metal liner that is coated with eutectic solder the target pipe;
The 5th step: to being sleeved on after together metal liner and target pipe take the lead, it is compound to carry out cold-drawn;
The 6th step: the multiple tube with cold-drawn after compound is placed on and carries out soldering in the heater; The temperature of heater is set and is higher than 50-150 ℃ of eutectic solder fusing point; Be incubated 20-200 minute, until between eutectic solder and target pipe and metal liner, all form 100% firm metallurgical binding.
The suitable Au of being used for of cold-drawing recovery, Ag, Al, Cu, Ni, Sn, Zn tubular metal target described in the 5th step and be the alloy tubulose target of main component with these metals.
Described cold-drawing recovery was combined on the drawbench and carried out the 5th step, and the selection of drawing deformation amount or cold drawing die will guarantee that drawing deformation only occurs on target pipe and the scolder, and metal liner does not deform.
The 5th goes on foot in the compound process of described cold-drawn; Through selecting suitable drawing deformation amount or cold drawing die size to make metal liner between the tubulose target, produce a capillary gap that is suitable for soldering; And capillary gap uniformity, thickness are 0.1mm-3mm, fill eutectic solder in the capillary gap.
Soldering compound through the cold-drawn in the 5th step and the 6th step makes and forms a uniformity between metal liner and the tubulose target, and thickness is the solder layer of 0.1mm-0.5mm.
Described Au, Ag, Al, Cu, Ni, Sn, Zn tubular metal target and be to have uniformity between alloy tubulose target and the metal lining of main component with these metals, and thickness is the solder layer of 0.1mm-0.5mm.
Embodiment 3: like Fig. 1,2, shown in 3, and a kind of adhering method of tubulose target, the step of this method is following:
The first step: process internal diameter and thickness earlier all greater than the final target pipe that requires, its length is less than
Whole requirement; Choose internal diameter, external diameter and finally require in full accordly, but length is longer than the metal liner of final requirement;
Second step: polish in target pipe and the metal liner surface to needs are bonding, sandblast, cleaning, coating film treatment;
The 3rd step: the metal liner outer surface that was processed on the surface applies one deck eutectic solder equably, and the eutectic solder coating layer thickness can not be less than the solder layer thickness of design;
The 4th step: the inside that is sleeved on the metal liner that is coated with eutectic solder the target pipe;
The 5th step: to being sleeved on after together metal liner and target pipe take the lead, it is compound to carry out cold-drawn;
The 6th step: the multiple tube with cold-drawn after compound is placed on and carries out soldering in the heater; The temperature of heater is set and is higher than 50-150 ℃ of eutectic solder fusing point; Be incubated 20-200 minute, until between eutectic solder and target pipe and metal liner, all form 100% firm metallurgical binding.
The suitable Au of being used for of cold-drawing recovery, Ag, Al, Cu, Ni, Sn, Zn tubular metal target described in the 5th step and be the alloy tubulose target of main component with these metals.
Described cold-drawing recovery was combined on the drawbench and carried out the 5th step, and the selection of drawing deformation amount or cold drawing die will guarantee that drawing deformation only occurs on target pipe and the scolder, and metal liner does not deform.
The 5th goes on foot in the compound process of described cold-drawn; Through selecting suitable drawing deformation amount or cold drawing die size to make metal liner between the tubulose target, produce a capillary gap that is suitable for soldering; And capillary gap uniformity, thickness are 0.1mm-3mm, fill eutectic solder in the capillary gap.
Soldering compound through the cold-drawn in the 5th step and the 6th step makes and forms a uniformity between metal liner and the tubulose target, and thickness is the solder layer of 0.1mm-0.2mm.
Described Au, Ag, Al, Cu, Ni, Sn, Zn tubular metal target and be to have uniformity between alloy tubulose target and the metal lining of main component with these metals, and thickness is the solder layer of 0.1mm-0.2mm.
Embodiment 4: like Fig. 1,2, shown in 3, and a kind of adhering method of tubulose target, the step of this method is following:
The first step: process internal diameter and thickness earlier all greater than the final target pipe that requires, its length is less than
Whole requirement; Choose internal diameter, external diameter and finally require in full accordly, but length is longer than the metal liner of final requirement;
Second step: polish in target pipe and the metal liner surface to needs are bonding, sandblast, cleaning, coating film treatment;
The 3rd step: the metal liner outer surface that was processed on the surface applies one deck eutectic solder equably, and the eutectic solder coating layer thickness can not be less than the solder layer thickness of design;
The 4th step: the inside that is sleeved on the metal liner that is coated with eutectic solder the target pipe;
The 5th step: to being sleeved on after together metal liner and target pipe take the lead, it is compound to carry out cold-drawn;
The 6th step: the multiple tube with cold-drawn after compound is placed on and carries out soldering in the heater; The temperature of heater is set and is higher than 50-150 ℃ of eutectic solder fusing point; Be incubated 20-200 minute, until between eutectic solder and target pipe and metal liner, all form 100% firm metallurgical binding.
The suitable Au of being used for of cold-drawing recovery, Ag, Al, Cu, Ni, Sn, Zn tubular metal target described in the 5th step and be the alloy tubulose target of main component with these metals.
Described cold-drawing recovery was combined on the drawbench and carried out the 5th step, and the selection of drawing deformation amount or cold drawing die will guarantee that drawing deformation only occurs on target pipe and the scolder, and metal liner does not deform.
The 5th goes on foot in the compound process of described cold-drawn; Through selecting suitable drawing deformation amount or cold drawing die size to make metal liner between the tubulose target, produce a capillary gap that is suitable for soldering; And capillary gap uniformity, thickness are 0.1mm-3mm, fill eutectic solder in the capillary gap.
Soldering compound through the cold-drawn in the 5th step and the 6th step makes and forms a uniformity between metal liner and the tubulose target, and thickness is the solder layer of 0.1mm-1mm.
Described Au, Ag, Al, Cu, Ni, Sn, Zn tubular metal target and be to have uniformity between alloy tubulose target and the metal lining of main component with these metals, and thickness is the solder layer of 0.1mm-1mm.
Embodiment 5: like Fig. 1,2, shown in 3, and a kind of adhering method of tubulose target, the step of this method is following:
The first step: process internal diameter and thickness earlier all greater than the final target pipe that requires, its length is less than final requirement; Choose internal diameter, external diameter and finally require in full accordly, but length is longer than the metal liner of final requirement;
Second step: polish in target pipe and the metal liner surface to needs are bonding, sandblast, cleaning, coating film treatment;
The 3rd step: the metal liner outer surface that was processed on the surface applies one deck eutectic solder equably, and the eutectic solder coating layer thickness can not be less than the solder layer thickness of design;
The 4th step: the inside that is sleeved on the metal liner that is coated with eutectic solder the target pipe;
The 5th step: to being sleeved on after together metal liner and target pipe take the lead, it is compound to carry out cold-drawn;
The 6th step: the multiple tube with cold-drawn after compound is placed on and carries out soldering in the heater; The temperature of heater is set and is higher than 50-150 ℃ of eutectic solder fusing point; Be incubated 20-200 minute, until between eutectic solder and target pipe and metal liner, all form 100% firm metallurgical binding.
The suitable Au of being used for of cold-drawing recovery, Ag, Al, Cu, Ni, Sn, Zn tubular metal target described in the 5th step and be the alloy tubulose target of main component with these metals.
Described cold-drawing recovery was combined on the drawbench and carried out the 5th step, and the selection of drawing deformation amount or cold drawing die will guarantee that drawing deformation only occurs on target pipe and the scolder, and metal liner does not deform.
The 5th goes on foot in the compound process of described cold-drawn; Through selecting suitable drawing deformation amount or cold drawing die size to make metal liner between the tubulose target, produce a capillary gap that is suitable for soldering; And capillary gap uniformity, thickness are 0.1mm-3mm, fill eutectic solder in the capillary gap.
Soldering compound through the cold-drawn in the 5th step and the 6th step makes and forms a uniformity between metal liner and the tubulose target, and thickness is the solder layer of 0.1mm-2mm.
Described Au, Ag, Al, Cu, Ni, Sn, Zn tubular metal target and be to have uniformity between alloy tubulose target and the metal lining of main component with these metals, and thickness is the solder layer of 0.1mm-2mm.
Embodiment 6: like Fig. 1,2, shown in 3, and a kind of adhering method of tubulose target, the step of this method is following:
The first step: process internal diameter and thickness earlier all greater than the final target pipe that requires, its length is less than final requirement; Choose internal diameter, external diameter and finally require in full accordly, but length is longer than the metal liner of final requirement;
Second step: polish in target pipe and the metal liner surface to needs are bonding, sandblast, cleaning, coating film treatment;
The 3rd step: the metal liner outer surface that was processed on the surface applies one deck eutectic solder equably, and the eutectic solder coating layer thickness can not be less than the solder layer thickness of design;
The 4th step: the inside that is sleeved on the metal liner that is coated with eutectic solder the target pipe;
The 5th step: to being sleeved on after together metal liner and target pipe take the lead, it is compound to carry out cold-drawn;
The 6th step: the multiple tube with cold-drawn after compound is placed on and carries out soldering in the heater; The temperature of heater is set and is higher than 50-150 ℃ of eutectic solder fusing point; Be incubated 20-200 minute, until between eutectic solder and target pipe and metal liner, all form 100% firm metallurgical binding.
The suitable Au of being used for of cold-drawing recovery, Ag, Al, Cu, Ni, Sn, Zn tubular metal target described in the 5th step and be the alloy tubulose target of main component with these metals.
Described cold-drawing recovery was combined on the drawbench and carried out the 5th step, and the selection of drawing deformation amount or cold drawing die will guarantee that drawing deformation only occurs on target pipe and the scolder, and metal liner does not deform.
The 5th goes on foot in the compound process of described cold-drawn; Through selecting suitable drawing deformation amount or cold drawing die size to make metal liner between the tubulose target, produce a capillary gap that is suitable for soldering; And capillary gap uniformity, thickness are 0.1mm-3mm, fill eutectic solder in the capillary gap.
Soldering compound through the cold-drawn in the 5th step and the 6th step makes and forms a uniformity between metal liner and the tubulose target, and thickness is the solder layer of 0.1mm-1.5mm.
Described Au, Ag, Al, Cu, Ni, Sn, Zn tubular metal target and be to have uniformity between alloy tubulose target and the metal lining of main component with these metals, and thickness is the solder layer of 0.1mm-1.5mm.
Claims (6)
1. the adhering method of a tubulose target, it is characterized in that: the step of this method is following:
The first step: process internal diameter and thickness earlier all greater than the final target pipe that requires, its length is less than
Whole requirement; Choose internal diameter, external diameter and finally require in full accordly, but length is greater than the final metal liner that requires;
Second step: polish in target pipe and the metal liner surface to needs are bonding, sandblast, cleaning, coating film treatment;
The 3rd step: the metal liner outer surface that was processed on the surface applies one deck eutectic solder equably, and the eutectic solder coating layer thickness can not be less than the tack coat or the solder layer thickness of design;
The 4th step: the inside that is sleeved on the metal liner that is coated with eutectic solder the target pipe;
The 5th step: to being sleeved on after together metal liner and target pipe take the lead, it is compound to carry out cold-drawn;
The 6th step: the multiple tube with cold-drawn after compound is placed on and carries out soldering in the heater; The temperature of heater is set and is higher than 50-150 ℃ of eutectic solder fusing point; Be incubated 20-200 minute, until between eutectic solder and target pipe and metal liner, all form 100% firm metallurgical binding.
2. the adhering method of tubulose target according to claim 1 is characterized in that: the suitable Au of being used for of cold-drawing recovery, Ag, Al, Cu, Ni, Sn, Zn tubular metal target described in the 5th step and be the alloy tubulose target of main component with these metals.
3. the adhering method of tubulose target according to claim 1; It is characterized in that: described cold-drawing recovery was combined on the drawbench and carried out the 5th step; The selection of drawing deformation amount or cold drawing die will guarantee that drawing deformation only occurs on target pipe and the scolder, and metal liner does not deform.
4. the adhering method of tubulose target according to claim 1; It is characterized in that: the 5th goes on foot in the compound process of described cold-drawn; Produce a capillary gap that is suitable for soldering between metal liner and the tubulose target through selecting suitable drawing deformation amount or cold drawing die size to make; And capillary gap uniformity, thickness are 0.1mm-3mm, fill eutectic solder in the capillary gap.
5. the adhering method of tubulose target according to claim 1 is characterized in that: soldering compound through the cold-drawn in the 5th step and the 6th step makes and forms a uniformity between metal liner and the tubulose target, and thickness is the solder layer of 0.1mm-3mm.
6. the adhering method of tubulose target according to claim 2; It is characterized in that: described Au, Ag, Al, Cu, Ni, Sn, Zn tubular metal target and be to have uniformity between alloy tubulose target and the metal lining of main component with these metals, and thickness is the solder layer of 0.1mm-3mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104314644A CN102513401A (en) | 2011-12-21 | 2011-12-21 | Tubular target bonding method |
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|---|---|---|---|
| CN2011104314644A CN102513401A (en) | 2011-12-21 | 2011-12-21 | Tubular target bonding method |
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| CN102513401A true CN102513401A (en) | 2012-06-27 |
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| CN103567583A (en) * | 2012-07-30 | 2014-02-12 | 宁波江丰电子材料有限公司 | Method for welding aluminum target assemblies |
| CN105378141A (en) * | 2013-07-05 | 2016-03-02 | 旭硝子工业陶瓷株式会社 | Sputtering target and method for manufacturing same |
| CN107953084A (en) * | 2017-11-24 | 2018-04-24 | 韶关市欧莱高新材料有限公司 | A kind of manufacture method of rafifinal rotary target material |
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| CN103567583A (en) * | 2012-07-30 | 2014-02-12 | 宁波江丰电子材料有限公司 | Method for welding aluminum target assemblies |
| CN105378141A (en) * | 2013-07-05 | 2016-03-02 | 旭硝子工业陶瓷株式会社 | Sputtering target and method for manufacturing same |
| CN105378141B (en) * | 2013-07-05 | 2018-05-18 | 旭硝子工业陶瓷株式会社 | Sputtering target material and its manufacturing method |
| CN107953084A (en) * | 2017-11-24 | 2018-04-24 | 韶关市欧莱高新材料有限公司 | A kind of manufacture method of rafifinal rotary target material |
| CN107953084B (en) * | 2017-11-24 | 2019-08-13 | 韶关市欧莱高新材料有限公司 | A kind of manufacturing method of rafifinal rotary target material |
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Application publication date: 20120627 |