CN102509723B - 覆晶薄膜的面板结构 - Google Patents
覆晶薄膜的面板结构 Download PDFInfo
- Publication number
- CN102509723B CN102509723B CN201110316840.5A CN201110316840A CN102509723B CN 102509723 B CN102509723 B CN 102509723B CN 201110316840 A CN201110316840 A CN 201110316840A CN 102509723 B CN102509723 B CN 102509723B
- Authority
- CN
- China
- Prior art keywords
- sheet metal
- wire
- length
- lead
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims abstract description 187
- 238000010276 construction Methods 0.000 claims description 43
- 239000002245 particle Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finishing Walls (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (11)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110316840.5A CN102509723B (zh) | 2011-10-18 | 2011-10-18 | 覆晶薄膜的面板结构 |
PCT/CN2011/081086 WO2013056456A1 (zh) | 2011-10-18 | 2011-10-21 | 覆晶薄膜的面板结构 |
US13/378,042 US8624131B2 (en) | 2011-10-18 | 2011-10-21 | Chip-on-film panel structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110316840.5A CN102509723B (zh) | 2011-10-18 | 2011-10-18 | 覆晶薄膜的面板结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102509723A CN102509723A (zh) | 2012-06-20 |
CN102509723B true CN102509723B (zh) | 2014-05-21 |
Family
ID=46221791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110316840.5A Expired - Fee Related CN102509723B (zh) | 2011-10-18 | 2011-10-18 | 覆晶薄膜的面板结构 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102509723B (zh) |
WO (1) | WO2013056456A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104280907A (zh) * | 2014-10-20 | 2015-01-14 | 深圳市华星光电技术有限公司 | 显示装置 |
CN108962838B (zh) * | 2017-05-22 | 2020-06-19 | 中芯国际集成电路制造(上海)有限公司 | 扇出结构和方法 |
CN106990630A (zh) * | 2017-05-24 | 2017-07-28 | 厦门天马微电子有限公司 | 显示面板及显示装置 |
CN107369692B (zh) * | 2017-06-09 | 2021-04-30 | 厦门天马微电子有限公司 | 显示面板及显示装置 |
CN109283717B (zh) * | 2018-11-26 | 2022-07-01 | 厦门天马微电子有限公司 | 显示模组和显示装置 |
CN110018598B (zh) * | 2019-04-10 | 2024-03-26 | 武汉华星光电技术有限公司 | 显示面板及显示装置 |
CN110738934B (zh) * | 2019-10-31 | 2022-11-04 | 上海中航光电子有限公司 | 显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5757450A (en) * | 1994-09-08 | 1998-05-26 | Hitachi, Ltd. | Liquid crystal display with color filters and sizes of inclined linear wiring and terminal electrodes adjusted for equal resistances |
CN1745405A (zh) * | 2003-01-30 | 2006-03-08 | 东芝松下显示技术有限公司 | 显示器、接线板及其制造方法 |
CN1976051A (zh) * | 2006-11-30 | 2007-06-06 | 昆山维信诺显示技术有限公司 | 一种显示装置的显示面板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020027958A (ko) * | 2000-10-06 | 2002-04-15 | 구자홍 | 표시소자의 cof 구조 |
JP2003330041A (ja) * | 2002-05-10 | 2003-11-19 | Sharp Corp | 半導体装置及びそれを備えた表示パネルモジュール |
US8149188B2 (en) * | 2006-07-05 | 2012-04-03 | Sharp Kabushiki Kaisha | EL display device |
JP5068067B2 (ja) * | 2006-11-22 | 2012-11-07 | 株式会社ジャパンディスプレイイースト | 表示装置および平面型表示装置 |
JP2008306050A (ja) * | 2007-06-08 | 2008-12-18 | Funai Electric Co Ltd | 電極接続構造および液晶表示ユニット |
JP4588748B2 (ja) * | 2007-09-25 | 2010-12-01 | Okiセミコンダクタ株式会社 | Cofパッケージ |
CN102097158A (zh) * | 2010-12-09 | 2011-06-15 | 友达光电股份有限公司 | 一种各向异性导电膜结构 |
-
2011
- 2011-10-18 CN CN201110316840.5A patent/CN102509723B/zh not_active Expired - Fee Related
- 2011-10-21 WO PCT/CN2011/081086 patent/WO2013056456A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5757450A (en) * | 1994-09-08 | 1998-05-26 | Hitachi, Ltd. | Liquid crystal display with color filters and sizes of inclined linear wiring and terminal electrodes adjusted for equal resistances |
CN1745405A (zh) * | 2003-01-30 | 2006-03-08 | 东芝松下显示技术有限公司 | 显示器、接线板及其制造方法 |
CN1976051A (zh) * | 2006-11-30 | 2007-06-06 | 昆山维信诺显示技术有限公司 | 一种显示装置的显示面板 |
Also Published As
Publication number | Publication date |
---|---|
WO2013056456A1 (zh) | 2013-04-25 |
CN102509723A (zh) | 2012-06-20 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Panel structure of chip on film Effective date of registration: 20190426 Granted publication date: 20140521 Pledgee: Bank of Beijing Limited by Share Ltd. Shenzhen branch Pledgor: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: 2019440020032 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201016 Granted publication date: 20140521 Pledgee: Bank of Beijing Limited by Share Ltd. Shenzhen branch Pledgor: Shenzhen China Star Optoelectronics Technology Co.,Ltd. Registration number: 2019440020032 |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140521 |