CN102486835A - Chip issuing equipment and chip issuing system - Google Patents
Chip issuing equipment and chip issuing system Download PDFInfo
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- CN102486835A CN102486835A CN2010105714866A CN201010571486A CN102486835A CN 102486835 A CN102486835 A CN 102486835A CN 2010105714866 A CN2010105714866 A CN 2010105714866A CN 201010571486 A CN201010571486 A CN 201010571486A CN 102486835 A CN102486835 A CN 102486835A
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Abstract
The invention discloses chip issuing equipment and a chip issuing system, wherein the chip issuing equipment comprises a chip loading device, a chip transmission passage, a chip writing device and a chip sorting device, wherein the chip loading device is used for loading chips to be issued into the chip transmission passage, the chip transmission passage is used for transmitting the chips to be issued to the chip writing device through the self weight of the chips to be issued, the chip writing device is used for writing issuing data into the chips to be issued, detecting issued chips and outputting detection results, and the chip sorting device is used for sliding the issued chips into successfully issued chip loading tubes or unsuccessfully issued chip loading tubes according to the detection results. The chip issuing equipment and the chip issuing system disclosed by the invention have the advantages that pneumatic transmission and infrared sensing detection modes are adopted, the computer software control is matched for completing the whole-process automatic feeding, the issuing, the detection and the loading of the chips, the issuing speed is high, and in addition, the issuing accuracy is high.
Description
Technical field
The present invention relates to the distribution of chip, particularly a kind of chip distribution equipment and chip publishing system.
Background technology
Along with science and technology development, chip being applied to more and more widely produce and life in the middle of, promoted the scientific and technological level of production technology, greatly facilitate daily life.In general; Chip with certain specific function must carry out the establishment of file structure, importing of key or the like to it through specific read-write equipment; This process also is known as the distribution of chip; Step is comparatively loaded down with trivial details, distribution efficient not high problem, particularly some chips in irregular shape and exist for the distribution process of chip itself, and the problems referred to above are just more outstanding.
With common embedded-type security control module (Embedded Secure Access Module; ESAM) be example; It has been widely used in copyright protection field of PW (like water power gas meter field), financial POS machine field and product etc., has sizable effectiveness.ESAM adopts special-purpose intelligent card chip encapsulation (DIP or COB) form, and chip exterior is stretched out eight metal pins, and the packing specification commonly vertical chip of 50 dresses is loaded pipe; ESAM vertically is arranged in chip and loads in the pipe, because the irregular contour of ESAM makes the distribution of present ESAM remain employing distribution pattern manually, promptly operating personnel load ESAM the pipe from chip and pour out; And one by one ESAM is put into the card extender of card reader with manual mode; Contact with eight stitch of ESAM eight contacts of an IC-card are overhanging, accomplish the distribution of ESAM then through computer software and card reader, will issue the ESAM that accomplishes with manual mode more afterwards and reload chip and load and manage; Whole process almost is to lean on technician's pure manual operation to accomplish; Obviously, the as easy as rolling off a log manual errors that occurs of this manual issuing way, distribution efficient is also very low; Facts have proved; Speed with manual mode distribution ESAM is very slow, on average per hour only can issue 200 to 400, and the probability that makes a mistake is very high.
In addition, after the chip distribution, also to detect, whether correctly write to chip to confirm file structure, key etc. to it; Just whether the chip after the distribution has desired functional effect, after the detection, also need qualified and underproof chip be carried out finishing collecting respectively; To carry out subsequent treatment; And in the prior art to the detection step of chip and to compile step all be to rely on technician's manual operations to accomplish, this certainly will cause work efficiency low, cost of labor is high; And very easily occur human error in the operating process, cause product problem or certified products and unacceptable product to mix each other.
In the face of the integral form that nowadays the chip use amount is increasing, user demand increases fast; The issuing way of above-mentioned poor efficiency, high fault rate obviously can't adapt to the production demand, needs improvement badly, Given this plants situation; The design people borrows its related-art technology experience and abundant professional knowledge for many years; Constantly research and develop improvement, and, proposed the technical scheme of automatic distribution of chip of the present invention and checkout equipment through a large amount of practical proofs.
Summary of the invention
The object of the present invention is to provide a kind of chip distribution equipment and chip publishing system; The main mode that adopts pneumatic transmission and infrared induction to detect; And cooperating whole-process automatic material loading, distribution, detection and the charging of accomplishing chip with control of computer software, distribution speed is fast and the distribution accuracy rate is high.
To achieve these goals, the invention provides a kind of chip distribution equipment, comprising: chip loading attachment, chip transmission channel, chip writing station, die sorter;
Said chip loading attachment is used for chip to be issued is loaded into said chip transmission channel;
Said chip transmission channel is used to rely on and waits that the deadweight of issuing chip sends chip to be issued to said chip writing station;
Said chip writing station is used for release data is write chip to be issued and detects the output testing result to issuing the back chip;
Said die sorter is used for making chip after the distribution slip into that the successful chip of distribution loads pipe or the unsuccessful chip of distribution loads pipe according to said testing result.
To achieve these goals, the invention provides a kind of chip publishing system, comprising:
The distribution host computer;
Chip distribution equipment carries out chip distribution operation under the control of said distribution host computer, said chip distribution equipment comprises chip loading attachment, chip transmission channel, chip writing station, die sorter again;
Said chip loading attachment is used for chip to be issued is loaded into said chip transmission chip transmission channel;
Said chip transmission channel is used to rely on and waits that the deadweight of issuing chip sends described chip to be issued to said chip writing station;
Said chip writing station is used for release data is write chip to be issued and detects the output testing result to issuing the back chip;
Said die sorter is used for making chip after the distribution slip into that the successful chip of distribution loads pipe or the unsuccessful chip of distribution loads pipe according to said testing result.
From the above, chip distribution equipment of the present invention and chip publishing system have following advantage and characteristics:
1, chip distribution equipment of the present invention and chip publishing system are through being provided with many places cylinder and sensor; Carry out pneumatic transmission and carry out the infrared induction detection; Realize whole-process automatic material loading, distribution, detection and the charging of chip; Substituted the traditional hand mode of operation, distribution speed is fast, efficient is high.
2, writing and the testing process full automation of the entire chip of chip distribution equipment of the present invention and chip publishing system avoided manual installation mistake to occur, and the distribution accuracy rate is high.
3, chip distribution equipment of the present invention and chip publishing system; Automatically detect step after chip is issued in writing station immediately, whether the distribution of detection chip is successful, and writes success and unsuccessful chip according to the signal of chip writing station and computing machine that read write line turns back to through the automatic taxonomic revision collection of sorting shuttle; Improved work efficiency; Whole process need not manual intervention, has avoided the high fault rate of manual inspection and finishing collecting, and has practiced thrift cost of labor greatly.
4, chip distribution equipment of the present invention and chip publishing system volume are less; Can be applicable to multiple work space and environment; Control section and man-machine communication's humanization designing, operation and parameter are provided with very convenient, can carry out work and get rid of simple fault by touch-screen.
5, chip of the present invention distribution equipment and chip publishing system to material loading, walk any fault that occurs in material and the sub-material and all can monitor through sensor; And give the distribution control part that checkout equipment had through sensor feedback information, control part is dealt with to feedback information and relevant information is shown in man-machine interface.
6, chip of the present invention distribution equipment and chip publishing system can be done suitably adjustment according to the actual chip that will issue, thereby applicable to the automatic distribution and the detection of various chips, help applying.
Description of drawings
Following accompanying drawing only is intended to the present invention is done schematic illustration and explanation, not delimit the scope of the invention.
Fig. 1 is chip distribution equipment overall structure synoptic diagram of the present invention;
Fig. 2 is chip distribution device chip loading attachment synoptic diagram of the present invention;
Fig. 3 is chip distribution equipment stepping discharging device synoptic diagram of the present invention;
Fig. 4 is chip distribution equipment clamping of the present invention location writing station synoptic diagram;
Fig. 5 is chip distribution device chip sorting unit synoptic diagram of the present invention;
Fig. 6 is a chip publishing system synoptic diagram of the present invention.
Description of reference numerals:
100 chips distribution equipment
200 distribution host computers
1 frame
11 planar portions
12 inclined plane parts
2 chip loading attachments
21 arm for taking material
211 chips load tube grip portion
212 upset cylinders
213 are turned to level sensor
214 press the pipe cylinder
215 press the pipe cylinder sensor
216 strike the pipe arm
The double pipe cylinder that strikes of 217 backgauges
218 baffle plates
22 backstays
221 conduits
222 storage pipe detecting sensors
223 notches
23 ejectors
231 straight-line grooves
232 ejector sleeve cylinders
233 ejector sleeve upfront sensors
24 push pipe cylinders
400 chip writing stations
3 stepping discharging devices
31 stepping cylinders
4 clampings location writing station
41 write terminal
300 read write lines
42 fixed mounts
43 clamping keepers
44 gripper cylinders
45 distribution position transducers
46 positioning cylinders
5 die sorters
51 sorters
511 slide rails
512 sorting shuttles
5121 material guide holes
5122 backgauge spares
Backgauge cylinder in 5123 shuttles
513 sorting shuttle cylinders
5131 shuttles load pipe position of mounting hole sensor at first chip
5132 shuttles load pipe position of mounting hole sensor at second chip
514 shuttles top photoelectric sensor
515 shuttles below photoelectric sensor
52 chips load the pipe fixed part
521 first chips load the pipe mounting hole
522 second chips load the pipe mounting hole
523 first chips load pipe mounting hole detecting sensor
524 second chips load pipe mounting hole detecting sensor
6 driving control devices
8 chip transmission channels
81 interface detecting sensors
82 stepping district photoelectric sensors
83 track the place ahead photoelectric sensors
9 chips load pipe
Embodiment
Understand in order technical characterictic of the present invention, purpose and effect to be had more clearly; Contrast description of drawings embodiment of the present invention at present; In order to make explanation clear more concrete; The elite preferred embodiment that is distributed as with ESAM is explained chip of the present invention distribution equipment and chip publishing system, but one of ordinary skill in the art should to understand the chip that the present invention is suitable for not be only to be limited to ESAM.
Please refer to Fig. 1; Be chip distribution equipment overall structure synoptic diagram of the present invention; As shown in the figure; Chip distribution equipment 100 of the present invention is devices that the ESAM chip carries out operations such as automatic charging, distribution, detection and charging, is the place of ESAM chip distribution, and chip distribution equipment 100 mainly includes chip loading attachment 2, chip transmission channel 8, chip writing station 400 and die sorter 5; Chip writing station 400 further comprises stepping discharging device 3 and clamping location writing station 4 again, and its chips loading attachment 2 is used for chip to be issued is loaded into chip transmission channel 8; Chip transmission channel 8 is used to rely on and waits that the deadweight of issuing chip sends chip to be issued to chip writing station 400; Chip writing station 400 is used for release data is write chip to be issued and detects the output testing result to issuing the back chip; Die sorter 5 is used for making chip after the distribution slip into that the successful chip of distribution loads pipe or the unsuccessful chip of distribution loads pipe according to testing result.
In addition; Chip distribution equipment 100 also includes driving control device 6; Respectively the connection-core sheet loads device 2, chip writing station 400 and die sorter 5, is used for control and drives said chip loading attachment 2, chip writing station 400 and die sorter 5.
Chip distribution equipment 100 has a frame 1, and frame 1 has a planar portions 11 and an inclined downward portion 12, and planar portions 11 is adjacent with inclined plane part 12; Chip loading attachment 2 is located on the planar portions 11, and it is mainly used under the control of driving control device 6, waits to issue the ESAM chip and loads depositing and automatic charging of pipe; Stepping discharging device 3 is connected with chip loading attachment 2 through core sheet transmission channel 8 always; Stepping discharging device 3 and chip transmission channel 8 all are arranged on the inclined plane part 12; Make the ESAM chip to be delivered to stepping discharging device 3 through chip transmission channel 8 by self gravitation by chip loading attachment 2; Stepping discharging device 3 is mainly used in control ESAM chip, makes its control following clamping that enters into one by one by driving control device 6 locate writing station 4; Clamping location writing station 4 is arranged on the inclined plane part 12; Be positioned at stepping discharging device 3 belows and be attached thereto logical; Clamping location writing station 4 is used to receive that stepping discharging device 3 sends into one by one waits to issue the ESAM chip; And under the control of driving control device 6, its clamping is positioned to issue the position, write distribution operation and detection and whether issue successful detecting operation; Driving control device 6 connects above-mentioned chip loading attachment 2, stepping discharging device 3, clamping location writing station 4 respectively, is used to control each above-mentioned device and driving force is provided for its motion; Die sorter 5; It is arranged on the inclined plane part 12; Be positioned at writing station 4 belows, clamping location and connection with it, die sorter 5 is mainly used under the control of driving control device 6 and carries out sorting to issuing successful and unsuccessful ESAM, and is included into different chip loading pipes respectively and carries out finishing collecting; Die sorter 5 also is connected in driving control device 6, and receives its control and driving.
Please refer to Fig. 2 below in addition, for chip distribution device chip loading attachment synoptic diagram of the present invention, as shown in the figure; Chip loading attachment 2 includes: an arm for taking material 21, and an end of arm for taking material 21 is coupling in frame 1, and this pivoted connection end offers a discharging opening; The other end is a free end, makes the arm for taking material 21 can be so that to serve as that fixed point is rocked in vertical plane parallel or parallel with inclined plane part 12 with planar portions 11 with the pivoted connection end of frame 1, and the free end of arm for taking material 21 is provided with chip and loads tube grip portion 211; Load an end of pipe 9 in order to grip chip, when arm for taking material 21 is rocked to when parallel with planar portions 11, the straight line at arm for taking material 21 places will be adjacent with said planar portions 11; That is to say,, then be rocked to when parallel when arm for taking material 21 with planar portions 11 if arm for taking material 21 clampings have chip to load pipe; The chip of its clamping loads pipe 9 can be placed horizontally at planar portions 11; And be rocked to parallel with inclined plane part 12 time when arm for taking material 21, the chip of arm for taking material 21 and clamping thereof load pipe 9 will with chip transmission channel 8 conllinear, arm for taking material 21 discharging openings are connected with chip transmission channel 8; The ESAM that the chip of arm for taking material 21 clampings loads in the pipe can slide in the chip transmission channel 8 under the effect of deadweight; The discharging opening that is connected with chip transmission channel 8 at arm for taking material 21 is provided with baffle plate 218, arm for taking material 21 swing to chip transmission channel 8 conllinear before, baffle plate 218 seals the discharging opening that the clamping chip loads pipe all the time; Avoiding in the process of arm for taking material 21 swing, ESAM chip accident skids off chip and loads pipe.On arm for taking material 21, also extend and be provided with one and strike pipe arm 216, this strikes the chip that pipe arm 216 can beat clamping on the arm for taking material 21 and loads pipe 9, in case the ESAM chip card loads in the pipe and can not freely slide in the chip transmission channel 8 down at chip; Baffle plate 218 and strike tube wall 216 and all be connected with the double pipe cylinder 217 that strikes of backgauge, backgauge is double to be struck pipe cylinder 217 and is arranged on the arm for taking material 21, receives the double drive of striking pipe cylinder 217 of backgauge; Striking pipe arm 216 falls when beaing chip and load pipe baffle plate 218 and opens; So that the ESAM chip that chip loads in the pipe slides, and manage arm 216 when lifting when striking, baffle plate 218 falls; Striking pipe arm 216 is connected through the double pipe cylinder 217 that strikes of two gas circuits and backgauge with baffle plate 218; Cylinder is controlled two gas circuits through solenoid valve, realizes backgauge and strikes the pipe action, thereby realize above-mentioned motion; Dependency structure is well known to those skilled in the art, repeats no more at this.The double pipe cylinder 217 that strikes of backgauge is connected in power drive control device 6 and receives its control and driving.
The arm body position of arm for taking material 21 is connected with a upset cylinder 212; The upset swing that is used to arm for taking material 21 provides driving force, and upset cylinder 212 is connected in power drive control device 6 and receives its control and driving, in general; The bottom surface that upset cylinder 212 is arranged at arm for taking material 21 is near the arm for taking material free end; Like this, when cylinder piston rod extends, will support pivoted arm 21 and upwards rotate, rotate and when cylinder piston rod shrinks, will drive pivoted arm 21; Also can be provided with one on the upset cylinder 212 and be turned to level sensor 213; Whether turn to predeterminated position to detect arm for taking material 21, the position that promptly mentioned above and planar portions 11 are parallel or parallel with inclined plane part 12 is turned to level sensor 213 and links to each other with driving control device 6; And the feedback transducing signal is to driving control device 6, so that driving control device 6 controls and drive the running of upset cylinder according to feedback signal.Similarly, the chip of arm for taking material 21 loads tube grip portion 211 and and presses pipe cylinder 214 to link to each other, and presses pipe cylinder 214 can be arranged on the frame 1; It is connected in power drive control device 6 and receives its control and driving, thinks that the action of chip loading tube grip portion 211 provides driving force, and is pressing pipe cylinder 214 also to be provided with pressure pipe cylinder sensor 215; Whether put in place to detect arm for taking material 21 clamping chips loading pipe, same, press pipe cylinder sensor 215 (because cylinder and sensor can be arranged at device inside; And the position is set can be adjusted according to operating mode flexibly; So only indicate in the drawings its in the present embodiment the position is set substantially, necessity is not drawn in detail, following each cylinder and sensor all adopt similar fashion) link to each other with driving control device 6; And the feedback transducing signal is given driving control device 6; So that driving control device 6 is controlled the running with drive pressure pipe cylinder 214 according to feedback signal, certainly, above-mentioned is turned to level sensor 213 and presses pipe cylinder sensor 215 also can be arranged on other positions according to actual conditions; One of ordinary skill in the art can easier suitably be adjusted according to technical need, just repeats no more at this;
Two backstays 22, vertical is arranged on the planar portions 11, between two backstays 22 certain spacing is arranged apart; This spacing equals the length that chip loads pipe 9 basically, loads pipe 9, two backstays 22 relative sides with ccontaining chip and all offers a vertical conduit 221; Load the two ends of pipe 9 with ccontaining positioning chip; But a plurality of chips load the stacked chip of depositing between two backstays 22 of pipe 9 levels and load the pipe parking space, and by two backstays, 22 location, the phenomenon that can't occur being scattered.When arm for taking material 21 is rocked to when parallel with planar portions 11; Arm for taking material 21 is parallel to the straight line that two backstays 22 are fixed in 2 places of planar portions 11; I.e. two backstays, 22 determined horizontal linears, the rectilinear direction that just stored chip loads pipe 9 in two backstays 22.Backstay 22 is provided with storage pipe detecting sensor 222; In order to detect whether also contain chip loading pipe between two backstays 22, storage pipe detecting sensor 222 is linked to driving control device 6, and transducing signal is fed back to driving control device 6; So that judging whether also to contain chip according to feedback signal, driving control device 6 loads pipe; If then do not send corresponding signalisation operator, certainly, storage pipe detecting sensor 222 also can be arranged on other positions according to actual conditions; One of ordinary skill in the art can easier suitably be adjusted according to technical need, just repeats no more at this;
Ejector 23; Be located on the planar portions 11; Be positioned at the chip loading pipe parking space below that two backstays 22 are formed; The end face of ejector 23 runs through the straight-line groove 231 that offers the ccontaining chip loading of ability pipe; This straight-line groove 231 and two backstays 22 were fixed in the straight line conllinear at 2 places of planar portions 11 when ejector 23 was positioned at initial position, and at this moment, nethermost one is contained in the straight-line groove 231 in the stacked chip loading pipe of depositing between two backstays 22 9; Two backstays, 22 bottoms and planar portions 11 fixing positions offer notch 223 respectively towards a side of arm for taking material 21, shift out the chip loading pipe parking space between two backstays 22 so that yoke frame 23 can drive chip loading pipe 9.Ejector 23 can move perpendicular to the direction of two backstays, 22 determined horizontal linears in planar portions 11 upper edges; Thereby the chip on the pushing tow planar portions 11 loads pipe 9; When arm for taking material 21 is rocked to parallel with planar portions 11 and when the folded chip of establishing loaded pipe 9 and be placed horizontally at planar portions 11; Chip loads tube grip portion 211 and unclamps the clamping of chip being loaded pipe 9; Ejector 23 moves and will load chip that tube grip portion 211 unclamps clamping to chip and load pipe 9 and push away planar portions 11; And with in the straight-line groove 231 ccontaining chip load pipe 9 and drive the clip position that chip loads tube grip portion 211, just with in the straight-line groove 231 ccontaining chip load pipe 9 and drive the position with arm for taking material 21 conllinear, just straight-line groove 231 and arm for taking material 21 conllinear; Chip loading tube grip portion 211 moves once more and will step up the chip loading pipe 9 in the straight-line groove 231 at this moment; When this chip of arm for taking material 21 clampings loads that pipe 9 lifts and after leaving straight-line groove 231, ejector 23 moves back to chip that two backstays, 22 clampings deposit to opposite direction and loads below the pipe, at this moment; Be positioned at that the chip of below loads pipe landing to straight-line groove 231 automatically, load and manage feeding and prepare next time chip.Ejector 23 is connected with ejector sleeve cylinder 232, and ejector sleeve cylinder 232 is arranged on the frame 1 and with driving control device 6 and links to each other, and by driving control device 6 controls and driving ejector sleeve cylinder 232, thereby control and driving ejector 23 move on planar portions 11.Also can on planar portions 11, be provided with ejector sleeve upfront sensor 233; Be used to detect ejector 23 and whether move to the precalculated position; Promptly whether chip being loaded pipe racks moves the clip position of chip loading tube grip portion 211 and whether gets back to chip loading pipe deposit position below; Ejector sleeve upfront sensor 233 links to each other with driving control device 6, and the feedback transducing signal is to driving control device 6, so that driving control device 6 controls and drive the running of ejector sleeve cylinder 232 according to feedback signal; Certainly; Ejector sleeve upfront sensor 233 also can be arranged on other positions according to actual conditions, and one of ordinary skill in the art can easier suitably be adjusted according to technical need, just repeats no more at this.
Quantity is set adjusts according to actual needs of ejector 23; Ejector 23 is provided with two in the present embodiment; Straight-line groove 231 conllinear of two ejectors 23; And moving of two ejectors 23 is same moved further, to guarantee that chip loading pipe is steadily delivered to the clip position of getting chip loading pipe 21 chips loading tube grip portion 211 smoothly.
Push pipe cylinder 24 is arranged at planar portions 11; When arm for taking material 21 turns to when parallel with planar portions 11; Push pipe cylinder 24 and arm for taking material 21 conllinear; 24 motions of push pipe cylinder can be loaded pipe to guarantee its chip that enters into arm for taking material 24 loading tube grip portion 211 by the ejection chip, and chip loads tube grip portion 211 chip is loaded the tube grip location afterwards.Push pipe cylinder 24 is connected with driving control device 6, receives its controlling and driving.
Chip writing station 400 in the chip distribution equipment 100 of the present invention comprises stepping discharging device 3 and clamping location writing station 4; Please refer to Fig. 3 below; Be chip distribution equipment stepping discharging device synoptic diagram of the present invention, as shown in the figure, stepping discharging device 3 and chip transmission channel 8 all are arranged on the inclined plane part 12; When arm for taking material 21 is rocked to parallel with inclined plane part 12; Clamping have chip load pipe arm for taking material 21 will with straight line chip transmission channel 8 conllinear, and the discharging opening of arm for taking material 21 is connected with the inlet of chip transmission channel 8, the ESAM chip that chip is loaded in managing can slide in the chip transmission channel 8 successively.Corresponding arm for taking material 21 is provided with interface detecting sensor 81 with the interface of chip transmission channel 8 on inclined plane part 12; Whether be used to detect arm for taking material 21 normal with being connected of chip transmission channel 8; Interface detecting sensor 81 links to each other with driving control device 6; And the feedback transducing signal so that driving control device 6 judges according to feedback signal whether interface is connected well, and is judged the signal that whether gives the alarm to driving control device 6.Certainly; Above-mentioned interface detecting sensor 81 also can be arranged on other positions; Such as the porch of discharging opening place that can be arranged at arm for taking material 21 or pipeline 8, one of ordinary skill in the art can easier suitably be adjusted according to technical need, just repeats no more at this.In addition, the end that chip transmission channel 8 is connected with arm for taking material 21 is provided with track the place ahead photoelectric sensor 83, is connected in driving control device 6; In addition whether it be used for detecting, and chip slips into the chip transmission channel 8 from arm for taking material 21; Thereby the chip of judging arm for taking material 21 clampings loads whether also have chip in the pipe, in general, and when arm for taking material does not still have chip to slip into the chip transmission channel from arm for taking material after striking the pipe action several times; Be that track the place ahead photoelectric sensor 83 has not detected chip and slips over; Then judging in the chip loading pipe has not had chip, and at this moment, track the place ahead photoelectric sensor 83 feeds back signal to driving control device 6; Driving control device 6 drives upset cylinder 212 according to this feedback signal, gets material thereby drive arm for taking material 21 is rocked to planar portions 11 once more.
The outlet of chip transmission channel 8 connects stepping discharging device 3; Stepping discharging device 3 is used to control the ESAM chip; Make its clamping location writing station 4 that enters into the below one by one; Stepping discharging device 3 is provided with stepping cylinder 31, and stepping cylinder 31 is used to control and makes the chip that rests in the chip transmission channel 8 transfer to the distribution district one by one, and stepping cylinder 31 is connected in driving control device 6 and controlled by it; Realize the technology that the below one by one of chip is well known to those skilled in the art about stepping cylinder, repeat no more at this.
Then please refer to Fig. 4; Be chip distribution equipment clamping of the present invention location writing station synoptic diagram, as shown in the figure, clamping location writing station 4 is located on the inclined plane part 12; Be positioned at the below of stepping discharging device 3; Clamping location writing station 4 is connected with stepping discharging device 3, receives the ESAM chip that it is sent into one by one, and it is clamped and fastened on the distribution position writes distribution and detection step.Clamping location writing station 4 comprises that one writes terminal 41; Be fixedly arranged on the inclined plane part 12; Write terminal 41 and can be a golden finger; Be used for contacting and file, key supervisor write among the chip accomplishing distribution, and carry out detecting operation, be the distribution position corresponding to the position that writes terminal 41 on the inclined plane part 12 through it with the chip metal section and part; Write terminal 41 and connect a read write line 300, said read write line 300 is used for release data is written to and waits to issue chip and carry out detecting operation through writing terminal 41.Above writing terminal 41, be provided with fixed mount 42; It is fixedly arranged on the inclined plane part 12; The corresponding position that writes terminal 41 is provided with clamping keeper 43 on the fixed mount 42; Clamping keeper 43 connects gripper cylinders 44, and clamping keeper 43 can be clamped and fastened on the ESAM chip under the driving of gripper cylinder 44 and issue the position, the metal section and part that makes chip with write terminal 41 and contact.Gripper cylinder 44 is arranged on the fixed mount 42 or on the inclined plane part 12, and it is connected with driving control device 6 and receives its control and driving.Clamping location writing station 4 also is provided with distribution position transducer 45; Distribution position transducer 45 is used to detect the ESAM chip on the one hand and whether arrives the distribution position; Whether also be used for detection chip on the other hand is that normal stepping is transferred to the distribution position; Such as distribution position transducer 45 can be arranged near the distribution position, when a chip to be issued slides into the distribution position; Be used for the part whether detection chip reaches the distribution position with triggering in the distribution position transducer 45, this part that is triggered is sent the corresponding feedback signal; And transmit when undesired when stepping; When having two chips to slide near the distribution position simultaneously, one of them chip slides into the distribution position and will trigger distribution and be used for the part whether detection chip reaches the distribution position in the position transducer 45, then triggers with another chip of this chip by chip to be used for whether another part of normal stepping of detection chip in the distribution position transducer 45; Distribution position transducer 45 will send feedback signal like this; Do not have normal stepping transmission with alarm chip, on the contrary, when stepping just often; Have only a chip to slide to the distribution position; Distribution be used in the position transducer 45 detection chip whether the part of normal stepping can not be triggered, just can not send the corresponding feedback signal, stepping is carried and is normally carried out.Distribution position transducer 45 is connected with driving control device 6; The feedback transducing signal is given driving control device 6; Make driving control device 6 judge according to feedback signal whether chip has arrived the distribution position and whether the stepping transmission is normal, issue and detect step thereby control gripper cylinder 44 positions and controls.
Clamping location writing station 4 also comprises positioning cylinder 46; Can be arranged on the inclined plane part 12, but positioning cylinder 46 drive controlling one interception part, like plate washer spare; With the ESAM chip after interception distribution and the detection; To prevent that it from arbitrarily skidding off under the effect of deadweight, this class formation of positioning cylinder 46 driving plate washer spare interception chips is comparatively common in the present technique field, just repeats no more at this.Positioning cylinder 46 can be arranged at the discharging opening place of clamping location writing station 4.Positioning cylinder 46 is connected in driving control device 6 and receives its control and driving, in the reasonable time action chip is transferred.
Please refer to Fig. 5 below; Be chip distribution device chip sorting unit synoptic diagram of the present invention, as shown in the figure, die sorter 5 is located on the inclined plane part 12; Be positioned at the below of clamping location writing station 4; ESAM chip through distribution and trace routine enters into die sorter 5, and the chip that die sorter 5 will be issued successfully under the control of driving control device 6 and unsuccessful chip carries out sorting and packs into different loads pipe, to realize categorised collection.Die sorter 5 comprises that a sorter 51 and chip load pipe fixed part 52; Wherein sorter 51 is used for sorting and issues and successfully reach unsuccessful chip; Sorter 51 comprises a slide rail 511 and a sorting shuttle 512, and slide rail 511 is horizontally located on the inclined plane part 12, sorting shuttle 512 slidable being arranged on the slide rail 511; Sorting shuttle inside vertically offers a material guide hole 5121; This material guide hole 5121 can be communicated in the discharging opening of clamping location writing station 4, and with transmission ESAM chip, the ESAM chip can pass from material guide hole 5121.
Sorting shuttle 512 inner material guide hole places also are provided with backgauge spare 5122; Backgauge spare 5112 is connected with backgauge cylinder 5123 in the shuttle; In shuttle under the driving of backgauge cylinder 5123, backgauge spare 5122 can move with blocking-up or open material guide hole 5121, thereby the chips that fall in the sorting shuttle 512 are stopped by backgauge spare 5122 and is temporary in the material guide hole 5121 of sorting shuttle 512; And after sorting shuttle 512 slides into appointed positions, drive backgauge spare 5122 again and move and open material guide hole inner chip is slided.Wherein, backgauge cylinder 5123 is connected in driving control device 6 and receives its control and driving in the shuttle.
Sorting shuttle 512 is externally connected to a sorting shuttle cylinder 513, is arranged on the inclined plane part 12, and sorting shuttle cylinder 513 is used to drive sorting shuttle 512 and on slide rail 511, slides, and sorting shuttle cylinder 513 is connected with driving control device 6, receives its control and driving.A kind of optimal way that is provided in the present embodiment is: a side that is arranged at slide rail 511 of sorting shuttle cylinder 513 levels, and cylinder push-rod is parallel with slide rail 511, and the level of cylinder push-rod is flexible like this can promote sorting shuttle 512 horizontal slip on slide rail 511.
Chip loads pipe fixed part 52 and is fixedly arranged on the inclined plane part 12; Be positioned at sorter 51 belows; Chip loading pipe fixed part 52 is used to install collect issues the chip loading pipe that successfully reaches unsuccessful chip; Chip loads pipe fixed part 52 and vertically runs through parallel two the chips loading pipe mounting holes that offer; First chip loads pipe mounting hole 521 and loads pipe mounting hole 522 with second chip, and wherein first chip loads pipe mounting hole 521 or second chip to load pipe mounting hole 522 relative with the discharging opening of clamping location writing station 4, and the discharging opening of clamping location writing station 4 loads and manages mounting hole 521 being positioned at first chip in the present embodiment.Thereby an end of pipe 9 system of can pressing from both sides of loading chip is fixed in chip and loads and make chip load pipe in the pipe mounting hole to be installed in chip and to load pipe fixed part 52; Two chips being installed load one of pipe and are used to deposit the successful ESAM chip of dress distribution, and another is used to deposit the unsuccessful ESAM chip of dress distribution.
Under the control of driving control device 6; The horizontal slip of sorting shuttle 512 can make its material guide hole 5121 align respectively and be communicated with that first chip loads pipe mounting hole 521 or second chip loads pipe mounting hole 522, and the ESAM chip can slip into first chip from material guide hole 5121 and load the chip that pipe mounting hole 521 or second chip load installing the pipe mounting hole 522 and load in the pipe 9.Load at chip and also to be provided with first chip on the pipe fixed part 52 and to load pipe mounting hole detecting sensor 523 and load with second chip and manage mounting hole detecting sensor 524; Be used for detecting first chip and load in pipe mounting hole 521 and second chip loading pipe mounting hole 522 whether be equiped with chip loading pipe; And feed back signal to driving control device 6; Driving control device 6 judges that according to feedback signal first chip loads pipe mounting hole 521 and second chip loads whether be equiped with chip loading pipe in the pipe mounting hole 522, and judges the signal that whether gives the alarm.
From the above mentioned; Sorting shuttle cylinder 513 drives sorting shuttle 512 and on slide rail 511, slides; Load pipe mounting hole 521 or second chip loading pipe mounting hole 522 and make sorting shuttle material guide hole 5121 can align and be communicated with first chip respectively; At this moment, sorting shuttle 512 residing positions are respectively first chip and load pipe position of mounting hole and second chip loading pipe position of mounting hole.On sorting shuttle cylinder 513, be respectively arranged with shuttle and load pipe position of mounting hole sensor 5132 with shuttle at second chip at first chip loading pipe position of mounting hole sensor 5131; Two above-mentioned sensors are respectively applied for to detect whether sorting shuttle 512 is positioned at first chip loading pipe position of mounting hole and second chip loads the pipe position of mounting hole; And detection signal fed back to driving control device 6; Driving control device 6 is judged the position of sorting shuttle 512 according to above-mentioned feedback signal; Do not arrive the precalculated position if judge sorting shuttle 512, then drive sorting shuttle cylinder 513 driving sorting shuttles 512 and move; If judgement sorting shuttle 512 is in place, just can drive backgauge cylinder 5123 in the shuttle, make the chips in the sorting shuttle 512 fall the chip loading pipe that is slipped into installing in first chip loading pipe mounting hole 521 or second chip loading pipe mounting hole 522.
In addition; Above the sorting shuttle 512 and below be respectively arranged with above the shuttle photoelectric sensor 515 below the photoelectric sensor 514 and shuttle; Whether shuttle top photoelectric sensor 514 is used to detect sorting shuttle 512 tops has the ESAM chip to slide, and whether shuttle below photoelectric sensor 515 then is to be used to detect sorting shuttle 512 belows have the ESAM chip to slide, and two photoelectric sensors all are connected in driving control device 6; Detection signal is fed back to driving control device 6; Driving control device 6 can be judged the conveying situation of sorting shuttle 512 inner ESAM chips according to this feedback signal, and fault such as whether get stuck takes place, thereby judges whether need send alerting signal.
Driving control device 6; Be used to receive the feedback signal of above-mentioned each sensor, and drive and control each above-mentioned cylinder, driving control device 6 can also further be divided into drive unit and control device; Control device is mainly used in and receives and handle feedback signal and send control signal; Thereby the control signal that drive unit then sends according to control device drives each device operation that each cylinder makes chip distribution equipment 100, and control device is connected in distribution host computer 200, and control device can adopt a PLC controller; Drive unit then can adopt a solenoid valve air compressor; Keying through control electromagnetic valve drive with control chip distribution equipment on different cylinders, this technology is well known to those skilled in the art, repeats no more at this.Control device and drive unit can be arranged on the frame 1 simultaneously, perhaps consider the heavy burden factor and only control device are arranged on the frame 1, and drive unit can be positioned near the frame 1.Control device also can comprise an operational module, controls for the technician, and the operational module in the present embodiment is the liquid crystal touch control panel, has to control picture and abundant man-machine communication's function intuitively.In addition, driving control device also can comprise a warning device, like alarm lamp, is used for when situation such as device fails or needs charging, sending alerting signal prompting staff.
Please refer to Fig. 6 below; For chip publishing system synoptic diagram of the present invention, as shown in the figure, chip publishing system of the present invention comprises distribution host computer 200 and chip distribution equipment 100; Wherein issue host computer 200 and be used for the control that chip is issued; Chip distribution equipment 100 then carries out chip distribution operation under the control of distribution host computer 200, the chip distribution equipment 100 here is chip distribution equipment illustrated in the preceding text, and its structure and principle of work are identical.Distribution host computer 200 is connected in chip distribution equipment 100; Definite saying so is connected in driving control device 6; Can communicate through the RS232 order wire between distribution host computer 200 and the chip distribution equipment 100, distribution host computer 200 can be a computing machine, and it is equipped with the relevant Control Software that chip is issued detection automatically; Make distribution host computer 200 can control chip the operation of distribution equipment 100, and control adjustment according to the signal that chip distribution equipment feeds back.
In addition; Distribution host computer 200 also is connected in read write line 300, and as stated, read write line is issued the terminal 41 that writes that clamping is located in the writing station 4 in the equipment 100 with chip and linked to each other; Read write line 300 is mainly used under the control of distribution host computer 200 file, key supervisor information is written in the ESAM chip; Accomplish the distribution operation, and the chip after the distribution is detected, judge whether it issues success and to distribution host computer 200 feedback signals.Read write line 300 can be inserted with a female card, to write the ESAM chip release data such as file, key be stored in advance among this mother's card, read write line 300 is read above-mentioned release data from mother's card, and is written in the ESAM chip.Read write line 300 can be interfaces such as USB or RS232 with distribution between the host computer 200 and is connected, and read write line 300 and chip are issued writing terminal 41 and can being connected through signal wire, transfer wire etc. of equipment 100.When distribution host computer 200 receives the accurate in place signal of the ESAM chip of chip distribution equipment 100 (distribution position transducer 45) feedback; 300 pairs of ESAM chips of distribution host computer 200 control read write lines are issued and are detected; And with the testing result signal feedback to the distribution host computer 200; Distribution host computer 200 transmits the Different control signal to chip distribution equipment 100 according to the different detection consequential signal, and the ESAM chip after chip distribution equipment will be issued according to Different control signal controlling die sorter 5 is issued successful chip loading pipe or the unsuccessful chip loading of distribution pipe.
Below in conjunction with principle of work that chip distribution equipment of the present invention and system are described referring to figs. 1 to Fig. 6 and simple workflow; At first, a plurality of chips of waiting to issue the ESAM chip that install are loaded the pipe level and are stacked between two backstays 22, storage pipe detecting sensor 222 detects backstay 22 places have been had chip and loads and manage then feedback signal to driving control device 6; Driving control device 6 control chip loading attachments 2 begin to get material; Drive upset cylinder 212 and drive arm for taking material 21 swings, when arm for taking material 21 swings to level, be turned to level sensor 213 and send detection signal; Driving control device 6 receives this signal and drives ejector sleeve cylinder 232 drive ejectors 23 and moves; The chip loading that ejector 23 drives in the straight-line groove 231 is managed the clip position that moves to arm for taking material 21 conllinear, and ejector sleeve upfront sensor 233 detects when chip loading pipe has been moved to the tram and sends signal to driving control device 6, and driving control device 6 receives that this signal then drives push pipe cylinder 24 and pressure pipe cylinder 214; Be clamped and fastened on chip loading tube grip portion 211 accurately chip is loaded pipe; Whether press pipe cylinder sensor 215 to detect arm for taking material 21 sandwich sheets and load pipe and put in place, and detection signal is fed back to driving control device 6, driving control device 6 judges that chips load tube grip and put in place and then drive upset cylinder 212; The chip that makes arm for taking material 21 drive clamping loads upwards swing of pipe; When being rocked to, be turned to level sensor 213 feedback signal to driving control device 6 once more, meanwhile with chip transmission channel 8 conllinear; Interface between 81 pairs of arm for taking material 21 of interface detecting sensor and the chip transmission channel 8 detects; Whether engage well with definite its, and detection signal is sent to driving control device 6, driving control device 6 receives above-mentioned feedback signal; If arm for taking material 21 has overturn and has put in place and interface engages good; Then drive the double pipe cylinder 217 that strikes of backgauge, open baffle plate 218 and chip is loaded under the ESAM chip in the pipe slide in the chip transmission channel 8, strike tube wall 216 simultaneously and beat chip and load pipe to prevent the phenomenon that gets stuck.After in chip all slips into chip transmission channel 8; Driving upset cylinder 212 once more makes arm for taking material 21 go back to level; Drive pressure pipe cylinder unclamps chip and loads tube grip portion 211; Ejector 23 moves the vacant chip of ejection once more and loads pipe away from clip position at this moment, and such as falling planar portions 11, ejector 23 will carry a new chip loading that chip is housed and manage clip position simultaneously; Chip loads the tube grip portion 211 new chip loading pipe of clamping once more, so repeats above-mentioned feeding action.
The ESAM chip is slipped into chip transmission channel 8 and is directed into stepping discharging device 3 by it; Detection signal drives control device 6 according to stepping district photoelectric sensor 82 drives stepping cylinder 31 operations, with the ESAM chip clamping location writing station 4 of transferring to the below one by one.
The ESAM chip of being transferred one by one by stepping discharging device 3 enters into clamping location writing station 4, and it is normal and arrive after the distribution position that distribution position transducer 45 detects chip stepping transmission, feeds back signal to driving control device 6; Drive gripper cylinder 44 by it clamping of ESAM chip is positioned at the distribution position, chip is contacted, simultaneously with writing terminal 41; Driving control device 6 sends signal and gives distribution host computer 200; 300 pairs of ESAM chips of distribution host computer 200 control read write lines are issued and are detected, and the testing result signal feedback is arrived distribution host computer 200, hereto; Chip distribution equipment 100 can be accomplished the whole operation of automatic charging and distribution detection; Substituted the mode of traditional-handwork operation, improved production efficiency greatly, the chip that detects through distribution can carry out categorised collection by operating personnel.
And from the above mentioned, chip distribution equipment 100 also can comprise a die sorter 5, is used for carrying out sorting to issuing successful and unsuccessful chip automatically, and is included into different chip loading pipes respectively and carries out finishing collecting.Distribution host computer 200 transmits the Different control signal to chip distribution equipment 100 according to the different testing result signals of read write line 300 feedbacks; After the driving control device 6 of chip distribution equipment 100 receives above-mentioned control signal; According to the information Control die sorter 5 in the signal ESAM chip being packed into, the certified products chip loads pipe or the unacceptable product chip loads pipe; In addition, be the die sorter 5 of ESAM chip below arbitrarily slipping under the effect of deadweight of avoiding issuing completion, cause fault such as get stuck; Clamping location writing station 4 also comprises positioning cylinder 46, receives driving control device 6 to drive the ESAM chip after interception distribution in good time detects.
Load that the successful chip of pipe mounting hole 521 installing distribution loads pipe and second chip loads the unsuccessful chip of pipe mounting hole 522 installing distribution to load pipe be example with first chip; When the signal panels that send of distribution host computer 200 judge that chip is issued successfully; Driving control device 6 drives sorting shuttle cylinder 513; Move it to first chip loading pipe position of mounting hole, it is in place to confirm sorting shuttle 512 when it arrives, to send detection signal by shuttle at first chip loading pipe position of mounting hole sensor 5131, at this moment; Discharging opening, sorting shuttle material guide hole 5121 and first chip of clamping location writing station 4 loads pipe mounting hole 521 and is in collinear position; Drive backgauge cylinder 5123 in positioning cylinder 46 and the shuttle by driving control device 6, make the successful ESAM chip of distribution be slipped into the certified products chip and load pipe, simultaneously; Really having slided into the certified products chip by shuttle top photoelectric sensor 514 with shuttle below photoelectric sensor 515 common chip monitorings loads in the pipe; Take place when unusual, two sensors feeds back signal to driving control device 6, adopts modes such as sending alerting signal to notify the staff by driving control device 6; When the signal panels that send of distribution host computer 200 judge that the chip distribution is unsuccessful; At first; Driving control device 6 drives sorting shuttle cylinder 513, moves it to first chip loading pipe position of mounting hole, and it is in place to confirm sorting shuttle 512 when it arrives, to send detection signal by shuttle at first chip loading pipe position of mounting hole sensor 5131; At this moment; Discharging opening, sorting shuttle material guide hole 5121 and first chip of clamping location writing station 4 loads pipe mounting hole 521 and is in collinear position, drives positioning cylinder 46 by driving control device 6, and the unsuccessful ESAM chip of distribution is slipped in the material guide hole 5121; But do not drive backgauge cylinder 5123 in the shuttle this moment; So backgauge spare 5122 will stop the downslide of chip, shuttle top photoelectric sensor 514 detection chip slip into after the sorting shuttle 512 feedback signal to driving control device 6; 6 of driving control devices drive sorting shuttle cylinder; Make it drive sorting shuttle 512 and move to second chip loading pipe position of mounting hole, it is in place to confirm sorting shuttle 512 when it arrives, to send detection signal by shuttle at second chip loading pipe position of mounting hole sensor 5132, and backgauge cylinder 5123 is opened backgauge spare 5122 in the driving control device 6 driving shuttles; Make the not successful ESAM chip of distribution in the sorting shuttle 512 fall into the unacceptable product chip loading pipe that loads 522 installings of pipe mounting hole to second chip, thereby accomplish the separation and collection operation of chip.
Loading pipe position of mounting hole and second chip at first chip loads the pipe position of mounting hole and also is respectively arranged with first chip and loads pipe mounting hole detecting sensor 523 and load with second chip and manage mounting hole detecting sensor 524; Being used for detecting first chip loads pipe mounting hole and second chip and loads the pipe mounting hole and whether be equiped with chip and load pipe; If there is not then feedback signal to driving control device 6; And then give the alarm, to avoid owing to not installing the situation that chip loading pipe causes chip to be scattered of collecting.
Each sensor and cylinder in above-mentioned according to actual conditions, are realized under the prerequisite of its effectiveness guaranteeing; It is provided with the position all can do suitable adjustment; Do not do concrete restriction, and the those skilled in the art in present technique field understand all, sensor and this type component of cylinder the position is set all relatively flexibly; For adapting to concrete operating mode, it is provided with the position and often need adjusts flexibly.
As stated; Automatically distribution and checkout equipment are used to issue the preferred embodiment of ESAM module for chip of the present invention; According to foregoing, those skilled in the art can learn, if will carry out the distribution of other chips; The specification that only needs to write the device that terminal and chip move through is done corresponding adjustment and is got final product, so technical scheme of the present invention is not restricted to the distribution of ESAM chip.
The above is merely the schematic embodiment of the present invention, is not in order to limit scope of the present invention.Any those skilled in the art, equivalent variations of under the prerequisite that does not break away from design of the present invention and principle, having done and modification all should belong to the scope that the present invention protects.
Claims (18)
1. a chip distribution equipment is characterized in that said chip distribution equipment comprises: chip loading attachment, chip transmission channel, chip writing station, die sorter;
Said chip loading attachment is used for chip to be issued is loaded into said chip transmission channel;
Said chip transmission channel is used to rely on and waits that the deadweight of issuing chip sends chip to be issued to said chip writing station;
Said chip writing station is used for release data is write chip to be issued and detects the output testing result to issuing the back chip;
Said die sorter is used for making chip after the distribution slip into that the successful chip of distribution loads pipe or the unsuccessful chip of distribution loads pipe according to said testing result.
2. chip distribution equipment according to claim 1; It is characterized in that; Said chip distribution equipment also comprises driving control device; Connect said chip loading attachment, chip writing station and die sorter respectively, be used for control and drive said chip loading attachment, chip writing station and die sorter.
3. chip distribution equipment according to claim 2; It is characterized in that; Said chip distribution equipment has a frame, has a planar portions and an inclined downward portion, and said planar portions is adjacent with said inclined plane part; Said chip loading attachment is located on the said planar portions, and said chip transmission channel, chip writing station and die sorter are located at said inclined plane part.
4. chip distribution equipment according to claim 3 is characterized in that said chip loading attachment comprises:
Arm for taking material; The one of which end is coupling in said frame, and the other end is a free end, and said arm for taking material can be rocked to parallel adjacent with said planar portions in vertical plane; And link to each other with said chip transmission channel conllinear; Said arm for taking material is provided with baffle plate with the endpiece that said chip transmission channel is connected, and extends on the said arm for taking material to be provided with one and to strike tube wall, and said baffle plate strikes double the striking of tube wall and backgauge and manages cylinder and be connected and be driven by it with said; The double pipe cylinder that strikes of said backgauge is connected in said driving control device and receives its controlling and driving; The arm body of said arm for taking material connect one drive its upset the upset cylinder, said upset cylinder is provided with one and is turned to level sensor, saidly is turned to level sensor and said upset cylinder is connected in said driving control device; The said material wall free end of getting is provided with chip loading tube grip portion; Said chip loads tube grip portion connection one pressure pipe cylinder and is driven by it, and said pressure pipe cylinder is provided with presses the pipe cylinder sensor, and said pressure pipe cylinder sensor and said pressure pipe cylinder are connected in said driving control device;
Two backstays; Vertical is arranged on the said planar portions; At a distance of a distance, and the relative side of said two backstays all offers vertical conduit, loads the pipe two ends with ccontaining positioning chip between said two backstays; Said two backstay bottoms and said planar portions fixing position offer notch respectively towards a side of said arm for taking material; Can shift out the chip loading pipe parking space between said two backstays so that chip loads pipe, said backstay is provided with storage pipe detecting sensor, and said storage pipe detecting sensor is connected in said driving control device;
Ejector; Be arranged on the said planar portions; Said ejector is positioned at said two backstays below and can moves along the direction perpendicular to the determined horizontal linear of said two backstays; Said ejector end face runs through the straight-line groove that offers ccontaining chip loading pipe, and when said ejector was positioned at initial position, said straight-line groove and said two backstays were fixed in the straight line conllinear at 2 places of said planar portions; Arm for taking material conllinear when said ejector can move and make said straight-line groove and swing to level; Said ejector is connected with the ejector sleeve cylinder, and on planar portions, is provided with the ejector sleeve upfront sensor that detects said ejector shift position, and said ejector sleeve upfront sensor and said ejector sleeve cylinder are connected in said driving control device;
The push pipe cylinder is arranged at said planar portions, said push pipe cylinder when swinging to level the arm for taking material conllinear and can the ejection chip load pipe and enter into said chip and load tube grip portion to guarantee it, said push pipe cylinder is connected in said driving control device.
5. chip distribution equipment according to claim 4 is characterized in that said yoke frame is provided with two, the straight-line groove conllinear that said two yoke frame end faces are offered, and moving of said two ejectors is same moved further.
6. chip distribution equipment according to claim 2; It is characterized in that; The interface of said chip transmission channel and said chip loading attachment is provided with the interface detecting sensor; Whether with being connected of said chip transmission channel normal, said interface detecting sensor links to each other with said driving control device if being used to detect said chip loading attachment.
7. chip distribution equipment according to claim 2; It is characterized in that; Said chip transmission channel is provided with stepping district photoelectric sensor; Be used for whether being equipped with in the detection chip transmission channel chip to be issued, said stepping district photoelectric sensor is positioned at the end of said chip transmission channel near said chip writing station, and is connected in said driving control device.
8. according to claim 2,6 or 7 described chip distribution equipment; It is characterized in that; Said chip transmission channel is provided with track the place ahead photoelectric sensor; Be used for detecting and whether remain to be issued chip and slip into the said chip transmission channel from said chip loading attachment, said track the place ahead photoelectric sensor is positioned at the end of said chip transmission channel near said chip loading attachment, and is connected in said driving control device.
9. chip distribution equipment according to claim 3 is characterized in that, said chip writing station comprises stepping discharging device and clamping location writing station;
Said stepping discharging device is connected in said chip transmission channel outlet, is used for chip to be issued is transferred the writing station to said clamping location one by one;
Said clamping location writing station is located at said stepping discharging device below, be used to receive chip that said stepping discharging device sends into and with its clamping location to write and detecting operation.
10. chip distribution equipment according to claim 9 is characterized in that said stepping discharging device is provided with the stepping cylinder that control chip is transferred one by one, and said stepping cylinder is connected in said driving control device.
11., it is characterized in that said clamping location writing station comprises according to claim 9 or 10 described chip distribution equipment:
Write terminal; Be fixedly arranged on the said inclined plane part; The said write terminal is used for contacting to write and detecting operation with chip to be issued; Be the distribution position corresponding to the position of said write terminal on the said inclined plane part, the said write terminal connects a read write line, and said read write line is used for release data is written to through the said write terminal to be waited to issue chip and carry out detecting operation;
Fixed mount is fixedly arranged on the said inclined plane part, and said fixed mount is positioned at said write terminal top;
The clamping keeper; Be located at the position of corresponding said write terminal on the said fixed mount; Said clamping keeper connects gripper cylinder and can under the driving of said gripper cylinder, chip to be issued be clamped and fastened on said distribution position; Make and wait to issue chip and said write termination contact, said gripper cylinder is connected in said driving control device;
The distribution position transducer is located on the said inclined plane part, is used for detecting waiting to issue chip and whether arriving the whether normal stepping transmission of said distribution position and detection chip, and said distribution position transducer is connected with said driving control device;
Positioning cylinder is located on the said inclined plane part, is used to tackle the chip after the distribution, and makes distribution back chip get into the die sorter of below in good time, and said positioning cylinder is connected in said driving control device and receives its control and driving.
12. chip distribution equipment according to claim 3 is characterized in that said die sorter comprises:
Sorter is located on the said inclined plane part, is used for sorting and issues and successfully reach unsuccessful chip, and said sorter comprises again;
Slide rail is horizontally located on the said inclined plane part;
The sorting shuttle; Slidable being arranged on the said slide rail, said sorting shuttle is externally connected to sorting shuttle cylinder, and said sorting shuttle cylinder is used to drive said sorting shuttle and on said slide rail, slides; Said sorting shuttle cylinder is connected in said drive control part; Said sorting shuttle inside vertically offers a material guide hole, and with transmission distribution back chip, said material guide hole can be communicated in said chip writing station; Also be provided with backgauge spare in the said material guide hole, said backgauge spare is connected with the interior backgauge cylinder of a shuttle and can under it drives, moves to block or to open said material guide hole
Chip loads the pipe fixed part; Be fixedly arranged on the said inclined plane part; Be positioned at said sorter below; Said chip loads the pipe fixed part and is used for that the successful chip of installing distribution loads pipe and the unsuccessful chip of distribution loads pipe; Said chip loads vertical parallel first chip loading pipe mounting hole and second chip that run through of offering of pipe fixed part and loads the pipe mounting hole; The discharging opening that said first chip loads pipe mounting hole or second chip loading pipe mounting hole and said chip writing station is relative; Issue successful chip load pipe and the unsuccessful chip of distribution load pipe respectively folder establish and be fixed in that said first chip loads the pipe mounting hole and second chip loads the pipe mounting hole; Load at said chip and to be provided with also on the pipe fixed part that first chip loads pipe mounting hole detecting sensor and second chip loads pipe mounting hole detecting sensor, be used for detecting said first chip and load pipe mounting hole and second chip and load and whether be equiped with chip in the pipe mounting hole and load pipe, said first chip loads pipe mounting hole detecting sensor and second chip and loads pipe mounting hole detecting sensor and be connected in said driving control device;
Wherein, Said sorter also has shuttle and loads pipe position of mounting hole sensor at first chip loading pipe position of mounting hole sensor and shuttle at second chip; Be respectively applied for the said sorting shuttle of detection and be positioned at first chip loading pipe position of mounting hole or second chip loading pipe position of mounting hole; Said shuttle is connected in said driving control device at first chip loading pipe position of mounting hole sensor and shuttle at second chip loading pipe position of mounting hole sensor; Photoelectric sensor below photoelectric sensor and the shuttle above said sorting shuttle above and below also is respectively arranged with shuttle; Whether have chip slide, said shuttle top photoelectric sensor and shuttle below photoelectric sensor are connected in said driving control device if being respectively applied for the said sorting shuttle of detection above and below.
13. chip distribution equipment according to claim 2 is characterized in that said driving control device comprises:
Control device receives and handles the feedback signal of said each sensor and sends control signal, and said control device also has an operational module;
Drive unit, the control signal of sending according to said control device drive each device operation of said distribution equipment.
14. chip distribution equipment according to claim 13 is characterized in that said control device is the PLC controller, said drive unit is the solenoid valve air compressor, and the operational module of said control device is the liquid crystal touch control panel.
15. chip distribution equipment according to claim 11; It is characterized in that said read write line is inserted with a female card, the release data that institute will write chip is stored in said female the card in advance; Said read write line is sense information from said female card, and is written into and waits to issue in the chip.
16. a chip publishing system is characterized in that, said chip publishing system comprises:
The distribution host computer;
Chip distribution equipment carries out chip distribution operation under the control of said distribution host computer, said chip distribution equipment comprises chip loading attachment, chip transmission channel, chip writing station, die sorter again;
Said chip loading attachment is used for chip to be issued is loaded into said chip transmission chip transmission channel;
Said chip transmission channel is used to rely on and waits that the deadweight of issuing chip sends described chip to be issued to said chip writing station;
Said chip writing station is used for release data is write chip to be issued and detects the output testing result to issuing the back chip;
Said die sorter is used for making chip after the distribution slip into that the successful chip of distribution loads pipe or the unsuccessful chip of distribution loads pipe according to said testing result.
17. chip publishing system according to claim 16 is characterized in that, said distribution host computer is a computing machine, and it is equipped with the chip distribution and detects Control Software, thereby controls the operation of said chip distribution equipment, and said distribution host computer has tally function.
18. according to claim 16 or 17 described chip publishing systems; It is characterized in that; Said chip distribution equipment also comprises driving control device; Connect said chip loading attachment, chip writing station and die sorter respectively, be used for control and drive said chip loading attachment, chip writing station and die sorter;
Said chip writing station has one and writes terminal; The said write terminal is used for contacting to write and detecting operation with chip to be issued; The said write terminal connects a read write line, and said read write line is used for release data is written to through the said write terminal to be waited to issue chip and carry out detecting operation;
Said distribution host computer is connected in said driving control device and said read write line.
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| CN201010571486.6A CN102486835B (en) | 2010-12-03 | 2010-12-03 | Chip issuing equipment and chip issuing system |
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| CN104200254A (en) * | 2014-08-26 | 2014-12-10 | 广州市明森机电设备有限公司 | Intelligent card tower type chip writing device and chip writing method |
| CN104200254B (en) * | 2014-08-26 | 2017-06-23 | 广州明森科技股份有限公司 | A kind of smart card is tower to be write chip apparatus and writes chip method |
| CN105809076A (en) * | 2014-12-31 | 2016-07-27 | 沈阳友联电子装备有限公司 | Data wiring equipment of intelligent card chip module |
| CN105809075A (en) * | 2014-12-31 | 2016-07-27 | 沈阳友联电子装备有限公司 | Card writing device of cos downloading and initiation mechanism of an intelligent card chip and card writing method thereof |
| CN105809076B (en) * | 2014-12-31 | 2018-01-12 | 沈阳友联电子装备有限公司 | A kind of data writing device of smart card chip module |
| CN105809075B (en) * | 2014-12-31 | 2018-01-12 | 沈阳友联电子装备有限公司 | A kind of cos of intelligent card chip is downloaded and the write cards device and its card writing method of initialization mechanism |
| CN106229281A (en) * | 2015-12-25 | 2016-12-14 | 桂林斯壮微电子有限责任公司 | A kind of Anti-blockage separator |
| CN108529199A (en) * | 2018-07-16 | 2018-09-14 | 南方电网科学研究院有限责任公司 | A kind of information interaction device of electrical energy measurement safety chip |
| CN108529199B (en) * | 2018-07-16 | 2024-02-02 | 南方电网科学研究院有限责任公司 | Information interaction equipment of electric energy measurement safety chip |
| CN108971762A (en) * | 2018-07-28 | 2018-12-11 | 北京艾丕科技有限责任公司 | A kind of electronic signature equipment process line and method |
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